Test structure based on compressed storage hard disk module

Abstract

The utility model discloses a test structure based on a compressed storage hard disk module, which relates to the technical field of memory chip modules and comprises a tail fixing part, a flash memory module, a heat dissipation component and a test component. The flash memory module is fixedly mounted between the tail fixing piece and the test assembly; the heat dissipation assembly is arranged between the test assembly and the flash memory module; the testing assembly comprises a testing seat pressing frame, a first spring, a testing plate, a testing seat bottom support, a pressing plate piece, a testing needle rubber core and a testing needle; the first spring is fixedly connected between the test seat pressing frame and the test seat bottom support and is located at the edge position of the test seat pressing frame; one end of the pressing plate piece is in sliding connection with the test seat pressing frame, and the other end is close to the test needle rubber core; the test pin is inserted into the test pin rubber core; and one side of the test plate is fixed with the tail fixing piece, and the other side of the test plate is fixed with the test needle rubber core. The beneficial effects of the utility model are that the heat dissipation performance can be optimized, and the test yield and the data accuracy can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of memory chip modules, and more particularly to a test structure based on a compression storage hard disk module. Background Art

[0002] The mini-compression storage disk module (mCSDM), standard compression storage disk module (CSDM), and extended compression storage disk module are next-generation storage disk modules, designed for thin and light devices, small and medium-sized standard devices, and medium and large devices, respectively. Automated production testing of compression storage disk modules is crucial for their rapid and large-scale adoption.

[0003] To this end, the utility model provides a test structure based on a compression storage hard disk module, which can optimize heat dissipation performance and ensure test yield and data accuracy. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a test structure based on a compression storage hard disk module, which can optimize heat dissipation performance and ensure test yield and data accuracy.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a test structure based on a compression storage hard disk module, the improvement of which is that the test structure based on the compression storage hard disk module includes a tail fixing member, a flash memory module, a heat dissipation assembly and a test assembly; the flash memory module is fixedly installed between the tail fixing member and the test assembly; the heat dissipation assembly is arranged between the test assembly and the flash memory module;

[0006] The test assembly includes a test seat pressure frame, a first spring, a test plate, a test seat base, a pressure plate, a test pin rubber core and a test pin; the first spring is fixedly connected between the test seat pressure frame and the test seat base, and is located at the edge of the test seat pressure frame; one end of the pressure plate is slidably connected to the test seat pressure frame, and the other end is close to the test pin rubber core; the test pin is inserted into the test pin rubber core; one side of the test plate is fixed to the tail fixing piece, and the other side is fixed to the test pin rubber core.

[0007] In the above structure, the heat dissipation component includes a heat sink and heat dissipation silica gel, and the heat dissipation silica gel and the heat sink are both arranged between the flash memory module and the test board, with the heat dissipation silica gel close to the flash memory module and the heat sink close to the test board.

[0008] In the above structure, the test needle rubber core includes a first structure, a second structure and a second spring; the second spring is fixedly connected between the first structure and the second structure.

[0009] In the above structure, the first structure and the second structure are provided with interconnected pinholes, the test needles are inserted into the pinholes, and the number and size of the pinholes are adapted to the number and size of the test needles.

[0010] In the above structure, a first pad matrix is ​​provided on one side of the flash memory module, and the first pad matrix is ​​close to a side of the first structure body away from the second structure body.

[0011] In the above structure, a second pad matrix is ​​provided on one side of the test board, and the second pad matrix is ​​close to a side of the second structure away from the first structure.

[0012] In the above structure, the tail fixing member is provided with a first positioning post on a side surface close to the test board, and the first positioning post is inserted into the test board.

[0013] In the above structure, the second structure is provided with a second positioning post and a third positioning post on the side close to the test board. The second positioning post and the third positioning post are respectively located on both sides of the pinhole, and the second positioning post and the third positioning post are both inserted into the test board.

[0014] In the above structure, the tail fixing piece is provided with a fourth positioning post and a guiding bevel on the side close to the flash memory module. The fourth positioning post is inserted on the flash memory module; the guiding bevel is close to the fourth positioning post and the end of the flash memory chip.

[0015] The beneficial effects of the present invention are: by pressing the test needle pressure frame, the two ends of the test needle are respectively in contact with the test board and the flash memory module, thereby achieving electrical connection between the test board and the flash memory module to test the flash memory module; by installing a heat dissipation component on the flash memory module and the test component, the heat dissipation performance can be optimized, and the test yield and data accuracy can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of a test structure based on a compression storage hard disk module of the present invention;

[0017] Figure 2 This is a structural diagram of a test needle rubber core of a test structure based on a compression storage hard disk module of the present invention;

[0018] Figure 3 This is a structural diagram of a test component of a test structure based on a compression storage hard disk module of the present invention. DETAILED DESCRIPTION

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.

[0021] Reference Figure 1-Figure 3 As shown, the utility model discloses a test structure based on a compression storage hard disk module, and the test structure based on the compression storage hard disk module includes a tail fixing part 1, a flash memory module 2, a heat dissipation component and a test component; the flash memory module 2 is fixedly installed between the tail fixing part 1 and the test component; the heat dissipation component is arranged between the test component and the flash memory module 2; the test component includes a test seat pressure frame 7, a first spring 10, a test board 3, a test seat base 6, a pressure plate part 8, a test needle rubber core 9 and a test needle 16; the first spring 10 is fixedly connected to the test seat pressure frame 7 between the test seat base 6, and is located at the edge of the test seat pressure frame 7; one end of the pressure plate part 8 is slidably connected to the test seat pressure frame 7, and the other end is close to the test needle rubber core 9; the test needle 16 is inserted in the test needle rubber core 9; one side of the test board 3 is fixed to the tail fixing part 1, and the other side is fixed to the test needle rubber core 9.

[0022] It should be noted that, in this embodiment, the flash memory module 2 is a product to be tested, and its performance needs to be tested through the entire test structure to ensure its reliability in actual application; the tail fixing member 1 is used as a fixing member for installing the flash memory module 2 and the test component; the heat dissipation component is used to dissipate heat for the flash memory module 2 during the test; the test component is used to perform performance testing on the flash memory module 2, specifically, the test component includes a test seat pressure frame 7, a first spring 10, a test board 3, a test seat base 6, a pressure plate 8, a test needle rubber core 9 and a test needle 16, wherein the test seat pressure frame 7 and the test The test seat base 6 serves as the basic structure of the test assembly, and is used to provide support and operating surface; the first spring 10 is used to connect the test seat pressure frame 7 and the test seat base 6 to achieve automatic rebound after pressing the test seat pressure frame 7; the test board 3 is used to perform performance testing on the flash memory module 2; the pressure plate 8 and the test seat pressure frame 7 are connected by a latch-type sliding connection, and the pressure plate 8 can be rotated around the end to open by pressing one side of the test seat pressure frame 7, so as to facilitate the removal and placement of the flash memory module 2; the test pin rubber core 9 is used to protect the test pin 16; the test pin 16 is used to achieve electrical connection between the flash memory module 2 and the test board 3. When the present invention is implemented, the pressure plate 8 is opened by pressing the test seat pressure frame 7, and one side of the flash memory module 2 is placed between the pressure plate 8 and the test needle rubber core 9, and the other side is fixed to the tail fixing part 1; then the middle position of the test seat pressure frame 7 is pressed down, so that the two ends of the test needle 16 are respectively in contact with the test board 3 and the flash memory module 2, thereby realizing the electrical connection between the test board 3 and the flash memory module 2, so as to perform performance testing on the flash memory module 2; since a heat dissipation component is installed between the flash memory module 2 and the test needle rubber core 9, during the test process, the heat dissipation performance can be optimized, and the test yield and data accuracy can be guaranteed.

[0023] Reference Figure 1 and Figure 3 As shown, the heat dissipation component includes a heat sink 5 and a heat dissipation silicone 4, and the heat dissipation silicone 4 and the heat sink 5 are both arranged between the flash memory module 2 and the test board 3, and the heat dissipation silicone 4 is close to the flash memory module 2, and the heat sink 5 is close to the test board 3.

[0024] It should be noted that, in this embodiment, the heat sink 5 and the heat dissipating silicone 4 are arranged between the flash memory module 2 and the test board 3. When the flash memory module 2 is installed, the flash memory module 2 contacts the heat dissipating silicone 4, and the heat is transferred to the heat sink 5 and the test board 3, so as to achieve rapid heat dissipation of the flash memory module 2 and ensure the test yield and data accuracy.

[0025] Reference Figure 1-Figure 3As shown, the test pin rubber core 9 includes a first structure 13, a second structure 14 and a second spring 15; the second spring 15 is fixedly connected between the first structure 13 and the second structure 14; the first structure 13 and the second structure 14 are provided with interconnected pinholes 20, the test pins 16 are inserted into the pinholes 20, and the number and size of the pinholes 20 are adapted to the number and size of the test pins 16; a first solder pad matrix is ​​provided on one side of the flash memory module 2, and the first solder pad matrix is ​​close to the side of the first structure 13 away from the second structure 14; a second solder pad matrix is ​​provided on one side of the test board 3, and the second solder pad matrix is ​​close to the side of the second structure 14 away from the first structure 13.

[0026] It should be noted that, in this embodiment, by providing interconnected pinholes 20 in the first structure 13 and the second structure 14, the test pin 16 can be hidden in the test pin rubber core 9; the design of the second spring 15 can realize automatic rebound between the first structure 13 and the second structure 14; the first solder pad matrix can realize a board-to-board pin connection between the flash memory module 2 and the test pin 16; the second solder pad matrix can realize a board-to-board pin connection between the test board 3 and the test pin 16. When the present invention is implemented, it is only necessary to press the test seat pressure frame 7, and pressure will be applied to the test needle rubber core 9. At this time, the second spring 15 is compressed, the first structure 13 and the second structure 14 are close to each other, and the test needle 16 is exposed from the pinhole 20 and contacts the first solder pad and the second solder pad to test the flash memory module 2; when the test is completed, the pressure applied to the test seat pressure frame 7 is canceled, and the pressure on the test needle rubber core 9 also disappears immediately, the second spring 15 automatically rebounds, and the first structure 13 and the second structure 14 are away from each other to hide the test needle 16 completely in the test seat rubber core. This design structure only exposes the test needle 16 during the test process, which can effectively protect the test needle 16 and extend the service life of the test needle 16.

[0027] Reference Figure 3 As shown, the tail fixing member 1 is provided with a first positioning column 17 close to the side of the test board 3, and the first positioning column 17 is inserted into the test board 3; the second structure 14 is provided with a second positioning column 18 and a third positioning column 19 close to the side of the test board 3, and the second positioning column 18 and the third positioning column 19 are respectively located on both sides of the pinhole 20, and the second positioning column 18 and the third positioning column 19 are both inserted into the test board 3.

[0028] It should be noted that, in this embodiment, the first positioning post 17 , the second positioning post 18 and the third positioning post 19 are designed to fix the test board 3 and have a guiding and correcting function, thereby enabling rapid assembly of the test board 3 .

[0029] Reference Figure 1 As shown, the tail fixing member 1 is provided with a fourth positioning column 12 and a guide bevel 11 on the side close to the flash memory module 2. The fourth positioning column 12 is inserted into the flash memory module 2; the guide bevel 11 is close to the fourth positioning column 12 and the end of the flash memory chip.

[0030] It should be noted that, in this embodiment, the fourth positioning column 12 is designed to fix the flash memory module 2 away from the side of the pressure plate 8 and has a guiding function; the guiding bevel 11 is used to guide the flash memory module 2 into a precise position.

[0031] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A test structure based on a compression storage hard disk module, characterized in that: The test structure based on the compression storage hard disk module includes a tail fixing member, a flash memory module, a heat dissipation component and a test component; the flash memory module is fixedly installed between the tail fixing member and the test component; the heat dissipation component is arranged between the test component and the flash memory module; The test assembly includes a test seat pressure frame, a first spring, a test plate, a test seat base, a pressure plate, a test pin rubber core and a test pin; the first spring is fixedly connected between the test seat pressure frame and the test seat base, and is located at the edge of the test seat pressure frame; one end of the pressure plate is slidably connected to the test seat pressure frame, and the other end is close to the test pin rubber core; the test pin is inserted into the test pin rubber core; one side of the test plate is fixed to the tail fixing piece, and the other side is fixed to the test pin rubber core.

2. The test structure based on the compression storage hard disk module according to claim 1, characterized in that: The heat dissipation component includes a heat sink and heat dissipation silica gel, and the heat dissipation silica gel and the heat sink are both arranged between the flash memory module and the test board, with the heat dissipation silica gel close to the flash memory module and the heat sink close to the test board.

3. The test structure based on the compression storage hard disk module according to claim 1, characterized in that: The test needle rubber core includes a first structure, a second structure and a second spring; the second spring is fixedly connected between the first structure and the second structure.

4. The test structure based on the compression storage hard disk module according to claim 3, characterized in that: The first structure and the second structure are provided with connected pinholes, the test needles are inserted into the pinholes, and the number and size of the pinholes are adapted to the number and size of the test needles.

5. The test structure based on the compression storage hard disk module according to claim 4, characterized in that: A first pad matrix is ​​provided on one side of the flash memory module. The first pad matrix is ​​close to a side of the first structure away from the second structure.

6. The test structure based on the compression storage hard disk module according to claim 4, characterized in that: A second pad matrix is ​​provided on one side of the test board, and the second pad matrix is ​​close to a side of the second structure away from the first structure.

7. The test structure based on the compression storage hard disk module according to claim 1, characterized in that: The tail fixing piece is provided with a first positioning column on a side surface close to the test board, and the first positioning column is inserted into the test board.

8. The test structure based on the compression storage hard disk module according to claim 4, characterized in that: The second structure is provided with a second positioning post and a third positioning post on the side close to the test board. The second positioning post and the third positioning post are respectively located on both sides of the pinhole, and the second positioning post and the third positioning post are both inserted into the test board.

9. The test structure based on the compression storage hard disk module according to claim 1, characterized in that: The tail fixing piece is provided with a fourth positioning post and a guiding bevel on the side close to the flash memory module. The fourth positioning post is inserted on the flash memory module; the guiding bevel is close to the fourth positioning post and the end of the flash memory chip.

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