Ultrasonic module and mobile machine equipment

Abstract

The embodiment of the utility model discloses an ultrasonic module and mobile machine equipment, relates to ultrasonic ranging technical field, the ultrasonic module includes transmitting probe and receiving probe, said transmitting probe and receiving probe are spaced apart, the position of transmitting surface of transmitting probe is higher than the position of receiving surface of receiving probe. The transmitting surface of the transmitting probe is higher than the receiving surface of the receiving probe, so that the transmitting probe and the receiving probe form a negative angle, ultrasonic waves transmitted by the transmitting surface of the transmitting probe cannot be directly transmitted to the receiving surface of the receiving probe, an ultrasonic short circuit phenomenon can be effectively avoided, false triggering of the ultrasonic module is avoided, and the service life of the ultrasonic module is prolonged. The precision is effectively improved, misjudgment is reduced, and blind areas can be effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of ultrasonic distance measurement, and in particular to an ultrasonic module and a mobile machine device. Background Art

[0002] The ultrasonic module is a commonly used distance measuring device that can measure the distance to obstacles and has a wide range of applications.

[0003] Currently, most ultrasonic modules on the market are car reversing radars. However, car reversing radars do not have high requirements for accuracy, and their assembly method is relatively rough, which makes it easy for ultrasonic short circuits to occur (the transmitting probe directly transmits to the ultrasonic probe), resulting in false triggering. Utility Model Content

[0004] The technical problem to be solved by the embodiments of the present invention is that the existing ultrasonic module is prone to ultrasonic short circuit phenomenon, which leads to false triggering.

[0005] In order to solve the above problems, in the first aspect, an embodiment of the present utility model proposes an ultrasound module, which includes a transmitting probe and a receiving probe, and the transmitting probe and the receiving probe are arranged at intervals, wherein the transmitting surface of the transmitting probe and the receiving surface of the receiving probe are oriented in the same direction; taking the orientation of the transmitting surface of the transmitting probe and the receiving surface of the receiving probe as the reference direction, the transmitting surface of the transmitting probe is higher than the receiving surface of the receiving probe.

[0006] A further technical solution is that the transmitting surface of the transmitting probe is 1-3 mm higher than the receiving surface of the receiving probe.

[0007] A further technical solution is that the ultrasonic module further includes a PCB board, a first shock-absorbing gasket and a second shock-absorbing gasket;

[0008] The first shock-absorbing gasket is provided between the transmitting probe and the PCB board, and the second shock-absorbing gasket is provided between the receiving probe and the PCB board;

[0009] The pins of the transmitting probe are welded to the PCB through the first shock-absorbing gasket; the pins of the receiving probe are welded to the PCB through the second shock-absorbing gasket;

[0010] The thickness of the first shock-absorbing pad is 1-3 mm greater than the thickness of the second shock-absorbing pad.

[0011] A further technical solution is that the ultrasound module further includes a bottom shell, and the bottom shell is provided with a first receiving groove and a second receiving groove;

[0012] The upper end surfaces of the first accommodating groove and the second accommodating groove are flush, the transmitting probe is arranged in the first accommodating groove, the receiving probe is arranged in the second accommodating groove, and the PCB board covers the first accommodating groove and the second accommodating groove.

[0013] A further technical solution is that the PCB board and the bottom shell are fixed by fasteners, and a shock-absorbing washer is provided between the fasteners and the bottom shell.

[0014] A further technical solution is that the ultrasound module also includes a sound insulation member, and the sound insulation member is arranged between the transmitting probe and the receiving probe.

[0015] A further technical solution is that the bottom shell is further provided with a third accommodating groove; the third accommodating groove is provided between the first accommodating groove and the second accommodating groove, and the sound insulation member is provided in the third accommodating groove.

[0016] A further technical solution is that the bottom shell includes a fourth receiving groove, the first receiving groove and the second receiving groove are both arranged at the bottom of the fourth receiving groove, and the PCB board is arranged in the fourth receiving groove;

[0017] The ultrasonic module further includes an upper cover, which covers the fourth accommodating groove. The upper cover is provided with a wire passing hole, and a wire passing plug is embedded in the wire passing hole.

[0018] A further technical solution is that the number of the receiving probes is two, and the two receiving probes are spaced apart and arranged on both sides of the transmitting probe.

[0019] In a second aspect, an embodiment of the present invention provides a mobile machine device, comprising the ultrasound module as described in the first aspect.

[0020] Compared with the prior art, the technical effects achieved by the embodiments of the present invention include:

[0021] By applying the technical solution of the embodiment of the utility model, since the transmitting surface of the transmitting probe is higher than the receiving surface of the receiving probe, the transmitting probe and the receiving probe form a negative angle, and the ultrasonic wave emitted by the transmitting surface of the transmitting probe cannot be directly transmitted to the receiving surface of the receiving probe, which can effectively avoid the ultrasonic short circuit phenomenon, thereby avoiding false triggering of the ultrasonic module, effectively improving accuracy, reducing misjudgment, and effectively reducing blind spots. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention.

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0025] Figure 1 A cross-sectional view of an ultrasonic module proposed in an embodiment of the present utility model;

[0026] Figure 2 This is a structural diagram of an ultrasound module proposed in an embodiment of the present utility model.

[0027] Reference numerals

[0028] Transmitting probe 10, transmitting surface 11, receiving probe 20, receiving surface 21, PCB board 30, first shock-absorbing gasket 40, second shock-absorbing gasket 50, bottom shell 60, sound insulation 70, upper cover 80, fastener 90, shock-absorbing gasket 100, first accommodating groove 61, second accommodating groove 62, third accommodating groove 63, fourth accommodating groove 64, wire hole 81, wire plug 82. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments. Similar component numbers in the drawings represent similar components. Obviously, the embodiments described below are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0030] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0031] It should also be understood that the terms used in this specification of the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the specification of the embodiments of the present invention and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0032] See also Figure 1-Figure 2 The present invention provides an ultrasonic module that can effectively avoid ultrasonic short circuits, thereby preventing false triggering of the ultrasonic module, effectively improving accuracy, and reducing misjudgments. The ultrasonic module includes a transmitting probe 10 and a receiving probe 20, which are described in detail as follows:

[0033] The number of the transmitting probe 10 is one, and the number of the receiving probe 20 can be one or more. For example, in this embodiment, the number of the receiving probe 20 is two. By providing two receiving probes 20, the accuracy of ranging can be improved.

[0034] The transmitting probe 10 and the receiving probe 20 are spaced apart. When there are two receiving probes 20 , the transmitting probe 10 is located in the middle, and the two receiving probes 20 are spaced apart on both sides of the transmitting probe 10 .

[0035] The transmitting surface 11 of the transmitting probe 10 refers to an end surface of the transmitting probe 10 that emits ultrasound. The receiving surface 21 of the receiving probe 20 refers to an end surface of the receiving probe 20 that receives ultrasound.

[0036] In the embodiment of the present invention, the transmitting surface 11 of the transmitting probe and the receiving surface 21 of the receiving probe are oriented in the same direction; see Figure 1 The transmitting surface 11 of the transmitting probe and the receiving surface 21 of the receiving probe are oriented in direction A.

[0037] In the embodiment of the present invention, the directions of the transmitting surface 11 of the transmitting probe and the receiving surface 21 of the receiving probe are taken as reference directions. Figure 1 That is, with direction A as the reference direction, the transmitting surface 11 of the transmitting probe 10 is higher than the receiving surface 21 of the receiving probe 20. For example, the transmitting surface 11 of the transmitting probe 10 is 1-3 mm higher than the receiving surface 21 of the receiving probe 20. Specifically, the transmitting surface 11 of the transmitting probe 10 is 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm higher than the receiving surface 21 of the receiving probe 20, etc., which is not specifically limited in the present utility model.

[0038] By applying the technical solution of the embodiment of the present utility model, since the transmitting surface 11 of the transmitting probe 10 is higher than the receiving surface 21 of the receiving probe 20, the transmitting probe 10 and the receiving probe 20 form a negative angle, and the ultrasonic wave emitted by the transmitting surface 11 of the transmitting probe 10 cannot be directly transmitted to the receiving surface 21 of the receiving probe 20, which can effectively avoid the ultrasonic short circuit phenomenon, thereby avoiding the false triggering of the ultrasonic module, effectively improving the accuracy, reducing misjudgment, and effectively reducing the blind spot.

[0039] The principle of reducing blind spots is that the effective range of the transmitting probe 10 transmitting ultrasonic waves is fixed, usually a fan-shaped area in front of the transmitting probe 10. By setting the transmitting probe 10 higher, the transmitting probe 10 can be effectively avoided from being blocked, and it can effectively cover a larger area, thereby reducing the blind spot, specifically reducing the blind spot by 1-2 cm.

[0040] Furthermore, in some embodiments, such as the present embodiment, the ultrasound module further includes a PCB board 30, a first shock-absorbing gasket 40, and a second shock-absorbing gasket 50. The first shock-absorbing gasket 40 is disposed between the transmitting probe 10 and the PCB board 30, and the second shock-absorbing gasket 50 is disposed between the receiving probe 20 and the PCB board 30. The pins of the transmitting probe 10 pass through the first shock-absorbing gasket 40 and are soldered to the PCB board 30; the pins of the receiving probe 20 pass through the second shock-absorbing gasket 50 and are soldered to the PCB board 30.

[0041] Specifically, the transmitting probe 10 and the receiving probe 20 are connected to the PCB board 30. By directly providing a first shock-absorbing gasket 40 between the PCB board 30 and the transmitting probe 10 and providing a second shock-absorbing gasket 50 between the PCB board 30 and the receiving probe 20, vibration between the PCB board 30 and the transmitting probe 10 and the receiving probe 20 can be effectively reduced, avoiding vibration interference, thereby improving the accuracy of the ultrasound module. At the same time, to achieve reliable welding, the pins of the transmitting probe 10 (which can be specifically power pins, data pins, etc.) pass through the first shock-absorbing gasket 40 and are welded to the PCB board 30; the pins of the receiving probe 20 (which can be specifically power pins, data pins, etc.) pass through the second shock-absorbing gasket 50 and are welded to the PCB board 30.

[0042] Furthermore, the thickness of the first shock-absorbing gasket 40 is 1-3 mm greater than the thickness of the second shock-absorbing gasket 50. By setting the thickness of the first shock-absorbing gasket 40 to be greater than the thickness of the second shock-absorbing gasket 50, the transmitting surface 11 of the transmitting probe 10 can be positioned higher than the receiving surface 21 of the receiving probe 20. For example, the thickness of the first shock-absorbing gasket 40 can be 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, etc. greater than the thickness of the second shock-absorbing gasket 50, which is not specifically limited in the present invention.

[0043] Furthermore, the first shock-absorbing pad 40 and the second shock-absorbing pad 50 may be made of an elastic material, such as an elastic rubber material.

[0044] Furthermore, the ultrasound module also includes a bottom shell 60, which is provided with a first accommodating groove 61 and a second accommodating groove 62; the upper end surfaces of the first accommodating groove 61 and the second accommodating groove 62 are flush, the transmitting probe 10 is arranged in the first accommodating groove 61, the receiving probe 20 is arranged in the second accommodating groove 62, and the PCB board 30 covers the first accommodating groove 61 and the second accommodating groove 62.

[0045] Specifically, the first receiving slot 61 is used to mount the transmitting probe 10, and the second receiving slot 62 is used to mount the receiving probe 20. The number of second receiving slots 62 is the same as the number of receiving probes 20. For example, in this embodiment, there are two receiving probes 20, and there are two corresponding second receiving slots 62, and the two second receiving slots 62 are located on both sides of the first receiving slot 61.

[0046] The PCB 30 covers the first and second receiving slots 61 and 62. The PCB 30 is secured to the bottom case 60 via fasteners 90, with a shock-absorbing washer 100 positioned between the fasteners 90 and the bottom case 60. The fasteners 90 can be screws, and the shock-absorbing washer 100 can be a rubber washer. The shock-absorbing washer 100 effectively reduces vibration, thereby improving the accuracy of the ultrasound module.

[0047] Furthermore, the ultrasound module further includes a sound insulation member 70 , which is disposed between the transmitting probe 10 and the receiving probe 20 .

[0048] Specifically, the bottom shell 60 is provided with a third receiving groove 63 ; the third receiving groove 63 is provided between the first receiving groove 61 and the second receiving groove 62 , and the sound insulation member 70 is provided in the third receiving groove 63 .

[0049] The sound insulation 70 can effectively absorb sound and effectively reduce the interference transmitted through space to the receiving probes 20 on both sides when the transmitting probe 10 transmits, thereby improving the accuracy of the ultrasound module. The sound insulation 70 can be specifically sound insulation cotton.

[0050] Furthermore, the bottom shell 60 includes a fourth accommodating groove 64, the first accommodating groove 61 and the second accommodating groove 62 are both arranged at the bottom of the fourth accommodating groove 64, and the PCB board 30 is arranged in the fourth accommodating groove 64; the ultrasonic module also includes an upper cover 80, the upper cover 80 covers the fourth accommodating groove 64, and the upper cover 80 is provided with a wire hole 81, and a wire plug 82 is embedded in the wire hole 81.

[0051] Specifically, the fourth receiving slot 64 provides space for mounting the PCB 30. The first receiving slot 61, the second receiving slot 62, and the third receiving slot 63 are defined at the bottom of the fourth receiving slot 64. The first receiving slot 61 provides space for mounting the transmitting probe 10, the second receiving slot 62 provides space for mounting the receiving probe 20, and the third receiving slot 63 provides space for mounting the sound insulation 70.

[0052] Furthermore, an inlay groove is provided at the upper end of the side wall of the fourth accommodating groove 64, and the upper cover 80 is embedded in the inlay groove. The upper cover 80 can be connected to the bottom shell 60 by fasteners and / or snap structures and / or bonding, which is not specifically limited in the present invention.

[0053] Furthermore, the wire-passing hole 81 can be used to lead the cables in the fourth accommodating groove 64 to the outside, and the wire-passing plug 82 embedded in the wire-passing hole 81 plays a role in arranging the cables.

[0054] The present invention also provides a mobile device comprising the ultrasonic module of any of the above embodiments. The mobile device may be a lawn mower, a drone, a mobile robot, or other device that has high requirements for obstacle avoidance accuracy.

[0055] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0056] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0058] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0059] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0060] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0061] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, as long as these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

[0062] The above description is a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An ultrasonic module, characterized in that: It includes a transmitting probe and a receiving probe, which are arranged at an interval, wherein the transmitting surface of the transmitting probe and the receiving surface of the receiving probe are oriented in the same direction; taking the orientation of the transmitting surface of the transmitting probe and the receiving surface of the receiving probe as the reference direction, the transmitting surface of the transmitting probe is higher than the receiving surface of the receiving probe.

2. The ultrasound module according to claim 1, wherein: The transmitting surface of the transmitting probe is 1-3 mm higher than the receiving surface of the receiving probe.

3. The ultrasound module according to claim 1, wherein: The ultrasonic module further includes a PCB board, a first shock-absorbing gasket and a second shock-absorbing gasket; The first shock-absorbing gasket is provided between the transmitting probe and the PCB board, and the second shock-absorbing gasket is provided between the receiving probe and the PCB board; The pins of the transmitting probe are welded to the PCB through the first shock-absorbing gasket; the pins of the receiving probe are welded to the PCB through the second shock-absorbing gasket; The thickness of the first shock-absorbing pad is 1-3 mm greater than the thickness of the second shock-absorbing pad.

4. The ultrasound module according to claim 3, characterized in that: The ultrasound module further includes a bottom shell, wherein the bottom shell is provided with a first receiving groove and a second receiving groove; The upper end surfaces of the first accommodating groove and the second accommodating groove are flush, the transmitting probe is arranged in the first accommodating groove, the receiving probe is arranged in the second accommodating groove, and the PCB board covers the first accommodating groove and the second accommodating groove.

5. The ultrasound module according to claim 4, characterized in that: The PCB board and the bottom shell are fixed by fasteners, and a shock-absorbing washer is provided between the fasteners and the bottom shell.

6. The ultrasound module according to claim 4, characterized in that: The ultrasound module further includes a sound insulating member, which is disposed between the transmitting probe and the receiving probe.

7. The ultrasound module according to claim 6, characterized in that: The bottom shell is further provided with a third accommodating groove; the third accommodating groove is provided between the first accommodating groove and the second accommodating groove, and the sound insulation member is provided in the third accommodating groove.

8. The ultrasound module according to claim 4, wherein: The bottom shell includes a fourth receiving groove, the first receiving groove and the second receiving groove are both arranged at the bottom of the fourth receiving groove, and the PCB board is arranged in the fourth receiving groove; The ultrasonic module further includes an upper cover, which covers the fourth accommodating groove. The upper cover is provided with a wire passing hole, and a wire passing plug is embedded in the wire passing hole.

9. The ultrasound module according to claim 1, wherein: The number of the receiving probes is two, and the two receiving probes are respectively arranged at two sides of the transmitting probe at intervals.

10. A mobile machine device, characterized in that Comprising the ultrasound module according to any one of claims 1-9.

Images