Heat dissipation structure based on extensible and compressible solid-state storage hard disk module

Abstract

The utility model discloses a heat dissipation structure based on an extensible and compressible solid-state storage hard disk module, which relates to the technical field of memory chip modules and comprises a first flash memory module, a second flash memory module, a connector, an onboard heat dissipation sheet, an application end PCB (printed circuit board) and a bottom heat dissipation sheet. The first flash memory module and the second flash memory module are fixedly connected with the top of the connector; the connector passes through the onboard radiating fin and is fixedly connected with the top of the application end PCB; the bottom cooling fin is fixedly mounted at the bottom of the application end PCB; the onboard cooling fin is of an axial symmetry structure, curled edges are arranged on the two sides of the onboard cooling fin, a plurality of ventilation holes are formed in the surfaces of the curled edges, and the number and the positions of the ventilation holes in the two sides of the onboard cooling fin correspond to each other. The beneficial effects of the utility model are that: can be applicable to desktop computer, workstation server, notebook computer, multimedia billboard, network terminal and other medium and large scale equipment, and can optimize the heat dissipation efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of memory chip modules, and more particularly to a heat dissipation structure based on an expandable and compressed solid-state storage hard disk module. Background Art

[0002] The three common module connection and assembly methods are embedded welding, connector slots, and board-to-board pin connections. Embedded welding refers to assembly to the device by welding, such as eMMC and UFS. The advantage is that it is compact and lightweight, but the disadvantage is that it is inconvenient to upgrade and replace. The connector slot is connected via a spring connector and fixed with structures such as screws and clips, such as conventional memory modules and solid-state drives with M.2 interfaces. The advantage is that upgrades and replacements are simple, but the spring pin structure and material limitations, such as defects in conductivity, equal length, impedance, and shielding protection, cannot meet the needs of higher frequency applications. The connector structure takes up space, limiting lightweight applications. With the small size and high density, the seismic stability of micro storage hard drive modules tends to weaken, and cannot meet the needs of next-generation technology. Board-to-board pin connection was first used in CPUs. It uses high-precision and tiny board-to-board spring pins to connect. Because the spring pins are extremely short and highly consistent, they are more suitable for high-frequency product applications. Among them, memory modules were the first to adopt board-to-board pin connection, giving birth to two types of compressed attached memory modules: LPCAMM2 (Low power DDRV CAMM2 module) and CAMM2 (Compression Attached Memory Module); however, board-to-board modules in the flash storage field are still in the exploratory stage, and standardized board-to-board pin connection modules and peripheral accessories such as onboard heat sinks have not yet been formed.

[0003] In this regard, the utility model provides a heat dissipation structure based on an expandable compressed solid-state storage hard disk module, which can be applied to medium and large devices such as desktop computers, workstation servers, notebook computers, multimedia billboards, network terminals, and can optimize heat dissipation efficiency. Utility Model Content

[0004] In order to overcome the shortcomings of the existing technology, the utility model provides a heat dissipation structure based on an expandable compressed solid-state storage hard disk module, which can be applied to medium and large devices such as desktop computers, workstation servers, notebook computers, multimedia billboards, network terminals, etc., and can optimize heat dissipation efficiency.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a heat dissipation structure based on an expandable compressed solid-state storage hard disk module, the improvement of which is that it includes a first flash memory module, a second flash memory module, a connector, an onboard heat sink, an application-end PCB circuit board, and a bottom heat sink; the first flash memory module and the second flash memory module are both fixedly connected to the top of the connector; the connector passes through the onboard heat sink and is fixedly connected to the top of the application-end PCB circuit board; the bottom heat sink is fixedly installed on the bottom of the application-end PCB circuit board;

[0006] The onboard heat sink has an axially symmetrical structure, the length of the onboard heat sink is adapted to the sum of the length of the first flash memory module and the length of the second flash memory module, and curling edges are provided on both sides of the onboard heat sink. A plurality of ventilation holes are provided on the surface of the curling edges, and the number and position of the ventilation holes on both sides of the onboard heat sink correspond to each other.

[0007] In the above structure, the onboard heat sink further includes an avoidance hollow, which is located in the middle of the onboard heat sink, and the shape and size of the avoidance hollow are adapted to the shape and size of the connector.

[0008] In the above structure, the onboard heat sink is further provided with first screw holes, and the first screw holes are distributed at the four corners of the onboard heat sink and at the end positions avoiding the hollowing.

[0009] In the above structure, second screw holes are provided on the bottom heat sink. The second screw holes are arranged around the edge of the bottom heat sink and are matched with the distribution positions of the first screw holes.

[0010] In the above structure, the heat dissipation structure based on the expandable compressed solid-state storage hard disk module further includes a first fixing screw, which passes through the second screw hole, the application-end PCB circuit board and the first screw hole in sequence.

[0011] In the above structure, third screw holes are provided at the edge of the onboard heat sink, and the third screw holes are located on both sides of the avoidance hollowing.

[0012] In the above structure, the heat dissipation structure based on the expandable and compressed solid-state storage hard disk module further includes a positioning column bracket, and the positioning column bracket is fixedly installed on the top of the third screw hole.

[0013] In the above structure, the positioning column bracket includes a bracket body, a positioning column and a positioning pin. A fourth screw hole is provided on the surface of the bracket body, and the fourth screw hole is communicated with the third screw hole; the positioning column is fixedly installed on the top of the bracket body and is located on both sides of the fourth screw hole; the positioning pin is fixedly installed on the bottom of the bracket body and is located on both sides of the fourth screw hole, and is inserted into the onboard heat sink.

[0014] In the above structure, the heat dissipation structure based on the expandable compression solid-state storage hard disk module further includes a second fixing screw, and the second fixing screw passes through the third screw hole and the fourth screw hole in sequence.

[0015] The beneficial effects of the present invention are as follows: the present invention realizes board-to-board pin connection through a connector and a flash memory chip, so as to be applicable to high-frequency equipment; curling is designed on both sides of the heat sink, and multiple ventilation holes are designed on the curling to form air convection, so as to improve the heat dissipation efficiency; and the heat sink is designed with an axisymmetric structure, so that one heat sink can be assembled with two flash memory modules, further improving the heat dissipation efficiency; thus, the present invention can be applicable to medium and large equipment such as desktop computers, workstation servers, laptops, multimedia billboards, network terminals, etc., and can optimize the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation structure based on an expandable and compressed solid-state storage hard disk module of the present invention;

[0017] Figure 2 The utility model is a structural schematic diagram of an onboard heat sink based on the heat dissipation structure of an expandable compressed solid-state storage hard disk module. DETAILED DESCRIPTION

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.

[0020] Reference Figure 1 and Figure 2As shown, the utility model discloses a heat dissipation structure based on an expandable compressed solid-state storage hard disk module, including a first flash memory module 1, a second flash memory module 2, a connector 4, an onboard heat sink 3, an application-end PCB circuit board 5 and a bottom heat sink 6; the first flash memory module 1 and the second flash memory module 2 are both fixedly connected to the top of the connector 4; the connector 4 passes through the onboard heat sink 3 and is fixedly connected to the top of the application-end PCB circuit board 5; the bottom heat sink 6 is fixedly installed on the bottom of the application-end PCB circuit board 5; the onboard heat sink 3 is an axially symmetrical structure, the length of the onboard heat sink 3 is adapted to the sum of the length of the first flash memory module 1 and the length of the second flash memory module 2, and curling edges 10 are provided on both sides of the onboard heat sink 3, and a plurality of ventilation holes 11 are provided on the surface of the curling edge 10, and the number and position of the ventilation holes 11 on both sides of the onboard heat sink 3 correspond to each other.

[0021] It should be noted that, in this embodiment, the first flash memory module 1 and the second flash memory module 2 are both scalable compressed solid-state storage hard disk modules. Specifically, the scalable compressed solid-state storage hard disk module includes a PCB motherboard, a flash memory chip, a control chip and a circular pad matrix; wherein the PCB motherboard is the structural basis of the entire scalable compressed solid-state storage hard disk module, and is used to provide circuit connection and mechanical support; the flash memory chip is used for data storage and reading, and this embodiment adopts the high-speed packaging specification BGA154 Ba ll to increase the transmission frequency; the control chip is responsible for managing the data transmission and access operations of the flash memory chip, and can perform basic operations such as data reading, writing and erasing, and also undertakes functions such as error detection and correction, and data encryption; the circular pad matrix is ​​used to provide connection points to realize a board-to-board pin connection method between the PCB mainboard and the application-end PCB circuit board 5, which is suitable for high-frequency equipment; the connector 4 is used to connect the first flash memory module 1, the second flash memory module 2 and the application-end PCB circuit board 5, and the connector 4 is designed with spring pins, which contact the circular pad matrix to realize a board-to-board pin connection method between the first flash memory module 1 / the second flash memory module 2 and the application-end PCB circuit board 5, which is suitable for high-frequency products; the application-end PCB circuit board 5 is used to connect to a specific application device to complete data input and output; the onboard heat sink 3 is used to reduce the operating temperature of the flash memory module to prevent performance degradation or damage caused by overheating; the bottom heat sink 6 is in direct contact with the application-end PCB circuit board 5, and uses thermal conductivity to conduct heat to a larger area of ​​heat dissipation surface to improve overall heat dissipation performance, ensure that heat can be quickly dissipated, and protect the application-end PCB circuit board. Working stability of the CB circuit board 5; in the specific implementation of the present invention, the connector 4 contacts the circular pad matrix of the first flash memory module 1 / the second flash memory module 2 through a spring pin to realize a pin-to-board connection between the first flash memory module 1 / the second flash memory module 2 and the application-end PCB circuit board 5, which is more suitable for high-frequency products and can be applied to medium and large-scale equipment such as desktop computers, workstation servers, laptops, multimedia billboards, and network terminals; the onboard heat sink 3 can simultaneously support the installation of the first flash memory module 1 and the second flash memory module 2. This dual-position design can effectively increase the heat dissipation surface area and optimize heat distribution, ensuring that the first flash memory module 1 and the second flash memory module 2 maintain a low temperature at the same time, helping to evenly distribute heat, prevent local overheating, and ensure the stability and reliability of the entire heat dissipation structure; the heat sink is designed with an axially symmetrical structure, and there is no need to identify the left and right directions during actual application installation, so as to facilitate the assembly of the entire heat dissipation structure; the onboard heat sink 3 forms an electromagnetic interference shielding and ESD protection shielding on both sides of the connector 4 by designing curling edges 10 and ventilation holes 11 on both sides. At the same time, the ventilation holes 11 can form air convection to improve heat dissipation efficiency;The onboard heat sink 3 and bottom heat sink 6 are sandwiched together to form a sandwich-type heat sink assembly, further improving heat dissipation performance. Furthermore, considering the scalability of the first flash memory module 1 and the second flash memory module 2, the curled edges 10 and ventilation holes 11 are designed only on the sides of the onboard heat sink 3 to avoid structural interference. Therefore, this embodiment is suitable for medium-to-large devices such as desktop computers, workstation servers, laptops, multimedia billboards, and network terminals, and can optimize heat dissipation efficiency.

[0022] Continue to refer to Figure 1 and Figure 2 As shown, the onboard heat sink 3 further includes an avoidance hollow 13 , which is located in the middle of the onboard heat sink 3 , and the shape and size of the avoidance hollow 13 are adapted to the shape and size of the connector 4 .

[0023] It should be noted that, in this embodiment, the design of the avoidance hollowing 13 is to adapt to the assembly of the connector 4, and the connector 4 is designed in a dual-position structure to ensure the electrical connection between the first flash memory module 1, the second flash memory module 2 and the application end PCB circuit board 5.

[0024] Continue to refer to Figure 1 and Figure 2 As shown, the onboard heat sink 3 is also provided with a first screw hole 12, and the first screw hole 12 is distributed at the four corners of the onboard heat sink 3 and the end position avoiding the hollow 13; the bottom heat sink 6 is provided with a second screw hole, and the second screw hole ring is arranged at the edge position of the bottom heat sink 6 and is adapted to the distribution position of the first screw hole 12; the heat dissipation structure based on the expandable compressed solid-state storage hard disk module also includes a first fixing screw 7, and the first fixing screw 7 passes through the second screw hole, the application end PCB circuit board 5 and the first screw hole 12 in sequence.

[0025] It should be noted that, in this embodiment, the design of the first screw hole 12, the second screw hole and the first fixing screw 7 is to respectively fix the onboard heat sink 3 and the bottom heat sink 6 to the top and bottom of the application end PCB circuit board 5, so as to ensure the stability of the clamping heat sink combination formed between the onboard heat sink 3 and the bottom heat sink 6, thereby ensuring good heat dissipation performance.

[0026] Continue to refer to Figure 1 and Figure 2As shown, a third screw hole 14 is provided at the edge of the onboard heat sink 3, and the third screw hole 14 is located on both sides of the avoidance hollow 13; the heat dissipation structure based on the expandable compression solid-state storage hard disk module also includes a positioning column bracket 9, and the positioning column bracket 9 is fixedly installed on the top of the third screw hole 14; the positioning column bracket 9 includes a bracket body, a positioning column and a positioning pin, and a fourth screw hole is provided on the surface of the bracket body, and the fourth screw hole is communicated with the third screw hole 14; the positioning column is fixedly installed on the top of the bracket body and is located on both sides of the fourth screw hole; the positioning pin is fixedly installed on the bottom of the bracket body and is located on both sides of the fourth screw hole, and is inserted into the onboard heat sink 3; the heat dissipation structure based on the expandable compression solid-state storage hard disk module also includes a second fixing screw 8, and the second fixing screw 8 passes through the third screw hole 14 and the fourth screw hole in turn.

[0027] It should be noted that, in this embodiment, the third screw hole 14, the fourth screw hole and the second fixing screw 8 are designed to fix the positioning column bracket 9 on the onboard heat sink 3; the positioning column bracket 9 is fixed to the first flash memory module 1 / the second flash memory module 2 through the positioning column to ensure the stability of the entire heat dissipation structure.

[0028] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A heat dissipation structure based on an expandable and compressed solid-state storage hard disk module, characterized in that: The device comprises a first flash memory module, a second flash memory module, a connector, an onboard heat sink, an application-end PCB, and a bottom heat sink; the first flash memory module and the second flash memory module are both fixedly connected to the top of the connector; the connector passes through the onboard heat sink and is fixedly connected to the top of the application-end PCB; the bottom heat sink is fixedly mounted on the bottom of the application-end PCB; The onboard heat sink has an axially symmetrical structure, the length of the onboard heat sink is adapted to the sum of the length of the first flash memory module and the length of the second flash memory module, and curling edges are provided on both sides of the onboard heat sink. A plurality of ventilation holes are provided on the surface of the curling edges, and the number and position of the ventilation holes on both sides of the onboard heat sink correspond to each other.

2. The heat dissipation structure based on the scalable compressed solid-state storage hard disk module according to claim 1, characterized in that: The onboard heat sink further includes an avoidance hollowing, which is located in the middle of the onboard heat sink, and the shape and size of the avoidance hollowing are adapted to the shape and size of the connector.

3. The heat dissipation structure based on the scalable compressed solid-state storage hard disk module according to claim 2, characterized in that: The onboard heat sink is further provided with first screw holes, which are distributed at the four corners of the onboard heat sink and at the end positions avoiding the hollowing out.

4. The heat dissipation structure based on the scalable compressed solid-state storage hard disk module according to claim 3, characterized in that: The bottom heat sink is provided with second screw holes, which are arranged at the edge of the bottom heat sink and are matched with the distribution positions of the first screw holes.

5. The heat dissipation structure based on the scalable compressed solid-state storage hard disk module according to claim 4, characterized in that: The heat dissipation structure based on the expandable compressed solid-state storage hard disk module also includes a first fixing screw, which passes through the second screw hole, the application-end PCB circuit board and the first screw hole in sequence.

6. The heat dissipation structure based on the scalable compressed solid-state storage hard disk module according to claim 3, characterized in that: A third screw hole is provided at the edge of the onboard heat sink, and the third screw hole is located on both sides of the avoidance hollowing.

7. The heat dissipation structure based on the scalable compressed solid-state storage hard disk module according to claim 6, characterized in that: The heat dissipation structure based on the expandable compressed solid-state storage hard disk module further includes a positioning column bracket, and the positioning column bracket is fixedly installed on the top of the third screw hole.

8. The heat dissipation structure based on the expandable compressed solid-state storage hard disk module according to claim 7, characterized in that: The positioning column bracket includes a bracket body, a positioning column and a positioning pin. A fourth screw hole is provided on the surface of the bracket body, and the fourth screw hole is communicated with the third screw hole; the positioning column is fixedly installed on the top of the bracket body and is located on both sides of the fourth screw hole; the positioning pin is fixedly installed on the bottom of the bracket body and is located on both sides of the fourth screw hole, and is inserted into the onboard heat sink.

9. The heat dissipation structure based on the expandable compressed solid-state storage hard disk module according to claim 8, characterized in that: The heat dissipation structure based on the expandable compressed solid-state storage hard disk module further includes a second fixing screw, which passes through the third screw hole and the fourth screw hole in sequence.

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