Semiconductor processing cooling device

Abstract

The utility model relates to a semiconductor processing cooling device, which comprises a first cavity with a medium circulation hole, a second cavity spaced from the first cavity, and a medium pipe, the first cavity is communicated with the second cavity through a cavity channel pipe, and the medium pipe is communicated with the first cavity. One end of the medium pipe penetrates through the first cavity and is fixed to the first cavity, the other end of the medium pipe is distributed in the axial direction of the cavity channel pipe and extends into the second cavity in a suspended mode, and a supporting ring arranged on the medium pipe in a sleeving mode is arranged in the end, close to the second cavity, of the cavity channel pipe. And the axial lead of the cavity channel pipe and the axial lead of the medium pipe coincide. The device has the advantages that the supporting rings are arranged in the cavity channel pipe, so that the two ends of the medium pipe are stably supported in the cavity, the medium pipe is more conveniently and efficiently installed in place, it is guaranteed that the medium pipe cannot generate the pipe body deviation phenomenon due to medium flowing during operation, the practical stability of the whole device is improved, and the service life of the whole device is prolonged.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing, and in particular to a semiconductor processing cooling device. Background Art

[0002] Semiconductor processing chillers are devices used to control temperature during the semiconductor manufacturing process. Semiconductor manufacturing often involves high-temperature and high-energy process steps such as thin film deposition, etching, and ion implantation. These steps require strict temperature control to ensure stable material and device performance. Therefore, chillers play a vital role in the processing process.

[0003] In the prior art, the medium pipe in the semiconductor processing cooling device needs to extend deep into the cavity, and only one end of the medium pipe is fixed, and its free end is suspended in the cavity. During the installation process, it is easy to cause the medium pipe to be installed offset. In addition, during operation, due to the circulation of medium in the cavity, the free end of the medium pipe is easily driven by the medium, resulting in long-term vibration, causing the fixed end of the medium pipe to loosen or cause medium leakage. Utility Model Content

[0004] The purpose of this utility model is to provide a semiconductor processing cooling device that can solve the above technical problems.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor processing cooling device includes a first cavity having a medium circulation hole, and a second cavity spaced apart from the first cavity. The first cavity and the second cavity are connected to each other through a cavity channel tube. The semiconductor processing cooling device also includes a medium tube, one end of which passes through the first cavity and is fixed to the first cavity, and the other end of the medium tube is distributed along the axial direction of the cavity channel tube and extends into the second cavity in a suspended state. A support ring is provided inside the end of the cavity channel tube close to the second cavity, so that the axial centerline of the cavity channel tube coincides with the axial centerline of the medium tube.

[0007] Furthermore, a pipeline step hole is provided on the wall thickness of the second cavity, and a step portion matching the pipeline step hole is provided on the cavity channel tube. The ends of the pipeline step hole and the step portion are welded, fixed and sealed.

[0008] Furthermore, the pipeline step hole and the outer wall of the step portion are welded and fixed.

[0009] Furthermore, a step groove is provided on the inner wall of one end of the cavity channel tube close to the second cavity, the support ring is clamped in the step groove and the two are welded, fixed and sealed.

[0010] Furthermore, a positioning through hole is provided in the axial center of the support ring, and the medium pipe passes through the positioning through hole.

[0011] Furthermore, the support ring is provided with a plurality of first through holes connecting the second cavity and the cavity channel tube.

[0012] Furthermore, a plurality of the first through holes are evenly arranged around the outside of the medium pipe along the circumference of the support ring.

[0013] Furthermore, the second cavity and the cavity channel tube are connected and fixed via a sleeve structure.

[0014] Furthermore, a joint pipe is connected to the outer opening of the medium circulation hole, and the joint pipe and the medium pipe are parallel to each other.

[0015] Furthermore, the first cavity includes a flange and a shell connected to one end face of the flange in the thickness direction, the medium pipe passes through the axial center of the flange, and the medium flow hole is provided beside the medium pipe.

[0016] Compared with the existing technology, the advantages of this application are: the semiconductor processing cooling device is equipped with a support ring in the cavity channel tube, so that the medium tube can obtain stable support at both ends in the cavity. During the installation process, the medium tube can be installed in place more conveniently and efficiently, and during operation, it is ensured that the medium tube will not produce tube body deviation due to the flow of the medium, thereby improving the practical stability and service life of the entire device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is an assembly diagram of the main components of the semiconductor processing cooling device of the present utility model;

[0018] Figure 2 for Figure 1 Enlarged detail of the main components in area A;

[0019] Figure 3 This is a front view of the main assembly of the flange component of the present invention;

[0020] Figure 4 This is a front view of the main assembly of the support ring component of the present invention.

[0021] In the figure, the first cavity 1, the medium circulation hole 10, the outer shell 11, the flange 12, the second cavity 2, the pipeline step hole 20, the cavity channel tube 3, the step portion 30, the step groove 31, the support ring 32, the positioning through hole 320, the first through hole 321, the medium pipe 4, and the joint pipe 5. DETAILED DESCRIPTION

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0023] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0024] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0025] In the description of this embodiment, terms such as "upper," "lower," "right," and "left" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0026] Example 1

[0027] like Figure 1 As shown, the semiconductor processing cooling device includes a first cavity 1 having a medium flow hole 10, and a second cavity 2 spaced apart from the first cavity 1. The first cavity 1 and the second cavity 2 are connected to each other through a cavity channel 3. The internal spaces of the first cavity 1, the second cavity 2 and the cavity channel 3 are connected to each other. Specifically, Figure 2As shown, a pipe step hole 20 is provided on the wall thickness of the second cavity 2, and a step portion 30 is provided on the cavity channel tube 3 to match the pipe step hole 20. The ends of the pipe step hole 20 and the step portion 30 are welded, fixed and sealed. Similarly, the above-mentioned pipe step hole 20 and step portion 30 are also provided at the connection between the first cavity 1 and the cavity channel tube 3, and the ends of the two are welded, fixed and sealed; the design of the step hole and the step portion 30 makes insertion and docking more convenient, and can provide better positioning during the installation process, while increasing the contact area between the first cavity 1 and the cavity channel tube 3, and the contact area between the second cavity 2 and the cavity channel tube 3, thereby improving the strength and stability of the connection, achieving a better sealing effect, and reducing the risk of internal medium leakage. Specifically, Figure 2 As shown, the aperture of the pipe step hole 20 is equal to the aperture of the outer wall of the step portion 30, and the outer walls of the pipe step hole 20 and the step portion 30 are welded and fixed. In addition, the above-mentioned second cavity 2 and the cavity channel tube 3 can also be connected and fixed by a sleeve structure. The sleeve structure makes the connection between the second cavity 2 and the cavity channel tube 3 easier. During installation, it is only necessary to align and insert the two parts, which reduces installation time and labor costs; similarly, when maintenance or replacement is required, it can also be easily disassembled. The sleeve connection allows the gap between the two components to be adjusted within a certain range, so that under different temperature and pressure conditions, it can automatically adapt to the thermal expansion or contraction of the material, thereby reducing stress concentration and damage risks at the connection.

[0028] The semiconductor processing cooling device also includes a medium pipe 4, one end of which passes through the first cavity 1 and is fixedly connected to the first cavity 1, and the other end of the medium pipe 4 is distributed along the axial direction of the cavity channel pipe 3 and extends into the second cavity 2 in a suspended state, but the medium pipe 4 at the other end does not contact the second cavity 2 and is suspended in the second cavity 2. In order to ensure the operating stability of the medium pipe 4 inside the semiconductor processing cooling device and prevent the medium pipe 4 from positional displacement, a support ring 32 is provided inside the end of the cavity channel pipe 3 close to the second cavity 2 and is sleeved on the medium pipe 4. A positioning through hole 320 is provided on the support ring 32 for the medium pipe 4 to pass through, so that the axial center line of the cavity channel pipe 3 and the axial center line of the medium pipe 4 coincide with each other. The support ring 32 provides a stable support point for the medium pipe 4 in the cavity channel pipe 3, and at the same time, the medium pipe 4 is fixedly connected to the first cavity 1. The two stable support points enable the medium pipe 4 to maintain good balance and stability during installation and operation.

[0029] like Figure 1 As shown, the first cavity 1 includes a flange 12 for fixing the semiconductor processing cooling device, and a shell 11 connected to one end surface of the flange 12 in the thickness direction. The end of the medium pipe 4 located in the first cavity 1 passes through the axial center of the flange 12 and is partially exposed in the first cavity 1. Figure 3As shown, in this embodiment, there are two medium circulation holes 10, wherein the medium pipe 4 is inserted into one of the medium circulation holes 10, and the outer opening of the other medium circulation hole 10 is connected to the joint pipe 5, and the joint pipe 5 and the medium pipe 4 are parallel to each other.

[0030] A step groove 31 is provided on the inner wall of one end of the cavity channel tube 3 close to the second cavity 2, and the support ring 32 is clamped in the step groove 31 and the two are welded and fixed and sealed. The design of the step groove 31 enables the support ring 32 to be accurately embedded therein to form a tight fitting structure, thereby ensuring that the support ring 32 will not be displaced or fall off during operation. Preferably, in this embodiment, the step groove 31 and the support ring 32 are only provided in one group close to the second cavity 2, and it can also be multiple groups of step grooves 31 and support rings 32. The specific number of groups is changed according to the actual work intensity requirements.

[0031] At the same time, since the support ring 32 is provided, and the support ring 32 and the step groove 31, as well as the support ring 32 and the medium pipe 4 are seamlessly connected, in order to ensure the spatial continuity of the semiconductor processing cooling device, such as Figure 4 As shown, a plurality of first through holes 321 connecting the second cavity 2 and the cavity channel tube 3 are further provided on the above-mentioned support ring 32. The plurality of first through holes 321 are evenly arranged around the outer side of the medium tube 4 along the circumference of the support ring 32. This design can ensure that the structural strength of the support ring 32 is not affected while ensuring smooth flow of the medium. In this embodiment, the size setting of the first through holes 321 will not affect the structural strength of the device, and can ensure that the fluidity of the medium inside the device will not be affected.

[0032] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope defined by the appended claims.

Claims

1. A semiconductor processing cooling device, comprising a first cavity (1) having a medium flow hole (10), and a second cavity (2) spaced apart from the first cavity (1), wherein the first cavity (1) and the second cavity (2) are connected to each other through a cavity channel tube (3), characterized in that: The semiconductor processing cooling device further comprises a medium tube (4), one end of which passes through the first cavity (1) and is fixed to the first cavity (1), and the other end of which is distributed along the axial direction of the cavity channel tube (3) and extends into the second cavity (2) in a suspended state, and a support ring (32) is provided inside one end of the cavity channel tube (3) close to the second cavity (2) and is sleeved on the medium tube (4), so that the axis center line of the cavity channel tube (3) and the axis center line of the medium tube (4) coincide with each other.

2. The semiconductor processing cooling device according to claim 1, characterized in that A pipeline step hole (20) is provided on the wall thickness of the second cavity (2), and a step portion (30) matching the pipeline step hole (20) is provided on the cavity channel tube (3), and the ends of the pipeline step hole (20) and the step portion (30) are welded, fixed, and sealed.

3. The semiconductor processing cooling device according to claim 2, characterized in that: The pipeline step hole (20) and the outer wall of the step portion (30) are welded and fixed.

4. The semiconductor processing cooling device according to claim 1, characterized in that A step groove (31) is provided on the inner wall of one end of the cavity channel tube (3) close to the second cavity (2), and the support ring (32) is clamped in the step groove (31), and the two are welded, fixed, and sealed.

5. The semiconductor processing cooling device according to claim 1, 2, 3 or 4, characterized in that: A positioning through hole (320) is provided at the axial center of the support ring (32), and the medium pipe (4) passes through the positioning through hole (320).

6. The semiconductor processing cooling device according to claim 1, 2, 3 or 4, characterized in that: The support ring (32) is provided with a plurality of first through holes (321) connecting the second cavity (2) and the cavity channel tube (3).

7. The semiconductor processing cooling device according to claim 6, characterized in that: A plurality of the first through holes (321) are evenly arranged around the outside of the medium pipe (4) along the circumference of the support ring (32).

8. The semiconductor processing cooling device according to claim 1, wherein The second cavity (2) and the cavity channel tube (3) are connected and fixed via a sleeve structure.

9. The semiconductor processing cooling device according to claim 1, characterized in that: A joint pipe (5) is connected to the outer opening of the medium circulation hole (10), and the joint pipe (5) and the medium pipe (4) are parallel to each other.

10. The semiconductor processing cooling device according to claim 1, characterized in that The first cavity (1) comprises a flange (12) and a shell (11) connected to one end face of the flange (12) in the thickness direction, the medium pipe (4) passes through the axial center of the flange (12), and the medium flow hole (10) is arranged beside the medium pipe (4).

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