Heat dissipation cover and chip packaging structure
By designing a cross-shaped structure and a back-shaped grid structure on the heat dissipation cover and filling with thermal conductive materials, the problem of poor thermal conductivity of the heat dissipation cover is solved, and efficient chip heat dissipation effect and mold cost savings are achieved.
Patent Information
- Application Number
- CN202422715544.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-11-07
AI Technical Summary
In the prior art, the heat dissipation cover made of a single material has poor thermal conductivity and cannot effectively improve the heat dissipation effect of the chip.
A heat dissipation cover is designed, a cover plate with a cross-shaped structure is nested, and multiple back-shaped grid structures are nested inside it, and a thermally conductive material is filled to form a thermally conductive area, and a copper, aluminum or stainless steel material is combined to improve thermal conductivity.
Through the design of multi-layer thermal conductivity materials, the thermal conductivity of the heat dissipation cover is significantly improved, and can adapt to changes in different chip sizes and positions, saving mold opening time and cost.
Smart Images
Figure CN223284979U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip packaging technology, and in particular to a heat dissipation cover and a chip packaging structure. Background Art
[0002] With the advancement of semiconductor technology, chip size continues to increase, and integration levels are becoming increasingly higher. However, this high-density integration consumes more power per unit area, and the chip generates more heat during operation. Therefore, improving the chip's heat dissipation capacity has become particularly important.
[0003] Currently, chip heat dissipation is typically addressed by using a heat sink made of a single material that covers the entire substrate. However, heat sinks made of a single material have poor thermal conductivity. Therefore, designing a heat sink with enhanced thermal conductivity to improve chip heat dissipation has become an urgent issue. Utility Model Content
[0004] In view of this, the present application provides a heat dissipation cover and a chip packaging structure to solve the problem of poor thermal conductivity of the heat dissipation cover.
[0005] Specifically, this application is implemented through the following technical solutions:
[0006] In a first aspect, the present application provides a heat dissipation cover, comprising a cover plate and an outer frame extending downward along an edge of the cover plate; wherein,
[0007] The cover plate includes a cross-shaped structure consisting of a first heat dissipation line and a second heat dissipation line; the center of the cross-shaped structure coincides with the center of the cover plate;
[0008] A plurality of U-shaped grille structures with overlapping centers are arranged in the area surrounded by the cross-shaped structure; wherein, in order from the center to the outside, the plurality of U-shaped grille structures are nested in sequence, and the sizes of the plurality of U-shaped grille structures increase in sequence;
[0009] A heat-conducting area cooperating with the chip is provided in the cross-shaped structure; wherein the heat-conducting area is formed by filling a heat-conducting material in an area cooperating with the chip in the cross-shaped structure.
[0010] Optionally, the spacing between two adjacent U-shaped grid structures is the same;
[0011] or,
[0012] The distances between two adjacent U-shaped grille structures are different.
[0013] Optionally, the thickness of the heat conduction area is equal to the thickness of the cover plate.
[0014] Optionally, in order from the center outward, the size of the Nth U-shaped grid structure is equal to N / 10 times the size of the specified chip.
[0015] Optionally, the thermally conductive material is any one of silver, graphene and indium.
[0016] Optionally, the cover plate is made of copper, aluminum or stainless steel.
[0017] Optionally, the cover plate and the outer frame are integrally formed;
[0018] or,
[0019] The cover plate and the outer frame are welded;
[0020] or,
[0021] The cover plate and the outer frame are bonded together.
[0022] Optionally, the area of the cross-shaped structure is smaller than or equal to the area of the cover plate.
[0023] A second aspect of the present application provides a chip packaging structure, the chip packaging structure comprising a substrate, a chip and any heat dissipation cover provided in the first aspect of the present application; wherein,
[0024] The chip is arranged on the substrate;
[0025] The outer frame of the heat dissipation cover is bonded and fixed on the substrate; wherein, when the outer frame of the heat dissipation cover is bonded and fixed on the substrate, the heat conduction area of the heat dissipation cover is attached to the side of the chip away from the substrate.
[0026] The heat dissipation cover provided by the present application is provided with a cross-shaped structure on the cover plate, and then a plurality of U-shaped grille structures are provided in the cross-shaped structure, and a heat-conducting area that cooperates with the chip is formed in the cross-shaped structure by filling a partial area of the cross-shaped structure with a heat-conducting material. In this way, on the one hand, the heat dissipation performance of the heat dissipation cover can be improved by filling the heat-conducting material; on the other hand, by providing a plurality of U-shaped grille structures in the cross-shaped area, the heat-conducting material can be filled at the position corresponding to the cross-shaped area to form a heat-conducting area according to the size and position of the chip to be covered, so that the heat-conducting area can change with the position and size of the chip; on the third hand, the same set of molds can be used to prepare a cover plate with a cross-shaped structure, and then by coordinating a variety of filling schemes, a plurality of different heat dissipation covers can be formed, which can save mold opening time and mold opening costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 A cross-sectional view of a heat dissipation cover provided as an exemplary embodiment of the present application;
[0028] Figure 2 A top view of a heat dissipation cover according to an exemplary embodiment of the present application is shown;
[0029] Figure 3 A top view of a heat dissipation cover according to another exemplary embodiment of the present application is shown;
[0030] Figure 4 A cross-sectional view of a heat dissipation cover according to another exemplary embodiment of the present application;
[0031] Figure 5 A schematic diagram of a heat dissipation cover according to another exemplary embodiment of the present application;
[0032] Figure 6 This is a schematic diagram of a chip packaging structure shown in an exemplary embodiment of the present application.
[0033] Description of reference numerals:
[0034] 1: Cover plate;
[0035] 2: outer frame;
[0036] 11: Cross-shaped structure;
[0037] 111: first heat dissipation line;
[0038] 112: second heat dissipation line;
[0039] 113: Chinese-shaped grille structure;
[0040] 114: heat conduction area;
[0041] 100: substrate;
[0042] 200: chip;
[0043] 300: Heat sink cover. DETAILED DESCRIPTION
[0044] Exemplary embodiments are described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numerals in different drawings represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this application.
[0045] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0046] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0047] Specific embodiments are given below to introduce the technical solutions of the present application in detail.
[0048] Figure 1 A cross-sectional view of a heat dissipation cover provided by an exemplary embodiment of the present application. Figure 2 This is a top view of a heat dissipation cover according to an exemplary embodiment of the present application. Figure 1 and Figure 2 The heat dissipation cover provided in this embodiment includes a cover plate 1 and an outer frame 2 extending downward along the edge of the cover plate 1, wherein:
[0049] The cover plate 1 includes a cross-shaped structure 11 consisting of a first heat dissipation line 111 and a second heat dissipation line 112; the center of the cross-shaped structure 11 coincides with the center of the cover plate 1;
[0050] A plurality of U-shaped grid structures 113 with overlapping centers are provided in the area surrounded by the cross-shaped structure 11; wherein, the plurality of U-shaped grid structures 113 are nested in sequence from the center outward, and the sizes of the plurality of U-shaped grid structures 113 increase in sequence;
[0051] The cross-shaped structure 11 is provided with a heat-conducting area 114 cooperating with the chip. The heat-conducting area 114 is formed by filling a heat-conducting material in an area of the cross-shaped structure 11 cooperating with the chip.
[0052] Specifically, in a possible implementation, the cover plate 1 and the outer frame 2 are integrally formed.
[0053] Alternatively, the cover plate 1 and the outer frame 2 are connected by welding, or the cover plate 1 and the outer frame 2 are connected by adhesive bonding.
[0054] It can be understood that the cover 1 is a flat plate, the outer frame 2 is a U-shaped frame, and the cover 1 and the outer frame 2 can be integrally formed. Furthermore, when the cover 1 and the outer frame 2 are integrally formed, the cover 1 and the outer frame 2 are made of the same material, which can be copper, aluminum or stainless steel, etc.
[0055] In addition, the cover plate 1 and the outer frame 2 can also be independent and separate. Further, when the cover plate 1 and the outer frame 2 are set separately, the cover plate 1 and the outer frame 2 can be welded and connected by welding, or can be glued and connected by gluing. This is not limited in this embodiment.
[0056] Furthermore, when the cover plate 1 and the outer frame 2 are provided separately, the materials of the cover plate 1 and the outer frame 2 can be the same or different, and this is not limited in this embodiment. For example, in one possible implementation, the material of the cover plate 1 can be one of copper, stainless steel, or aluminum, and the material of the outer frame 2 can be one of copper, stainless steel, or aluminum. It should be noted that, preferably, in one possible implementation, the material of the outer frame 2 is stainless steel, which can improve the strength of the outer frame 2 and prevent substrate warping.
[0057] For further information, please refer to Figure 2 The cover plate 1 includes a cross-shaped structure 11 consisting of a first heat dissipation line 111 and a second heat dissipation line 112 , and the center of the cross-shaped structure 11 coincides with the center of the cover plate 1 .
[0058] Figure 3 This is a top view of a heat dissipation cover according to another exemplary embodiment of the present application. Figure 2 and Figure 3 Optionally, in a possible implementation, the area of the cross-shaped structure 11 is smaller than or equal to the area of the cover plate 1 .
[0059] For details, please refer to Figure 2 ,exist Figure 2 In the figure, the area of the cross-shaped structure 11 is smaller than the area of the cover 1 (it should be noted that by making the area of the cross-shaped structure 11 smaller than the area of the cover 1, the strength of the heat dissipation cover can be ensured); further, please refer to Figure 3 ,exist Figure 3 In the example shown, the area of the cross-shaped structure 11 is equal to the area of the cover plate 1. In other words, the center of the cross-shaped structure 11 coincides with the center of the cover plate 1, and the cross-shaped structure 11 extends outward from the center of the cover plate 1, and its maximum area is equal to the area of the cover plate 1.
[0060] Please refer to Figure 2 and Figure 3 , the first heat dissipation line 111 can be a horizontal connection line ( Figure 2 The horizontal connecting line passes through the center point of the cover 1, and is a horizontal line extending from the center to both sides, and its outermost line extends to the edge of the cover 1; similarly, the second heat dissipation line 112 is a longitudinal connecting line ( Figure 2The longitudinal connecting line passes through the center point of the cover plate 1 and is also a transverse line extending from the center to both sides, and extends to the edge of the cover plate 1 at the outermost point.
[0061] Figure 4 This is a cross-sectional view of a heat dissipation cover according to another exemplary embodiment of the present application. Figure 4 It can be understood that the first heat dissipation line 111 and the second heat dissipation line 112 can also be two heat dissipation lines on the diagonal line of the heat dissipation cover. These two heat dissipation lines extend from the center to the vertex, and the outermost part extends to the vertex.
[0062] For further information, please refer to Figures 1 to 4 , a plurality of U-shaped grid structures 113 with overlapping centers are arranged in the area surrounded by the cross-shaped structure 11; wherein, in order from the center to the outside, the plurality of U-shaped grid structures 113 are nested in sequence, and the sizes of the plurality of U-shaped grid structures 113 increase in sequence.
[0063] Specifically, the specific number of the plurality of U-shaped grid structures 113 is set according to actual conditions and is not limited in this embodiment.
[0064] Furthermore, the centers of the multiple U-shaped grille structures 113 coincide with each other, and further, the center of each U-shaped grille structure 113 coincides with the center of the cover plate 1. Furthermore, the sizes of the multiple U-shaped grille structures increase sequentially from the center outward, i.e., from the inside out, and the multiple U-shaped grille structures 113 are nested in sequence.
[0065] Optionally, in a possible implementation, the distances between two adjacent U-shaped grid structures are the same; or the distances between two adjacent U-shaped grid structures are different.
[0066] Specifically, whether the spacing between two adjacent U-shaped grid structures in the plurality of U-shaped grid structures 113 is the same is set according to actual needs, and is not limited in this embodiment. Figures 2 to 4 In the example shown, the spacing between any two adjacent U-shaped grid structures is the same.
[0067] Further, Figure 5 This is a schematic diagram of a heat dissipation cover according to another exemplary embodiment of the present application. Figure 5 ,exist Figure 5 In the example shown, the spacing between any two adjacent U-shaped grid structures is not exactly the same.
[0068] It should be noted that, when the spacing between two adjacent U-shaped grid structures is different, the size of each U-shaped grid structure needs to be set according to actual needs, and is not limited in this embodiment.
[0069] Optionally, in a possible implementation, in order from the center outward, the size of the Nth U-shaped grid structure is equal to N / 10 times the size of the specified chip.
[0070] Specifically, when the spacing between any two adjacent U-shaped grid structures is the same, in one embodiment, the size of the Nth U-shaped grid structure is equal to N / 10 times the size of the designated chip in order from the center outward.
[0071] For example, the plurality of U-shaped grid structures 113 include a total of 10 U-shaped grid structures 113, and these 10 U-shaped grid structures 113 are sequentially recorded as the first U-shaped grid structure 113, the second U-shaped grid structure 113, ..., the tenth U-shaped grid structure 113 in order from the center to the outside, wherein the size of the first U-shaped grid structure 113 is equal to 1 / 10 times the size of the specified chip, the size of the second U-shaped grid structure 113 is equal to 2 / 10 of the size of the specified chip, the size of the third U-shaped grid structure 113 is equal to 3 / 10 times the size of the specified chip, ..., the size of the tenth U-shaped grid structure 113 is equal to 10 / 10 times the size of the specified chip (that is, the size of the tenth U-shaped grid structure 113 is equal to the specified chip size).
[0072] It should be noted that the designated chip size is set according to actual needs and is not limited in this embodiment. For example, in one possible implementation, the designated chip size may be the size of a standard chip.
[0073] For further information, please refer to Figures 1 to 5 The cross-shaped structure 11 is provided with a heat-conducting area 114 that cooperates with the chip; wherein the heat-conducting area 114 is formed by filling a heat-conducting material in an area of the cross-shaped structure 11 that cooperates with the chip (the chip is a packaged chip to be covered by the heat dissipation cover).
[0074] Optionally, in a possible implementation, the thickness of the heat conduction area 114 is equal to the thickness of the cover plate 1 .
[0075] Specifically, referring to the previous description, the size of the cross-shaped structure 11 can be smaller than or equal to the size of the heat dissipation cover. Furthermore, a heat conduction region 114 is provided in the cross-shaped structure 11 to match the chip to be packaged. It should be noted that the location of the heat conduction region 114 is adapted to the chip to be packaged to ensure that after the chip is packaged, the heat conduction region 114 covers the area where the chip is located.
[0076] For example, in one possible implementation, when the chip size is x5 / y5, the filling material only fills the five U-shaped grids between x1 / y1 and x5 / y5; if the chip size becomes larger to x7 / y7, the filling material fills the seven U-shaped grids between x1 / y1 and x7y7.
[0077] Furthermore, the heat conducting area 114 is formed by filling a heat conducting material, which may be indium, silver, graphene, etc., and is not limited in this embodiment.
[0078] Specifically, by filling the cross-shaped region 11 with thermally conductive material, a thermally conductive region 114 can be formed that is the same size as or larger than the chip to be covered by the heat dissipation cover. Furthermore, by providing multiple U-shaped grid structures 113 within the cross-shaped structure 11, material can be saved and heat from the chip sides can be released to a certain extent.
[0079] It can be understood that by arranging multiple U-shaped grid structures 113 in the cross-shaped area 11, thermal conductive material can be filled in the corresponding position of the cross-shaped area 11 to form a thermal conductive area 114 according to the size and position of the chip to be covered, so that the thermal conductive area 114 can change with the position and size of the chip. In this way, for the same cross-shaped structure 11, multiple different heat dissipation covers can be formed by combining multiple filling schemes to match multiple packaging schemes, that is, the same set of molds can be used to prepare a cover plate 1 with a cross-shaped structure 11, and then multiple different heat dissipation covers can be formed by combining multiple filling schemes, which can save mold opening time and mold opening costs.
[0080] In this embodiment, the heat dissipation cover is composed of a base material of copper (melting point of 1083°C, thermal conductivity of 386W / (m*K)) and a filler material of silver with excellent thermal conductivity (melting point of 962°C, thermal conductivity of 429W / (m*K), which can improve the thermal conductivity and ensure the strength of the heat dissipation cover.
[0081] The heat dissipation cover provided in this embodiment is provided with a cross-shaped structure on the cover plate, and then a plurality of U-shaped grille structures are provided in the cross-shaped structure, and a heat-conducting area cooperating with the chip is formed in the cross-shaped structure by filling a partial area of the cross-shaped structure with a heat-conducting material. In this way, on the one hand, the heat dissipation performance of the heat dissipation cover can be improved by filling the heat-conducting material; on the other hand, by providing a plurality of U-shaped grille structures in the cross-shaped area, the heat-conducting material can be filled at the position corresponding to the cross-shaped area to form a heat-conducting area according to the size and position of the chip to be covered, so that the heat-conducting area can change with the position and size of the chip; on the third hand, the same set of molds can be used to prepare a cover plate with a cross-shaped structure, and then a plurality of different heat dissipation covers can be formed by coordinating a plurality of filling schemes, which can save mold opening time and mold opening costs.
[0082] The present application also provides a chip packaging structure, which is described below:
[0083] Figure 6 This is a schematic diagram of a chip packaging structure shown in an exemplary embodiment of the present application. Figure 6 The chip packaging structure provided in this embodiment includes a substrate 100, a chip 200 and a heat dissipation cover 300, wherein:
[0084] The chip 200 is disposed on the substrate 100;
[0085] The outer frame 2 of the heat dissipation cover 300 is bonded and fixed on the substrate 100 . When the outer frame 2 of the heat dissipation cover 300 is bonded and fixed on the substrate 100 , the heat conduction area 114 of the heat dissipation cover 300 is attached to the side of the chip 200 away from the substrate 100 .
[0086] Specifically, the chip 200 is connected to the substrate 100 via solder balls (solder balls are made of alloy metal and are used for electronic assembly).
[0087] Furthermore, the outer frame 2 of the heat dissipation cover 300 is connected to the substrate 100 through thermal conductive glue and adhesive. At the same time, the heat dissipation cover 300 is connected to the chip 200 through thermal conductive glue and adhesive.
[0088] In this embodiment, the heat dissipation cover 300 is any heat dissipation cover in the above embodiments.
[0089] The chip packaging structure provided in this embodiment can achieve good heat dissipation effect by utilizing the heat dissipation cover.
[0090] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. A heat dissipation cover, characterized in that: The heat dissipation cover includes a cover plate and an outer frame extending downward along the edge of the cover plate; wherein, The cover plate includes a cross-shaped structure consisting of a first heat dissipation line and a second heat dissipation line; the center of the cross-shaped structure coincides with the center of the cover plate; A plurality of U-shaped grille structures with overlapping centers are arranged in the area surrounded by the cross-shaped structure; wherein, in order from the center to the outside, the plurality of U-shaped grille structures are nested in sequence, and the sizes of the plurality of U-shaped grille structures increase in sequence; A heat-conducting area cooperating with the chip is provided in the cross-shaped structure; wherein the heat-conducting area is formed by filling a heat-conducting material in an area cooperating with the chip in the cross-shaped structure.
2. The heat dissipation cover according to claim 1, characterized in that: The distance between two adjacent U-shaped grille structures is the same; or, The distances between two adjacent U-shaped grille structures are different.
3. The heat dissipation cover according to claim 1, wherein: The thickness of the heat conduction area is equal to the thickness of the cover plate.
4. The heat dissipation cover according to claim 1, wherein: In order from the center outward, the size of the Nth U-shaped grid structure is equal to N / 10 times the size of the designated chip.
5. The heat dissipation cover according to claim 1, wherein: The thermal conductive material is any one of silver, graphene and indium.
6. The heat dissipation cover according to claim 1, wherein: The cover plate is made of copper, aluminum or stainless steel.
7. The heat dissipation cover according to claim 1, wherein: The cover plate and the outer frame are integrally formed; or, The cover plate and the outer frame are welded together; or, The cover plate and the outer frame are bonded together.
8. The heat dissipation cover according to claim 1, wherein: The area of the cross-shaped structure is smaller than or equal to the area of the cover plate.
9. A chip packaging structure, characterized in that: The chip packaging structure comprises a substrate, a chip and a heat dissipation cover according to any one of claims 1 to 7; wherein, The chip is arranged on the substrate; The outer frame of the heat dissipation cover is bonded and fixed on the substrate; wherein, when the outer frame of the heat dissipation cover is bonded and fixed on the substrate, the heat conduction area of the heat dissipation cover is attached to the side of the chip away from the substrate.