Heat dissipation module for computer central processing unit

Abstract

The utility model discloses a heat dissipation module for a computer central processing unit, which comprises a circuit substrate, an assembly base and a high-efficiency heat dissipation mechanism, the assembly base is clamped at the top of the circuit substrate through bolts, and the high-efficiency heat dissipation mechanism is mounted on the assembly base. The efficient heat dissipation mechanism comprises a heat conduction head, heat conduction copper pipes, heat dissipation fins, an installation shell, a heat dissipation assembly and an auxiliary assembly, one ends of the multiple heat conduction copper pipes are symmetrically installed on the two sides of the heat conduction head at equal intervals, the multiple heat dissipation fins are fixedly connected to the heat conduction copper pipes in a sleeving mode at equal intervals, one side of the installation shell is fixedly connected to the side walls of the multiple heat dissipation fins, and the auxiliary assembly is fixedly connected to the side walls of the multiple heat dissipation fins. The heat dissipation assembly is installed on the other side of the installation shell, and the auxiliary assembly is installed on the tops of the heat dissipation fins, so that heat of the heat dissipation fins is discharged through the heat dissipation assembly in the installation shell, the heat conduction efficiency of the heat conduction copper pipe can be further improved through the auxiliary assembly, and the heat dissipation effect of the central processing unit is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation modules, in particular to a heat dissipation module for a computer central processing unit. Background Art

[0002] In modern computer systems, the central processing unit (CPU) is the core component that handles various computing tasks. Current cooling modules typically use a combination of fans and radiators to ensure that the CPU operates within a safe temperature range. However, over time, fans accumulate a large amount of dust, resulting in reduced cooling efficiency and thus affecting the performance and stability of the CPU.

[0003] Currently, the traditional way to solve the fan dust problem is to regularly disassemble the fan for cleaning. However, this process is not only tedious and time-consuming, but also requires certain technical knowledge and may cause damage to other components of the computer. In addition, the installation of fans and radiators usually involves multiple screws and clips. During the disassembly and reinstallation process, it is very easy to cause parts to be lost or damaged.

[0004] To this end, the utility model provides a heat dissipation module for a computer central processing unit. Utility Model Content

[0005] In view of the deficiencies in the prior art, the present invention provides a heat dissipation module for a computer central processing unit to solve the above problems.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a heat dissipation module for a computer central processing unit, comprising a circuit substrate, an assembly base and a high-efficiency heat dissipation mechanism, wherein the assembly base is clamped on the top of the circuit substrate by bolts, and the high-efficiency heat dissipation mechanism is installed on the assembly base, and the high-efficiency heat dissipation mechanism includes a thermal head, a thermal copper tube, heat dissipation fins, a mounting shell, a heat dissipation component and an auxiliary component, wherein the thermal head passes through the assembly base and abuts against the processor, one end of a plurality of the thermal copper tubes is symmetrically installed on both sides of the thermal head at equal intervals, a plurality of the heat dissipation fins are fixedly sleeved on the thermal copper tubes at equal intervals, one side of the mounting shell is fixedly connected to the side walls of the plurality of the heat dissipation fins, the heat dissipation component is installed on the other side of the mounting shell, and the auxiliary component is installed on the top of the heat dissipation fins.

[0007] Preferably, the heat dissipation assembly includes a fixed sleeve, a connecting pipe, a heat sink, a driving device, a clamping sleeve and a heat dissipation fan, wherein the fixed sleeve is fixedly connected to the other side of the mounting shell, one end of a plurality of connecting pipes is fixedly connected to the inner wall of the mounting shell in a circular array, the outer wall of the heat dissipation head is fixedly connected to the other end of the connecting pipe, the driving device is installed at the end of the heat dissipation head, one end of the clamping sleeve is fixedly connected to the output end of the driving device, and one end of the heat dissipation fan is clamped to the inner wall of the other end of the clamping sleeve through a clamping joint.

[0008] Preferably, the auxiliary component includes a storage box, a pump body, a connecting pipe, a discharge pipe, an output pipe and an input pipe, wherein the storage box is fixedly connected to the top of the heat dissipation fins, the pump body is installed on the top of the storage box, one end of the connecting pipe is fixedly connected to the output end of the pump body, the input end of the discharge pipe is fixedly connected to the other end of the connecting pipe, the output end of the discharge pipe is provided with a plurality of outlets, which are respectively fixedly connected to one end of a plurality of the heat-conducting copper pipes, the input end of the output pipe is provided with a plurality of inlets, which are fixedly connected to the other end of the heat-conducting copper pipe, the output end of the output pipe is installed on the outer wall of the mounting shell, the input pipe is provided between the outer wall of the mounting shell and the storage box, and are connected through the input pipe.

[0009] Preferably, a card slot is provided on the inner wall of the card sleeve, a card connector is fixedly connected to the end of the heat dissipation fan, and a card plate matching the card slot is fixedly connected to the outer wall of the card connector.

[0010] Preferably, the connecting pipe and the heat sink are both hollow structures, and a connecting groove is provided inside the mounting shell, with both ends of the connecting groove being respectively connected to the input end of the connecting pipe and the output end of the output pipe.

[0011] Beneficial effects

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] (1) The utility model is fixedly connected to the other end of the connecting pipe through the outer wall of the heat sink, the driving device is installed at the end of the heat sink, one end of the clamping sleeve is fixedly connected to the output end of the driving device, and one end of the heat sink fan is clamped to the inner wall of the other end of the clamping sleeve through the clamping joint. When the heat sink fan needs to be replaced, it only needs to be replaced by plugging and unplugging the clamping joint at the end of the heat sink fan, so that the heat sink fan can be cleaned conveniently.

[0014] (2) In the utility model, the output end of the output pipe is installed on the outer wall of the installation shell, and an input pipe is provided between the outer wall of the installation shell and the storage box, and the input pipe is connected, and then by injecting coolant into the interior of the storage box, and then by starting the pump body, the coolant can be circulated in sequence through the connecting pipe, the discharge pipe, the heat-conducting copper pipe, the output pipe and the input pipe. During the circulation process, the heat can be transported to the heat sink and finally discharged through the heat dissipation fan, thereby effectively improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of the utility model;

[0016] Figure 2 This is a schematic diagram of the auxiliary component structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the card connector structure of the utility model;

[0018] Figure 4 This utility model Figure 2 Schematic diagram of the locally enlarged structure at point A in the middle.

[0019] In the figure: 1. Circuit board; 2. Assembly base; 3. High-efficiency heat dissipation mechanism; 31. Heat-conducting head; 32. Heat-conducting copper tube; 33. Heat dissipation fins; 34. Mounting shell; 35. Heat dissipation assembly; 351. Fixed sleeve; 352. Connecting pipe; 353. Heat dissipation head; 354. Driving device; 355. Snap sleeve; 356. Heat dissipation fan; 3561. Snap joint; 36. Auxiliary assembly; 361. Storage box; 362. Pump body; 363. Connecting pipe; 364. Discharge pipe; 365. Output pipe; 366. Input pipe. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-4 As shown, a heat dissipation module for a computer central processing unit includes a circuit substrate 1, an assembly base 2 and a high-efficiency heat dissipation mechanism 3.

[0022] The assembly base 2 is clamped on the top of the circuit substrate 1 by bolts, and the high-efficiency heat dissipation mechanism 3 is installed on the assembly base 2.

[0023] It should be noted that a plurality of mounting holes are provided on the circuit substrate 1 described in this embodiment, and a plurality of bolts are threadedly connected to the assembly base 2, so that the assembly base 2 can be mounted on the mounting holes.

[0024] The efficient heat dissipation mechanism 3 includes a heat conducting head 31 , a heat conducting copper tube 32 , heat dissipation fins 33 , a mounting shell 34 , a heat dissipation component 35 and an auxiliary component 36 .

[0025] Among them, the thermal head 31 passes through the assembly base 2 and contacts the processor. One end of multiple thermal copper tubes 32 are symmetrically installed on both sides of the thermal head 31 at equal intervals. Multiple heat dissipation fins 33 are fixedly sleeved on the thermal copper tubes 32 at equal intervals. One side of the mounting shell 34 is fixedly connected to the side walls of the multiple heat dissipation fins 33.

[0026] It should be noted that the bottom of the heat conducting head 31 described in this embodiment is coated with silicone grease, so that the heat conducting head 31 can be pressed against the processor, and the inner walls of the multiple heat conducting copper tubes 32 are hollow structures.

[0027] The heat dissipation assembly 35 is mounted on the other side of the mounting housing 34 , and the auxiliary assembly 36 is mounted on top of the heat dissipation fins 33 .

[0028] Specifically, in order to efficiently dissipate heat for the central processing unit, the heat-conducting head 31 passes through the assembly base 2 and contacts the processor. One end of a plurality of heat-conducting copper tubes 32 is symmetrically installed on both sides of the heat-conducting head 31 at equal intervals, and a plurality of heat-dissipating fins 33 are fixedly sleeved on the heat-conducting copper tubes 32 at equal intervals. One side of the mounting shell 34 is fixedly connected to the side wall of the plurality of heat-dissipating fins 33. The heat-dissipating component 35 is installed on the other side of the mounting shell 34. The auxiliary component 36 is installed on the top of the heat-dissipating fins 33. The heat generated by the central processing unit is transferred to the heat-dissipating fins 33 through the heat-conducting copper tubes 32, and then the heat of the heat-dissipating fins 33 is discharged through the heat-dissipating component 35 in the mounting shell 34. The heat conduction efficiency of the heat-conducting copper tubes 32 can be further increased through the auxiliary component 36, thereby effectively improving the heat dissipation effect of the central processing unit.

[0029] In one embodiment of the present invention, Figures 1-4 As shown, the heat dissipation assembly 35 includes a fixed sleeve 351, a connecting pipe 352, a heat dissipation head 353, a driving device 354, a clamping sleeve 355 and a heat dissipation fan 356, wherein the fixed sleeve 351 is fixedly connected to the other side of the mounting shell 34, one end of a plurality of connecting pipes 352 is fixedly connected to the inner wall of the mounting shell 34 in a circular array, the outer wall of the heat dissipation head 353 is fixedly connected to the other end of the connecting pipe 352, the driving device 354 is installed at the end of the heat dissipation head 353, one end of the clamping sleeve 355 is fixedly connected to the output end of the driving device 354, and one end of the heat dissipation fan 356 is clamped to the inner wall of the other end of the clamping sleeve 355 through the clamping joint 3561.

[0030] Furthermore, if Figure 2-Figure 4 As shown, a card slot is formed on the inner wall of the card sleeve 355 , the end of the heat dissipation fan 356 is fixedly connected to a card joint 3561 , and a card plate matching the card slot is fixedly connected to the outer wall of the card joint 3561 .

[0031] It should be noted that the driving device 354 described in this embodiment is a driving motor, and the end of the clamping joint 3561 is fixedly connected to a magnetic head, and the inner wall end of the clamping sleeve 355 is embedded with a magnet.

[0032] Specifically, in order to facilitate the removal of the cooling fan 356, the fixed sleeve 351 is fixedly connected to the other side of the mounting shell 34, one end of a plurality of connecting tubes 352 is fixedly connected to the inner wall of the mounting shell 34 in a circular array, the outer wall of the heat dissipation head 353 is fixedly connected to the other end of the connecting tube 352, the driving device 354 is installed at the end of the heat dissipation head 353, one end of the clamping sleeve 355 is fixedly connected to the output end of the driving device 354, and one end of the cooling fan 356 is clamped to the inner wall of the other end of the clamping sleeve 355 through the clamping joint 3561. When the cooling fan 356 needs to be replaced, it only needs to be replaced by unplugging and plugging the clamping joint 3561 at the end of the cooling fan 356, so that the cooling fan 356 can be conveniently cleaned.

[0033] In one embodiment of the present invention, Figures 1-4 As shown, the auxiliary component 36 includes a storage box 361, a pump body 362, a connecting pipe 363, a discharge pipe 364, an output pipe 365 and an input pipe 366, wherein the storage box 361 is fixedly connected to the top of the heat dissipation fin 33, the pump body 362 is installed on the top of the storage box 361, one end of the connecting pipe 363 is fixedly connected to the output end of the pump body 362, the input end of the discharge pipe 364 is fixedly connected to the other end of the connecting pipe 363, the output end of the discharge pipe 364 is provided with multiple outlets, and are respectively fixedly connected to one end of multiple heat-conducting copper tubes 32, the input end of the output pipe 365 is provided with multiple inlets, and are fixedly connected to the other end of the heat-conducting copper tube 32, the output end of the output pipe 365 is installed on the outer wall of the mounting shell 34, and an input pipe 366 is provided between the outer wall of the mounting shell 34 and the storage box 361, and is connected through the input pipe 366.

[0034] Furthermore, if Figure 1 As shown, the connecting pipe 352 and the heat sink 353 are both cavity structures, and a connecting groove is opened inside the mounting shell 34, and the two ends of the connecting groove are respectively connected to the input end of the connecting pipe 352 and the output end of the output pipe 365.

[0035] Specifically, in order to further improve the heat dissipation effect, the storage box 361 is fixedly connected to the top of the heat dissipation fin 33, the pump body 362 is installed on the top of the storage box 361, one end of the connecting pipe 363 is fixedly connected to the output end of the pump body 362, the input end of the discharge pipe 364 is fixedly connected to the other end of the connecting pipe 363, the output end of the discharge pipe 364 is provided with multiple outlets, and are respectively fixedly connected to one end of multiple heat-conducting copper pipes 32, the input end of the output pipe 365 is provided with multiple inlets, and are fixedly connected to the other end of the heat-conducting copper pipe 32, and the output of the output pipe 365 is provided with multiple inlets. The output end is installed on the outer wall of the mounting shell 34. An input pipe 366 is provided between the outer wall of the mounting shell 34 and the storage box 361, and is connected through the input pipe 366. Then, by injecting coolant into the interior of the storage box 361, and then starting the pump body 362, the coolant can be circulated in sequence through the connecting pipe 363, the discharge pipe 364, the heat-conducting copper tube 32, the output pipe 365 and the input pipe 366. During the circulation process, the heat can be transported to the heat dissipation head 353, and finally discharged through the heat dissipation fan 356, thereby effectively improving the heat dissipation efficiency.

[0036] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0037] Working principle: Multiple heat sink fins 33 are fixedly sleeved on the thermal copper tube 32 at equal intervals, one side of the mounting shell 34 is fixedly connected to the side wall of the multiple heat sink fins 33, the heat sink component 35 is installed on the other side of the mounting shell 34, and the auxiliary component 36 is installed on the top of the heat sink fins 33. The heat generated by the central processing unit is transferred to the heat sink fins 33 through the thermal copper tube 32, and then the heat of the heat sink fins 33 is discharged through the heat sink component 35 in the mounting shell 34. The auxiliary component 36 can further increase the thermal conductivity efficiency of the thermal copper tube 32, thereby effectively improving the heat dissipation effect of the central processing unit.

[0038] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0039] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation module for a computer central processing unit, characterized in that: It comprises a circuit substrate (1), an assembly base (2) and a high-efficiency heat dissipation mechanism (3), wherein: The assembly base (2) is clamped to the top of the circuit substrate (1) by means of bolts, and the high-efficiency heat dissipation mechanism (3) is mounted on the assembly base (2); The high-efficiency heat dissipation mechanism (3) comprises a heat conducting head (31), a heat conducting copper tube (32), heat dissipation fins (33), a mounting shell (34), a heat dissipation component (35) and an auxiliary component (36), wherein: The heat conducting head (31) passes through the assembly base (2) and contacts the processor, one end of a plurality of heat conducting copper tubes (32) is symmetrically installed at equal intervals on both sides of the heat conducting head (31), a plurality of heat dissipation fins (33) are fixedly sleeved on the heat conducting copper tubes (32) at equal intervals, and one side of the mounting shell (34) is fixedly connected to the side walls of the plurality of heat dissipation fins (33); The heat dissipation component (35) is installed on the other side of the installation shell (34), and the auxiliary component (36) is installed on the top of the heat dissipation fin (33).

2. The heat dissipation module for a computer central processing unit according to claim 1, characterized in that: The heat dissipation assembly (35) includes a fixed sleeve (351), a connecting pipe (352), a heat dissipation head (353), a driving device (354), a clamping sleeve (355) and a heat dissipation fan (356), wherein: The fixed sleeve (351) is fixedly connected to the other side of the mounting shell (34); one end of a plurality of connecting tubes (352) is fixedly connected to the inner wall of the mounting shell (34) in a circumferential array; the outer wall of the heat dissipation head (353) is fixedly connected to the other end of the connecting tube (352); and the driving device (354) is installed at the end of the heat dissipation head (353); One end of the snap-fit ​​sleeve (355) is fixedly connected to the output end of the driving device (354), and one end of the heat dissipation fan (356) is snap-fitted to the inner wall of the other end of the snap-fit ​​sleeve (355) via a snap-fit ​​joint (3561).

3. The heat dissipation module for a computer central processing unit according to claim 2, characterized in that: The auxiliary component (36) includes a storage tank (361), a pump body (362), a connecting pipe (363), a discharge pipe (364), an output pipe (365) and an input pipe (366), wherein: The storage box (361) is fixedly connected to the top of the heat dissipation fin (33), the pump body (362) is installed on the top of the storage box (361), one end of the connecting pipe (363) is fixedly connected to the output end of the pump body (362), the input end of the discharge pipe (364) is fixedly connected to the other end of the connecting pipe (363), and the output end of the discharge pipe (364) is provided with multiple outlets, which are respectively fixedly connected to one end of multiple heat-conducting copper pipes (32); The input end of the output pipe (365) is provided with a plurality of inlets and is fixedly connected to the other end of the heat-conducting copper pipe (32). The output end of the output pipe (365) is installed on the outer wall of the installation shell (34). The input pipe (366) is provided between the outer wall of the installation shell (34) and the storage box (361), and is connected through the input pipe (366).

4. The heat dissipation module for a computer central processing unit according to claim 2, wherein: A card slot is provided on the inner wall of the card sleeve (355); a card joint (3561) is fixedly connected to the end of the heat dissipation fan (356); and a card plate matching the card slot is fixedly connected to the outer wall of the card joint (3561).

5. The heat dissipation module for a computer central processing unit according to claim 3, characterized in that: The connecting pipe (352) and the heat sink (353) are both hollow structures, and a connecting groove is provided inside the mounting shell (34), with both ends of the connecting groove being respectively connected to the input end of the connecting pipe (352) and the output end of the output pipe (365).

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