GaN-based vertical LED chip vacuum packaging machine

Abstract

The utility model relates to the technical field of LED chip vacuum packaging, in particular to a GaN-based vertical LED chip vacuum packaging machine, which can be used for packaging a plurality of LED chips at one time, is convenient to operate and improves the working efficiency. Comprising a workbench, a bottom box is fixedly connected to the bottom end of the workbench, supporting legs are fixedly connected to the four corners of the bottom of the bottom box, a vacuum pump is arranged in the bottom box, and a top cover is installed on the top of the workbench through an opening and closing assembly; the opening and closing assembly comprises two sliding rods, two limiting sliding blocks, two moving plates, two electric telescopic rods, two mounting bases and two ratchet wheels, the top cover is connected with a vacuum pump through a vacuumizing pipe, a sealing assembly is mounted between the top cover and the workbench, a packaging cavity is formed in the top of the workbench, and a pressing assembly is mounted in the packaging cavity.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum packaging of LED chips, in particular to a vacuum packaging machine for GaN-based vertical LED chips. Background Art

[0002] With technological advancements, LED lamps have become the most common lighting fixtures and are deeply loved by a large number of users. The LED light-emitting unit is an LED chip, which is a solid-state semiconductor device. Due to the small size of the LED chip, it is easily corroded and damaged by contact with water vapor. Therefore, LED chips must be packaged before transportation. The traditional method is to manually package them in plastic bags, which is inefficient and easily corroded by water vapor in humid climates, affecting product quality. Prior art publication number CN205311981U proposes an LED chip vacuum packaging machine, which includes a machine table and a packaging cover. The machine table is equipped with a vacuum pump and a control host. The machine table is provided with an operation button connected to the control host. Two packaging stations are provided on the upper end surface of the machine table, and each packaging station is provided with a pressure rod. Two rocker arms are connected to the front and back sides of the packaging cover, and the other ends of the rocker arms are connected to the machine table. The bottom surface of the packaging cover is provided with a heating plate that matches the pressure rod. The bottom edge of the packaging cover is provided with a sealing strip. The packaging cover is connected to the vacuum pump via a rubber tube. However, one packaging station can only package one chip, which wastes manpower and affects work efficiency. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a GaN-based vertical LED chip vacuum packaging machine that can package multiple LED chips at a time, facilitates operation, and improves work efficiency.

[0004] The utility model discloses a GaN-based vertical LED chip vacuum packaging machine, comprising a workbench, wherein the bottom end of the workbench is fixedly connected to a bottom box, the four bottom corners of the bottom box are fixedly connected to supporting legs, the bottom box has a built-in vacuum pump, the top of the workbench is equipped with a top cover through an opening and closing component, the top cover is connected to the vacuum pump through a vacuum pipe, a sealing component is installed between the top cover and the workbench, a packaging cavity is opened on the top of the workbench, and a pressing component is installed in the packaging cavity; a packaging film is placed in the packaging cavity at the top of the workbench, a GaN-based vertical LED chip is placed on the packaging film, and then another packaging film is placed on top, the top cover is driven to be installed on the top of the workbench by the opening component, the sealing is increased by the sealing component, the vacuum pump is started to vacuum the space between the top cover and the workbench, and the GaN-based vertical LED chip is plastic-sealed and packaged between two packaging films through the pressing component, so that multiple LED chips can be packaged at one time, thereby improving work efficiency.

[0005] Preferably, the opening and closing assembly includes two sliding bars, two limit sliders, two movable plates, two electric telescopic rods, two mounting seats and two ratchet wheels, and limited sliding grooves are provided at the left and right ends of the top rear end of the workbench, the sliding bar is fixedly installed in the limit sliding groove, the limit slider is slidably installed in the limit sliding groove, and the limit slider is slidably installed on the outer wall of the slide bar, the top of the limit slider is fixedly connected to the movable plate, the top of the movable plate is fixedly connected to the electric telescopic rod, the top of the electric telescopic rod is fixedly connected to the mounting seat, the left and right ends of the top cover are rotatably mounted on the mounting seat through a rotating shaft, the rotating shaft is connected to the ratchet, and the ratchet is mounted on the outer wall of the mounting seat; starting the electric telescopic rod pushes the top cover upward through the mounting seat, pushing the top cover can push the limit slider to slide on the slide bar, and the top cover rotates on the mounting seat, which can fully open the top of the workbench, making operation convenient and improving convenience during use.

[0006] Preferably, the sealing assembly includes a mounting frame, a lower sealing frame and an upper sealing frame. The mounting frame is fixedly connected to the bottom of the top cover, the lower sealing frame is fixedly connected to the top of the workbench, the bottom of the mounting frame is fixedly connected to the upper sealing frame, and the upper sealing frame matches the lower sealing frame; starting the electric telescopic rod to retract and drive the top cover to move downward, the top cover drives the mounting frame to move downward, so that the upper sealing frame is inserted into the lower sealing frame, and the lower sealing frame and the upper sealing frame cooperate to seal between the workbench and the top cover, thereby improving the sealing effect.

[0007] Preferably, the pressing assembly includes multiple lower pressing dies, multiple lower springs, multiple lower support rings, multiple upper pressing dies, multiple upper springs, multiple upper pressing rings and heat sealing components, the multiple lower pressing dies are evenly arranged and installed in the top packaging cavity of the workbench, the inner bottom end of the lower pressing die is provided with a circular hole, the bottom of the lower spring is fixedly connected to the bottom of the circular hole, the top of the lower spring is connected to the lower support ring, the multiple upper pressing dies are evenly arranged and installed in the inner position of the installation frame corresponding to the lower pressing dies, the installation frame is provided with a second circular hole, the upper spring is fixed in the second circular hole, and the bottom of the upper spring is fixedly connected to the upper pressing ring; the LED chip is supported by the lower support ring, and when the top cover is installed on the top of the workbench, the installation frame moves downward to drive the upper pressing ring to contact the top of the LED chip, and the lower support ring and the upper pressing ring are pushed by the lower spring and the upper spring to discharge the air between the packaging film, and at the same time the LED chip is positioned to improve the processing quality.

[0008] Preferably, the heat sealing component includes multiple lower heating frames and multiple upper heating frames, and the multiple lower heating frames are respectively fixedly connected to the tops of the multiple lower pressing dies, and the multiple upper heating frames are respectively fixedly connected to the bottoms of the multiple upper pressing dies; after the vacuuming is completed, the lower heating frames and the upper heating frames are started to heat the plastic sealing film for hot-melt bonding, and multiple LED chips are packaged at one time, thereby improving work efficiency.

[0009] Preferably, a controller is installed inside the bottom box, a control button is fixedly installed on the front side wall of the workbench, an electronic pressure gauge is installed on the top of the top cover, and the vacuum pump, control button and electronic pressure gauge are electrically connected to the controller; the air pressure in the space between the top cover and the workbench is detected by the controller, and when the requirement is met, the controller controls the vacuum pump to stop, and at the same time, the control button is operated to control the lower heating frame and the upper heating frame through the controller to encapsulate multiple LED chips, which is convenient for operation.

[0010] Preferably, a handle is provided at the middle of the front end of the top cover, and a friction pad is fixedly connected to the bottom of the support leg; the handle facilitates the rotation operation of the top cover, and the friction pad can increase the friction of the support surface to ensure stability.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: placing the packaging film in the top packaging cavity of the workbench, placing the GaN-based vertical LED chip on the packaging film, and then placing another packaging film on top, driving the top cover to be installed on the top of the workbench by opening the assembly, increasing the sealing performance through the sealing assembly, starting the vacuum pump to evacuate the space between the top cover and the workbench, and plastic-sealing the GaN-based vertical LED chip between the two packaging films through the pressing assembly. Multiple LED chips can be packaged at one time, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural diagram of the utility model;

[0013] Figure 2 It is a front structural schematic diagram of the utility model;

[0014] Figure 3 It is a partial cross-sectional structural schematic diagram of the utility model;

[0015] Figure 4 It is a front cross-sectional structural schematic diagram of the utility model;

[0016] Figure 5 It is a right side cross-sectional structural schematic diagram of the utility model;

[0017] Markings in the accompanying drawings: 1. workbench; 2. bottom box; 3. support leg; 4. vacuum pump; 5. top cover; 6. slide bar; 7. limit slider; 8. movable plate; 9. electric telescopic rod; 10. mounting seat; 11. ratchet; 12. mounting frame; 13. lower sealing frame; 14. upper sealing frame; 15. lower pressure die; 16. lower spring; 17. lower support ring; 18. upper pressure die; 19. upper spring; 20. upper pressure ring; 21. lower heating frame; 22. upper heating frame; 23. controller; 24. control button; 25. electronic pressure gauge; 26. friction pad. DETAILED DESCRIPTION

[0018] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0019] like Figures 1 to 5 As shown, the bottom end of the workbench 1 is fixedly connected to the bottom box 2, and the four corners of the bottom of the bottom box 2 are fixedly connected to the supporting legs 3. The bottom box 2 has a built-in vacuum pump 4. The left and right ends of the top rear end of the workbench 1 are provided with limited sliding grooves, the slide rod 6 is fixedly installed in the limited sliding groove, the limit slider 7 is slidably installed in the limit sliding groove, and the limit slider 7 is slidably installed on the outer wall of the slide rod 6, the top of the limit slider 7 is fixedly connected to the movable plate 8, the top of the movable plate 8 is fixedly connected to the electric telescopic rod 9, and the top of the electric telescopic rod 9 is fixedly connected to the movable plate 8. The top cover 5 is fixedly connected with a mounting seat 10, and the left and right ends of the top cover 5 are rotatably mounted on the mounting seat 10 through a rotating shaft. The rotating shaft is connected to the ratchet 11, and the ratchet 11 is mounted on the outer wall of the mounting seat 10. The top cover 5 is connected to the vacuum pump 4 through a vacuum tube. A packaging cavity is opened on the top of the workbench 1, and a mounting frame 12 is fixedly connected to the bottom of the top cover 5. The lower sealing frame 13 is fixedly connected to the top of the workbench 1. The bottom of the mounting frame 12 is fixedly connected to an upper sealing frame 14, and the upper sealing frame 14 matches the lower sealing frame 13. A plurality of lower pressing dies 15 are evenly arranged and installed in the top packaging cavity of the workbench 1, a circular hole is provided at the inner bottom end of the lower pressing die 15, the bottom of the lower spring 16 is fixedly connected to the bottom of the circular hole, the top of the lower spring 16 is connected to a lower support ring 17, a plurality of upper pressing dies 18 are evenly arranged and installed in the corresponding positions of the lower pressing die 15 inside the mounting frame 12, a second circular hole is provided on the mounting frame 12, an upper spring 19 is fixed in the second circular hole, the bottom of the upper spring 19 is fixedly connected to an upper pressing ring 20, a plurality of lower heating frames 21 are respectively fixedly connected to the tops of the plurality of lower pressing dies 15, and a plurality of upper heating frames 22 are respectively fixedly connected to the bottoms of the plurality of upper pressing dies 18, a controller 23 is installed inside the bottom box 2, a control button 24 is fixedly installed on the front side wall of the workbench 1, an electronic pressure gauge 25 is installed on the top of the top cover 5, a vacuum pump 4, a control button 24 and an electronic pressure gauge 25 are electrically connected to the controller 23, a handle is provided at the middle part of the front end of the top cover 5, and a friction pad 26 is fixedly connected to the bottom of the supporting leg 3;

[0020] Put the packaging film into the top packaging cavity of the workbench 1, put the GaN-based vertical LED chip on the packaging film, and then put another packaging film on top, support the LED chip through the lower support ring 17, when the top cover 5 is installed on the top of the workbench 1, the installation frame 12 moves downward to drive the upper pressure ring 20 to contact the top of the LED chip, and the lower support ring 17 and the upper pressure ring 20 are pushed by the lower spring 16 and the upper spring 19 to discharge the air between the packaging films, and at the same time position the LED chip to improve the processing quality, start the electric telescopic rod 9 to contract and drive the top cover 5 to move downward, and the top cover 5 drives the installation frame 12 to move downward so that the upper sealing frame 14 is inserted into the lower sealing frame 13, and the lower sealing frame 13 and the upper sealing frame 14 cooperate to seal the workbench 1 and the top cover 5 to improve the sealing effect, start the vacuum pump 4 to evacuate the space between the top cover 5 and the workbench 1, and evacuate the vacuum. After the vacuum is completed, the lower heating frame 21 and the upper heating frame 22 are started to heat the plastic sealing film for hot-melt bonding, and multiple LED chips are packaged at one time to improve work efficiency. The air pressure in the space between the top cover 5 and the workbench 1 is detected by the controller 23. After meeting the requirements, the controller 23 controls the vacuum pump 4 to stop. At the same time, the operation control button 24 controls the lower heating frame 21 and the upper heating frame 22 through the controller 23 to package multiple LED chips, which is convenient for operation. The electric telescopic rod 9 is started to push the top cover 5 upward through the mounting seat 10. Pushing the top cover 5 can push the limit slider 7 to slide on the slide rod 6. The top cover 5 rotates on the mounting seat 10, which can fully open the top of the workbench 1, making it easy to operate and improving convenience during use. The handle is used to facilitate the rotation of the top cover 5, and the friction pad 26 can increase the friction of the supporting surface to ensure stability.

[0021] like Figures 1 to 5As shown, the utility model is a GaN-based vertical LED chip vacuum packaging machine. When it is working, the packaging film is placed on the lower pressure mold 15 in the packaging cavity at the top of the workbench 1, the GaN-based vertical LED chip is placed on the packaging film, and the LED chip is supported by the lower support ring 17. Then, another packaging film is placed on top. When the top cover 5 is installed on the top of the workbench 1, the installation frame 12 moves downward to drive the upper pressure ring 20 to contact the top of the LED chip. The lower support ring 17 and the upper pressure ring 20 are pushed by the lower spring 16 and the upper spring 19 to discharge the air between the packaging films, and at the same time, the LED chip is positioned and started. The vacuum pump 4 evacuates the space between the top cover 5 and the workbench 1, and detects the air pressure in the space between the top cover 5 and the workbench 1 through the controller 23. When the requirement is met, the controller 23 controls the vacuum pump 4 to stop, and at the same time operates the control button 24 to control the lower heating frame 21 and the upper heating frame 22 to heat the plastic film through the controller 23 to perform hot-melt bonding, thereby encapsulating multiple LED chips at one time, and starting the electric telescopic rod 9 to push the top cover 5 upward through the mounting seat 10. Pushing the top cover 5 can push the limit slider 7 to slide on the slide rod 6, and the top cover 5 rotates on the mounting seat 10 to fully open the top of the workbench 1.

[0022] The vacuum pump 4, ratchet 11, lower heating frame 21, upper heating frame 22, controller 23 and control button 24 of the GaN-based vertical LED chip vacuum packaging machine of the utility model are purchased on the market. Technical personnel in this industry only need to install and operate them according to the accompanying instruction manual, without the need for technical personnel in this field to make creative labor.

[0023] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A GaN-based vertical LED chip vacuum packaging machine, characterized in that: The invention comprises a workbench (1), wherein the bottom end of the workbench (1) is fixedly connected to a bottom box (2), the four corners of the bottom of the bottom box (2) are fixedly connected to support legs (3), the bottom box (2) has a built-in vacuum pump (4), a top cover (5) is installed on the top of the workbench (1) through an opening and closing assembly, the top cover (5) is connected to the vacuum pump (4) through a vacuum pipe, a sealing assembly is installed between the top cover (5) and the workbench (1), and a packaging cavity is opened on the top of the workbench (1), and a pressing assembly is installed in the packaging cavity.

2. A GaN-based vertical LED chip vacuum packaging machine according to claim 1, characterized in that: The opening and closing assembly comprises two slide bars (6), two limit sliders (7), two movable plates (8), two electric telescopic rods (9), two mounting seats (10) and two ratchets (11). The left and right ends of the top rear end of the workbench (1) are provided with limit slide grooves. The slide bar (6) is fixedly mounted in the limit slide groove. The limit slider (7) is slidably mounted in the limit slide groove. The limit slider (7) is slidably mounted on the outer wall of the slide bar (6). The top of the limit slider (7) is fixedly connected to the movable plate (8). The top of the movable plate (8) is fixedly connected to the electric telescopic rod (9). The top of the electric telescopic rod (9) is fixedly connected to the mounting seat (10). The left and right ends of the top cover (5) are rotatably mounted on the mounting seat (10) through a rotating shaft. The rotating shaft is connected to the ratchet (11). The ratchet (11) is mounted on the outer wall of the mounting seat (10).

3. A GaN-based vertical LED chip vacuum packaging machine according to claim 2, characterized in that: The sealing assembly comprises a mounting frame (12), a lower sealing frame (13) and an upper sealing frame (14), wherein the mounting frame (12) is fixedly connected to the bottom of the top cover (5), the lower sealing frame (13) is fixedly connected to the top of the workbench (1), and the bottom of the mounting frame (12) is fixedly connected to the upper sealing frame (14), and the upper sealing frame (14) matches the lower sealing frame (13).

4. A GaN-based vertical LED chip vacuum packaging machine according to claim 3, characterized in that: The pressing assembly comprises a plurality of lower pressing dies (15), a plurality of lower springs (16), a plurality of lower supporting rings (17), a plurality of upper pressing dies (18), a plurality of upper springs (19), a plurality of upper pressing rings (20) and a heat sealing component, wherein the plurality of lower pressing dies (15) are evenly arranged and installed in the top packaging cavity of the workbench (1), a circular hole is opened at the inner bottom end of the lower pressing dies (15), the bottom of the lower spring (16) is fixedly connected to the bottom of the circular hole, the top of the lower spring (16) is connected to the lower supporting ring (17), the plurality of upper pressing dies (18) are evenly arranged and installed in the inner part of the installation frame (12) at positions corresponding to the lower pressing dies (15), a second circular hole is opened on the installation frame (12), the upper spring (19) is fixed in the second circular hole, and the bottom of the upper spring (19) is fixedly connected to the upper pressing ring (20).

5. A GaN-based vertical LED chip vacuum packaging machine as claimed in claim 4, characterized in that: The heat sealing component comprises a plurality of lower heating frames (21) and a plurality of upper heating frames (22), wherein the plurality of lower heating frames (21) are respectively fixedly connected to the tops of the plurality of lower pressing dies (15), and the plurality of upper heating frames (22) are respectively fixedly connected to the bottoms of the plurality of upper pressing dies (18).

6. A GaN-based vertical LED chip vacuum packaging machine according to claim 4, characterized in that: A controller (23) is installed inside the bottom box (2), a control button (24) is fixedly installed on the front side wall of the workbench (1), an electronic pressure gauge (25) is installed on the top of the top cover (5), and the vacuum pump (4), the control button (24) and the electronic pressure gauge (25) are electrically connected to the controller (23).

7. The GaN-based vertical LED chip vacuum packaging machine according to claim 1, characterized in that: A handle is provided at the middle of the front end of the top cover (5), and a friction pad (26) is fixedly connected to the bottom of the support leg (3).

Images