Substrate processing equipment and substrate processing system

Abstract

The utility model discloses substrate processing equipment and a substrate processing system, and relates to the field of substrate processing equipment.The substrate processing equipment comprises an air static pressure vibration workbench which is used for driving a substrate fixed on the air static pressure vibration workbench to vibrate in the first direction at the set amplitude and frequency in the processing process; periodic contact and separation are formed between the machining tool rotating at a high speed and the substrate, so that machining of the substrate is achieved. In the embodiment, the air static pressure vibration workbench is arranged on the substrate processing equipment, and the air static pressure vibration workbench drives the substrate on the air static pressure vibration workbench to perform high-frequency vibration in the first direction at the set amplitude and frequency in the processing process, so that the complex structure of a traditional main shaft vibration mode is simplified, and the cost is reduced; the problems that an existing substrate machining device adopting a main shaft vibration mode is complex in structure and high in cost are solved.

Description

Technical Field

[0001] The utility model relates to the field of substrate processing equipment, in particular to substrate processing equipment and a substrate processing system. Background Art

[0002] With the rapid development of the aerospace, medical, automotive, and electronics industries, substrates (such as printed circuit boards) are becoming increasingly multi-layered, micropore diameters are shrinking, and micropore quality requirements are becoming increasingly stringent. However, in substrate processing, micropore machining often involves difficult-to-machine materials such as carbon fiber composites. These materials have poor machinability, and the micropores generally have large aspect ratios. This results in high drilling forces and temperatures, shortening drill bit life, and ultimately reducing substrate machining accuracy.

[0003] In the prior art, in order to improve the processing accuracy of the substrate, a vibration device is usually added to the main shaft to improve the processing accuracy of the substrate. However, this method increases the complexity of the main shaft structure and is costly. Summary of the Invention

[0004] Based on this, the embodiments of the present invention provide a substrate processing device and a substrate processing system to solve the technical problems of the existing substrate processing equipment using a spindle vibration method having a complex structure and high cost.

[0005] In order to solve the above problems, the technical solutions adopted by the present invention are as follows:

[0006] In a first aspect, an embodiment of the present invention provides a substrate processing device, comprising:

[0007] The pneumatic static pressure vibration worktable is used to drive the substrate fixed thereon to vibrate in the first direction at a set amplitude and frequency during the processing process, so that the high-speed rotating processing tool and the substrate form periodic contact and separation to realize the processing of the substrate.

[0008] Optionally, the air static pressure vibration workbench includes an air static pressure ultrasonic vibration workbench, and the air static pressure ultrasonic vibration workbench includes a processing workbench and an air static pressure ultrasonic vibration device;

[0009] The air static pressure ultrasonic vibration device is used to drive the substrate on the processing workbench to vibrate in the first direction at a set amplitude and frequency during the processing process, so that the high-speed rotating processing tool and the substrate form periodic contact and separation to achieve processing of the substrate.

[0010] Optionally, the air static pressure ultrasonic vibration device includes an ultrasonic vibration device that utilizes aerodynamic principles to enable a vibration rod disposed inside the ultrasonic vibration device to vibrate and rotate in a preset direction in a cyclonic floating state.

[0011] Optionally, at least one of the aforementioned air static pressure ultrasonic vibration devices is included, and the air static pressure ultrasonic vibration devices are arranged on the processing workbench in a uniformly arranged manner.

[0012] Optionally, the air static pressure ultrasonic vibration device includes a bearing mounting cover, a bearing mounting base and a vibration rod;

[0013] The output end of the vibration rod is detachably connected to the processing workbench;

[0014] The bearing mounting cover is detachably connected to the bearing mounting base;

[0015] The vibration rod is arranged in a receiving chamber formed by the bearing mounting cover and the bearing mounting base, and is used to drive the processing workbench to vibrate in the first direction, thereby driving the substrate to vibrate in the first direction.

[0016] Optionally, the aerostatic pressure ultrasonic vibration device further comprises a first aerostatic pressure bearing, a second aerostatic pressure bearing and an air-floating vibration plate provided on the vibration rod;

[0017] The first aerostatic bearing is fixedly mounted on the bearing mounting cover;

[0018] The second hydrostatic bearing is fixedly mounted on the bearing mounting base;

[0019] The central axis of the vibration rod is perpendicular to the central axes of the first and second gas static pressure bearings, respectively, and the air-floating vibration plate is located between the first and second gas static pressure bearings;

[0020] An air inlet hole is provided on the bearing mounting base, a first air inlet duct is provided between the first aerostatic bearing and the bearing mounting cover, and a second air inlet duct is provided between the second aerostatic bearing and the bearing mounting base;

[0021] The first air inlet channel and the second air inlet channel are both connected to the air inlet hole, so that high-pressure air introduced through the air inlet hole enters the first annular air groove on the first air static pressure bearing through the first air inlet channel, and forms a first air film between the first air static pressure bearing and the air-floating vibration plate;

[0022] After entering the second annular air groove on the second air static pressure bearing through the second air inlet passage, a second air film is formed between the second air static pressure bearing and the air floating vibration plate;

[0023] The first air film and the second air film generate different pressures on both sides of the air-floating vibration plate, so that the air-floating vibration plate drives the vibration rod to vibrate along the first direction.

[0024] Optionally, the aerostatic pressure ultrasonic vibration device further includes a third aerostatic pressure bearing;

[0025] The third hydrostatic air bearing is fixedly mounted on the bearing mounting base;

[0026] A third air inlet duct is provided between the third aerostatic bearing and the bearing mounting base;

[0027] The third air inlet channel is connected to the air inlet hole, so that the high-pressure air introduced from the air inlet hole enters the third annular air groove on the third air static pressure bearing through the third air inlet channel and then fills into the accommodating chamber to form a third air film for supporting the suspension of the vibration rod.

[0028] Optionally, the aerostatic bearing comprises a toroidal throttle type aerostatic bearing or a small hole throttling type aerostatic bearing.

[0029] Optionally, the air static pressure ultrasonic vibration device further includes a muffler;

[0030] The bearing mounting base is provided with an outlet communicated with the accommodating chamber, and the muffler is arranged at the outlet.

[0031] Optionally, the processing workbench is provided with a groove;

[0032] The bearing mounting cover is embedded in the groove.

[0033] Optionally, the substrate processing equipment further comprises a bed and a movable platform disposed below the pneumatic static pressure vibration worktable;

[0034] The mobile platform is provided with a first through hole communicating with the air inlet and a second through hole communicating with the muffler;

[0035] The bearing mounting base is detachably connected to the mobile platform;

[0036] The movable platform is detachably connected to the bed.

[0037] Optionally, the substrate processing equipment further comprises a gantry system, a first motion assembly, a second motion assembly, a third motion assembly and a spindle fixing assembly;

[0038] The gantry system and the bed form a channel;

[0039] The spindle is connected to one side of the spindle fixing assembly, the other side of the spindle fixing assembly is connected to one end of the first motion assembly, the other end of the first motion assembly is connected to one end of the second motion assembly, and the other end of the second motion assembly is connected to the gantry system;

[0040] One end of the third motion component is connected to the bed, and the other end is connected to the mobile platform;

[0041] The first motion component can drive the spindle fixing component to move along the first direction, so that the spindle fixing component drives the spindle to move along the first direction;

[0042] The second motion component can drive the first motion component to move along a second direction, so as to drive the main shaft to move along the second direction;

[0043] The third motion component can drive the mobile platform to move along the third direction, so that the mobile platform drives the pneumatic static pressure vibration worktable to move into or out of the channel;

[0044] The first direction, the second direction and the third direction are perpendicular to each other.

[0045] Optionally, the spindle fixing assembly includes a spindle clamping assembly, a chip suction assembly, and a lifting assembly for controlling the lifting of the chip suction assembly;

[0046] One side of the spindle clamp assembly is detachably connected to the first motion assembly;

[0047] The other side of the spindle clamp assembly is detachably connected to the lifting assembly;

[0048] The end of the lifting assembly is detachably connected to the chip suction assembly.

[0049] Optionally, the chip suction assembly includes a chip suction cover and a pressure component for pressing the substrate;

[0050] The pressure component is detachably connected to the chip suction cover assembly.

[0051] Optionally, the processing type of the substrate includes drilling, grooving, milling or cutting, and / or the substrate includes a high aspect ratio substrate, a multi-layer stacked substrate or a high density interconnect substrate.

[0052] In a second aspect, an embodiment of the present invention provides a substrate processing system, wherein the substrate includes a PCB board, a packaging substrate and a glass substrate; the substrate processing system includes at least one substrate processing device described in the first aspect above.

[0053] In one embodiment of the present invention, substrate processing equipment includes an air-static-pressure vibration table configured to vibrate a substrate mounted thereon in a first direction at a set amplitude and frequency during processing, thereby periodically contacting and separating a high-speed rotating tool and the substrate to achieve processing of the substrate. In this embodiment, by providing the substrate processing equipment with an air-static-pressure vibration table, which drives the substrate mounted thereon to vibrate in the first direction at a set amplitude and frequency during processing, the complex structure of conventional spindle vibration methods is simplified, costs are reduced, and the complex structure and high cost of spindle vibration methods used in existing substrate processing equipment are resolved. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0055] Figure 1 It is a schematic diagram of a substrate processing device in one embodiment of the present utility model;

[0056] Figure 2 This is a partial cross-sectional view of a substrate processing device in one embodiment of the present invention;

[0057] Figure 3 This is a plan view of a substrate processing device in one embodiment of the present invention;

[0058] Figure 4 1 is a schematic diagram of the arrangement of an air static pressure ultrasonic vibration device in one embodiment of the present utility model;

[0059] Figure 5 It is a plan view of an air static pressure ultrasonic vibration device in one embodiment of the present utility model;

[0060] Figure 6 This is a partially enlarged view of a substrate processing device in one embodiment of the present invention;

[0061] Figure 7 It is a partial cross-sectional view of a substrate processing device in one embodiment of the present invention.

[0062] The accompanying drawings are numerals as follows:

[0063] 1. Spindle;

[0064] 2. Gas static pressure vibration workbench;

[0065] 21. Processing workbench;

[0066] 22. Aerostatic ultrasonic vibration device; 221. Bearing mounting cover; 222. Bearing mounting base; 223. Vibration rod; 224. First aerostatic bearing; 225. Second aerostatic bearing; 226. Third aerostatic bearing; 227. Air-floating vibration plate; 228. First air inlet duct; 229. Second air inlet duct; 2210. Third air inlet duct; 2211. First annular air groove; 2212. Second annular air groove; 2213. Third annular air groove; 2214. Air inlet hole; 2215. Muffler;

[0067] 3. Mobile platform; 31. First through hole; 32. Second through hole;

[0068] 4. Beam base; 41. First base; 42. Second base;

[0069] 5. Crossbeam; 6. Bed; 7. First moving assembly; 8. Second moving assembly; 9. Third moving assembly; 10. Spindle fixing assembly; 11. Base plate; 12. Processing tool; 13. Screws;

[0070] 14. Spindle clamp assembly; 141. Spindle clamp rear seat; 142. Spindle clamp front cover;

[0071] 15. Chip suction assembly; 151. Chip suction cover; 152. Pressure component;

[0072] 16. Lifting assembly. DETAILED DESCRIPTION

[0073] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0074] In the description of the present invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0075] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0076] To facilitate understanding of the embodiments of the present invention, the substrate 11 involved in the present invention is explained as follows: The substrate 11 involved in the present invention can include a PCB board, a packaging substrate (IC carrier board), and a glass substrate, which is not limited here. The embodiments provided by the present invention are explained as follows:

[0077] The first aspect provides a substrate processing device, see Figure 1 and Figure 2 The substrate processing equipment includes an air static pressure vibration worktable 2, which is used to drive the substrate 11 fixed thereon to vibrate in the first direction at a set amplitude and frequency during the processing process, so that a high-speed rotating processing tool 12 and the substrate 11 form periodic contact and separation to realize the processing of the substrate 11.

[0078] In some embodiments, the machining tool 12 can be connected to the output end of the spindle 1, and the pneumatic static pressure vibration table 2 can be disposed below the spindle 1. The spindle 1 can have a rotational speed between 50,000 rpm and 300,000 rpm. Preferably, the spindle 1 can have a rotational speed of 100,000 rpm, 150,000 rpm, 200,000 rpm, or 250,000 rpm, though this is not intended to be limiting. Therefore, when the spindle 1 rotates at high speed, the machining tool 12 can be driven to rotate at high speed. Furthermore, the pneumatic static pressure vibration table 2 can have a preset amplitude range of 1 µm to 20 µm, and a preset frequency range of 100 Hz to 80 kHz. Specifically, when the substrate 11 is processed by the substrate processing equipment, based on the air static pressure vibration worktable 2 set on the substrate processing equipment, the air static pressure vibration worktable 2 drives the substrate 11 thereon to vibrate at high frequency in the first direction at a set amplitude and frequency during the processing, which simplifies the complex structure of the traditional spindle vibration method, reduces the cost, and solves the problem of complex structure and high cost of the spindle vibration method adopted by the existing substrate processing equipment.

[0079] As an example, the pneumatic vibrating table 2 can be an ultrasonic vibrating table driven by pneumatic technology and ultrasonic vibration technology. While controlling the spindle 1 to drive the machining tool 12 to process the substrate 11, the pneumatic vibrating table 2 can be simultaneously controlled to vibrate in a first direction at a set amplitude and frequency. This allows the machining tool 12 to rotate and feed while the vibration of the pneumatic vibrating table 2 causes a periodic contact and separation between the substrate 11 on the pneumatic vibrating table 2 and the machining tool 12. This significantly improves machining accuracy and efficiency compared to conventional continuous contact between the machining tool 12 and the substrate 11.

[0080] For example, during vibration drilling, when the drill bit encounters an offset during the drilling process, the vibration will cause the drill bit to temporarily exit and reposition, thereby automatically eliminating the offset and ensuring that the drill bit can accurately re-drill into the target position, thereby improving the positioning accuracy of the drill hole, making vibration drilling show higher precision and efficiency in substrate processing compared to ordinary drilling. In particular, it shows great advantages when processing difficult-to-process materials such as high aspect ratio substrates, multi-layer stacked substrates, and high-density interconnected substrates. Therefore, by using the air static pressure vibration worktable 2 to drive the substrate 11 thereon to vibrate at high frequency in the first direction during the processing, the effect of improving processing accuracy and efficiency can also be achieved, simplifying the complex structure of the traditional spindle vibration method, and reducing costs.

[0081] Furthermore, the excellent chip-breaking properties generated by vibration facilitate smoother chip removal during machining, reducing scraping of the hole surface by the chips. Furthermore, the reciprocating ironing action of the machining tool 12 on the inner hole surface during vibration machining further reduces the surface roughness of the substrate 11 and the surface quality of the hole wall, thereby improving the machining quality of the substrate 11. Furthermore, the intermittent action between the machining tool 12 and the substrate 11 significantly reduces friction, thus maintaining a stable and normal wear state for the machining tool 12. This results in lower cutting temperatures, stable drill performance, and slow wear, extending the life of the machining tool 12.

[0082] It should be understood that the periodic contact and separation described above, manifested as the number of times the tool 12 and substrate 11 come into contact and separate during machining, is determined by the vibration frequency of the pneumatic static pressure vibration table 2. For example, one contact and separation cycle is completed every 50µs (1s / 20,000 times). The amplitude determines the amount of pressure applied by the tool 12 to the substrate 11 during each contact; the greater the amplitude, the greater the contact force.

[0083] In one embodiment, if Figure 2 and Figure 3As shown, the air static pressure vibration workbench 2 includes an air static pressure ultrasonic vibration workbench, and the frequency range of the air static pressure ultrasonic vibration workbench is above 20kHz. Further, the frequency range of the air static pressure ultrasonic vibration workbench can be configured within the range of 20kHz~60kHz, preferably, it can be configured to 20kHz, 30kHz or 40kHz, etc.; the air static pressure ultrasonic vibration workbench includes a processing workbench 21 and an air static pressure ultrasonic vibration device 22; further, the frequency range of the air static pressure ultrasonic vibration device 22 can be configured within the range of 20kHz~40kHz, and the specific range is not limited; the air static pressure ultrasonic vibration device 22 is used to drive the substrate 11 on the processing workbench 21 to vibrate in the first direction with a set amplitude and frequency during the processing, so that the high-speed rotating processing tool 12 and the substrate 11 form periodic contact and separation to realize the processing of the substrate 11.

[0084] In some embodiments, the air static pressure ultrasonic vibration device 22 can apply vibration to the processing table 21 at a set amplitude and frequency during the processing, thereby driving the substrate 11 to perform a small periodic displacement in the first direction. The amplitude and frequency can be adjusted according to the specific requirements of the processing to adapt to different types of processing tasks. For example, during drilling or milling, the amplitude range can be set between 1µm and 20µm, and the frequency range can be set between 20kHz and 40kHz. Specifically, the present invention does not limit this. By vibrating at a specific amplitude and frequency, the cutting ability of the processing tool 12 can be effectively improved, and the processing accuracy of the substrate 11 can be optimized.

[0085] In one embodiment, the air static pressure ultrasonic vibration device 22 includes an ultrasonic vibration device that utilizes aerodynamic principles to enable a vibration rod 223 disposed inside the ultrasonic vibration device to vibrate and rotate in a preset direction in a cyclonic floating state.

[0086] In some embodiments, the air static pressure ultrasonic vibration device 22 can be an ultrasonic vibration device that integrates aerodynamic principles with ultrasonic technology. As an example, a vibration rod 223 can be provided inside the ultrasonic vibration device, and under ultrasonic drive, the vibration rod 223 is caused to vibrate at a high frequency along a first direction. High-pressure air is introduced into the ultrasonic vibration device, so that the introduced high-pressure air forms a static pressure air film around the vibration rod 223, thereby isolating the vibration rod 223 from direct contact with the inner wall of the ultrasonic vibration device. Under the action of cyclonic buoyancy, the vibration rod 223 can simultaneously achieve vibration and rotation in a preset direction.

[0087] In one embodiment, if Figure 4 As shown, the substrate processing equipment includes at least one air static pressure ultrasonic vibration device 22, and the air static pressure ultrasonic vibration device 22 is arranged on the processing workbench 21 in a uniform arrangement.

[0088] As an example, the air static pressure ultrasonic vibration device 22 is evenly arranged above and / or below the processing workbench 21, or the processing workbench 21 can be implemented with a honeycomb aluminum structure, and the air static pressure ultrasonic vibration device 22 can be evenly arranged inside the processing workbench 21, etc., which is not specifically limited here. The purpose is to enable the substrate 11 on the processing workbench 21 to vibrate in the first direction, so that the processing tool 12 and the substrate 11 form periodic contact and separation. The technical solution, or the corresponding vibration fixture can make the substrate 11 vibrate in the first direction, so that the processing tool 12 and the substrate 11 form periodic contact and separation. Both are within the scope of protection requested by this application.

[0089] Preferably, taking the example of the air static pressure ultrasonic vibration device 22 being evenly arranged under the processing workbench 21, five identical air static pressure ultrasonic vibration devices 22 can be used and symmetrically arranged under the processing workbench 21, for example, at the four corners and the center position of the processing workbench 21, so as to achieve uniform vibration distribution of the processing workbench 21 and ensure that the substrate 11 can obtain uniform ultrasonic vibration during the processing process.

[0090] It should be noted that the above is merely an example and does not constitute a limitation of the present application. If a single hydrostatic ultrasonic vibration device 22 is sufficient to meet the processing requirements, only one hydrostatic ultrasonic vibration device 22 may be arranged directly below the processing table 21. It should be understood that in this case, a guide column structure is required to enhance stability and prevent displacement or uneven vibration of the processing table 21 caused by vibration.

[0091] Further, if Figure 5 As shown, the air static pressure ultrasonic vibration device 22 includes a bearing mounting cover 221, a bearing mounting base 222 and a vibration rod 223; the output end of the vibration rod 223 is detachably connected to the processing workbench 21; the bearing mounting cover 221 and the bearing mounting base 222 are detachably connected; the vibration rod 223 is arranged in a accommodating chamber formed by the bearing mounting cover 221 and the bearing mounting base 222, and is used to drive the processing workbench 21 to vibrate in a first direction, thereby driving the substrate 11 to vibrate in the first direction.

[0092] In some embodiments, the air static pressure ultrasonic vibration device 22 may include a bearing mounting cover 221, a bearing mounting base 222, and a vibration rod 223. The output end of the vibration rod 223 is fixedly connected to the processing table 21 via a detachable connection device. For example, a screw 13 is inserted through a pre-set through-hole in the processing table 21 and a pre-set threaded hole in the vibration rod 223 to securely connect the output end. This ensures that the vibration rod 223 can stably transmit vibrations during operation. The other end of the vibration rod 223 is located within the accommodation chamber formed by the bearing mounting cover 221 and the bearing mounting base 222.

[0093] As an example, the bearing mounting cover 221 and the bearing mounting base 222 can be detachably connected by bolts or other fasteners to form a closed accommodating chamber for supporting and fixing the vibration rod 223. During operation, high-pressure air is introduced into the accommodating chamber formed by the bearing mounting cover 221 and the bearing mounting base 222, so that the high-pressure air forms a static pressure air film around the vibration rod 223, thereby isolating the vibration rod 223 from direct contact with the inner wall of the accommodating chamber. Then, under the action of the cyclonic buoyancy, the vibration rod 223 is caused to vibrate periodically in the first direction with a set amplitude and frequency. Further, the processing workbench 21 is driven by the vibration rod 223 to drive the substrate 11 to undergo a small periodic displacement in the first direction. This small vibration can form a periodic contact and separation between the processing tool 12 and the substrate 11, reduce the cutting force during processing, and improve the cutting ability and processing accuracy of the processing tool 12.

[0094] Furthermore, the air static pressure ultrasonic vibration device 22 also includes a first air static pressure bearing 224, a second air static pressure bearing 225 and an air floating vibration plate 227 arranged on the vibration rod 223; the first air static pressure bearing 224 is fixedly mounted on the bearing mounting cover 221; the second air static pressure bearing 225 is fixedly mounted on the bearing mounting base 222; the central axis of the vibration rod 223 is perpendicular to the central axis of the first air static pressure bearing 224 and the second air static pressure bearing 225 respectively, and the air floating vibration plate 227 is located between the first air static pressure bearing 224 and the second air static pressure bearing 225; an air inlet hole 2214 is provided on the bearing mounting base 222, a first air inlet duct 228 is provided between the first air static pressure bearing 224 and the bearing mounting cover 221, and a second air static pressure bearing 225 is provided with a first air inlet duct 228. A second air inlet duct 229 is provided between the bearing mounting base 222; the first air inlet duct 228 and the second air inlet duct 229 are both connected to the air inlet hole 2214, so that the high-pressure air introduced through the air inlet hole 2214 enters the first annular air groove 2211 on the first air static pressure bearing 224 through the first air inlet duct 228, and forms a first air film between the first air static pressure bearing 224 and the air-floating vibration plate 227; after entering the second annular air groove 2212 on the second air static pressure bearing 225 through the second air inlet duct 229, a second air film is formed between the second air static pressure bearing 225 and the air-floating vibration plate 227; the first air film and the second air film generate different pressures on both sides of the air-floating vibration plate 227, so that the air-floating vibration plate 227 drives the vibration rod 223 to vibrate in the first direction.

[0095] In some embodiments, a threaded hole can be provided on the first aerostatic bearing 224, and a through-hole matching the threaded hole on the first aerostatic bearing 224 can be pre-set on the bearing mounting cover 221. During the connection process, a screw 13 can be inserted through the through-hole to securely connect the first aerostatic bearing 224 with the threaded hole. Alternatively, the first aerostatic bearing 224 can be adhered to the interior of the bearing mounting cover 221 using an adhesive. The specific securing method is not limited in this utility model. Similarly, the second aerostatic bearing 225 is secured to the bearing mounting base 222 using the aforementioned method, which will not be further described here. Furthermore, the air-floating vibration plate 227 is fixedly connected to the vibration rod 223. The air inlet 2214 is connected to the first air inlet duct 228 and the second air inlet duct 229 via a pipe. For example, the connecting pipe of the air inlet 2214 can be docked to the first air inlet duct 228 and the second air inlet duct 229, ensuring the sealing of each connection point and further ensuring that high-pressure air can smoothly enter the air tank of the aerostatic bearing. These connections not only optimize the performance of substrate processing equipment, but also increase durability and ease of maintenance.

[0096] During operation, high-pressure air enters through the air inlet 2214, passes through the first air inlet duct 228, and enters the first annular air groove 2211 of the first air bearing 224, forming a first air film between the first air bearing 224 and the air-floating vibration plate 227. Similarly, high-pressure air enters the second annular air groove 2212 of the second air bearing 225 through the second air inlet duct 229, forming a second air film between the second air bearing 225 and the air-floating vibration plate 227. These two air films create different pressures on either side of the air-floating vibration plate 227, driving the air-floating vibration plate 227 to vibrate back and forth in the first direction. Because the vibration rod 223 is connected to the air-floating vibration plate 227, the vibration of the air-floating vibration plate 227 is transmitted to the processing table 21 through the vibration rod 223, causing the substrate 11 on the processing table 21 to vibrate in the first direction. This periodic vibration creates intermittent contact between the processing tool 12 and the substrate 11, achieving the goal of precision machining of the substrate 11. Frictionless vibration transmission is achieved through the pressure difference of the air film, ensuring stability and accuracy during the vibration process, effectively reducing mechanical wear between the vibration rod 223 and the air static pressure bearing, and improving the reliability and service life of the air static pressure ultrasonic vibration device 22.

[0097] Furthermore, the air static pressure ultrasonic vibration device 22 also includes a third air static pressure bearing 226; the third air static pressure bearing 226 is fixedly mounted on the bearing mounting base 222; a third air inlet duct 2210 is arranged between the third air static pressure bearing 226 and the bearing mounting base 222; the third air inlet duct 2210 is connected to the air inlet hole 2214, so that the high-pressure air introduced from the air inlet hole 2214 enters the third annular air groove 2213 on the third air static pressure bearing 226 through the second air inlet duct 229 and then fills into the accommodating chamber to form a third air film for supporting the suspension of the vibration rod 223.

[0098] In some embodiments, the third aerostatic bearing 226 can be fixedly mounted on the bearing mounting base 222 in the same manner as the second aerostatic bearing 225, which will not be further described herein. The bearing mounting base 222 is also provided with a third air inlet duct 2210 connected to the air inlet hole 2214, which functions to guide high-pressure air to the third aerostatic bearing 226. During operation, when high-pressure air enters the third annular air groove 2213 through the third air inlet duct 2210, it forms a uniform air film. This air film provides support within the accommodating chamber formed by the bearing mounting cover 221 and the bearing mounting base 222, allowing the vibration rod 223 to suspend on the air film. This not only supports the weight of the vibration rod 223, but also reduces direct contact with the inner wall of the accommodating chamber, thereby improving the stability and life of the aerostatic ultrasonic vibration device 22.

[0099] In summary, the aerostatic ultrasonic vibration device 22 includes a vibration rod 223, an air-floating vibration plate 227, a first aerostatic bearing 224, a second aerostatic bearing 225, a third aerostatic bearing 226, a bearing mounting cover 221, and a bearing mounting base 222. The output end of the vibration rod 223 is detachably connected to the processing table 21. The bearing mounting cover 221 and the bearing mounting base 222 are fixed together by bolts or other connecting devices, forming a accommodating chamber within which the vibration rod 223 is disposed. The first aerostatic bearing 224 is fixedly mounted on the bearing mounting cover 221, while the second and third aerostatic bearings 225, 226 are both fixedly mounted on the bearing mounting base 222. The central axis of the vibration rod 223 is perpendicular to the central axes of the first and second aerostatic bearings 224, 225. The first, second, and third air inlet ducts 228, 229, and 2210 are all connected to the air inlet hole 2214.

[0100] During operation, high-pressure air enters through the air inlet 2214, passes through the first air inlet duct 228, and enters the first annular air groove 2211 on the first hydrostatic bearing 224, forming a first air film. Simultaneously, high-pressure air enters the second annular air groove 2212 on the second hydrostatic bearing 225 through the second air inlet duct 229, forming a second air film. The first and second air films generate different pressures on either side of the air-floating vibration plate 227, causing the air-floating vibration plate 227 to vibrate in the first direction, thereby driving the vibration rod 223 and the processing table 21 to vibrate in the first direction. Furthermore, the third hydrostatic bearing 226 is connected to the air inlet 2214 via the third air inlet duct 2210. High-pressure air enters the third annular air groove 2213 on the third hydrostatic bearing 226 and then fills the accommodating chamber, forming a third air film. The third air film generates a supporting force within the accommodating chamber, maintaining the suspension of the vibration rod 223 and reducing contact between the vibration rod 223 and the inner wall of the accommodating chamber. The above arrangement simplifies the problem of complicated structure of the existing ultrasonic vibration device due to the need for functional components such as ultrasonic power supply, transducer, horn, etc., and reduces the cost.

[0101] Furthermore, the aerostatic bearing includes a toroidal restrictor type aerostatic bearing or a small hole restrictor type aerostatic bearing.

[0102] In this embodiment, the types of aerostatic bearings include annular restrictor-type aerostatic bearings and small-hole restrictor-type aerostatic bearings. The annular restrictor-type aerostatic bearing regulates gas flow through a toroidal restrictor. Its advantage lies in its ability to provide a uniform and stable air film, reducing friction between the vibrating rod 223 and the aerostatic bearing, and improving the suspension stability and motion accuracy of the vibrating rod 223. This air film is evenly distributed across the entire aerostatic bearing surface, effectively supporting the vibrating rod 223 and reducing vibration errors.

[0103] As an embodiment, since the aerostatic ultrasonic vibration device 22 has low requirements for axial motion and radial load, the third aerostatic bearing 226 can be a toroidal restrictor-type aerostatic bearing, which features simple processing, easy maintenance, and good stability. This reduces costs and also reduces the air hammer phenomenon in the third aerostatic bearing 226. It should be noted that the above is merely an example and is not intended to be limiting in the present invention.

[0104] The small-hole throttling type gas static pressure bearing is a gas static pressure bearing that uses a throttling hole with a tiny aperture to adjust the gas flow. Its advantage is that it can achieve a higher air film pressure in a smaller volume. It is suitable for application scenarios with strict requirements on space and gas flow. It can provide stable support force under different working conditions and can effectively reduce the movement error of the vibration rod 223.

[0105] As another embodiment, since the first and second aerostatic bearings 224, 225 need to control the vibration of the vibrating rod 223 to drive the vibration of the processing table 21, small-hole throttling aerostatic bearings with greater load-bearing capacity and stiffness can be used. This provides greater load-bearing capacity and stiffness for the processing table 21 mounted on the aerostatic ultrasonic vibration device 22. It should be noted that the first and second aerostatic bearings 224, 225 have different numbers of air holes.

[0106] In summary, in actual applications, appropriate types of aerostatic bearings can be selected according to needs to optimize the performance of the aerostatic ultrasonic vibration device 22, ensuring that the substrate processing equipment can operate efficiently under various operating conditions.

[0107] Furthermore, the air static pressure ultrasonic vibration device 22 includes a muffler 2215; the bearing mounting cover 221 is provided with an outlet communicating with the accommodating chamber, and the muffler 2215 is arranged at the outlet.

[0108] In some embodiments, a muffler 2215 can be fixed to the bearing mounting base 222 at the outlet communicating with the accommodating chamber via bolts, clamps, or flanges, thereby reducing noise generated by the aerostatic pressure ultrasonic vibration device 22 during operation, thereby improving the comfort of the working environment and the quiet operation of the device. The muffler 2215 can be of various types, including but not limited to porous mufflers, diffuser mufflers, and reflective mufflers.

[0109] Furthermore, the processing workbench 21 is provided with a groove; the bearing mounting cover 221 is embedded in the groove.

[0110] In some embodiments, the size and shape of the groove need to match the outer shape of the bearing mounting cover 221 to ensure that the bearing mounting cover 221 can be accurately embedded therein. Generally, the depth, width and shape of the groove can be pre-set according to needs to ensure that the bearing mounting cover 221 can be stably fixed in the groove without displacement or loosening. The number of positions of the grooves is related to the setting position and number of the air static pressure ultrasonic vibration device 22. During the installation process, the bearing mounting cover 221 can be placed in the groove, and through the adaptability of its outer edge, it can be in close contact with the inner wall of the groove to form a firm fixed relationship. By embedding the bearing mounting cover 221 into the groove of the processing workbench 21, the bearing mounting cover 221 can be firmly fixed on the processing workbench 21, thereby improving the overall stability of the air static pressure vibration workbench 2. In addition, because the components can be more easily positioned and fixed through the embedded structure, the above design also simplifies the assembly and disassembly process.

[0111] In one embodiment, the substrate processing equipment also includes a bed 6 and a movable platform 3 arranged under the air static pressure vibration workbench 2; the movable platform 3 is provided with a first through hole 31 connected to the air inlet 2214 and a second through hole 32 connected to the muffler 2215; the bearing mounting base 222 is detachably connected to the movable platform 3; the movable platform 3 is detachably connected to the bed 6.

[0112] In some embodiments, by providing a first through hole 31 and a second through hole 32 on the mobile platform 3 and connecting the first through hole 31 to the air inlet 2214, it is ensured that high-pressure gas can enter the interior of the air static pressure ultrasonic vibration device 22. Furthermore, the second through hole 32 is connected to the muffler 2215, so that the gas entering the air static pressure ultrasonic vibration device 22 can be reduced in noise after passing through the muffler 2215.

[0113] During operation, high-pressure air is introduced into the air inlet of the air-static-pressure ultrasonic vibrator 22 through the first through-hole 31 of the mobile platform 3. The high-pressure air is directed to the corresponding position at the air inlet, thereby driving the vibrating rod 223 to vibrate in the first direction. Simultaneously, the second through-hole 32 on the mobile platform 3 is connected to the muffler 2215. This effectively reduces the noise generated by the air-static-pressure ultrasonic vibrator 22 during operation, thereby reducing the noise caused by the high-pressure air and improving the working environment comfort of the substrate processing equipment and the operator's work experience.

[0114] In one embodiment, the substrate processing equipment further includes a gantry system, a first motion assembly 7 , a second motion assembly 8 , a third motion assembly 9 and a spindle fixing assembly 10 .

[0115] In some embodiments, the gantry system includes a beam base 4 and a beam 5 arranged on the beam base 4. Specifically, the beam base 4 includes a first base 41 and a second base 42 that are spaced apart. Among them, one end of the first base 41 and the second base 42 are respectively connected to the beam 5 by fasteners or other means, thereby forming a gantry system. Through this connection method, the substrate processing equipment can be quickly disassembled and reassembled when it needs to be moved or adjusted, thereby improving the operating efficiency and flexibility of the substrate processing equipment. Among them, the beam 5 can also be made of a material with strong rigidity, such as marble, steel or aluminum alloy, to ensure that it can withstand the weight of the spindle 1 and the load caused by the movement during the processing to avoid deformation, and the length and strength of the beam 5 can be customized according to the processing area and processing requirements, which are not limited here.

[0116] Furthermore, a passage is formed between the gantry system and the bed 6. As an example, one end of the first base 41 and the second base 42 can be connected to the crossbeam 5 respectively, and the other end can be connected to the bed 6 respectively, thereby forming a movement passage for the air static pressure vibration worktable 2 between the first base 41 and the second base 42.

[0117] Furthermore, the spindle 1 is connected to one side of the spindle fixing assembly 10, the other side of the spindle fixing assembly 10 is connected to one end of the first motion assembly 7, the other end of the first motion assembly 7 is connected to one end of the second motion assembly 8, and the other end of the second motion assembly 8 is connected to the gantry system; the first motion assembly 7 can drive the spindle fixing assembly 10 to move in the first direction, so that the spindle fixing assembly 10 drives the spindle 1 to move in the first direction; the second motion assembly 8 can drive the first motion assembly 7 to move in the second direction, so as to drive the spindle 1 to move in the second direction.

[0118] In some embodiments, one side of the spindle fixing assembly 10 can be connected to the spindle 1 via a detachable connection device (such as a bolt or clamp). This connection allows 1 to be easily installed and removed when needed. The other side of the spindle fixing assembly 10 is connected to one end of the first motion assembly 7 via a similar detachable connection device. This ensures that the first motion assembly 7 can drive the spindle fixing assembly 10 to move in the first direction, thereby driving the spindle 1 to move in the first direction. The other end of the first motion assembly 7 is connected to one end of the second motion assembly 8 via a detachable connection device, and the other end of the second motion assembly 8 is connected to the crossbeam 5 via a similar detachable connection device. In this way, while the first motion assembly 7 drives the spindle fixing assembly 10 to move in the first direction, the second motion assembly 8 can drive the first motion assembly 7 to move in the second direction, thereby driving the spindle 1 to move synchronously in the first and second directions. This improves processing flexibility, meets the requirements of different processing techniques, and simplifies the installation and maintenance of the substrate processing equipment.

[0119] In one embodiment, the first motion component 7 includes a first linear motor, a first rolling guide, a first slider and a base plate. The first linear motor and the first rolling guide are fixed on the front side of the base plate. The first slider is arranged on the first rolling guide and is connected to the first linear motor and one side of the spindle fixing assembly 10, while the spindle 1 is fixed on the other side of the spindle fixing assembly 10. During operation, the first linear motor is controlled to drive the first slider to move smoothly in the first direction along the first rolling guide to drive the spindle fixing assembly 10 to move in the first direction, for example, the Z-axis direction, thereby driving the spindle 1 to move in the first direction. Among them, the first motion component 7 can use high-precision and low-friction materials (for example, steel or aluminum alloy) to ensure that the first slider moves smoothly on the first guide rail to avoid affecting the processing accuracy due to vibration or friction.

[0120] In one embodiment, the second motion component 8 includes a second linear motor, a second rolling guide and a second slider. The second linear motor and the second rolling guide are mounted on the crossbeam 5, and the second slider is arranged on the second rolling guide and is connected to the back of the base plate and the second linear motor. During operation, the second linear motor is controlled to drive the second slider to move along the second rolling guide in the second direction, for example, the X-axis direction, to drive the first motion component 7 to move in the second direction, thereby driving the spindle 1 on the spindle fixing component 10 to move in the second direction. This connection method enables the spindle 1 to move accurately in two directions to form a complete two-dimensional motion plane, for example, the ZX plane, thereby achieving comprehensive control of the spindle 1 and meeting the precision requirements of processing different substrates 11.

[0121] Furthermore, one end of the third motion component 9 is connected to the bed 6, and the other end is connected to the mobile platform 3; the third motion component 9 can drive the mobile platform 3 to move along the third direction, so that the mobile platform 3 drives the air static pressure vibration worktable 2 to move in or out of the channel;

[0122] In some embodiments, the third motion assembly 9 can be connected to the bed 6 and the pneumatic vibrating table 2, respectively, via a threaded connection, a pin connection, a key connection, or a quick-locking device. This allows the third motion assembly 9 to be easily disassembled or adjusted when needed, facilitating maintenance or component replacement. The primary function of the third motion assembly 9 is to drive the pneumatic vibrating table 2 to move in a third direction, such as the Y-axis, thereby enabling the pneumatic vibrating table 2 to flexibly move in and out of the channel formed between the crossbeam base 4 and the crossbeam 5.

[0123] For example, when processing a large substrate 11, the pneumatic static pressure vibration worktable 2 can be moved along the third direction through the third motion component 9, which facilitates moving the substrate 11 from outside the substrate processing equipment into the processing area, or moving it out of the processing area after processing is completed, making the operation of the substrate processing equipment more flexible, especially in batch production or complex plate processing, which can significantly improve production efficiency.

[0124] Furthermore, the third motion assembly 9 includes a third linear motor, a third rolling guide, and a third slider. The third linear motor and third rolling guide are mounted on the bed 6, and the third slider is mounted on the third rolling guide and connected to the mobile platform 3 and the third linear motor. During operation, the third linear motor is controlled to drive the third slider along the third rolling guide in the third direction, thereby driving the mobile platform 3 in the third direction, and the pneumatic static pressure vibration table 2 in the third direction. This allows for flexible movement in and out of the channel, forming a complete three-dimensional motion plane, for example, a ZXY plane, which meets the machining accuracy requirements of different substrates 11.

[0125] In summary, the first and second motion assemblies 7 and 8 respectively drive the spindle 1 to perform precision machining in the first and second directions. After machining is completed, the third motion assembly 9 drives the movable platform 3 to move in the third direction, thereby moving the pneumatic static pressure vibration table 2 out of the machining area along the third direction, allowing the operator to conveniently unload and reload the substrate 11. This entire process improves the efficiency and operational convenience of the substrate machining equipment.

[0126] Furthermore, the first direction, the second direction, and the third direction are perpendicular to each other. Specifically, this perpendicular relationship ensures that the first motion component 7, the second motion component 8, and the third motion component 9 do not interfere with each other when working independently in their respective directions, thereby achieving precise and stable motion control. For example, when the first motion component 7 drives the spindle 1 to move in the first direction, the second motion component 8 can simultaneously adjust the processing position in the second direction, while the third motion component 9 can flexibly adjust the movement of the mobile platform 3 in the third direction. Through this design, the substrate processing equipment can be accurately positioned and operated in three-dimensional space, thereby achieving complex processing tasks.

[0127] In one embodiment, if Figure 6 and Figure 7 As shown, the spindle fixing assembly 10 includes a spindle clamping assembly 14, a chip suction assembly 15 and a lifting assembly 16 for controlling the lifting and lowering of the chip suction assembly 15; one side of the spindle clamping assembly 14 is detachably connected to the first motion assembly 7; the other side of the spindle clamping assembly 14 is detachably connected to the lifting assembly 16; and the end of the lifting assembly 16 is detachably connected to the chip suction assembly 15.

[0128] In some embodiments, one side of the spindle clamp assembly 14 is connected to the first motion assembly 7 via a detachable connecting device (e.g., a bolt, a clamp, or other mechanical fastener), so that the spindle clamp assembly 14 can be easily installed and removed from the first motion assembly 7 when needed. The other side of the spindle clamp assembly 14 is connected to the lifting assembly 16 via a similar detachable connecting device, so that the lifting assembly 16 is fixed to the other side of the spindle clamp assembly 14. The end of the lifting assembly 16 is connected to the chip suction assembly 15 via a detachable connecting device, so that during the processing, the lifting and lowering of the lifting assembly 16 can be controlled according to the processing requirements, thereby adjusting the height of the chip suction assembly 15. During operation, the chip suction assembly 15, under the control of the lifting assembly 16, can be raised and lowered accordingly according to the position change of the spindle 1, so as to effectively collect and remove the debris generated during the processing and keep the processing area clean.

[0129] In one embodiment, the spindle clamp assembly 14 may include a spindle clamp rear seat 141 and a spindle clamp front cover 142. Specifically, the spindle 1 may be secured between the spindle clamp rear seat 141 and the spindle clamp front cover 142. For example, the spindle 1 may be inserted into the spindle clamp rear seat 141, and then the spindle clamp front cover 142 may be tightly connected to the spindle clamp rear seat 141 via threads or snaps, thereby securing the spindle 1.

[0130] In one embodiment, if Figure 7 As shown, the chip suction assembly 15 includes a chip suction cover 151 and a pressure component 152 for pressing the substrate 11; the pressure component 152 is detachably connected to the chip suction cover 151 assembly.

[0131] In some embodiments, the chip hood 151 and the pressure component 152 of the chip suction assembly 15 can be connected by bolts, nuts, clamps or other mechanical connectors. These connecting devices allow the pressure component 152 to be easily installed or removed from the chip hood 151 when needed, while ensuring that the two are firmly combined together during operation. The pressure component 152 is responsible for pressing the substrate 11, thereby maintaining the stability of the substrate 11 during the processing. The design of the pressure component 152 and the connection with the chip hood 151 ensure that the pressure component 152 can be firmly fixed to the chip hood 151, so that the substrate 11 can obtain uniform pressure.

[0132] During installation, the pressure member 152 can be docked with the chip hood 151 and secured together using bolts or other fastening devices. This allows the pressure member 152 to press firmly against the substrate 11, preventing it from moving during processing. At the same time, the chip hood 151 effectively collects the cutting chips generated during processing. This design simplifies the installation and removal of the chip hood assembly 15 and ensures convenient maintenance of the substrate processing equipment.

[0133] In one embodiment, the processing types of the substrate 11 include drilling, grooving, milling or cutting. During the processing of the substrate 11, according to different requirements and design specifications, common processing types include drilling, grooving, milling and cutting. Specifically:

[0134] Drilling is a processing method for forming holes in the substrate 11 .

[0135] As one embodiment, while drilling a hole in a substrate 11 using a machining tool 12, the pneumatic static pressure vibration table 2 is driven to vibrate at a high frequency in a first direction (e.g., perpendicular to the surface of the substrate 11) at a set amplitude and frequency. This vibration creates a periodic contact and separation between the machining tool 12 and the substrate 11, effectively reducing cutting forces and heat and facilitating the timely removal of chips. Furthermore, ultrasonic vibration helps remove burrs and debris generated during the drilling process, improving drilled hole quality.

[0136] Gonging is a processing method for removing excess material from the substrate 11 to form a specific shape or structure.

[0137] As an embodiment, while machining tool 12 is performing a gong operation on substrate 11, the pneumatic static pressure vibration table 2 is driven to vibrate at a high frequency in a first direction at a set amplitude and frequency, allowing machining tool 12 to precisely remove excess material from substrate 11 along a predetermined trajectory. During this process, ultrasonic vibration not only significantly reduces cutting resistance and thermal effects, but also ensures the accuracy and integrity of the machining area, promotes smooth chip removal, and effectively prevents tool clogging and wear.

[0138] Milling is a processing method for surface treatment and fine processing of the substrate 11.

[0139] As an embodiment, when the substrate 11 is milled by the machining tool 12, the air static pressure vibration worktable 2 is driven to vibrate at high frequency in the first direction with a set amplitude and frequency, so that the cutting process is more precise and delicate, which not only reduces the damage to the substrate 11 caused by cutting heat and mechanical stress, but also ensures the smoothness and accuracy of the machining edge.

[0140] Cutting is a processing method for forming the substrate 11 into a desired shape and structure.

[0141] As an embodiment, when cutting substrate 11 with machining tool 12, the pneumatic static pressure vibration table 2 is driven to vibrate at a set amplitude and frequency in a first direction, generating high-frequency impact between machining tool 12 and substrate 11, thereby achieving precise and efficient cutting. This cutting method not only reduces damage to the substrate 11 base material, ensuring the smoothness and flatness of the machined edge, but also significantly improves machining accuracy and production efficiency.

[0142] In one embodiment, the substrate 11 includes a high aspect ratio substrate, a multi-layer laminated substrate, or a high-density interconnect substrate. Specifically, a high aspect ratio substrate refers to a relatively thick substrate, for example, a substrate with a thickness of 1.0 mm to 10.0 mm. A multi-layer laminated substrate refers to a circuit board composed of multiple laminated substrate layers, each layer having independent circuit patterns and connection structures. For example, a substrate with 4 to 20 layers and a thickness of 1.5 mm to 10.0 mm. A high-density interconnect (HDI) substrate refers to a PCB with a high wiring density.

[0143] Another aspect provides a substrate processing method applicable to the substrate processing device of the first embodiment. The substrate processing device includes an air static pressure vibration worktable 2, a control system, an air source pressure processing system, an air pressure control system, and a detection system. The substrate processing method of the substrate processing device includes:

[0144] S10, obtaining processing parameters of the substrate 11;

[0145] In this embodiment, the processing parameters of the substrate 11 include substrate parameters and processing type parameters. Specifically, the substrate parameters include substrate type and substrate inherent parameters; wherein the substrate type includes a high aspect ratio substrate, a multi-layer stacked substrate or a high density interconnect (HDI) substrate; the substrate parameters include high aspect ratio substrate parameters, multi-layer stacked substrate parameters or high density interconnect substrate parameters.

[0146] As an example, high aspect ratio substrate parameters include:

[0147] Thickness: for example, 1.0mm to 10.0mm;

[0148] Aperture: for example, 0.2mm to 1.0mm;

[0149] Aspect ratio: for example, 5:1 to 10:1 or higher;

[0150] Material type: For example, FR-4 material.

[0151] Multi-layer substrate parameters include:

[0152] Number of layers: for example, 4 to 20 layers or more;

[0153] Total thickness: for example, 1.5mm to 10.0mm;

[0154] Material type: For example, FR-4 material.

[0155] High-density interconnect substrate parameters include:

[0156] Thickness: for example, 0.5mm to 3.0mm;

[0157] Aperture: for example, 0.1mm to 0.3mm;

[0158] Line width and spacing: for example, 50µm to 150µm.

[0159] Material type: For example, low dielectric constant material.

[0160] The processing type parameters include drilling parameters, drilling parameters, milling parameters or cutting parameters.

[0161] Specifically, drilling parameters include: drilling depth, spindle speed and feed speed.

[0162] The gong parameters include: cutting width, gong knife diameter, cutting speed, gong knife speed and feed speed.

[0163] Milling parameters include: milling depth, milling cutter diameter, spindle speed and feed speed.

[0164] Cutting parameters include: cutting depth, cutting speed and cutting accuracy.

[0165] S20, determining target vibration parameters corresponding to the processed substrate 11 according to the processing parameters;

[0166] In this embodiment, the target vibration parameters include amplitude and frequency. Specifically, the amplitude range is 1µm to 20µm, and the frequency range is 2kHz to 40kHz. Preferably, the amplitude can be configured to 5µm, 10µm, 15µm or 18µm, and the frequency can be configured to 5kHz, 10kHz, 20kHz, 30kHz or 35kHz, and the specific details are not limited. The amplitude and frequency applicable to the substrate 11 are determined according to the processing parameters of the substrate 11, in order to optimize the processing effect and ensure the processing quality. Specifically, the corresponding amplitude and frequency can be pre-set according to the processing parameters of the substrate 11, and the corresponding amplitude and frequency can be automatically queried by inputting the processing parameters of the substrate 11. It can also be determined in other ways, which are not limited here.

[0167] As an example, a database of processing parameters for substrate 11 can be pre-established. This database includes the aforementioned processing parameters for substrate 11, the corresponding amplitudes and frequencies for substrate 11, and the processing results. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. This parameter prediction model is used to predict the amplitudes and frequencies corresponding to the processing parameters for substrate 11.

[0168] Specifically, once the user enters the processing parameters for substrate 11, the control system immediately initiates an automatic query and matching mechanism to quickly filter similar or similar cases from the historical database based on the input processing parameters for substrate 11. A parameter prediction model then intelligently analyzes the amplitude and frequency settings in these cases, taking into account multiple factors such as machining accuracy, machining quality, and tool wear, ultimately recommending the optimal amplitude and frequency.

[0169] For example, a user needs to process a batch of FR-4 substrates 11 with a thickness of 1.6mm, a pore diameter of 0.3mm, and a material type of FR-4. After entering these parameters, the control system uses a pre-trained parameter prediction model to determine the corresponding amplitude and frequency. For example, the amplitude is set to 2.5µm and the frequency is set to 30kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0170] As another example, a relationship table between the processing parameters of the substrate 11 and the amplitude and frequency can be established in advance. When the user inputs the processing parameters of the substrate 11, the control system determines the corresponding amplitude and frequency of the substrate 11 by querying the pre-established relationship table. For example, a high aspect ratio substrate with a thickness of 1.0 mm corresponds to a frequency of 30 kHz and an amplitude of 1.5 µm. A high aspect ratio substrate with a thickness of 2.0 mm corresponds to a frequency of 28 kHz and an amplitude of 2 µm. It should be noted that the above is only an example. Specifically, the processing parameters of the substrate 11, the corresponding amplitude and frequency, can be pre-set according to actual conditions and are not limited here.

[0171] S30. According to the target vibration parameters, the air static pressure vibration worktable 2 is controlled to vibrate along the first direction to drive the substrate 11 on the air static pressure vibration worktable 2 to vibrate in the first direction, so that the high-speed rotating processing tool 12 and the substrate 11 form periodic contact and separation to achieve processing of the substrate 11.

[0172] In this embodiment, based on the target vibration parameters determined in step S20, the pneumatic static pressure vibration table 2 is controlled to vibrate stably along a first direction at the micrometer level. As the pneumatic static pressure vibration table 2 vibrates, the substrate 11 affixed thereto also vibrates, causing the machining tool 12 to periodically contact and separate from the substrate 11 during machining. This effectively reduces the continuous friction between the machining tool 12 and the substrate 11, thereby reducing cutting forces and temperatures, and achieving efficient and precise machining of the substrate 11.

[0173] For example, take a 5.4mm high aspect ratio substrate and drilling a 0.2mm through hole as an example:

[0174] Assume that spindle 1 rotates at 100,000 rpm, the drill speed is 20µm / rev, and the amplitude of the hydrostatic vibration table 2 is 10µm at a frequency of 20kHz. Under these settings, the drill feed rate is 33.33 mm / s. This can be calculated by multiplying the drill speed (20µm / rev) by the spindle 1 revolutions per second (1666.67 rpm) and converting the units. Spindle 1 rotates at 100,000 rpm, or 100,000 rpm. Converting to revolutions per second yields 100,000 ÷ 60 = 1666.67 rpm.

[0175] During operation, the pneumatic vibrating table 2 has an amplitude of 10µm and a frequency of 20kHz, meaning it vibrates 20,000 times per second. Under these settings, the actual drilling feed displacement corresponding to each vibration is 1.67µm (calculated as 33.33mm / 20,000 times). Thus, during the drilling process, the pneumatic vibrating table 2 undergoes 20,000 ultrasonic vibrations. The displacement generated on the substrate 11 by each vibration is far greater than the actual drilling displacement, enabling the drill bit to effectively perform micron-level cutting of the substrate 11 with each vibration. Under ultrasonic vibration conditions, the drill bit does not continuously and uninterruptedly drill 33.33mm. Instead, it simultaneously performs high-frequency, minute (1.67µm) vibratory cutting. This micron-level cutting significantly improves cutting efficiency and quality, effectively reducing cutting forces and temperatures, minimizing drill wear, and improving machining accuracy and surface quality. It should be noted that the above is merely an example and does not constitute a limitation of the present invention.

[0176] Optionally, after step S10, that is, after obtaining the processing parameters of the substrate 11, the following steps are included:

[0177] S40 , controlling the spindle 1 to move to a preset position above the air static pressure vibration worktable 2 , and controlling the spindle 1 to rotate at a high speed according to a preset speed, so as to drive the machining tool 12 provided on the spindle 1 to rotate at a high speed.

[0178] In this embodiment, after obtaining the processing parameters of the substrate 11, the spindle 1 is further controlled to move to a preset position above the air static pressure vibration worktable 2. The purpose of this process is to ensure the accurate positioning of the spindle 1 so that the processing tool 12 can be aligned with the substrate 11 at an appropriate distance and angle, thereby performing effective processing. Next, the spindle 1 is controlled to rotate at a high speed according to a preset speed to ensure that the processing tool 12 can effectively cut or drill. The setting of its speed depends on the obtained processing parameters. For example, different types of substrates 11 require different speeds. The drive system of the spindle 1 is adjusted according to the set speed to achieve a stable rotation speed. For example, when processing a substrate with a high aspect ratio, the speed of the spindle 1 can be set to 50,000 revolutions per minute to reduce the wear of the processing tool 12 and ensure the stability of the processing.

[0179] In one embodiment, the pneumatic static pressure vibration worktable 2 includes a processing worktable 21 and a pneumatic static pressure ultrasonic vibration device 22. That is, step S30, i.e., controlling the pneumatic static pressure vibration worktable 2 to vibrate in a first direction according to target vibration parameters, includes the following steps:

[0180] S31. Outputting a corresponding current signal according to the target vibration parameter;

[0181] S32 , converting the current signal into an air signal, and controlling the input air pressure of the air static pressure ultrasonic vibration device 22 according to the air signal, so that the air static pressure ultrasonic vibration device 22 drives the substrate 11 on the processing workbench 21 to vibrate in the first direction.

[0182] In this embodiment, after determining the amplitude and frequency, the control system further outputs a corresponding current signal and sends it to the air pressure control system. Based on the received current signal, the air pressure control system controls a dedicated signal conversion device to convert the current signal into an air signal. For example, the current signal is first converted into an air signal through an electric-to-pneumatic converter (e.g., an E / P converter) or a proportional solenoid valve. The converted air signal is then amplified by an air-to-air positioner to precisely control the opening of the pressure regulating valve, thereby precisely controlling the input air pressure of the air static pressure ultrasonic vibration device 22. This allows precise control of the amplitude and frequency of the air static pressure ultrasonic vibration device 22, enabling the air static pressure ultrasonic vibration device 22 to vibrate in the first direction according to the input air pressure. One end of the pressure regulating valve is connected to the air inlet of the air static pressure ultrasonic vibration device 22, and the other end is connected to the air source pressure processing system. This allows the air pressure control system to adjust the input air pressure from the air source pressure processing system to the air static pressure ultrasonic vibration device 22 by controlling the opening of the pressure regulating valve.

[0183] It should be noted that the air supply pressure processing system may include an air dryer, a main line filter, an oil mist separator, and an air tank. The air dryer is used to remove most of the moisture from the compressed air; the main line filter is used to filter impurities from the air; the oil mist separator is used to remove oil mist particles from the air; the air tank is used to stabilize the air pressure and reduce airflow fluctuations; and the ultra-fine oil mist separator is used to deeply purify the air, ensuring the extreme dryness and purity of the input air pressure. Furthermore, one end of the air dryer is connected to the air source, and the other end is connected to one end of the main line filter. The other end of the main line filter is connected to one end of the oil mist separator. The other end of the oil mist separator is connected to one end of the air tank, and the other end of the air tank is connected to one end of the pressure regulating valve. By providing the above-mentioned air supply pressure processing system, the high-pressure air input into the air static pressure ultrasonic vibration device 22 is dry and pure compressed air, ensuring the stable performance and reliable operation of the air static pressure ultrasonic vibration device 22.

[0184] For example, when processing a 2.5mm thick substrate with a high aspect ratio, the frequency of the hydrostatic ultrasonic vibration device 22 is determined to be 25kHz and the amplitude to be 2µm. The control system then calculates the corresponding current signal, assuming it is 100mA, and converts this current signal into an air signal through an E / P converter. This signal is then converted into a precise input air pressure, for example, 0.5MPa, through an air-to-air positioner. This precisely controls the opening of the pressure regulating valve and introduces high-pressure air into the hydrostatic ultrasonic vibration device 22, where it contacts the air-floating vibration plate 227 fixed to the vibration rod 223. This causes the air-floating vibration plate 227 to drive the vibration rod 223 to vibrate in a first direction, thereby precisely controlling the vibration of the processing table 21. This effectively reduces stress accumulation, interlayer separation, and other issues during the processing process, improving processing efficiency and reducing defective product rates and material waste. It should be noted that the operating pressure of the ultrasonic wave of the air static pressure ultrasonic vibration device 22 is 0.55 MPa to 0.65 MPa, and the minimum operating pressure without ultrasonic wave is 0.45 MPa to 0.55 MPa. By controlling the input pressure within the range of 0.45 MPa to 0.55 MPa, the above embodiment solves the problem of continuous noise generated during or before processing, improves the comfort of the working environment, reduces the impact on the health of operators, effectively extends the service life of the air static pressure ultrasonic vibration device 22, and improves the overall performance of the substrate processing equipment.

[0185] In one embodiment, after step S30, that is, after controlling the air static pressure ultrasonic vibration device 22 to drive the machining tool 12 to vibrate in the first direction according to the target vibration parameter, the following steps are included:

[0186] S50, obtaining actual vibration parameters of the air static pressure ultrasonic vibration device 22;

[0187] S60, comparing the actual vibration parameter with the target vibration parameter to obtain a comparison result;

[0188] S70, if the comparison result is a match, then start processing the substrate 11;

[0189] S80: If the comparison result is mismatch, adjust the input air pressure of the air static pressure ultrasonic vibration device 22 until the actual vibration parameters match the target vibration parameters.

[0190] In this embodiment, to ensure that the air-static-pressure ultrasonic vibrator 22 achieves target vibration parameters when driving the machining table 21, the control system acquires the actual vibration parameters of the air-static-pressure ultrasonic vibrator 22 as detected in real time by a detection system. These parameters include key data such as actual amplitude and frequency. The detection system may include a high-precision sensor or detection device. Specifically, a high-precision sensor or detection device may be installed inside the machining table 21 or elsewhere to accurately measure the vibration of the machining table 21 and transmit the measured actual vibration parameters to the control system.

[0191] Next, the control system compares the acquired actual vibration parameters with the preset target vibration parameters, generating a comparison result. If the actual vibration parameters fully match the target vibration parameters, the control system confirms that the ultrasonic vibration conditions have been met and allows processing of substrate 11 to begin. In this case, the hydrostatic ultrasonic vibration device 22 drives the processing table 21 to operate at the set frequency and amplitude, causing the processing table 21 to vibrate the substrate 11 thereon at the set frequency and amplitude, ensuring the processing quality and efficiency of substrate 11.

[0192] If the comparison results show that there is a difference between the actual vibration parameters and the target vibration parameters, the control system will automatically make adjustments, for example, adjusting the input air pressure of the air static pressure ultrasonic vibration device 22 to change the vibration characteristics of the processing workbench 21 until the actual vibration parameters match the target vibration parameters. The adjustment process may require multiple iterations, and after each adjustment, the system will re-monitor the actual vibration parameters to ensure that the vibration state of the processing workbench 21 meets the requirements. Through this process, the processing quality and consistency of the substrate 11 are improved. It should be noted that the above is only an example and does not constitute a limitation of this application.

[0193] In one embodiment, in step S80, if the comparison result is mismatch, the input air pressure of the air static pressure ultrasonic vibration device 22 is adjusted until the actual vibration parameters match the target vibration parameters, including the following steps:

[0194] S81, obtaining input air pressure;

[0195] S82, determining whether the input air pressure exceeds a preset range;

[0196] S83, if the input air pressure exceeds the preset range, triggering an alarm and / or controlling the air static pressure ultrasonic vibration device 22 to stop working;

[0197] S84. If the input air pressure does not exceed the preset range, adjust the input air pressure until the actual vibration parameter matches the target vibration parameter.

[0198] In this embodiment, in order to ensure that the air static pressure ultrasonic vibration device 22 can achieve the expected vibration effect, if the actual vibration parameters do not match the target vibration parameters, the current input air pressure value will be obtained. This step can be achieved through a built-in air pressure sensor to ensure that the control system can monitor air pressure changes in real time. Next, it is determined whether the current input air pressure exceeds the preset range. The preset range is a pre-set safe range for the operation of the air static pressure ultrasonic vibration device 22, for example, 0.2MPa to 0.8MPa. Preferably, the input air pressure range can be configured to be 0.4MPa to 0.6MPa, and the specific range is not limited.

[0199] If the input air pressure is detected to be outside the preset range, an alarm is immediately triggered. This alarm can be either audible or visual, alerting the operator to the abnormal air pressure and / or halting the operation of the hydrostatic ultrasonic vibration device 22 to prevent damage to the substrate processing equipment or a decrease in processing accuracy due to the abnormal air pressure. If the input air pressure is within the preset range, the air pressure is continuously adjusted until the actual vibration parameters match the target vibration parameters, ensuring that the hydrostatic ultrasonic vibration device 22 operates under optimal conditions, thereby achieving high-precision processing results.

[0200] For example, the target vibration parameters have an amplitude of 3µm and a frequency of 25kHz. However, the initial measured actual vibration parameters have an amplitude of 2µm and a frequency of 22kHz. Comparing the actual vibration parameters with the target parameters reveals that the amplitude is lower than the target value, while the frequency is higher than the target value. At this point, the control system obtains the current input air pressure, assuming it is 0.5MPa. Next, it determines whether this pressure is within the preset safety range. Since 0.5MPa is within this range, no alarm is triggered or operation is stopped, and adjustments continue.

[0201] Then start adjusting the input air pressure. By increasing the air pressure, for example, the input air pressure is adjusted to 0.6MPa. During the adjustment process, the control system continuously monitors the actual vibration parameters to verify the adjustment effect. If the actual vibration parameters have an amplitude of 3µm and a frequency of 25kHz after adjustment, and these parameters have matched the target vibration parameters, it is confirmed that the new actual vibration parameters have reached the target standard, indicating that the adjustment is successful. After confirming the match, the processing process of the substrate 11 is started. During the processing, the control system will continue to monitor the actual vibration parameters to ensure that they remain within the set range to ensure the quality of the processing and the stability of the equipment. This process not only improves the processing quality and efficiency, but also optimizes the operating stability of the substrate processing equipment, and is suitable for various application scenarios with strict requirements for ultrasonic processing. It should be noted that the above is only an example and does not constitute a limitation.

[0202] The second aspect provides a substrate processing system, which includes at least one substrate processing device according to the embodiment of the first aspect.

[0203] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A substrate processing device, characterized in that: include: An air static pressure vibration workbench, wherein the air static pressure vibration workbench includes an air static pressure ultrasonic vibration workbench, and the air static pressure ultrasonic vibration workbench includes a processing workbench and an air static pressure ultrasonic vibration device; The air static pressure ultrasonic vibration device is used to drive the substrate fixed on the processing workbench to vibrate in the first direction at a set amplitude and frequency during the processing process, so that the high-speed rotating processing tool and the substrate form periodic contact and separation to realize the processing of the substrate.

2. The substrate processing equipment according to claim 1, wherein: The air static pressure ultrasonic vibration device comprises an ultrasonic vibration device which utilizes the principle of aerodynamics to enable a vibration rod arranged inside the ultrasonic vibration device to vibrate and rotate in a preset direction in a cyclonic floating state.

3. The substrate processing equipment according to claim 1, wherein It comprises at least one of the aforementioned air static pressure ultrasonic vibration devices, and the aforementioned air static pressure ultrasonic vibration devices are arranged on the aforementioned processing workbench in a uniformly arranged manner.

4. The substrate processing equipment according to claim 1, wherein The air static pressure ultrasonic vibration device includes a bearing mounting cover, a bearing mounting base and a vibration rod; The output end of the vibration rod is detachably connected to the processing workbench; The bearing mounting cover is detachably connected to the bearing mounting base; The vibration rod is arranged in a receiving chamber formed by the bearing mounting cover and the bearing mounting base, and is used to drive the processing workbench to vibrate in the first direction, thereby driving the substrate to vibrate in the first direction.

5. The substrate processing equipment according to claim 4, wherein: The air static pressure ultrasonic vibration device further comprises a first air static pressure bearing, a second air static pressure bearing and an air floating vibration plate arranged on the vibration rod; The first aerostatic bearing is fixedly mounted on the bearing mounting cover; The second hydrostatic bearing is fixedly mounted on the bearing mounting base; The central axis of the vibration rod is perpendicular to the central axes of the first and second gas static pressure bearings, respectively, and the air-floating vibration plate is located between the first and second gas static pressure bearings; An air inlet hole is provided on the bearing mounting base, a first air inlet duct is provided between the first aerostatic bearing and the bearing mounting cover, and a second air inlet duct is provided between the second aerostatic bearing and the bearing mounting base; The first air inlet channel and the second air inlet channel are both connected to the air inlet hole, so that high-pressure air introduced through the air inlet hole enters the first annular air groove on the first air static pressure bearing through the first air inlet channel, and forms a first air film between the first air static pressure bearing and the air-floating vibration plate; After entering the second annular air groove on the second air static pressure bearing through the second air inlet passage, a second air film is formed between the second air static pressure bearing and the air floating vibration plate; The first air film and the second air film generate different pressures on both sides of the air-floating vibration plate, so that the air-floating vibration plate drives the vibration rod to vibrate along the first direction.

6. The substrate processing equipment according to claim 5, wherein: The aerostatic pressure ultrasonic vibration device further includes a third aerostatic pressure bearing; The third hydrostatic air bearing is fixedly mounted on the bearing mounting base; A third air inlet duct is provided between the third aerostatic bearing and the bearing mounting base; The third air inlet channel is connected to the air inlet hole, so that the high-pressure air introduced from the air inlet hole enters the third annular air groove on the third air static pressure bearing through the third air inlet channel and then fills into the accommodating chamber to form a third air film for supporting the suspension of the vibration rod.

7. The substrate processing equipment according to claim 6, wherein: The gas static pressure bearing includes a toroidal throttle type gas static pressure bearing or a small hole throttling type gas static pressure bearing.

8. The substrate processing equipment according to claim 6, wherein: The air static pressure ultrasonic vibration device also includes a muffler; The bearing mounting base is provided with an outlet communicated with the accommodating chamber, and the muffler is arranged at the outlet.

9. The substrate processing equipment according to claim 8, wherein: The processing workbench is provided with a groove; The bearing mounting cover is embedded in the groove.

10. The substrate processing equipment according to claim 9, wherein: The substrate processing equipment further includes a bed and a movable platform disposed below the pneumatic static pressure vibration worktable; The mobile platform is provided with a first through hole communicating with the air inlet and a second through hole communicating with the muffler; The bearing mounting base is detachably connected to the mobile platform; The movable platform is detachably connected to the bed.

11. The substrate processing equipment according to claim 10, wherein: The substrate processing equipment further includes a gantry system, a first motion assembly, a second motion assembly, a third motion assembly and a spindle fixing assembly; The gantry system and the bed form a channel; The spindle is connected to one side of the spindle fixing assembly, the other side of the spindle fixing assembly is connected to one end of the first motion assembly, the other end of the first motion assembly is connected to one end of the second motion assembly, and the other end of the second motion assembly is connected to the gantry system; One end of the third motion component is connected to the bed, and the other end is connected to the mobile platform; The first motion component can drive the spindle fixing component to move along the first direction, so that the spindle fixing component drives the spindle to move along the first direction; The second motion component can drive the first motion component to move along a second direction, so as to drive the main shaft to move along the second direction; The third motion component can drive the mobile platform to move along the third direction, so that the mobile platform drives the pneumatic static pressure vibration worktable to move into or out of the channel; The first direction, the second direction and the third direction are perpendicular to each other.

12. The substrate processing equipment according to claim 11, wherein: The spindle fixing assembly includes a spindle clamping assembly, a chip suction assembly, and a lifting assembly for controlling the lifting of the chip suction assembly; One side of the spindle clamp assembly is detachably connected to the first motion assembly; The other side of the spindle clamp assembly is detachably connected to the lifting assembly; The end of the lifting assembly is detachably connected to the chip suction assembly.

13. The substrate processing equipment according to claim 12, wherein: The chip suction assembly includes a chip suction cover and a pressure component for pressing the substrate; The pressure component is detachably connected to the chip suction cover assembly.

14. The substrate processing equipment according to any one of claims 1 to 13, characterized in that: The processing type of the substrate includes drilling, grooving, milling or cutting, and / or the substrate includes a high aspect ratio substrate, a multi-layered substrate or a high density interconnect substrate.

15. A substrate processing system, characterized in that: The substrate includes a PCB board, a packaging substrate and a glass substrate; the substrate processing system includes at least one substrate processing device according to any one of claims 1 to 14.

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