Terminal device

Abstract

The utility model discloses terminal equipment, which comprises a shell, a control module, a heat conduction pad and a hard disk, and is characterized in that the control module is located in the shell; the heat conduction pad is located between the shell and the upper surface of the control module, and the heat conduction pad transmits heat generated by the control module to the shell; the hard disk is located in the shell and electrically connected with the control module, and the hard disk is located below the control module. Through the arrangement, the service life and the working stability of the hard disk can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a terminal device. Background Art

[0002] Existing terminal devices (such as servers) are becoming increasingly powerful, and their hard disk data storage capacity is also increasing. However, the heat-generating device modules (such as various processors) in the terminal devices also consume high power, thus placing high heat dissipation requirements on the terminal devices.

[0003] Existing terminal devices use thermal pads in their heating element modules to transfer heat to a heat sink or housing for dissipation, resulting in a high number of thermal pads inside the devices. However, because the thermal pads contain volatile silicone oil, the amount of silicide released from the devices increases over time. When silicide enters the hard drive's internal space, it contaminates the silicon, increasing the drive's failure rate and reducing its lifespan and operational stability. Utility Model Content

[0004] In order to address the deficiencies of the prior art, the purpose of this application is to provide a terminal device that can improve the service life and working stability of a hard disk.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] A terminal device includes a housing, a control module, a thermal pad, and a hard disk. The control module is located within the housing; the thermal pad is located between the housing and the upper surface of the control module, and transfers heat generated by the control module to the housing; the hard disk is located within the housing and electrically connected to the control module, and is located below the control module.

[0007] Furthermore, the shell includes a first chamber and a second chamber, the first chamber is located above the second chamber, the control module and the thermal pad are both located in the first chamber, and the hard disk is located in the second chamber.

[0008] Furthermore, the shell includes an upper cover, a middle shell and a lower shell connected in sequence from top to bottom, the middle shell includes a partition structure perpendicular to the up and down direction of the terminal device and a side panel structure arranged around the partition structure, the upper cover and the lower shell are both connected to the side panel structure, the partition structure, the side panel structure and the upper cover are surrounded to form a first chamber, and the partition structure, the side panel structure and the lower shell are surrounded to form a second chamber; the thermal pad is located between the lower surface of the upper cover and the upper surface of the control module, and the thermal pad is connected to the upper cover; the hard disk is fixed to the lower shell, and the lower shell can transfer the heat generated by the hard disk to the outside world.

[0009] Furthermore, the partition structure is provided with a wire threading hole that passes through the partition structure along the up and down direction of the terminal device, and the wire threading hole is used for passing the wiring harness between the hard disk and the control module; the partition structure is at least partially protruded upward to form a protruding structure, and the wire threading hole is provided through the protruding structure along the up and down direction of the terminal device.

[0010] Furthermore, the raised structure is provided with a plurality of connection holes, which are arranged around the threading hole, and the plurality of connection holes are connected to the control module; the partition structure is at least partially raised upward to form a plurality of mounting columns, and the plurality of mounting columns are connected to the control module.

[0011] Furthermore, the terminal device also includes a heat dissipation mechanism, and the hard disk and the shell are both in contact with the heat dissipation mechanism, which transfers the heat generated by the hard disk to the shell; the heat dissipation mechanism is made of copper foil material; a shock-absorbing pad is provided between the hard disk and the shell; the lower shell or the shell is made of metal material.

[0012] Furthermore, the heat dissipation mechanism extends along an "L" shape, and the heat dissipation mechanism includes a first heat dissipation portion and a second heat dissipation portion that are perpendicular to each other, and the first heat dissipation portion and the second heat dissipation portion are integrally formed, the first heat dissipation portion contacts and is fixed to one side of the hard disk, and the second heat dissipation portion contacts and is fixed to the shell; the heat dissipation mechanism contacts the upper surface of the lower shell.

[0013] Furthermore, top heat dissipation fins and bottom heat dissipation fins are provided on the shell, the top heat dissipation fins are located on the upper surface of the shell, and the bottom heat dissipation fins are located on the lower surface of the shell.

[0014] Furthermore, the terminal device also includes a protective mechanism, which is at least partially located above the hard disk and at least partially covers the hard disk; the protective mechanism includes a covering portion and a fixing portion, the covering portion is adapted to the upper surface of the hard disk, the fixing portion is formed by extending downward from the edge of the covering portion, and the fixing portion is at least partially arranged around the hard disk; the protective mechanism is made of aluminum foil material.

[0015] Furthermore, the control module includes a control circuit board and a processor installed on the control circuit board, the processor is located above the control circuit board, and the thermal pad is located between the processor and the shell; the shell includes an upper cover, a middle shell and a lower shell connected in sequence from top to bottom, an opening is opened on one side of the middle shell, the shell also includes an interface panel, the interface panel covers the opening of the middle shell and is connected to the middle shell, the interface panel has multiple interface holes, the control module also includes multiple interfaces installed on the control circuit board, and the multiple interfaces are respectively located in the corresponding interface holes.

[0016] The above-mentioned terminal device can set the hard disk under the control module and set the thermal pad on the upper surface of the control module, so that the silicide cannot move to the hard disk, thereby avoiding silicide contamination of the hard disk, thereby improving the service life and working stability of the hard disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of the terminal device provided in an embodiment of the present application.

[0018] Figure 2 This is an exploded diagram of the terminal device provided in an embodiment of the present application.

[0019] Figure 3 A three-dimensional cross-sectional view of a terminal device provided in an embodiment of the present application.

[0020] Figure 4 A schematic diagram of a portion of the structure of the terminal device provided in an embodiment of the present application.

[0021] Figure 5 A cross-sectional view of a terminal device provided in an embodiment of the present application.

[0022] Figure 6 A schematic structural diagram of the middle shell of the terminal device provided in an embodiment of the present application.

[0023] Figure 7 This is an exploded diagram of the partial structure of the terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation of the present application will be clearly and completely described below in conjunction with the drawings in the implementation of the present application.

[0025] It should be noted that the words "first", "second" and similar terms used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "an" do not indicate a quantity limitation, but rather indicate the presence of at least one. "Multiple" or "several" means at least two. Unless otherwise specified, words such as "front", "back", "left", "right", "bottom" and / or "top" are used for ease of description only and are not limited to one position or one spatial orientation. Words such as "include" or "comprising" and similar terms mean that the elements or objects appearing before "include" or "comprising" include the elements or objects listed after "include" or "comprising" and their equivalents, and do not exclude other elements or objects. Words such as "connected" or "connected" and similar terms are not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect.

[0026] As used in this specification and the appended claims, the singular forms "a," "an," "said," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0027] In order to clearly illustrate the technical solution of this application, the following is also defined: Figure 1 Front, back, left, right, up and down as shown.

[0028] like Figure 1 and Figure 2 As shown, the present application provides a terminal device 100, which includes a housing 11, a control module 12, and a hard disk 13. The control module 12 and the hard disk 13 are both located within the housing 11, so that the housing 11 can protect the control module 12 and the hard disk 13, thereby increasing the service life of the control module 12 and the hard disk 13. The hard disk 13 is electrically connected to the control module 12, so that the control module 12 can obtain or store information from the hard disk 13.

[0029] Specifically, the terminal device 100 also includes a thermal pad 14, which is located between the housing 11 and the upper surface of the control module 12. The thermal pad 14 can transfer the heat generated by the control module 12 to the housing 11, so that the housing 11 can transfer the heat generated by the control module 12 to the outside, thereby achieving heat dissipation of the control module 12. In addition, the provision of the thermal pad 14 can increase the heat transfer rate, thereby improving the heat dissipation effect of the control module 12. More specifically, the thermal pad 14 can contact with the control module 12 and the housing 11, thereby improving the heat transfer efficiency of the thermal pad 14. Among them, the thermal pad 14 is connected to the housing 11; the hard disk 13 can be a mechanical hard disk 13, etc.; the control module 12 can be a module with information processing and control functions, which is not limited in this application.

[0030] In this embodiment, the thermal pad 14 contains silicone oil, and the silicone oil is volatile, that is, the silicone oil will evaporate into silicide when heated, and the density of silicide is lighter than air, so the silicide will move upward to the top of the housing 11.

[0031] To prevent the volatilization of silicide from causing it to adhere to the hard disk 13, and to prevent the silicide from adhering to the hard disk 13 and causing contamination of the hard disk 13, thereby affecting the normal operation of the terminal device 100, the hard disk 13 of the present application is located below the control module 12. This arrangement can prevent the silicide from moving onto the hard disk 13, that is, the arrangement can reduce the main source of contamination of the hard disk 13, thereby preventing silicide from contaminating the hard disk 13, thereby increasing the service life and operating stability of the hard disk 13, and can also increase the service life of the terminal device 100 and reduce the failure rate of the terminal device 100.

[0032] In addition, since the heat generated by the control module 12 will also move upward instead of downward, the setting position of the above-mentioned hard disk 13 can ensure that the heat generated by the control module 12 does not affect the normal operation of the hard disk 13, thereby reducing the failure rate of the hard disk 13 and improving the service life and working stability of the hard disk 13.

[0033] like Figure 2 and Figure 3 As shown, as an implementation method, the housing 11 includes a first chamber 111 and a second chamber 112. The first chamber 111 is located above the second chamber 112. The control module 12 and the thermal pad 14 are both located in the first chamber 111, and the hard disk 13 is located in the second chamber 112. Through the above arrangement, the hard disk 13 can be placed in the second chamber 112 separated from the control module 12, thereby further preventing the heat generated by the control module 12 from being transferred to the hard disk 13; at the same time, the hard disk 13 can also be placed in the second chamber 112 separated from the thermal pad 14, thereby further preventing the silicide generated by the thermal pad 14 due to heat from entering the second chamber 112, thereby preventing the silicide from contaminating the hard disk 13, thereby reducing the failure rate of the hard disk 13 and increasing the service life of the hard disk 13.

[0034] Specifically, the housing 11 includes an upper cover 113, a middle shell 114, and a lower shell 115, which are connected in sequence from top to bottom. The middle shell 114 includes a partition structure 1141 and a side panel structure 1140. The partition structure 1141 is perpendicular to the vertical direction of the terminal device 100, and the side panel structure 1140 is arranged around the partition structure 1141. The side panel structure 1140 extends in the vertical direction of the terminal device 100. More specifically, the upper cover 113 and the lower shell 115 are both connected to the side panel structure 1140. The partition structure 1141, the side panel structure 1140, and the upper cover 113 surround a first chamber 111, and the partition structure 1141, the side panel structure 1140, and the lower shell 115 surround a second chamber 112. The partition structure 1141 can be provided to separate the control module 12 from the first chamber 111 where the thermal pad 14 is located and the second chamber 112 where the hard disk 13 is located, so that the partition structure 1141 can prevent the heat generated by the control module 12 from entering the second chamber 112 and can also prevent the silicide volatilized by the thermal pad 14.

[0035] In addition, the partition structure 1141 can also block the silicide volatilized from other components on the control module 12 , thereby preventing the silicide volatilized from other components on the control module 12 from contaminating the hard disk 13 , thereby further reducing the pollution source of the hard disk 13 .

[0036] In this embodiment, the thermal pad 14 is located between the lower surface of the upper cover 113 and the upper surface of the control module 12, and the thermal pad 14 is connected to the upper cover 113. The thermal pad 14 and the upper cover 113 can be connected by bonding, so that the thermal pad 14 can be fixed to the upper cover 113.

[0037] In this embodiment, the hard disk 13 is fixed to the lower housing 115, and the lower housing 115 is capable of transferring heat generated by the hard disk 13 to the outside world. The hard disk 13 is fixed to the lower housing 115 using fasteners such as screws. The lower housing 115 can transfer heat generated by the hard disk 13 to the outside world by directly contacting the hard disk 13 or indirectly releasing the heat, thereby enabling the lower housing 115 to dissipate heat from the hard disk 13.

[0038] like Figure 2 and Figure 4As shown, as an optional implementation, the terminal device 100 further includes a heat dissipation mechanism 15. Both the hard disk 13 and the housing 11 are in contact with the heat dissipation mechanism 15, which can transfer heat generated by the hard disk 13 to the housing 11. In other words, the hard disk 13 and the housing 11 are in indirect contact via the heat dissipation mechanism 15, allowing the lower shell 115 of the housing 11 to transfer heat from the hard disk 13 to the outside world via the heat dissipation mechanism 15. Furthermore, the provision of the heat dissipation mechanism 15 can also improve the heat dissipation efficiency between the lower shell 115 and the hard disk 13, thereby enabling the hard disk 13 to function properly.

[0039] In this application, the heat dissipation mechanism 15 is made of copper foil. The heat transfer efficiency of the copper foil is greater than that of the thermal pad 14. This allows the heat generated by the hard disk 13 to be transferred to the lower housing 115 more quickly, thereby improving the heat dissipation efficiency of the hard disk 13. In addition, the copper foil does not produce silicides, so the copper foil does not cause silicide contamination to the hard disk 13.

[0040] It should be noted that in this application, a shock-absorbing pad is provided between the hard disk 13 and the housing 11. Since the hard disk 13 generates vibrations during operation, the shock-absorbing pad can provide a buffer between the hard disk 13 and the housing 11, thereby reducing the rigid wear between the hard disk 13 and the housing 11 caused by the vibration of the hard disk 13, thereby increasing the service life of the hard disk 13 and the housing 11.

[0041] It should be noted that since a shock-absorbing pad is provided between the hard disk 13 and the housing 11 , in this application, there is no direct contact between the hard disk 13 and the housing 11 , but indirect contact is formed between the hard disk 13 and the housing 11 through the provision of the heat dissipation mechanism 15 .

[0042] In this embodiment, the lower shell 115 or the housing 11 is made of metal, so that the hard disk 13 and the lower shell 115 can be electrically connected via the heat dissipation mechanism 15 made of copper foil, or the hard disk 13 and the housing 11 can be electrically connected via the heat dissipation mechanism 15 made of copper foil, so that the hard disk 13 can be grounded and electrically connected, thereby improving the antistatic performance of the hard disk 13. In this application, the lower shell 115 or the housing 11 is made of aluminum.

[0043] Exemplarily, the heat dissipation mechanism 15 extends in an "L" shape and includes a first heat dissipation portion 151 and a second heat dissipation portion 152 that are perpendicular to each other. The first heat dissipation portion 151 and the second heat dissipation portion 152 are integrally formed. The first heat dissipation portion 151 contacts and is fixed to one side of the hard disk 13, while the second heat dissipation portion 152 contacts and is fixed to the housing 11. Specifically, the second heat dissipation portion 152 contacts the lower housing 115, so that heat generated by the hard disk 13 is transferred through the first heat dissipation portion 151 to the second heat dissipation portion 152, and then to the lower housing 115 through the second heat dissipation portion 152. This transfers the heat generated by the hard disk 13 to the outside world, thereby dissipating heat from the hard disk 13.

[0044] Among them, one side of the hard disk 13 can be any side of the hard disk 13 along the front, back, left and right directions of the terminal device 100, and this application does not impose any restrictions; the first heat dissipation part 151 and the second heat dissipation part 152 can also be connected by a fixed connection, and it is only necessary to enable heat transfer between the first heat dissipation part 151 and the second heat dissipation part 152, and this application does not impose any restrictions.

[0045] Specifically, the first heat dissipation portion 151 can be bonded to one side of the hard disk 13 using adhesive, and the second heat dissipation portion 152 can also be bonded to the housing 11 using adhesive. The adhesive does not contain silicide, so that the adhesive does not cause silicide contamination of the hard disk 13. It should be noted that the connection between the first heat dissipation portion 151 and the hard disk 13, and the second heat dissipation portion 152 and the housing 11, can also be other connection methods, as long as the first heat dissipation portion 151 is in contact with the hard disk 13, and the second heat dissipation portion 152 is in contact with the housing 11.

[0046] like Figure 5 As shown, to improve the heat dissipation efficiency of the hard disk 13 and the control module 12, as one implementation method, the housing 11 of the present application is provided with top heat dissipation fins 1131 and bottom heat dissipation fins 1151. The top heat dissipation fins 1131 are located on the upper surface of the housing 11, and the bottom heat dissipation fins 1151 are located on the lower surface of the housing 11, thereby improving the heat dissipation effect of the upper and lower surfaces of the housing 11.

[0047] Specifically, a top heat dissipation fin 1131 is provided on the upper cover 113, and the top heat dissipation fin 1131 is located on the upper surface of the upper cover 113. The thermal pad 14 is bonded to the bottom of the upper cover 113, so that the thermal pad 14 can transfer the heat generated by the control module 12 to the top heat dissipation fin 1131, and the heat can be transferred to the outside world more quickly through the top heat dissipation fin 1131, thereby improving the heat dissipation efficiency of the control module 12.

[0048] Specifically, the bottom shell 115 is provided with a bottom heat dissipation fin 1151, and the bottom heat dissipation fin 1151 is located on the lower surface of the bottom shell 115. Figure 4) contacts the upper surface of the lower shell 115, so that the heat dissipation mechanism 15 can transfer the heat generated by the hard disk 13 to the bottom heat dissipation fins 1151, and the heat can be transferred to the outside world more quickly through the bottom heat dissipation fins 1151, thereby improving the heat dissipation efficiency of the hard disk 13.

[0049] like Figure 4 As shown, as an implementation, the terminal device 100 further includes a protection mechanism 16, which is at least partially located above the hard disk 13 and at least partially covers the hard disk 13. The protection mechanism 16 can prevent the silicide in the control module 12 and / or the thermal pad 14 in the first chamber 111 from volatilizing to the hard disk 13, so that the protection mechanism 16 can cooperate with the partition structure 1141 to reduce the contamination of the hard disk 13 by the silicide, thereby further improving the working stability of the hard disk 13 and reducing the failure rate of the hard disk 13, thereby increasing the service life of the hard disk 13.

[0050] Specifically, the protective mechanism 16 includes a covering portion 161 and a fixing portion 162. The covering portion 161 is adapted to the upper surface of the hard disk 13, i.e., the lower surface of the covering portion 161 is substantially the same shape and size as the upper surface of the hard disk 13. This allows the covering portion 161 to better fit the upper surface of the hard disk 13, thereby better protecting the hard disk 13. Optionally, to ensure that the covering portion 161 does not affect the heat dissipation of the hard disk 13, the covering portion 161 may be provided with heat dissipation holes, thereby improving the heat dissipation efficiency of the hard disk 13.

[0051] The fixing portion 162 extends downward from the edge of the covering portion 161. The fixing portion 162 is at least partially disposed around the hard disk 13, thereby allowing the fixing portion 162 to fit against the side of the hard disk 13, thereby enabling the protective mechanism 16 to better protect the hard disk 13 from contamination by silicide. The side of the hard disk 13 refers to any side of the hard disk 13 along the front-back, left-right, and right-hand directions of the terminal device 100.

[0052] More specifically, the protection mechanism 16 is substantially a box-shaped structure, so that the protection mechanism 16 can be covered on the hard disk 13 .

[0053] In this embodiment, the protection mechanism 16 is made of aluminum foil, which can isolate electromagnetic interference, thereby achieving electromagnetic shielding for the hard disk 13 and further improving the anti-electromagnetic radiation performance of the hard disk 13 .

[0054] In the present application, to improve the connection stability between the protective mechanism 16 and the hard disk 13, the protective mechanism 16 can be bonded to the hard disk 13 by adhesive. Since the adhesive does not contain silicide, the protective mechanism 16 is connected to the hard disk 13 by the adhesive while preventing the adhesive from contaminating the hard disk 13.

[0055] like Figure 5 and Figure 6 As shown, as an implementation method, the partition structure 1141 is provided with a wire hole 1142 that passes through the partition structure 1141 in the upper and lower directions of the terminal device 100. The wire hole 1142 can be used for passing the wiring harness between the hard disk 13 and the control module 12, so that the wire hole 1142 can realize electrical connection between the hard disk 13 and the control module 12.

[0056] Specifically, the partition structure 1141 is at least partially raised upward to form a raised structure 1143, and the wire threading hole 1142 is provided through the raised structure 1143 in the vertical direction of the terminal device 100. The raised structure 1143 can allow the wire harness to extend substantially in the vertical direction of the terminal device 100, thereby facilitating the routing of the wire harness and preventing the wire harness from being too scattered.

[0057] Furthermore, the raised structure 1143 can also support the control module 12. More specifically, the raised structure 1143 is provided with a plurality of connection holes 1143a, which are arranged around the threading holes 1142 and can be connected to the control module 12. To connect the control module 12 to the raised structure 1143, the control module 12 can be first placed on the raised structure 1143, thereby enabling the raised structure 1143 to support the control module 12. Fasteners such as bolts are then inserted through the control module 12 and the connection holes 1143a, thereby connecting the control module 12 to the raised structure 1143.

[0058] It should be noted that the multiple connection holes 1143a are located at the edge of the protruding structure 1143, thereby preventing deformation of the control module 12 and the formation of a gap between the protruding structure 1143. Through this arrangement, the threading holes 1142 can be separated from the first chamber 111 by the control module 12, thereby preventing the silicide volatilized from the thermal pad 14 in the first chamber 111 from entering the second chamber 112 through the threading holes 1142, thereby preventing the silicide volatilized from the thermal pad 14 from contaminating the hard disk 13.

[0059] To improve the connection stability between the control module 12 and the partition structure 1141, the partition structure 1141 of the present application is at least partially raised upward to form a plurality of mounting posts 1144. The plurality of mounting posts 1144 can be connected to the control module 12, so that the mounting posts 1144 can cooperate with the raised structure 1143 to achieve the installation of the control module 12. The mounting posts 1144 can be configured as boss posts.

[0060] like Figure 7As shown, as an implementation, the control module 12 includes a control circuit board 121 and a processor 122 mounted on the control circuit board 121, with the processor 122 located above the control circuit board 121. Since the processor 122 serves as the primary heat source for the control module 12, a thermal pad 14 is disposed between the processor 122 and the housing 11. Specifically, the thermal pad 14 is elastic, so while transferring heat generated by the processor 122, it also provides a buffer between the processor 122 and the housing 11, thereby preventing damage to the processor 122 due to collisions between the two.

[0061] Specifically, the thermal pad 14 can be deformed so that the processor 122 can be protected by the thermal pad 14 , thereby avoiding a rigid collision between the processor 122 and the housing 11 .

[0062] In this embodiment, the control circuit board 121 may be a PCB (Printed Circuit Board), and the processor 122 may be a module with information processing and control functions, which is not limited in this application.

[0063] In this embodiment, an opening is defined on one side of the middle shell 114. The housing 11 further includes an interface panel 116, which covers the opening of the middle shell 114 and is connected to the middle shell 114. The interface panel 116 defines a plurality of interface holes 1161. The control module 12 further includes a plurality of interfaces 123 mounted on a control circuit board 121. Each of the interfaces 123 is located in a corresponding interface hole 1161, enabling electrical connection between the interfaces 123 and an external device, thereby enabling signal transmission between the terminal device 100 and the external device.

[0064] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims appended to this application.

Claims

1. A terminal device, characterized in that: The terminal device includes: case; a control module, the control module being located in the housing; a thermal pad, located between the housing and an upper surface of the control module, and transferring heat generated by the control module to the housing; A hard disk is located in the housing and electrically connected to the control module, and the hard disk is located below the control module.

2. The terminal device according to claim 1, wherein: The housing includes a first chamber and a second chamber, the first chamber is located above the second chamber, the control module and the thermal pad are both located in the first chamber, and the hard disk is located in the second chamber.

3. The terminal device according to claim 2, characterized in that The housing includes an upper cover, a middle shell, and a lower shell connected in sequence from top to bottom, the middle shell includes a partition structure perpendicular to the up and down direction of the terminal device and a side plate structure arranged around the partition structure, the upper cover and the lower shell are both connected to the side plate structure, the partition structure, the side plate structure, and the upper cover surround forming the first chamber, and the partition structure, the side plate structure, and the lower shell surround forming the second chamber; The thermal pad is located between the lower surface of the upper cover and the upper surface of the control module, and the thermal pad is connected to the upper cover; The hard disk is fixed to the lower shell, and the lower shell transfers heat generated by the hard disk to the outside.

4. The terminal device according to claim 3, characterized in that The partition structure is provided with a threading hole that passes through the partition structure in the vertical direction of the terminal device, and the threading hole is used for the wiring harness between the hard disk and the control module to pass through; The partition structure is at least partially raised upward to form a raised structure, and the threading hole is arranged to pass through the raised structure along the up-down direction of the terminal device.

5. The terminal device according to claim 4, characterized in that The protruding structure is provided with a plurality of connection holes, the plurality of connection holes are arranged around the threading hole, and the plurality of connection holes are connected to the control module; The partition structure is at least partially protruded upward to form a plurality of mounting columns, and the plurality of mounting columns are connected to the control module.

6. The terminal device according to any one of claims 3 to 5, characterized in that: The terminal device further includes a heat dissipation mechanism, the hard disk and the housing are both in contact with the heat dissipation mechanism, and the heat dissipation mechanism transfers heat generated by the hard disk to the housing; The heat dissipation mechanism is made of copper foil material; A shock-absorbing pad is provided between the hard disk and the housing; The lower shell or the housing is made of metal material.

7. The terminal device according to claim 6, characterized in that The heat dissipation mechanism extends in an "L" shape and includes a first heat dissipation portion and a second heat dissipation portion that are perpendicular to each other, and the first heat dissipation portion and the second heat dissipation portion are integrally formed, the first heat dissipation portion contacts and is fixed to one side of the hard disk, and the second heat dissipation portion contacts and is fixed to the housing; The heat dissipation mechanism contacts the upper surface of the lower shell.

8. The terminal device according to any one of claims 1 to 5, characterized in that: The housing is provided with a top heat dissipation fin and a bottom heat dissipation fin. The top heat dissipation fin is located on the upper surface of the housing, and the bottom heat dissipation fin is located on the lower surface of the housing.

9. The terminal device according to any one of claims 1 to 5, characterized in that: The terminal device further includes a protection mechanism, wherein the protection mechanism is at least partially located above the hard disk and at least partially covers the hard disk; The protective mechanism includes a covering portion and a fixing portion, wherein the covering portion is adapted to the upper surface of the hard disk, and the fixing portion is formed by extending downward from the edge of the covering portion, and the fixing portion is at least partially arranged around the hard disk; The protective mechanism is made of aluminum foil.

10. The terminal device according to any one of claims 1 to 5, characterized in that: The control module includes a control circuit board and a processor mounted on the control circuit board, the processor is located above the control circuit board, and the thermal pad is located between the processor and the housing; The shell includes an upper cover, a middle shell and a lower shell connected in sequence from top to bottom, and an opening is opened on one side of the middle shell. The shell also includes an interface panel, which covers the opening of the middle shell and is connected to the middle shell. The interface panel has multiple interface holes. The control module also includes multiple interfaces installed on the control circuit board, and the multiple interfaces are respectively located in the corresponding interface holes.

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