Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic device includes: a housing; the mainboard assembly is arranged on the shell; the circuit board is arranged in the shell, and the mainboard assembly and the circuit board are located on the two sides in the shell respectively; the loudspeaker assembly is arranged on the shell; two ends of the connecting assembly are respectively connected with the mainboard assembly and the circuit board; the limiting part is arranged on the mainboard assembly and / or the loudspeaker assembly; wherein the limiting part is used for being connected with the connecting assembly so as to limit the connecting assembly, and the connecting assembly is grounded through the mainboard assembly and / or the loudspeaker assembly.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] To improve the antenna performance of electronic devices, a small antenna board is often added to the lower half of the device and connected to the main board via a coaxial cable to ensure the antenna function of the antenna board. However, this method often requires a long coaxial cable routing distance and is interspersed with various stacked components. These components often interfere with the coaxial cable's performance. To reduce this interference with the coaxial cable's antenna performance, the coaxial cable must be grounded to improve antenna performance.

[0003] In the prior art, the coaxial line is secured and grounded using steel features on the speaker housing and metal features on the motherboard bracket. However, this method provides poor coaxial line retention, especially in the thickness direction of the electronic device. This can easily cause the coaxial line to pop out, leading to unreliable grounding and impacting antenna performance. Utility Model Content

[0004] The present application aims to provide an electronic device that can solve the technical problem in the related art that the coaxial line is poorly fixed, resulting in the coaxial line popping out and affecting the antenna grounding effect.

[0005] An embodiment of the present application provides an electronic device, including:

[0006] case;

[0007] A mainboard assembly is disposed in the housing;

[0008] A circuit board is disposed in the housing, wherein the mainboard assembly and the circuit board are respectively located on two sides of the housing;

[0009] A speaker assembly is disposed on the housing;

[0010] A connecting component, two ends of which are connected to the mainboard component and the circuit board respectively;

[0011] A limiting portion, provided on the mainboard assembly and / or the speaker assembly;

[0012] The limiting portion is used to connect with the connecting component to limit the connecting component, and the connecting component is grounded through the mainboard component and / or the speaker component.

[0013] The electronic device of the embodiment of the present application, by providing a limiting portion on the mainboard assembly and / or the speaker assembly, can, on the one hand, fix the connecting assembly between the mainboard assembly and the circuit board through the limiting portion to ensure the stability of the position of the connecting assembly; on the other hand, the connecting assembly can be electrically connected to the mainboard assembly and the speaker assembly through the limiting portion, thereby ensuring the grounding performance of the connecting assembly, thereby avoiding signal interference to the connecting assembly by other electrical components in the electronic device, and ensuring the stable operation of the mainboard assembly and the circuit board.

[0014] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 One of the structural schematic diagrams of the electronic device according to the embodiment of the present application is shown;

[0017] Figure 2 A second structural diagram of an electronic device according to an embodiment of the present application is shown;

[0018] Figure 3 The third structural diagram of the electronic device according to the embodiment of the present application is shown;

[0019] Figure 4 Shown Figure 3 One of the structural diagrams of the first limiting part;

[0020] Figure 5 Shown Figure 3 One of the structural diagrams of the middle fixing clip;

[0021] Figure 6 Shown Figure 3 The second structural diagram of the first limiting part;

[0022] Figure 7 Shown Figure 6 A partial enlarged view of point A in the middle;

[0023] Figure 8 Shown Figure 3 The second structural diagram of the middle fixing clip;

[0024] Figure 9 Shown Figure 8 A partial enlarged view of point B in the middle;

[0025] Figure 10 A fourth structural diagram of an electronic device according to an embodiment of the present application is shown;

[0026] Figure 11 One of the partial structural schematic diagrams of an electronic device is shown;

[0027] Figure 12 A second schematic diagram of a partial structure of an electronic device is shown;

[0028] Figure 13 Shown Figure 11 A schematic structural diagram of the first limiting portion;

[0029] Figure 14 Shown Figure 13 A partial enlarged view of point C in the middle;

[0030] Figure 15 Shown Figure 11 A schematic structural diagram of the second limiting portion;

[0031] Figure 16 Shown Figure 15 A partial enlarged view of point D in the middle;

[0032] Figure 17 A fifth structural diagram of an electronic device according to an embodiment of the present application is shown;

[0033] Figure 18 A sixth structural diagram of an electronic device according to an embodiment of the present application is shown;

[0034] Figure 19 A schematic structural diagram of a circuit board in an electronic device according to an embodiment of the present application is shown;

[0035] Figure 20 A schematic structural diagram of a speaker housing in an electronic device according to an embodiment of the present application is shown;

[0036] Figure 21 FIG7 shows a seventh structural diagram of an electronic device according to an embodiment of the present application;

[0037] Figure 22 FIG8 shows an eighth structural diagram of an electronic device according to an embodiment of the present application;

[0038] Figure 23 A schematic structural diagram of a connection component in an electronic device according to an embodiment of the present application is shown.

[0039] Reference numerals:

[0040] 100 electronic device, 102 housing, 104 mainboard assembly, 108 circuit board, 110 speaker assembly, 112 connecting assembly, 114 limiting portion, 116 mainboard bracket, 118 speaker housing, 120 first limiting portion, 122 second limiting portion, 124 first protrusion, 126 second protrusion, 128 fixing clip, 130 first rib, 132 bottom edge, 134 second rib, 136 clamping space, 138 guide portion, 140 third protrusion, 142 first baffle, 144 conductive area, 146 fourth protrusion, 148 second baffle, 150 third baffle, 152 limiting space, 154 connecting wire, 156 metal ring, 158 metal connecting part. DETAILED DESCRIPTION

[0041] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0042] The features of the terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application in specific circumstances.

[0044] The following combination Figures 1 to 23 An electronic device according to an embodiment of the present application is described.

[0045] In some embodiments of the present application, an electronic device is provided. Figure 1 One of the structural schematic diagrams of the electronic device according to the embodiment of the present application is shown; Figure 2 FIG2 shows a second structural diagram of an electronic device according to an embodiment of the present application; Figure 1 and Figure 2As shown, the electronic device 100 includes: a shell 102; a mainboard assembly 104, which is arranged in the shell 102; a circuit board 108, which is arranged in the shell 102, wherein the mainboard assembly 104 and the circuit board 108 are respectively located on both sides of the shell 102; a speaker assembly 110, which is arranged in the shell 102; a connecting assembly 112, wherein both ends of the connecting assembly 112 are respectively connected to the mainboard assembly 104 and the circuit board 108; a limiting portion 114, which is arranged on the mainboard assembly 104 and / or the speaker assembly 110; wherein the limiting portion 114 is used to connect with the connecting assembly 112 to limit the connecting assembly 112, and the connecting assembly 112 is grounded through the mainboard assembly 104 and / or the speaker assembly 110.

[0046] In an embodiment of the present application, the electronic device 100 includes a housing 102 , a mainboard assembly 104 and a speaker assembly 110 , wherein the mainboard assembly 104 and the speaker assembly 110 are disposed in the housing 102 so as to protect the mainboard assembly 104 and the speaker assembly 110 through the housing 102 .

[0047] Furthermore, the mainboard assembly 104 and the circuit board 108 are respectively located on two sides of the housing 102 , and the mainboard assembly 104 and the circuit board 108 are connected via a connecting assembly 112 . The circuit board 108 is used to improve the antenna performance of the electronic device 100 .

[0048] Furthermore, the electronic device 100 also includes a limiting portion 114, which can be used to limit the position of the connecting assembly 112, thereby ensuring the stability of the position of the connecting assembly 112. Specifically, the limiting portion 114 can be provided on the mainboard assembly 104, or on the speaker assembly 110, or can be provided on both the mainboard assembly 104 and the speaker assembly 110. In this way, while the connecting assembly 112 is fixed by the limiting portion 114, it can also be connected to the mainboard assembly 104 and the speaker assembly 110 through the limiting portion 114, thereby grounding the connecting assembly 112. This can prevent signal interference with the connecting assembly 112 caused by other electrical components in the electronic device 100, thereby ensuring the stable operation of the mainboard assembly 104 and the circuit board 108.

[0049] Specifically, the limiting portion 114 can be made of a conductive material to ensure that the connecting component 112 can be connected to the mainboard component 104 and the speaker component 110 through the limiting portion 114, thereby ensuring that the connecting component 112 can be grounded.

[0050] The electronic device 100 of the embodiment of the present application, by providing a limiting portion 114 on the mainboard assembly 104 and / or the speaker assembly 110, can, on the one hand, fix the connecting assembly 112 between the mainboard assembly 104 and the circuit board 108 through the limiting portion 114 to ensure the stability of the position of the connecting assembly 112. On the other hand, the connecting assembly 112 can be electrically connected to the mainboard assembly 104 and the speaker assembly 110 through the limiting portion 114, thereby ensuring the grounding performance of the connecting assembly 112, thereby avoiding signal interference to the connecting assembly 112 by other electrical components in the electronic device 100, and ensuring the stable operation of the mainboard assembly 104 and the circuit board 108.

[0051] In some embodiments of the present application, the motherboard assembly 104 includes a motherboard bracket 116, which is used for grounding; the speaker assembly 110 includes a speaker housing 118; and the limiting portion 114 is arranged on the motherboard bracket 116 and / or the speaker housing 118; wherein the connecting assembly 112 is grounded through the limiting portion 114 and the motherboard bracket 116; and / or the connecting assembly 112 is grounded through the limiting portion 114 and the speaker housing 118.

[0052] In the embodiments of this application, Figure 2 As shown, the motherboard assembly 104 may include a motherboard bracket 116. It is understood that the motherboard bracket 116 can be used to protect the multiple electrical components on the motherboard, preventing them from being damaged by external objects. Furthermore, the motherboard bracket 116 can be used for grounding, thereby meeting the grounding requirements of the multiple electrical components on the motherboard. Thus, when the limiter 114 is disposed on the motherboard bracket 116, the connection assembly 112 can be directly grounded through the motherboard bracket 116, preventing signal interference on the connection assembly 112.

[0053] Furthermore, the speaker assembly 110 includes a speaker housing 118. The speaker housing 118 protects the speaker's components while also ensuring the speaker's sound quality. The speaker housing 118 can also be electrically connected to the motherboard bracket 116. Thus, when the retaining portion 114 is disposed on the speaker housing 118, the connecting assembly 112 can be grounded sequentially through the retaining portion 114, the speaker housing 118, and the motherboard bracket 116, thereby preventing signal interference on the connecting assembly 112.

[0054] Furthermore, when limiting portions 114 are provided on both the mainboard bracket 116 and the speaker housing 118, the connection component 112 can be grounded simultaneously through the mainboard bracket 116 and the speaker housing 118, that is, bidirectional grounding, further improving the grounding stability of the connection component 112 and ensuring the stability of the operation of the mainboard component 104 and the circuit board 108.

[0055] In some embodiments of the present application, the limiting portion 114 includes: a first limiting portion 120, which is arranged on the mainboard bracket 116; a second limiting portion 122, which is arranged on the speaker housing 118; wherein the connecting component 112 is grounded through the second limiting portion 122 and the speaker housing 118.

[0056] In the embodiments of this application, Figure 3 The third structural diagram of the electronic device according to the embodiment of the present application is shown; Figure 2 and Figure 3 As shown, the limiting portion 114 may include a first limiting portion 120 and a second limiting portion 122, wherein the first limiting portion 120 is arranged on the mainboard bracket 116, and the second limiting portion 122 is arranged on the speaker housing 118, that is, the connecting component 112 is limited by the first limiting portion 120 and the second limiting portion 122 at the same time, thereby further improving the limiting effect of the limiting portion 114 on the connecting component 112 and ensuring the stability of the connecting component 112.

[0057] Furthermore, the connecting component 112 is grounded through the second limiting portion 122 and the speaker housing 118. It is understandable that in the actual production process, the mainboard bracket 116 is usually manufactured by mold injection molding. During the injection molding process, the mold surface needs to be chemically treated, so an insulating layer is usually formed on the mainboard bracket 116 obtained by injection molding. In this case, if the connecting component 112 needs to be stably grounded through the mainboard bracket 116, it is necessary to mill the mainboard bracket 116 to remove the insulating layer on the surface of the mainboard bracket 116. In the embodiment of the present application, the connecting component 112 is grounded through the second limiting portion 122 and the speaker housing 118. It can not only ensure the stability of the position of the connecting component 112 through the second limiting portion 122, but also achieve stable grounding of the connecting component 112, thereby reducing the process of milling the mainboard bracket 116 during the production process, and improving the processing efficiency of the electronic device 100.

[0058] In some embodiments of the present application, the first limiting portion 120 includes: a first protrusion 124, which is arranged on the surface of the mainboard bracket 116; a second protrusion 126, which is arranged on the surface of the mainboard bracket 116; wherein a portion of the connecting component 112 is located between the first protrusion 124 and the second protrusion 126, so as to be limited by the first protrusion 124 and the second protrusion 126.

[0059] In the embodiments of this application, Figure 4 Shown Figure 3 One of the structural diagrams of the first limiting part; Figure 6 Shown Figure 3 The second structural diagram of the first limiting part; Figure 4 and Figure 6 As shown, the first limiting portion 120 may include a first protrusion 124 and a second protrusion 126. The first protrusion 124 and the second protrusion 126 are both arranged on the surface of the mainboard bracket 116. Through the first protrusion 124 and the second protrusion 126, a part of the connecting component 112 can be clamped, thereby achieving a fixing effect on the connecting component 112 and ensuring the stability of the position of the connecting component 112.

[0060] Specifically, a portion of the connecting component 112 can be located between the first protrusion 124 and the second protrusion 126, and the connecting component 112 and the first protrusion 124 and the second protrusion 126 are interference fit, thereby ensuring the stability of the connection between the connecting component 112 and the first protrusion 124 and the second protrusion 126.

[0061] In addition, the first protrusion 124 and the second protrusion 126 can be integrally formed with the mainboard bracket 116. For example, the mainboard bracket 116 and the first protrusion 124 and the second protrusion 126 on the mainboard bracket 116 can be directly provided through injection molding, thereby ensuring the structural stability of the first protrusion 124 and the second protrusion 126, and further ensuring the limiting effect on the connecting assembly 112. The ends of the first protrusion 124 and the second protrusion 126 can be provided with guide radius, thereby effectively improving the assembly efficiency of the connecting assembly 112 and preventing the first protrusion 124 and the second protrusion 126 from getting stuck with the connecting assembly 112 during the assembly process of the connecting assembly 112.

[0062] In some embodiments of the present application, the angle between the side wall of the first protrusion 124 and the surface of the mainboard bracket 116 is greater than 90 degrees and less than 92 degrees, and the angle between the side wall of the second protrusion 126 and the surface of the mainboard bracket 116 is greater than 90 degrees and less than 92 degrees.

[0063] In the embodiments of this application, Figure 7 、 Figure 13 and Figure 14 As shown, the angle α between the side walls of the first protrusion 124 and the second protrusion 126 and the surface of the mainboard bracket 116 can be set to be greater than 90 degrees, that is, the distance between the first protrusion 124 and the second protrusion 126 gradually decreases, which makes it convenient to configure the connecting component 112 between the first protrusion 124 and the second protrusion 126, thereby improving assembly efficiency.

[0064] The angle between the sidewalls of the first and second protrusions 124, 126 and the surface of the motherboard bracket 116 needs to be less than 92 degrees. This prevents the distance between the first and second protrusions 124, 126 from being too large and affecting the stability of the assembly of the connection assembly 112. Specifically, the angle α between the sidewalls of the first and second protrusions 124, 126 and the surface of the motherboard bracket 116 can be set to 91.5 degrees.

[0065] In some embodiments of the present application, the second limiting portion 122 includes: a fixing clip 128, which is connected to the speaker housing 118, and the fixing clip 128 is grounded through the speaker housing 118; wherein the fixing clip 128 is used to clamp the connecting component 112 so that the connecting component 112 is grounded through the fixing clip 128 and the speaker housing 118.

[0066] like Figure 5 As shown, the second limiting portion 122 may include a fixing clip 128, which clamps the connecting assembly 112 to ensure the stability of the position of the connecting assembly 112. At the same time, in conjunction with the first limiting portion 120 composed of the first protrusion 124 and the second protrusion 126 on the mainboard bracket 116, the connecting assembly 112 can be simultaneously limited by the two limiting portions 114, further improving the limiting effect of the limiting portion 114 on the connecting assembly 112.

[0067] Specifically, fixing clip 128 is connected to speaker housing 118 and can be made of a conductive material, such as steel or copper. Furthermore, since speaker housing 118 is electrically connected to motherboard bracket 116, connection assembly 112 can be grounded sequentially through fixing clip 128, speaker housing 118, and motherboard bracket 116.

[0068] In some embodiments of the present application, the fixing clip 128 includes: a first rib 130, one end of the first rib 130 is connected to the speaker housing 118; a bottom edge 132, one end of the bottom edge 132 is connected to the other end of the first rib 130; a second rib 134, one end of the second rib 134 is connected to the other end of the bottom edge 132; wherein, the first rib 130, the second rib 134 and the bottom edge 132 enclose a clamping space 136, a portion of the connecting component 112 is located in the clamping space 136 and is connected to the first rib 130 and the second rib 134, the angle between the first rib 130 and the bottom edge 132 is less than 90 degrees, and the angle between the second rib 134 and the bottom edge 132 is less than 90 degrees.

[0069] Figure 9 Shown Figure 8 A partial enlarged view of point B in the middle; Figure 8 and Figure 9As shown, the fixing clip 128 may include a first rib 130, a bottom rib 132, and a second rib 134. One end of the first rib 130 is connected to the speaker housing 118, the bottom rib 132 is connected to the other end of the first rib 130, and the second rib 134 is connected to the other end of the bottom rib 132. Thus, the first rib 130, the bottom rib 132, and the second rib 134 can enclose a clamping space 136, thereby clamping the connecting assembly 112 within the clamping space 136 to define the position of the connecting assembly 112. Furthermore, the connecting assembly 112 is connected to the first rib 130 and the second rib 134, so that the connecting assembly 112 can be connected to the speaker housing 118 via the fixing clip 128, thereby achieving grounding requirements through the speaker housing 118.

[0070] Furthermore, the angle β between the first rib 130 and the bottom edge 132 is less than 90 degrees, and the angle between the second rib 134 and the bottom edge 132 is less than 90 degrees. That is, the first rib 130 and the second rib 134 gradually converge upward from the bottom edge 132, thereby further improving the clamping effect of the fixing clip 128 on the connecting assembly 112 and further enhancing the position stability of the connecting assembly 112. Specifically, the angle between the first rib 130 and the bottom edge 132 can be set to 70 degrees, and similarly, the angle between the second rib 134 and the bottom edge 132 can also be set to 70 degrees.

[0071] In some embodiments of the present application, a guide portion 138 is provided on one side of the first rib 130 and the second rib 134 away from the bottom edge 132 .

[0072] In the embodiments of this application, Figure 9 As shown, a guide portion 138 can be provided on one side of the first rib 130 and the second rib 134 away from the bottom edge 132, so that when the connecting component 112 is installed in the clamping space 136 between the first rib 130 and the second rib 134, the connecting component 112 can be guided by the guide portion 138, thereby improving the assembly efficiency of the connecting component 112.

[0073] Specifically, the guide portion 138 can extend from the side of the first and second ribs 130 and 134 away from the bottom edge 132 toward both sides of the clamping space 136. The guide portion 138 can be formed with rounded corners to reduce manufacturing difficulty. In other words, the first rib 130, bottom edge 132, second rib 134, and guide portion 138 can form an M-shaped structure, resulting in an overall M-shaped shape for the fixing clamp 128.

[0074] In some embodiments of the present application, the second limiting portion 122 includes: a third protrusion 140, which is arranged on the surface of the mainboard bracket 116; a first baffle 142, one end of the first baffle 142 is connected to the speaker housing 118; wherein, a portion of the connecting component 112 is located between the third protrusion 140 and the first baffle 142, so as to be limited by the third protrusion 140 and the first baffle 142; a conductive area 144 is provided on the surface of the third protrusion 140, a portion of the connecting component 112 is connected to the conductive area 144, and the connecting component 112 is grounded through the mainboard bracket 116 and the speaker housing 118.

[0075] In the embodiments of this application, Figure 10 FIG4 shows a fourth structural diagram of an electronic device according to an embodiment of the present application; Figure 10 、 Figure 11 and Figure 12 As shown, the second limiting portion 122 may include a third protrusion 140 arranged on the surface of the mainboard bracket 116 and a first baffle 142 arranged on the speaker housing 118, that is, the second protrusion 126 may be composed of the third protrusion 140 and the first baffle 142 respectively, and the connection component 112 is limited by the third protrusion 140 and the first baffle 142.

[0076] Furthermore, a conductive area 144 may be provided on the surface of the third raised portion 140, and a portion of the connecting assembly 112 is connected to the conductive area 144, thereby achieving electrical connection between the connecting assembly 112 and the motherboard bracket 116. This allows the connecting assembly 112 to be grounded via the motherboard bracket 116. Simultaneously, the connecting assembly 112 may also be connected to the speaker housing 118 via the first baffle 142, thereby achieving bidirectional grounding for the connecting assembly 112, further improving the grounding stability of the connecting assembly 112 and ensuring the operational stability of the motherboard assembly 104 and the circuit board 108.

[0077] Specifically, the third protrusion 140 and the mainboard bracket 116 can be integrally formed. For example, the mainboard bracket 116 and the third protrusion 140 on the mainboard bracket 116 can be directly formed through injection molding, thereby ensuring the structural stability of the third protrusion 140. Furthermore, the insulating layer on the third protrusion 140 can be removed by milling to form a conductive area 144 on the third protrusion 140, thereby achieving electrical connection between the mainboard bracket 116 and the connecting assembly 112.

[0078] It should be noted that, since the second limiting portion 122 is formed by the cooperation of the third protrusion 140 on the mainboard bracket 116 and the first baffle 142 connected to the speaker housing 118, and the first baffle 142 can be grounded through the speaker housing 118, when realizing bidirectional grounding of the connecting component 112, only the surface of the third protrusion 140 on the mainboard bracket 116 can be milled, and the third protrusion 140 protrudes from the surface of the mainboard bracket 116. In this way, during milling, the tool of the milling equipment has sufficient processing space, so that a tool with a larger diameter can be used for processing, thereby effectively avoiding the problem of tool breakage during processing using a small diameter tool. Taking the first limiting portion 120 as an example, the first protrusion 124 and the second protrusion 126 of the first limiting portion 120 are both set on the mainboard bracket 116 by injection molding. In order to ensure the limiting effect of the first protrusion 124 and the second protrusion 126 on the connecting component 112, the distance between the first protrusion 124 and the second protrusion 126 is only about 0.7 mm. At this time, if it is necessary to mill the surface opposite to the connecting component 112 on the first protrusion 124 or the second protrusion 126, it is necessary to use a tool with a diameter of less than 0.7 mm for processing, and the risk of tool breakage is relatively high.

[0079] In some embodiments of the present application, the angle between the first baffle 142 and the surface of the mainboard bracket 116 is less than 90 degrees.

[0080] In the embodiments of this application, Figure 15 Shown Figure 11 A schematic structural diagram of the second limiting portion; Figure 16 Shown Figure 15 A partial enlarged view of point D in the middle; Figure 15 and Figure 16 As shown, the angle between the first baffle 142 and the surface of the motherboard bracket 116 can be set to be less than 90 degrees. That is, the first baffle 142 gradually approaches the third protrusion 140, thereby further improving the clamping effect of the connecting component 112 and further improving the position stability of the connecting component 112. Specifically, the angle γ between the first baffle 142 and the surface of the motherboard bracket 116 can be set to 75 degrees.

[0081] In addition, a guide radius may also be provided at the end of the first baffle 142 to facilitate the installation process of the connecting assembly 112 .

[0082] In some embodiments of the present application, the limiting portion 114 includes: a fourth protrusion 146, one end of the fourth protrusion 146 is connected to the mainboard bracket 116; a second baffle 148, one end of the second baffle 148 is connected to the other end of the fourth protrusion 146; a third baffle 150, one end of the third baffle 150 is connected to the speaker housing 118; wherein, the fourth protrusion 146, the second baffle 148 and the third baffle 150 enclose a limiting space 152, a portion of the connecting component 112 is located in the limiting space 152, and is connected to the fourth protrusion 146, the second baffle 148 and the third baffle 150, and the connecting component 112 is grounded through the third baffle 150 and the speaker housing 118.

[0083] In the embodiments of this application, Figure 17 A fifth structural diagram of an electronic device according to an embodiment of the present application is shown; Figure 18 FIG6 shows a sixth structural diagram of an electronic device according to an embodiment of the present application; Figure 17 and Figure 18 As shown, the limiting portion 114 may include a fourth protrusion 146, a second baffle 148, and a third baffle 150. One end of the fourth protrusion 146 is connected to the motherboard bracket 116, the second baffle 148 is connected to the other end of the fourth protrusion 146, and one end of the third baffle 150 is connected to the speaker housing 118. As a result, the fourth protrusion 146, the second baffle 148, and the third baffle 150 can enclose a limiting space 152, thereby positioning a portion of the connecting assembly 112 within the limiting space 152. Combined with the surface of the motherboard bracket 116, the connecting assembly 112 can be simultaneously limited in position from the circumference of the connecting assembly 112, thereby further ensuring the limiting effect of the connecting assembly 112. While ensuring the stability of the position of the connecting assembly 112, the connecting assembly 112 can be grounded through the third baffle 150 and the speaker housing 118, ensuring the grounding effect of the connecting assembly 112.

[0084] Specifically, along the length direction of the electronic device 100, the fourth protrusion 146 and the third baffle 150 are respectively located on both sides of the connecting component 112, and along the thickness direction of the electronic device 100, the second baffle 148 is located on one side of the connecting component 112. At the same time, along the thickness direction of the electronic device 100, the surface of the mainboard bracket 116 is located on the other side of the connecting component 112, thereby realizing the simultaneous limitation of the connecting component 112 from the circumference of the connecting component 112.

[0085] For example, Figure 19 A schematic structural diagram of a circuit board in an electronic device according to an embodiment of the present application is shown; Figure 20 A schematic structural diagram of a speaker housing in an electronic device according to an embodiment of the present application is shown; Figure 21FIG7 shows a seventh structural diagram of an electronic device according to an embodiment of the present application; Figure 22 FIG8 shows an eighth structural diagram of an electronic device according to an embodiment of the present application; Figure 20 、 Figure 21 and Figure 22 As shown, during the assembly of the connecting assembly 112, the connecting assembly 112 can first be connected to the circuit board 108, and then the circuit board 108 with the connecting assembly 112 installed can be assembled on the speaker housing 118. Furthermore, the speaker housing 118 can be first tilted and assembled on the mainboard bracket 116, and the position of the connecting assembly 112 opposite the fourth protrusion 146 can be assembled below the second baffle 148. Finally, the speaker housing 118 can be pressed to allow the connecting assembly 112 to enter the limited space 152 enclosed by the fourth protrusion 146, the second baffle 148, and the third baffle 150. The connecting assembly 112 and the fourth protrusion 146, the second baffle 148, and the third baffle 150 can all be interference fits to improve the limiting effect of the connecting assembly 112. When disassembling the connecting assembly 112, the speaker housing 118 can be removed first to achieve the disassembly of the connecting assembly 112.

[0086] Specifically, the fourth protrusion 146, the second baffle 148 and the mainboard bracket 116 can be integrally formed by injection molding to ensure the structural stability of the fourth protrusion 146 and the second baffle 148. The second baffle 148 can also be formed by milling with a T-shaped cutter using a milling machine.

[0087] In some embodiments of the present application, the connecting component 112 includes: a connecting wire 154, the two ends of which are respectively connected to the mainboard component 104 and the circuit board 108; a metal ring 156, the metal ring 156 is sleeved on the connecting wire 154, and the metal ring 156 is used to connect to the limiting portion 114.

[0088] like Figure 23 As shown, the connecting component 112 may include a connecting wire 154 and a metal ring 156, wherein the two ends of the connecting wire 154 are respectively connected to the mainboard component 104 and the circuit board 108 to achieve electrical connection between the mainboard component 104 and the circuit board 108, thereby ensuring that the mainboard component 104 and the circuit board 108 can simultaneously radiate signals, thereby improving the antenna performance of the electronic device 100.

[0089] Furthermore, a metal ring 156 is sleeved on the connecting wire 154 and is used to connect to the limiting portion 114. Specifically, the metal ring 156 can be electrically connected to the connecting wire 154. By providing the metal ring 156 to achieve connection with the limiting portion 114, the connecting wire 154 is grounded through the limiting portion 114, and the connecting wire 154 can be protected to prevent the limiting portion 114 from damaging the connecting wire 154 during installation and removal, or when the electronic device 100 is impacted or shaken.

[0090] In some embodiments of the present application, the electronic device 100 further includes: a metal connector 158 , which is respectively connected to the speaker assembly 110 and the mainboard assembly 104 , and the speaker assembly 110 is electrically connected to the mainboard assembly 104 through the metal connector 158 .

[0091] In the embodiments of this application, Figure 1 、 Figure 2 、 Figure 3 、 Figure 8 、 Figure 10 、 Figure 15 、 Figure 17 、 Figure 18 and Figure 22 As shown, the electronic device 100 may further include a metal connector 158, through which the speaker assembly 110 and the motherboard assembly 104 may be connected. Specifically, the speaker housing 118 may be connected to the motherboard bracket 116 via the metal connector 158, so that the speaker housing 118 can be electrically connected to the motherboard bracket 116 via the metal connector 158, thereby achieving grounding of the speaker housing 118.

[0092] In addition, connecting the speaker assembly 110 to the mainboard assembly 104 via the metal connector 158 can also ensure the stability of the connection position between the speaker assembly 110 and the mainboard assembly 104, thereby improving the structural integrity of the electronic device 100.

[0093] Exemplarily, the metal connector 158 can be a metal screw. Accordingly, a threaded hole can be opened on the mainboard bracket 116, and a through hole can be opened on the speaker housing 118. The metal screw can pass through the through hole of the speaker housing 118 and be threadedly connected to the threaded hole on the mainboard bracket 116 to connect the mainboard bracket 116 with the speaker housing 118.

[0094] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0095] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: case; a mainboard assembly, disposed in the housing; A circuit board is disposed in the housing, wherein the mainboard assembly and the circuit board are respectively located on two sides of the housing; a speaker assembly, disposed on the housing; A connecting component, two ends of which are connected to the mainboard component and the circuit board respectively; a limiting portion, provided on the mainboard assembly and / or the speaker assembly; The limiting portion is used to be connected to the connecting assembly to limit the connecting assembly, and the connecting assembly is grounded through the mainboard assembly and / or the speaker assembly.

2. The electronic device according to claim 1, wherein The mainboard assembly includes a mainboard bracket, the mainboard bracket is used for grounding, the speaker assembly includes a speaker housing, and the limiting portion is provided on the mainboard bracket and / or the speaker housing; Wherein, the connecting component is grounded through the limiting portion and the mainboard bracket; and / or The connecting assembly is grounded through the limiting portion and the speaker housing.

3. The electronic device according to claim 2, wherein: The limiting portion includes: A first limiting portion is provided on the mainboard bracket; A second limiting portion is provided on the speaker housing; Wherein, the connecting assembly is grounded through the second limiting portion and the speaker housing.

4. The electronic device according to claim 3, wherein: The first limiting portion includes: A first protrusion is provided on the surface of the mainboard bracket; A second protrusion is provided on the surface of the mainboard bracket; Part of the connecting assembly is accommodated between the first protrusion and the second protrusion so as to be limited by the first protrusion and the second protrusion.

5. The electronic device according to claim 3, wherein: The second limiting portion includes: a fixing clip connected to the speaker housing, wherein the fixing clip is grounded through the speaker housing; The fixing clip is used to clamp the connection assembly so that the connection assembly is grounded through the fixing clip and the speaker housing.

6. The electronic device according to claim 5, characterized in that The fixing clip comprises: a first rib, one end of which is connected to the speaker housing; a bottom edge, one end of the bottom edge being connected to the other end of the first rib; a second rib, one end of the second rib being connected to the other end of the bottom edge; The first rib, the second rib and the bottom edge enclose a clamping space, a portion of the connecting assembly is located in the clamping space and connected to the first rib and the second rib, the angle between the first rib and the bottom edge is less than 90 degrees, and the angle between the second rib and the bottom edge is less than 90 degrees.

7. The electronic device according to claim 3, wherein: The second limiting portion includes: a third protrusion, provided on the surface of the mainboard bracket; a first baffle, one end of the first baffle being connected to the speaker housing; Wherein, a portion of the connecting assembly is located between the third protrusion and the first baffle, so as to be limited by the third protrusion and the first baffle; A conductive area is provided on the surface of the third protrusion, a portion of the connecting component is connected to the conductive area, and the connecting component is grounded through the mainboard bracket and the speaker housing.

8. The electronic device according to claim 7, wherein: An angle between the first baffle and a surface of the mainboard bracket is less than 90 degrees.

9. The electronic device according to claim 2, wherein: The limiting portion includes: a fourth protrusion, one end of which is connected to the mainboard bracket; a second baffle, one end of the second baffle being connected to the other end of the fourth protrusion; a third baffle, one end of the third baffle being connected to the speaker housing; The fourth protrusion, the second baffle and the third baffle form a limiting space, a portion of the connecting component is located in the limiting space and is connected to the fourth protrusion, the second baffle and the third baffle, and the connecting component is grounded through the third baffle and the speaker housing.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The connection component includes: A connecting wire, wherein two ends of the connecting wire are respectively connected to the mainboard assembly and the circuit board; A metal ring is sleeved on the connecting wire and is used to connect with the limiting portion.

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