Wafer glass slide blank TTV correction device

Abstract

The utility model discloses a wafer glass slide blank TTV correction device which comprises a bottom plate, a bending plate fixed at the top of the bottom plate and an electric sliding table installed on the outer wall of the top of the bottom plate, and further comprises a shell fixed on a sliding piece of the electric sliding table, an adjusting roller is rotatably installed on the inner wall of the shell, and an adjusting assembly is installed on the inner wall of the shell. A wafer glass slide can be placed on the slide holder, the surface flatness of the wafer glass slide is detected through the laser sensor, the motor drives the transmission assembly to rotate so as to drive the adjusting assembly to rotate, the adjusting assembly drives the adjusting roller to rotate slowly, and then the horizontal angle positions of the slide holder and the wafer glass slide are adjusted in a stepless mode. The horizontal state of the wafer glass slide can be conveniently adjusted according to the surface flatness of the wafer glass slide, process angle adjustment is facilitated, and the TTV value of the wafer glass slide can be reduced, so that the grinding quality of the wafer glass slide is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a TTV correction device for a wafer glass carrier blank. Background Art

[0002] During the wafer glass thinning and grinding process, the TTV value is a critical parameter that reflects the flatness of the wafer glass surface. Currently, the TTV value is primarily adjusted by adjusting grinding process parameters, such as grinding force, grinding speed, and grinding fluid flow rate. However, adjusting grinding process parameters alone still leaves room for improvement in TTV value correction and does not effectively improve wafer glass surface flatness. Utility Model Content

[0003] The purpose of the present invention is to provide a TTV correction device for a wafer glass carrier blank, so as to solve the problem in the background art that there is still room for improvement in the correction of the TTV value.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a TTV correction device for wafer glass carrier blanks, comprising: a base plate, a bending plate fixed to the top of the base plate and an electric slide installed on the outer wall of the top of the base plate, and also comprising: a shell fixed on the sliding part of the electric slide, an adjusting roller is rotatably installed on the inner wall of the shell, and an adjusting component is installed on the inner wall of the shell, a carrier is installed on the top of the adjusting roller, and a motor is installed on the outer wall of one side of the shell, a transmission component is installed on the output shaft of the motor, and the motor is connected to the adjustment component through the transmission component, a laser sensor is installed on the inner wall of the top of the bending plate, and a controller is installed on the inner wall of one side of the bending plate, an electric clamp is installed on the outer wall of one side of the shell, and clamps are fixed on the two clamping parts of the electric clamp, and limiting plates are fixed at both ends of the adjusting roller.

[0005] The adjustment component includes a first rotating roller, a second rotating roller, a third rotating roller and a transmission belt, and the first rotating roller, the second rotating roller and the third rotating roller are connected by the transmission belt.

[0006] The transmission assembly comprises a driving wheel sleeved on the output shaft of the motor, a driven wheel sleeved on one end of the first roller, and a belt connected to the driving wheel and the driven wheel.

[0007] The outer walls of the clamping plate and the limiting plate on the opposite side are both frosted surfaces.

[0008] The wheel speed ratio of the driving wheel and the driven wheel is:.

[0009] The outer wall of the transmission belt portion is in contact with the outer wall of the adjusting roller.

[0010] Compared with the prior art, the beneficial effects of the present invention are:

[0011] The TTV correction device for wafer glass carrier blanks of the utility model can place the wafer glass carrier on the carrier stage, detect the surface flatness of the wafer glass carrier by means of a laser sensor, drive the transmission component to rotate by means of a motor, and then drive the adjustment component to rotate, and drive the adjustment roller to rotate slowly by means of the adjustment component, thereby steplessly adjusting the horizontal angle position of the carrier stage and the wafer glass carrier, conveniently adjusting the horizontal state of the wafer glass carrier itself according to the surface flatness of the wafer glass carrier, facilitating process angle adjustment, and capable of reducing the TTV value of the wafer glass carrier, thereby improving the grinding quality of the wafer glass carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a cross-sectional structural diagram of the utility model;

[0013] Figure 2 This is an external structural diagram of the utility model;

[0014] Figure 3 This is a structural diagram of the adjustment component of the utility model;

[0015] Figure 4 This is a structural diagram of the transmission component of the present utility model.

[0016] In the figure: 1. Base plate; 2. Bending plate; 3. Electric slide; 4. Housing; 5. Adjusting roller; 6. Adjusting assembly; 601. First roller; 602. Second roller; 603. Third roller; 7. Carrier; 8. Motor; 9. Transmission assembly; 901. Driving wheel; 902. Driven wheel; 903. Belt; 10. Laser sensor; 11. Controller; 12. Electric gripper; 13. Clamp; 14. Limiting plate. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] See also Figure 1-4The TTV correction device for wafer glass carrier blanks provided by the utility model includes: a base plate 1, a bending plate 2 fixed to the top of the base plate 1 and an electric slide 3 installed on the outer wall of the top of the base plate 1, and also includes: a shell 4 fixed on the sliding part of the electric slide 3, an adjusting roller 5 is rotatably installed on the inner wall of the shell 4, and an adjusting component 6 is installed on the inner wall of the shell 4, a carrier stage 7 is installed on the top of the adjusting roller 5, and a motor 8 is installed on the outer wall of one side of the shell 4, a transmission component 9 is installed on the output shaft of the motor 8, and the motor 8 is connected to the adjustment component 6 through the transmission component 9, a laser sensor 10 is installed on the inner wall of the top of the bending plate 2, and a controller 11 is installed on the inner wall of one side of the bending plate 2, an electric clamp 12 is installed on the outer wall of one side of the shell 4, and a clamping plate 13 is fixed on the two clamping parts of the electric clamp 12, and a limiting plate 14 is fixed at both ends of the adjusting roller 5.

[0019] It should be noted here that: the wafer glass carrier can be placed on the carrier stage 7, and the two clamps 13 are driven by the electric clamp 12 to approach each other and press against the two limit plates 14 respectively, so as to clamp and fix the adjustment roller 5, and the carrier stage 7 is moved to the bottom of the polishing device by the electric slide 3 for polishing. After polishing, the carrier stage 7 can be moved to the bottom of the laser sensor 10 by the electric slide 3, and the surface flatness of the wafer glass carrier can be detected by the laser sensor 10. The electric clamp 12 can release the clamping of the adjustment roller 5, and the transmission component 9 can be driven to rotate by the motor 8, thereby driving the adjustment component 6 to rotate, and the adjustment roller 5 can be driven to rotate slowly by the adjustment component 6, thereby steplessly adjusting the horizontal angle position of the carrier stage 7 and the wafer glass carrier, so as to facilitate the adjustment of the horizontal state of the wafer glass carrier itself according to the surface flatness of the wafer glass carrier, help to adjust the process angle, and can reduce the TTV value of the wafer glass carrier, thereby improving the grinding quality of the wafer glass carrier.

[0020] In a preferred embodiment, the adjustment assembly 6 includes a first roller 601 , a second roller 602 , a third roller 603 and a transmission belt 604 , and the first roller 601 , the second roller 602 and the third roller 603 are connected by the transmission belt 604 .

[0021] It should be noted that the motor 8 drives the transmission assembly 9, which in turn drives the first roller 601 to rotate, and further drives the transmission belt 604 to rotate. The rotation of the transmission belt 604 drives the adjustment roller 5 to rotate slowly to adjust the angle.

[0022] In a preferred embodiment, the transmission assembly 9 includes a driving wheel 901 sleeved on the output shaft of the motor 8, a driven wheel 902 sleeved on one end of the first roller 601, and a belt 903 connected to the driving wheel 901 and the driven wheel 902.

[0023] It should be noted that the motor 8 can drive the driving wheel 901 to rotate, thereby driving the belt 903 to rotate, thereby driving the driven wheel 902 to rotate, and thereby driving the first rotating roller 601 to rotate.

[0024] In a preferred embodiment, the outer walls of the clamping plate 13 and the limiting plate 14 on the opposite side are both frosted surfaces.

[0025] It should be noted here that it helps to improve the clamping and anti-slip effect.

[0026] In a preferred embodiment, the wheel speed ratio between the driving wheel 901 and the driven wheel 902 is 1:5.

[0027] It should be noted here that it can play a decelerating role, making it convenient for fine angle adjustments.

[0028] In a preferred embodiment, a portion of the outer wall of the transmission belt 604 is in contact with the outer wall of the adjusting roller 5 .

[0029] It should be noted here that the rotation of the transmission belt 604 can drive the adjustment roller 5 to rotate.

[0030] Working principle: The wafer glass carrier can be placed on the carrier table 7, and the two clamps 13 are driven by the electric clamp 12 to approach each other and press against the two limit plates 14 respectively, so as to clamp and fix the adjusting roller 5. The carrier table 7 is moved to the bottom of the grinding device for grinding through the electric slide 3. After grinding, the carrier table 7 can be moved to the bottom of the laser sensor 10 through the electric slide 3. The flatness of the surface of the wafer glass carrier can be detected by the laser sensor 10. The clamping of the adjusting roller 5 can be released by the electric clamp 12, and the active roller 5 can be driven by the motor 8. The wheel 901 rotates, thereby driving the belt 903 to rotate, and then driving the driven wheel 902 to rotate, and then driving the first roller 601 to rotate, and then driving the transmission belt 604 to rotate. The rotation of the transmission belt 604 drives the adjustment roller 5 to rotate slowly, adjust the angle, and then steplessly adjust the horizontal angle position of the wafer stage 7 and the wafer glass carrier, which is convenient for adjusting the horizontal state of the wafer glass carrier itself according to the flatness of the wafer glass carrier surface, helps to adjust the process angle, can reduce the TTV value of the wafer glass carrier, and thus improve the grinding quality of the wafer glass carrier.

[0031] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. Wafer glass carrier blank TTV correction device, including: A base plate (1), a bending plate (2) fixed to the top of the base plate (1), and an electric slide (3) mounted on the outer wall of the top of the base plate (1); The invention is characterized in that it also includes: a shell (4) fixed on the sliding part of the electric slide (3), an adjusting roller (5) is rotatably installed on the inner wall of the shell (4), and an adjusting component (6) is installed on the inner wall of the shell (4), a film carrier (7) is installed on the top of the adjusting roller (5), and a motor (8) is installed on the outer wall of one side of the shell (4), a transmission component (9) is installed on the output shaft of the motor (8), and the motor (8) is connected to the adjusting component (6) through the transmission component (9), a laser sensor (10) is installed on the inner wall of the top of the bending plate (2), and a controller (11) is installed on the inner wall of one side of the bending plate (2), an electric clamp (12) is installed on the outer wall of one side of the shell (4), and clamps (13) are fixed on both clamping parts of the electric clamp (12), and limiting plates (14) are fixed at both ends of the adjusting roller (5).

2. The TTV correction device for a wafer glass carrier blank according to claim 1, characterized in that: The adjustment component (6) comprises a first rotating roller (601), a second rotating roller (602), a third rotating roller (603) and a transmission belt (604), and the first rotating roller (601), the second rotating roller (602) and the third rotating roller (603) are connected by transmission through the transmission belt (604).

3. The TTV correction device for a wafer glass carrier blank according to claim 2, characterized in that: The transmission assembly (9) comprises a driving wheel (901) sleeved on the output shaft of the motor (8), a driven wheel (902) sleeved on one end of the first roller (601), and a belt (903) connected to the driving wheel (901) and the driven wheel (902).

4. The TTV correction device for a wafer glass carrier blank according to claim 1, characterized in that: The outer walls of the clamping plate (13) and the limiting plate (14) on the opposite side are both frosted surfaces.

5. The TTV correction device for a wafer glass carrier blank according to claim 3, characterized in that: The wheel speed ratio between the driving wheel (901) and the driven wheel (902) is 1:

5.

6. The TTV correction device for a wafer glass carrier blank according to claim 2, characterized in that: Part of the outer wall of the transmission belt (604) is in contact with the outer wall of the regulating roller (5).

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