CPU (Central Processing Unit) liquid cooling heat dissipation module

Abstract

The utility model relates to a CPU (Central Processing Unit) liquid cooling heat dissipation module, which comprises a fixed plate, the connecting plate is arranged on one side of the fixing plate, a first screw hole is formed in the middle of the connecting plate, and an adjusting bolt penetrates through the through hole to be in threaded connection with the first screw hole; the heat conduction pressing block is arranged on the side, opposite to the side provided with the fixing plate, of the connecting plate, the heat conduction pressing block is slidably connected with the connecting plate through a plurality of guide rods, the distances between the adjacent guide rods are equal, and a plurality of first elastic elements are evenly arranged between the heat conduction pressing block and the connecting plate; the distance between every two adjacent first elastic elements is equal, the side, opposite to the side provided with the connecting plate, of the heat conduction pressing block is provided with a pressing connection face, and the pressing connection face is connected with a central processing unit in a pressing mode. According to the utility model, the pressing pressure of the CPU heat dissipation module can be flexibly adjusted to meet the standard pressure range of the central processing unit, the pressing pressure can be ensured to be uniform, and the heat dissipation effect of the central processing unit is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCU module cooling, in particular to a CPU liquid cooling heat dissipation module. Background Art

[0002] As computer performance continues to improve, the central processing unit (CPU) generates a large amount of heat during operation. If the temperature is too high, the computer will experience program errors, system crashes, automatic shutdowns, and even serious problems such as internal electronic components burning out and circuit aging accelerating, leading to a decline in computer performance. The CPU cooling module can keep the temperature of the CPU within the optimal operating range and is key to ensuring stable and efficient computer operation. It is directly related to the performance, lifespan, and reliability of the hardware. Current CPU cooling modules achieve heat dissipation by fully pressing the heat dissipation components against the surface of the CPU. However, it is difficult for the CPU cooling module to ensure that its downward pressure can meet the standard range of the CPU, nor can it ensure that its downward pressure can be evenly applied to the surface of the CPU. If the force is uneven, it will not only reduce the heat dissipation effect but also damage the structure of the CPU. Utility Model Content

[0003] To this end, the technical problem to be solved by the present invention is to overcome the problem in the prior art that the downward pressure of the CPU heat dissipation module cannot meet the CPU pressure standard range and the pressure is uneven, and thus provide a CPU liquid cooling heat dissipation module, which can flexibly adjust the downward pressure of the CPU heat dissipation module to meet the central processing unit pressure standard range, and can also ensure that the downward pressure is uniform, thereby improving the heat dissipation effect of the central processing unit.

[0004] In order to solve the above technical problems, the utility model provides a CPU liquid cooling heat dissipation module, comprising: a fixing plate, a through hole being provided in the middle thereof;

[0005] a connecting plate, which is arranged on one side of the fixing plate, wherein a first screw hole is provided in the middle of the connecting plate, and an adjusting bolt passes through the through hole and is threadedly connected to the first screw hole;

[0006] A heat-conducting pressure block is arranged on the side of the connecting plate opposite to the fixed plate, the heat-conducting pressure block and the connecting plate are slidingly connected through a plurality of guide rods, and the spacing between adjacent guide rods is equal, a plurality of first elastic elements are evenly arranged between the heat-conducting pressure block and the connecting plate, and the spacing between adjacent first elastic elements is equal, the heat-conducting pressure block is provided with a pressing surface on the side opposite to the connecting plate, and the pressing surface presses the central processing unit.

[0007] In one embodiment of the present invention, a pressure sensor is further provided between the heat-conducting pressing block and the connecting plate, and the pressure sensor is used to detect the pressure value of the heat-conducting pressing block.

[0008] In one embodiment of the present invention, the connecting plate includes a first connecting plate and a second connecting plate stacked together, a plurality of the first elastic elements are arranged between the first connecting plate and the second connecting plate, the first connecting plate is adjacent to the fixed plate, the second connecting plate is adjacent to the heat-conducting pressure block, the first connecting plate and the second connecting plate are slidingly connected by the guide rod, the free end of the guide rod is provided with a limiting cap, and the adjusting bolt is threadedly connected to the first connecting plate.

[0009] In one embodiment of the present utility model, the fixed plate is provided with a plurality of first linear bearings, the second connecting plate is provided with a plurality of second linear bearings, the fixed plate and the first connecting plate are connected through a plurality of first linear bearings, and the first connecting plate and the second connecting plate are connected through a plurality of second linear bearings.

[0010] In one embodiment of the present invention, a mounting groove is provided in the middle of the second connecting plate, and the pressure sensor is arranged in the mounting groove:

[0011] In one embodiment of the present invention, the first connecting plate is provided with a first inclined surface at both ends along the first direction, the fixing plate is provided with a second inclined surface at both ends along the first direction corresponding to the first inclined surface, and a limit block is slidably provided on the first inclined surface, the limit block is connected to the second inclined surface through a second elastic element, the heat conductive pressure block is provided with a plurality of second screw holes, and the limit block is provided with a third screw hole corresponding to the plurality of second screw holes, and the limit bolts are threadedly connected to the second screw holes and the third screw holes.

[0012] In one embodiment of the present invention, the limiting block is provided with a limiting portion, the fixing plate is provided with a plurality of limiting pins distributed along the second direction, and the plurality of limiting pins are arranged on both sides of the limiting portion along the second direction.

[0013] In one embodiment of the present invention, support blocks are provided at both ends of the fixing plate along the first direction, the support blocks are detachably connected to the fixing plate, and the second inclined surface is provided on the support blocks.

[0014] In one embodiment of the present invention, a heat dissipation cavity is provided inside the thermal conductive pressure block, a liquid cooling medium is provided in the heat dissipation cavity, and a liquid inlet and a liquid outlet are respectively provided on both sides of the thermal conductive pressure block that pass through the heat dissipation cavity, and the liquid inlet and the liquid outlet are symmetrically arranged about the symmetry line of the thermal conductive pressure block.

[0015] In one embodiment of the present invention, a plurality of heat sinks are further provided inside the heat dissipation cavity, and the plurality of heat sinks are spaced apart and distributed in a direction perpendicular to a line connecting the liquid inlet and the liquid outlet.

[0016] In one embodiment of the present invention, a heat insulating sheet is further provided between the pressure sensor and the heat conductive pressure block, wherein the heat insulating sheet is conformed to the mounting groove and the plane of the heat insulating sheet fits in the mounting groove.

[0017] The above technical solution of the utility model has the following beneficial effects compared with the prior art:

[0018] The CPU liquid cooling heat dissipation module described in the present invention is connected by a fixed plate and a connecting plate through an adjusting bolt, which is flexibly driven to move the connecting plate by rotating the adjusting bolt, and the connecting plate drives the heat conductive pressure block to move, so that the stroke and downward pressure of the heat conductive pressure block can be adjusted, thereby meeting the different pressure standard ranges of the central processing unit; the adjusting screw is connected to the middle of the connecting plate to ensure that the center of gravity of the entire heat dissipation module does not shift during the movement of the connecting plate and the heat conductive pressure block, and the pressing surface can contact and disengage parallel to the central processing unit, thereby preventing damage to the structure of the central processing unit and improving the pressing effect; a plurality of elastic elements are evenly arranged between the connecting plate and the heat conductive pressure block, and the equidistant arrangement of the plurality of elastic elements is conducive to the connecting plate adjusting its own parallelism with the central processing unit, ensuring the parallelism of the pressing surface with the central processing unit, and preventing the heat conductive pressure block from overpressing the central processing unit; the equal-distance distribution of the plurality of guide rods is conducive to the center of gravity not shifting during the movement of the heat conductive pressure block, ensuring the flatness of the pressing surface and the central processing unit, and preventing the heat conductive pressure block from overpressing the central processing unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to make the content of the utility model easier to understand, the utility model is further described in detail below based on the specific embodiments of the utility model and in conjunction with the accompanying drawings, wherein

[0020] Figure 1 This is a structural diagram of a CPU liquid cooling module in a preferred embodiment of the present invention;

[0021] Figure 2 for Figure 1 The structure diagram of the exploded view of the CPU liquid cooling module is shown;

[0022] Figure 3 for Figure 2 The structural diagram of the limit block shown;

[0023] Figure 4 for Figure 1 A schematic structural diagram of a cross-sectional view of a CPU liquid cooling module is shown;

[0024] Figure 5 for Figure 4 A partial enlarged view of point A shown;

[0025] Explanation of the reference numerals in the specification: 1. fixing plate; 11. supporting block; 111. second inclined surface; 12. first linear bearing; 13. adjusting bolt; 14. limiting pin; 15. limiting bolt; 16. through hole; 17. second screw hole; 2. first connecting plate; 21. first screw hole; 22. first inclined surface; 3. second connecting plate; 31. second linear bearing; 32. first elastic element; 33. mounting groove; 4. heat-conducting pressure block; 41. guide rod; 411. limiting cap; 42. heat dissipation cavity; 43. heat sink substrate; 431. heat sink; 432. pressing surface; 44. liquid inlet; 45. liquid outlet; 5. limiting block; 51. second elastic element; 52. limiting portion; 521. third screw hole; 6. pressure sensor; 7. thermal insulation plate; Y, first direction; X, third direction; Z, second direction. DETAILED DESCRIPTION

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0027] Example

[0028] Reference Figure 1 and 2 As shown, in one embodiment of the present utility model, a CPU liquid cooling heat dissipation module is disclosed, comprising:

[0029] The fixing plate 1 has a through hole 16 in the middle, and the fixing plate 1 is fixedly connected to the chassis;

[0030] A connecting plate is provided on one side of the fixing plate 1. A first screw hole 21 is provided in the middle of the connecting plate. One end of the adjusting bolt 13 passes through the through hole 16 and is threadedly connected to the first screw hole 21. The head of the adjusting bolt 13 abuts against the fixing plate 1. The connecting plate can be driven to move along a third direction X by rotating the adjusting bolt 13, thereby changing the distance between the connecting plate and the fixing plate 1. The third direction is the vertical direction.

[0031] The heat-conducting pressure block 4 is arranged on the side of the connecting plate relative to the fixed plate 1, and the heat-conducting pressure block 4 is slidably connected to the connecting plate through four guide rods 41. The four guide rods 41 are distributed on the four corners of the square, and the square is located in the middle of the heat-conducting pressure block 4. Six first elastic elements 32 are evenly arranged between the heat-conducting pressure block 4 and the connecting plate, and the spacing between adjacent first elastic elements 32 is equal. When the connecting plate approaches the heat-conducting pressure block 4, the six first elastic elements 32 are synchronously compressed and the heat-conducting pressure block 4 is pushed. The heat-conducting pressure block 4 is provided with a pressing surface 432 on the side relative to the connecting plate, and the pressing surface 432 is coated with heat dissipation mud. The pressing surface 432 presses the central processing unit to transfer the heat generated by the central processing unit. The heat-conducting pressure block 4 is preferably made of copper, and the first elastic element 32 is preferably a spring.

[0032] Reference Figure 2 As shown, it also includes a pressure sensor 6 arranged between the thermally conductive pressure block 4 and the connecting plate. The pressure sensor 6 is used to detect the pressure value of the thermally conductive pressure block 4 on the central processing unit. If the pressure value does not conform to the set pressure value range, the test machine will issue an alarm and stop working.

[0033] Reference Figure 2 As shown, the connecting plate includes a first connecting plate 2 and a second connecting plate 3 stacked together, and six first elastic elements 32 are arranged between the first connecting plate 2 and the second connecting plate 3, wherein the first connecting plate 2 is adjacent to the fixed plate 1, and the second connecting plate 3 is adjacent to the heat-conducting pressure block 4, and the circular holes of the first connecting plate 2 and the second connecting plate 3 are both passed through by the guide rod 41 to achieve sliding connection, and the limiting cap 411 at the free end of the guide rod 41 abuts on the first connecting plate 2 for limiting the first connecting plate 2, and the first screw hole 21 is arranged in the middle of the first connecting plate 2, and the adjusting bolt 13 is threadedly connected to the first connecting plate 2.

[0034] Reference Figure 2 As shown, the fixed plate 1 is provided with four first linear bearings 12, and the first linear bearings 12 are arranged in the circular hole of the fixed plate 1. The second connecting plate 3 is provided with four second linear bearings 31, and the second linear bearings 31 are arranged in the circular hole of the second connecting plate 3. The fixed plate 1 and the first connecting plate 2 are connected through the four first linear bearings 12. Specifically, the four optical axes of the first connecting plate 2 are respectively inserted into the four first linear bearings 12; the first connecting plate 2 and the second connecting plate 3 are connected through the four second linear bearings 31. Specifically, the four optical axes of the first connecting plate 2 are respectively inserted into the four second linear bearings 31.

[0035] Reference Figure 2As shown, a mounting groove 33 is provided in the middle of the second connecting plate 3, and the pressure sensor 6 is arranged in the mounting groove 33, so that the pressure sensor 6 avoids the heat-conducting pressing block 4 to prevent the heat-conducting pressing block 4 from crushing the pressure sensor 6:

[0036] Reference Figure 3 、 4 As shown in FIG5 , the first connecting plate 2 is provided with a first inclined surface 22 at both ends along the first direction Y, and the fixing plate 1 is provided with a second inclined surface 111 at both ends along the first direction Y corresponding to the first inclined surface 22. The second inclined surface 111 is lower than the first inclined surface 22, and the angle between the first inclined surface 22 and the second inclined surface 111 is less than ninety degrees. A limit block 5 is slidably provided on the first inclined surface 22 at both ends, and the limit block 5 is connected to the second inclined surface 111 through a second elastic element 51. The support of the second elastic element 51 can make the limit block 5 stationary on the first inclined surface 22. When the limit block 5 moves obliquely downward, the second elastic element Part 51 will be compressed, the thermal conductive pressure block 4 is provided with four second screw holes 17, and the two limit blocks 5 are respectively provided with two third screw holes 521 corresponding to the four second screw holes 17. The four limit bolts 15 are first threadedly connected with the second screw holes 17, and then inserted into the third screw holes 521 and threadedly connected. Specifically, after the adjusting bolt 13 completes the adjustment of the thermal conductive pressure block 4, the four limit bolts 15 are respectively screwed into the second screw holes 17 and the third screw holes 521 to press down and limit the height of the two limit blocks 5, which is used to balance the height of the two ends of the first connecting plate 2 to avoid one end from being lifted. The second elastic element 51 is preferably a spring.

[0037] Reference Figure 2 As shown, the limit block 5 is provided with a limit portion 52, and the fixed plate 1 is provided with a plurality of limit pins 14 distributed along the second direction Z. Specifically, for the two limit blocks 5, two limit pins 14 are configured and arranged on both sides of the limit portion 52 along the second direction Z for limiting the limit block 5 in the horizontal direction. The limit pins 14 are preferably set as screws.

[0038] Reference Figure 2 and 5 As shown, support blocks 11 are provided at both ends of the fixing plate 1 along the first direction Y. To facilitate assembly, the support blocks 11 can be detachably connected to the fixing plate 1 by bolts, and the second inclined surface 111 is provided on the inner side of the support block 11 .

[0039] Reference Figure 2As shown, a heat dissipation cavity 42 is provided inside the heat conductive pressure block 4, and a liquid cooling medium is provided in the heat dissipation cavity 42. A liquid inlet 44 and a liquid outlet 45 are respectively provided on both sides of the heat conductive pressure block 4, which pass through the heat dissipation cavity 42, so as to realize the circulation of the liquid cooling medium. The liquid inlet 44 and the liquid outlet 45 are symmetrically arranged about the symmetry line of the heat conductive pressure block 4 to prevent the center of gravity of the heat dissipation module from shifting.

[0040] Reference Figure 2 As shown, a plurality of heat sinks 431 are further provided inside the heat dissipation cavity 42, and the plurality of heat sinks 431 are spaced apart in a direction perpendicular to the line connecting the liquid inlet 44 and the liquid outlet 45, so as to increase the contact area between the heat sink 431 and the liquid cooling medium and improve the heat dissipation effect. The plurality of heat sinks 431 are arranged on the heat sink substrate 43, and the heat dissipation cavity 42 is provided with an opening on the pressing surface 432 of the heat conductive pressure block 4, and the opening is conformally matched with the heat sink substrate 43, and the heat sink substrate 43 is flatly fitted to the opening to achieve sealing of the heat dissipation cavity 42. The liquid cooling medium and the heat sink 431 are preferably made of copper.

[0041] Reference Figure 2 As shown, a heat insulating sheet 7 is further included between the pressure sensor 6 and the heat conductive pressure block 4 . The heat insulating sheet 7 is conformed to the mounting groove 33 , and the plane of the heat insulating sheet 7 fits into the mounting groove 33 .

[0042] The working principle of the CPU liquid cooling heat dissipation module described in this utility model is:

[0043] After the pressing surface 432 of the heat-conducting pressure block 4 is pressed parallel to the surface of the central processing unit, the fixing plate 1 is fixed on the chassis, and the adjusting bolt 13 is rotated to adjust the downward pressure of the heat-conducting pressure block 4 until it meets the pressure standard range of the central processing unit. Then the four limit bolts 15 are tightened to adjust the height of the limit block 5 and limit the height. The infusion pipe of the liquid cooling heat dissipation circulation system is connected to the liquid inlet 44 and the liquid outlet 45, and the liquid cooling medium is circulated into the heat dissipation cavity 4242. The leakage sensor is connected to the liquid inlet 44 and the liquid outlet 45 to detect whether the liquid inlet 44 and the liquid outlet 45 are leaking. The circulating liquid cooling medium liquid sends away the heat generated by the central processing unit.

[0044] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A CPU liquid cooling module, characterized in that ,include, A fixing plate, wherein a through hole is provided in the center thereof; a connecting plate, which is arranged on one side of the fixing plate, wherein a first screw hole is provided in the middle of the connecting plate, and an adjusting bolt passes through the through hole and is threadedly connected to the first screw hole; A heat-conducting pressure block is arranged on the side of the connecting plate opposite to the fixed plate, the heat-conducting pressure block and the connecting plate are slidingly connected through a plurality of guide rods, and the spacing between adjacent guide rods is equal, a plurality of first elastic elements are evenly arranged between the heat-conducting pressure block and the connecting plate, and the spacing between adjacent first elastic elements is equal, the heat-conducting pressure block is provided with a pressing surface on the side opposite to the connecting plate, and the pressing surface presses the central processing unit.

2. A CPU liquid cooling module according to claim 1, characterized in that: It also includes a pressure sensor arranged between the heat-conducting pressing block and the connecting plate, and the pressure sensor is used to detect the pressure value of the heat-conducting pressing block.

3. A CPU liquid cooling module according to claim 2, characterized in that: The connecting plate includes a first connecting plate and a second connecting plate stacked together, a plurality of the first elastic elements are arranged between the first connecting plate and the second connecting plate, the first connecting plate is adjacent to the fixed plate, the second connecting plate is adjacent to the heat-conducting pressure block, the first connecting plate and the second connecting plate are slidingly connected by the guide rod, the free end of the guide rod is provided with a limiting cap, and the adjusting bolt is threadedly connected to the first connecting plate.

4. A CPU liquid cooling module according to claim 3, characterized in that: The fixed plate is provided with a plurality of first linear bearings, the second connecting plate is provided with a plurality of second linear bearings, the fixed plate and the first connecting plate are connected via the plurality of first linear bearings, and the first connecting plate and the second connecting plate are connected via the plurality of second linear bearings.

5. The CPU liquid cooling module according to claim 3, characterized in that: A mounting groove is provided in the middle of the second connecting plate, and the pressure sensor is arranged in the mounting groove.

6. A CPU liquid cooling module according to claim 3, characterized in that: Both ends of the first connecting plate along the first direction are provided with a first inclined surface, and both ends of the fixing plate along the first direction are provided with a second inclined surface corresponding to the first inclined surface. Limiting blocks are slidably provided on the first inclined surface, and the limiting blocks are connected to the second inclined surface through a second elastic element. The heat-conducting pressure block is provided with a plurality of second screw holes, and the limiting block is provided with a third screw hole corresponding to the plurality of second screw holes, and the limiting bolts are threadedly connected to the second screw holes and the third screw holes.

7. A CPU liquid cooling module according to claim 6, characterized in that: The limiting block is provided with a limiting portion, and the fixing plate is provided with a plurality of limiting pins distributed along the second direction, and the plurality of limiting pins are arranged on both sides of the limiting portion along the second direction.

8. The CPU liquid cooling module according to claim 6, characterized in that: Support blocks are provided at both ends of the fixing plate along the first direction. The support blocks can be detachably connected to the fixing plate, and the second inclined surface is provided on the support blocks.

9. The CPU liquid cooling module according to claim 1, characterized in that: A heat dissipation cavity is provided inside the heat conductive pressure block, and a liquid cooling medium is provided in the heat dissipation cavity. A liquid inlet and a liquid outlet are respectively provided on both sides of the heat conductive pressure block and pass through the heat dissipation cavity. The liquid inlet and the liquid outlet are symmetrically arranged about the symmetry line of the heat conductive pressure block.

10. A CPU liquid cooling module according to claim 9, characterized in that: A plurality of heat sinks are further provided inside the heat dissipation cavity, and the plurality of heat sinks are distributed at intervals along a direction perpendicular to a line connecting the liquid inlet and the liquid outlet.

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