Distributed temperature real-time acquisition device

Abstract

The utility model relates to a distributed temperature real-time acquisition device, which is connected with a sensor and comprises a data acquisition module, an antenna, a power supply conversion module, a stud, a mainboard and heat-conducting glue, the antenna is mounted on the data acquisition module and is in communication connection with the sensor, and the power supply conversion module is connected with the stud. The stud and the heat-conducting glue are installed on the data acquisition module, the data acquisition module is installed on the mainboard through the stud, the power supply module is installed on the mainboard, and the power supply module is connected with the data acquisition module. According to the utility model, the heat-conducting glue and the studs are arranged, the front shell and the rear shell are also provided with heat dissipation holes, and the studs suspend the data acquisition module to form a heat dissipation space, so that when the device works, the heat dissipation condition is good, and the device is ensured to be in a proper working environment; according to the utility model, the front shell, the rear shell and the data acquisition module are structurally installed and are fixed through screws, so that the installation steps are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature acquisition, in particular to a distributed real-time temperature acquisition device. Background Art

[0002] Compared to traditional RF and LoRa communication systems, real-time temperature acquisition devices utilize RFID wireless communication technology. The resulting sensors are smaller and offer superior wireless performance, meeting user needs for measuring temperatures in confined spaces. Currently, real-time temperature acquisition devices have a low market share, largely due to their high cost, which in turn keeps their prices high.

[0003] The utility model patent with publication number CN207937075U discloses a multi-port temperature acquisition device for ring network cabinets based on passive wireless sensing technology. The device includes: multiple passive sensors, with at least one passive sensor installed in each compartment of the ring network cabinet; multiple in-cabinet antennas, which are built into the multiple compartments of the ring network cabinet in a one-to-one correspondence; a temperature collector, which includes a radio frequency switching switch and a temperature acquisition unit. The radio frequency switching switch includes a signal output terminal, multiple radio frequency antenna ports connected to the multiple in-cabinet antennas in a one-to-one correspondence, and a conduction switch that cyclically connects one of the radio frequency antenna ports to the signal output terminal. The temperature acquisition unit is electrically connected to the signal output terminal. This patent realizes temperature acquisition, but during the acquisition process, the device generates a large amount of heat, which may affect the device.

[0004] Therefore, providing a real-time temperature acquisition device with strong heat dissipation capability is a problem that needs to be solved at present. Utility Model Content

[0005] The purpose of the present invention is to provide a distributed real-time temperature acquisition device in order to overcome the defects of the prior art.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] According to one aspect of the present invention, a distributed real-time temperature acquisition device is provided, which is connected to a sensor. The device includes a data acquisition module and an antenna, which is installed on the data acquisition module. The antenna and the sensor are communicatively connected. The device also includes a power module, a stud, a mainboard and thermal conductive adhesive, which are installed on the data acquisition module. The data acquisition module is installed on the mainboard via the stud, and the power module is installed on the mainboard. The power module is connected to the data acquisition module.

[0008] As a preferred technical solution, the device also includes a front cover sticker, a front shell and a rear shell, the front cover sticker is installed on the front shell, the front shell and the rear shell are connected, and the mainboard is installed in the space formed by the connection of the front shell and the rear shell.

[0009] As a preferred technical solution, the front cover sticker, the front shell and the rear shell are all provided with heat dissipation holes.

[0010] As a preferred technical solution, the rear shell is provided with an antenna hole.

[0011] As a preferred technical solution, the device further includes a 15-hole connector, which is mounted on the mainboard and connected to the data acquisition module.

[0012] As a preferred technical solution, the stud is made of metal.

[0013] As a preferred technical solution, the device further includes screws, and the mainboard is mounted on the rear housing via the screws.

[0014] As a preferred technical solution, the data acquisition module is mounted on a stud by means of screws, and the stud is welded to the mainboard.

[0015] As a preferred technical solution, the power supply module includes a power supply conversion module and a voltage and current transformer module, the power supply conversion module is connected to the voltage and current transformer module, and the power supply conversion module is connected to the data acquisition module.

[0016] As a preferred technical solution, the device further includes a CPU module, which is mounted on a mainboard and connected to a power conversion module.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The utility model is provided with heat-conducting glue and studs, and heat dissipation holes are also provided on the front shell and the rear shell. At the same time, the studs suspend the data acquisition module to form a heat dissipation space, so that the heat dissipation is good when the device is working, ensuring that the device is in a suitable working environment.

[0019] 2. The device of the present invention adopts a front shell, a rear shell and a data acquisition module to adopt a structural installation and is fixed by screws, which reduces the installation steps.

[0020] 3. The front cover sticker and the front shell of this utility model are bonded with double-sided tape, which is more conducive to the different customization needs of the surface sticker compared to the traditional shell silk screen.

[0021] 4. The hardware structure of the utility model is clear and simple, which is convenient for production and installation, reduces labor costs and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural diagram of the utility model;

[0023] Figure 2 This is a schematic diagram of the data collection process of the present utility model.

[0024] 1. Front cover sticker; 2. Front housing; 3. Screws; 4. Thermal adhesive; 5. Power module; 6. Mainboard; 7. Data acquisition module; 8. 15-hole connector; 9. Rear housing; 10. Studs; 11. Antenna. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0026] Compared to traditional RF and LoRa communication systems, real-time temperature acquisition devices utilize RFID wireless communication technology. The resulting sensors are smaller and offer superior wireless performance, meeting user needs for measuring temperatures in confined spaces. Currently, real-time temperature acquisition devices have a low market share, largely due to their high cost, which in turn keeps their prices high.

[0027] In terms of structure, the existing data acquisition devices on the market mainly use communication methods such as LORA and FSK. The corresponding sensors are mostly powered by batteries or induction coils. The designed size is relatively large, which makes it difficult to install temperature monitoring in narrow spaces such as switch cabinet circuit breaker contact positions.

[0028] In terms of hardware, most existing temperature acquisition products use the STM32 hardware platform. This chip is designed by the foreign ST company. Affected by international factors, there may be problems such as unstable procurement channels and high procurement prices.

[0029] At the same time, existing devices are prone to slow refresh speeds on low-cost platforms; they use analog serial ports for communication between the mainboard and external terminals, occupying the CPU resources of the central controller.

[0030] The present invention provides a distributed real-time temperature acquisition device. The present invention provides heat-conducting glue and studs, and heat dissipation holes are provided on the front shell and the rear shell. At the same time, the studs suspend the data acquisition module to form a heat dissipation space, so that the heat dissipation is good when the device is working, ensuring that the device is in a suitable working environment. The device in the present invention adopts a front shell, a rear shell and a data acquisition module for structural installation, which is fixed by screws, reducing the number of installation steps. The front cover sticker and the front shell in the present invention are bonded with double-sided tape, which is more conducive to different customization needs of the surface sticker compared to traditional shell silk screen printing. The hardware structure of the present invention is clear and simple, which is convenient for production and installation, reduces labor costs and improves production efficiency.

[0031] Example 1

[0032] like Figure 1 As shown, a distributed real-time temperature acquisition device is connected to a sensor. The device includes a data acquisition module 7 and an antenna 11. The antenna 11 is installed on the data acquisition module 7. The antenna 11 is communicatively connected to the sensor. The device also includes a power module 5, a stud 10, a mainboard 6 and a thermal adhesive 4. The stud 10 and the thermal adhesive 4 are installed on the data acquisition module 7. The data acquisition module 7 is installed on the mainboard 6 through the stud 10. The power module 5 is installed on the mainboard 6. The power module 5 is connected to the data acquisition module 7.

[0033] The device also includes a front cover sticker 1, a front shell 2 and a rear shell 9, the front cover sticker 1 is installed on the front shell 2, the front shell 2 and the rear shell 9 are connected, and the mainboard 6 is installed in the space formed by the connection of the front shell 2 and the rear shell 9.

[0034] In this embodiment, screws 3 are used to connect the front housing 2 and rear housing 9, and the mainboard 6 and rear housing 9. Compared to the four-sided installation method of the prior art, the housing structure designed in this utility model is easier to assemble and has better mechanical performance. The front housing 2 and rear housing 9 are connected to form a storage space for thermal conductive adhesive 4, mainboard 6, power module 5, and data acquisition module 7. The data acquisition module 7 is connected to a 15-hole connector, and the mainboard 6 and data acquisition module 7 are connected using both a 15-hole connector and screws, facilitating data transmission and structural stability. The front housing 2 and rear housing 9 are both metal shells, which are fixed with screws. This not only reduces the tedious assembly procedures, but also ensures the device's good mechanical performance and grounding performance.

[0035] The front cover sticker 1, the front shell 2 and the rear shell 9 are provided with heat dissipation holes to facilitate better heat dissipation.

[0036] The rear housing 9 is provided with an antenna hole to facilitate the antenna 11 to send or receive signals.

[0037] The device also includes a 15-pin connector 8 mounted on the mainboard 6 and connected to the data acquisition module 7. The mainboard 6 and the data acquisition module 7 are connected via the 15-pin connector 8. The data acquisition module is powered by a power conversion module on the mainboard 6. The mainboard 6 and the data acquisition module exchange data via a serial port to ensure data stability and real-time performance.

[0038] The stud 10 is made of metal, which has better heat dissipation performance.

[0039] The device further comprises screws 3 , and the mainboard 6 is mounted on the rear housing 9 via the screws 3 .

[0040] The data acquisition module 7 is mounted on the stud 10 by means of screws 3 , and the stud 10 is welded to the mainboard 6 .

[0041] The power supply module 5 includes a power supply conversion module and a voltage and current transformer module. The power supply conversion module is connected to the voltage and current transformer module, and the power supply conversion module is connected to the data acquisition module 7 .

[0042] The device further comprises a CPU module, which is mounted on the mainboard 6 and connected to the power conversion module.

[0043] In this embodiment, the device also includes a communication module, a storage module, a voltage conversion module and a switch signal output circuit module, and the CPU module, communication module, storage module, voltage conversion module and switch signal output circuit module are installed on the main board 6.

[0044] The central controller CPU is mainly responsible for collecting temperature data and making judgments based on internal logical conditions, thereby controlling the operation of the output relays and providing logical indications and alarms.

[0045] The central controller CPU uses the SPI protocol for Ethernet communication. The Ethernet port module mainly includes the Ethernet port chip and logic adapter circuit to ensure that the Ethernet port chip achieves optimal functional support. The central processing unit CPU controls the internal logic conditions to ensure the stability of Ethernet port communication.

[0046] The central controller CPU uses a UART serial port configuration for both TTL and RS485 communication. The TTL module primarily includes the NSI8221 chip and peripheral circuitry, supporting simple data communication. The RS485 module primarily includes the NSI8221 and ISL3152 chips, working in conjunction with peripheral logic circuitry to ensure device communication stability.

[0047] like Figure 2As shown in FIG, the processing process of the real-time temperature acquisition device includes the following steps:

[0048] Step S1, the real-time temperature acquisition device sends a signal to the sensor;

[0049] Step S2: The sensor determines whether it has received the RFID radio frequency signal from the real-time temperature acquisition device. If the signal is received successfully, the sensor sends the temperature data to the real-time temperature acquisition device. If the signal is received unsuccessfully, the real-time temperature acquisition device changes the data antenna and continues to send acquisition instructions.

[0050] Step S3, the sensor sends temperature data to a real-time temperature acquisition device;

[0051] Step S4: The temperature real-time acquisition device determines whether the temperature data exceeds the set logical alarm value. If it exceeds the alarm value, the temperature real-time acquisition device issues a logical alarm state and the output relay is actuated. If it does not exceed the logical alarm value, the acquisition instruction continues to be sent to the sensor.

[0052] Step S5: an alarm is generated, and the output relay is activated accordingly; the temperature real-time acquisition device continues to send acquisition instructions to the sensor.

[0053] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A distributed real-time temperature acquisition device, the device being connected to a sensor, comprising a data acquisition module (7) and an antenna (11), the antenna (11) being mounted on the data acquisition module (7), the antenna (11) being communicatively connected to the sensor, characterized in that: The device further comprises a power module (5), a stud (10), a mainboard (6) and a thermally conductive adhesive (4); the stud (10) and the thermally conductive adhesive (4) are mounted on a data acquisition module (7); the data acquisition module (7) is mounted on the mainboard (6) via the stud (10); the power module (5) is mounted on the mainboard (6); and the power module (5) is connected to the data acquisition module (7).

2. A distributed real-time temperature acquisition device according to claim 1, characterized in that: The device further comprises a front cover sticker (1), a front shell (2) and a rear shell (9), wherein the front cover sticker (1) is mounted on the front shell (2), the front shell (2) and the rear shell (9) are connected, and the mainboard (6) is mounted in a space formed by the connection of the front shell (2) and the rear shell (9).

3. A distributed real-time temperature acquisition device according to claim 2, characterized in that: The front cover sticker (1), the front shell (2) and the rear shell (9) are all provided with heat dissipation holes.

4. The distributed real-time temperature acquisition device according to claim 2, characterized in that: The rear housing (9) is provided with an antenna hole.

5. The distributed real-time temperature acquisition device according to claim 1, characterized in that: The device further comprises a 15-hole connector (8), wherein the 15-hole connector (8) is mounted on the main board (6), and the 15-hole connector (8) is connected to the data acquisition module (7).

6. The distributed real-time temperature acquisition device according to claim 1, characterized in that: The stud (10) is a stud (10) made of metal.

7. The distributed real-time temperature acquisition device according to claim 2, characterized in that: The device further comprises screws (3), and the main board (6) is mounted on the rear housing (9) via the screws (3).

8. The distributed real-time temperature acquisition device according to claim 7, characterized in that: The data acquisition module (7) is mounted on a stud (10) via a screw (3), and the stud (10) is welded to the mainboard (6).

9. The distributed real-time temperature acquisition device according to claim 1, characterized in that: The power supply module (5) comprises a power supply conversion module and a voltage and current transformer module, the power supply conversion module and the voltage and current transformer module are connected, and the power supply conversion module is connected to the data acquisition module (7).

10. The distributed real-time temperature acquisition device according to claim 9, characterized in that: The device further comprises a CPU module, which is mounted on a mainboard (6) and is connected to a power conversion module.

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