Immersive liquid cooling server and liquid cooling system

Abstract

The embodiment of the utility model provides an immersion type liquid cooling server and a liquid cooling system. The immersion type liquid cooling server comprises a plurality of 1U server units, each 1U server unit in the plurality of 1U server units comprises a plurality of 1U servers, a plurality of power supply modules and a power supply backboard; the bottom end of each 1U server and the bottom end of each power supply module in the plurality of 1U server units are connected with the power supply backboard, and the 1U servers are adjacent to the power supply modules; each 1U server in the plurality of 1U server units comprises a case, an upper panel and a hard disk assembly; the upper panel is fixed at the top end of the case, and the hard disk assembly is arranged adjacent to the upper panel. According to the embodiment of the utility model, the bottom end of the 1U server is connected with the power supply backboard, and the hard disk assembly is adjacent to the upper panel, so that the operation and maintenance difficulty of the 1U server is greatly reduced, and meanwhile, higher cooling efficiency can be obtained.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling servers, in particular to an immersion liquid cooling server and a liquid cooling system. Background Art

[0002] Immersion liquid cooling technology has become a major technology leading the energy-saving transformation due to its advantages of being green, environmentally friendly, energy-saving, low-consumption, safe and reliable. It helps data centers achieve lower costs and higher investment returns, and becomes the development direction of green and energy-saving data centers.

[0003] Liquid-cooled servers are the core of the entire cooling system. However, the chassis depth of current liquid-cooled servers is over 800mm, so the cabinet height of the liquid cooling box designed for the liquid cooling system is generally over 1300mm. This makes liquid-cooled servers more difficult to operate and maintain.

[0004] In addition, in the prior art, when the hard disk is set at the bottom of the liquid-cooled server and the power supply is set at the upper part of the liquid-cooled server, the hard disk occupies the entire bottom panel of the liquid-cooled server, causing the cooling liquid channel to be blocked and unable to flow into the server well, resulting in low heat dissipation efficiency; and when the hard disk is set at the upper part of the liquid-cooled server and the power supply is set at the bottom of the liquid-cooled server, due to the complex wiring of the power supply at the bottom and the high height of the cabinet, there is a problem of greater difficulty in operation and maintenance. Utility Model Content

[0005] The embodiments of the present invention provide an immersive liquid-cooled server and a liquid cooling system, which aim to solve the problem in the prior art that when a liquid-cooled server is placed in a liquid-cooled box, the liquid-cooled server has high difficulty in operation and maintenance and low heat dissipation efficiency.

[0006] In a first aspect, an embodiment of the present invention provides an immersion liquid cooling server, comprising a plurality of 1U server units; each of the plurality of 1U server units comprises a plurality of 1U servers, a plurality of power modules, and a power backplane; the bottom of each of the 1U servers and the bottom of each of the power modules in the plurality of 1U server units are connected to the power backplane, and the 1U servers and the power modules are arranged adjacent to each other; a gap is provided between the bottom of the plurality of 1U servers and the plurality of power modules and the power backplane;

[0007] Each of the 1U server units includes a chassis, an upper panel, and a hard disk assembly; the upper panel is fixed to the top of the chassis, and the hard disk assembly is arranged adjacent to the upper panel; and the chassis contains cooling liquid.

[0008] In some embodiments, the upper panel includes an upper panel body, and a first functional area and a second functional area are provided on the upper panel body. The first functional area is provided with an Mgt RJ45 network port, an OCP3.0 interface, an HHHL PCIe Slot plug, several USB interfaces, a VGA interface, a power button, a display digital tube and several EDSFF E1.S SSD slots; the MgtRJ45 network port, the OCP3.0 interface, the HHHL PCIe Slot plug, the several USB interfaces, the VGA interface, the power button, and the display digital tube are all arranged around the outer edge of the upper panel body; the several EDSFF E1.S SSD slots are arranged in the second functional area.

[0009] In some embodiments, the upper panel further includes a first hanging ring, a handle, and several liquid holes; the first hanging ring is arranged on both sides of the upper panel body; the handle is arranged in the middle of the upper panel body; the several liquid holes are used to pass the cooling liquid.

[0010] In some embodiments, the 1U server also includes a motherboard; the motherboard is provided with a plurality of CPUs, a plurality of memory DIMM slots, a first PCIe CONN, a riser card, an OCP network card interface and a plurality of M.2 slots; the plurality of CPUs are arranged on the motherboard at laterally intervals and are connected to the plurality of memory DIMM slots and the first PCIe CONN; the plurality of memory DIMM slots are evenly arranged on both sides of the plurality of CPUs; the riser card is connected to the first PCIe CONN; the OCP network card interface is arranged above the plurality of M.2 slots.

[0011] In some embodiments, a first Power CONN is provided on the mainboard in an area near the bottom of the chassis; and a first positioning pin and a second positioning pin are provided on the bottom of the chassis.

[0012] In some embodiments, the hard disk assembly includes a hard disk, a hard disk backplane, an EDSFF CONN and a second PCIe CONN; the hard disk is connected to the multiple M.2 slots; the EDSFF CONN and the second PCIe CONN are both located on the hard disk backplane, wherein the second PCIe CONN is connected to the first PCIe CONN.

[0013] In some embodiments, the power module includes a power module body, a second hanging ring, a power interface, a third positioning pin and a second Power CONN; the second hanging ring and the power interface are both located at the top of the power module body, wherein the power interface is used to connect to the power wiring; the third positioning pin and the second Power CONN are both located at the bottom of the power module body; the second Power CONN is connected to the power backplane; and a plurality of honeycomb holes are provided on the outer wall of the power module body.

[0014] In some embodiments, the power backplane is provided with a reinforcement frame, a first positioning hole, a second positioning hole, a third positioning hole, a third Power CONN and a fourth Power CONN; the reinforcement frame is used to fix the power backplane; the first positioning pin is aligned with the first positioning hole, the second positioning pin is aligned with the second positioning hole, and the third positioning pin is aligned with the third positioning hole; the first Power CONN is connected to the third Power CONN, and the second PowerCONN is connected to the fourth Power CONN.

[0015] In some embodiments, a partition plate is further included, which is arranged between the 1U server and the power module and is used to fix the 1U server and the power module.

[0016] In the second aspect, an embodiment of the present invention also provides a liquid cooling system, which includes an immersion liquid cooling server as in any of the aforementioned embodiments, and also includes a liquid cooling box. The immersion liquid cooling server is arranged in the liquid cooling box. Among the several 1U server units included in the immersion liquid cooling server, the power backplane of each 1U server unit is arranged on the bottom inner wall of the liquid cooling box.

[0017] The embodiment of the present utility model provides an immersion liquid-cooled server and liquid cooling system, including a 1U server, a power module, and a power backplane; the bottom end of the 1U server and the bottom end of the power module are both connected to the power backplane, and the 1U server is arranged adjacent to the power module; the 1U server includes a chassis, a motherboard, an upper panel, and a hard disk assembly; the upper panel is fixed to the top of the chassis, the hard disk assembly is arranged adjacent to the upper panel, and the motherboard is connected to the hard disk assembly; the chassis contains cooling liquid. In the embodiment of the present utility model, connecting the bottom end of the 1U server to the power backplane and arranging the hard disk assembly adjacent to the upper panel greatly reduces the difficulty of operating and maintaining the 1U server while achieving higher heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 A schematic diagram of the structure of an immersion liquid cooling server provided by an embodiment of the present utility model;

[0020] Figure 2 A schematic diagram of the structure of a 1U server in an immersive liquid cooling server provided in an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the structure of the upper panel of the immersion liquid cooling server provided by an embodiment of the present utility model;

[0022] Figure 4 A schematic structural diagram of a motherboard in an immersion liquid cooling server provided by an embodiment of the present utility model;

[0023] Figure 5 A schematic diagram of the structure of a power module in an immersion liquid cooling server provided by an embodiment of the present utility model;

[0024] Figure 6 A schematic diagram of the structure of a power backplane in an immersion liquid cooling server provided by an embodiment of the present utility model;

[0025] Figure 7 This is a schematic structural diagram of a liquid cooling system provided in an embodiment of the present utility model. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0028] It should also be understood that the terms used in this utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in this utility model specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0029] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0030] See also Figures 1 to 6 , Figure 1 A schematic diagram of the structure of an immersive liquid cooling server and a liquid cooling system provided by an embodiment of the present utility model; Figure 2 A schematic diagram of the structure of an immersive liquid cooling server and a 1U server of a liquid cooling system provided by an embodiment of the present invention; Figure 3 A schematic structural diagram of the upper panel of the immersion liquid cooling server and liquid cooling system provided by an embodiment of the present invention; Figure 4 A schematic structural diagram of an immersive liquid cooling server and a mainboard of a liquid cooling system provided by an embodiment of the present invention; Figure 5 A schematic diagram of the structure of the power module of the immersion liquid cooling server and the liquid cooling system provided by an embodiment of the utility model; Figure 6 This is a structural schematic diagram of the power backplane of the immersion liquid cooling server and liquid cooling system provided in an embodiment of the present utility model.

[0031] See again Figure 1 、 Figure 2 、 Figure 3 as well as Figure 4 The immersion liquid cooling server and liquid cooling system provided by the embodiment of the present invention include several 1U server units; each of the several 1U server units includes several 1U servers 100, several power modules 200 and a power backplane 300; the bottom end of each of the 1U servers 100 and the bottom end of each of the power modules 200 in the several 1U server units are connected to the power backplane 300, and the 1U server 100 and the power module 200 are arranged adjacent to each other; a gap is provided between the bottom of the several 1U servers and the several power modules and the power backplane; each of the 1U servers 100 in the several 1U server units includes a chassis 110, an upper panel 130 and a hard disk assembly 140; the upper panel 130 is fixed to the top of the chassis 110, and the hard disk assembly 140 is arranged adjacent to the upper panel 130; the chassis 110 contains cooling liquid.

[0032] In this embodiment, the bottom end of the power module 200 is electrically connected to the power backplane 300 to provide power to the power backplane 300. The 1U server 100 is connected to the power backplane 300 through the power interface at the bottom to obtain electrical energy, wherein the 1U server 100 is connected to the power backplane 300 through the power interface, specifically the power interface is connected to the output line of the power module 200 through the power backplane 300. Since the height of the 1U server 100 is only 1.75 inches (about 4.45 cm), the space inside the 1U server 100 is extremely limited. The power module 200 is set outside the 1U server 100 and connected through the power backplane 300 at the bottom, which can maximize the use of limited space and avoid wasting the internal space of the 1U server 100. The chassis 110 of the 1U server 100 is not provided with a top cover, which is convenient for technicians to operate and maintain the 1U server 100, and is also conducive to improving the heat dissipation effect. In addition, the power module 200 is one of the components that generates the most heat in the liquid cooling system. Placing it outside the 1U server 100 can reduce the heat load on the internal space of the 1U server 100, which is beneficial to the heat dissipation of other components inside the 1U server 100, thereby maintaining the stable operation of the 1U server 100 system.

[0033] In one embodiment, if Figure 3 As shown, the upper panel 130 includes an upper panel body 131, and the upper panel body 131 is provided with a first functional area and a second functional area. The first functional area is provided with an Mgt RJ45 network port 1311, an OCP3.0 interface 1312, an HHHL PCIe Slot plug 1313, several USB interfaces 1314, a VGA interface 1315, a power button 1316, a display digital tube 1317, and several EDSFF E1.SSSD slots 1318;

[0034] The Mgt RJ45 network port 1311, the OCP3.0 interface 1312, the HHHL PCIe Slot pin 1313, the multiple USB interfaces 1314, the VGA interface 1315, the power button 1316, and the display digital tube 1317 are all arranged around the outer edge of the upper panel body; the multiple EDSFF E1.SSSD slots 1318 are arranged in the second functional area.

[0035] In this embodiment, Mgt RJ45 (Management Registered Jack 45) refers to an Ethernet interface on the server used for remote management and control, which is connected to other network devices through an RJ45 connector. OCP3.0 (Open Compute Project) refers to the third edition interface specification of the Open Compute Project. Specifically, OCP3.0 in the embodiment of this application refers to a network card interface that complies with the OCP 3.0 specification. HHHL PCIe Slot (Half-Height Half-Length PCI Express Slot) refers to a hardware device with a height and length that is only half the standard size pin, which is used to connect to the high-speed serial computer expansion bus standard. USB (Universal Serial Bus) interface refers to an interface for communication, connection and data transmission. VGA (Video Graphics Array) interface refers to an interface standard mainly used to connect a 1U server 100 and a display device (such as a monitor, projector, etc.) to realize the transmission of video signals. The EDSFFE1.S SSD (Enterprise & Data Center SSD Form Factor E1.S) slot is primarily used in data centers and enterprise-class servers. It supports high-speed data transmission and achieves higher storage capacity within a limited space.

[0036] Specifically, in this embodiment, the upper panel body 131 is equipped with one Mgt RJ45 management network port, one OCP3.0 interface 1312, one HHHL PCIe slot latch 1313, two USB ports 1314, one VGA port 1315, a power button 1316, a display 1317 (dual digital display), and eight EDSFF E1.S SSD slots 1318. The eight EDSFF E1.S SSD slots 1318 can be expanded by one OCP3.0 and one PCIe slot. By selecting high-performance E1.S hard drives, fewer hard drives can meet computing power requirements, leaving more space for other interface designs. The more rational layout of the various interfaces on the upper panel 130, combined with the hard drive backplane 141 design, reduces the space occupied by hard drives within the 1U server 100, making the internal layout of the 1U server 100 more compact and saving internal space. At the same time, all interfaces are designed on the upper panel 130 , making it more convenient for operation and maintenance personnel to operate and manage the 1U server 100 .

[0037] It should be noted that the number of various interfaces, buttons and display digital tubes set on the upper panel body 131 is only used to illustrate this embodiment. In this embodiment, the specific number of the various interfaces, buttons and display digital tubes involved is not limited and can be set according to actual needs.

[0038] In one embodiment, if Figure 2 as well as Figure 3 As shown, the upper panel 130 also includes a first hanging ring 132, a handle 133 and a plurality of liquid holes 134; the first hanging ring 132 is arranged on both sides of the upper panel body 131; the handle 133 is arranged in the middle of the upper panel body 131; the plurality of liquid holes 134 are used to pass the cooling liquid.

[0039] In this embodiment, maintenance personnel can pull out the 1U server 100 using the first lifting ring 132 or directly using the handle 133, greatly facilitating maintenance and operation of the 1U server 100. The upper panel 130 is provided with a plurality of liquid holes 134 to facilitate the flow of coolant, reducing the resistance of the coolant through the 1U server 100. This allows more coolant to flow through the interior of the 1U server 100 with less resistance, cooling the internal components of the 1U server 100 and improving the heat dissipation efficiency of the 1U server 100.

[0040] In one embodiment, if Figure 4 As shown, the 1U server also includes a motherboard 120; the motherboard 120 is provided with a plurality of CPUs 121, a plurality of memory DIMM slots 122, a first PCIe CONN 123, a riser card 124, an OCP network card interface 125 and a plurality of M.2 slots 126; the plurality of CPUs 121 are arranged on the motherboard 120 at intervals on the horizontal direction and are connected to the plurality of memory DIMM slots 122 and the first PCIe CONN 123; the plurality of memory DIMM slots 122 are evenly arranged on both sides of the plurality of CPUs 121; the riser card 124 is connected to the first PCIe CONN 123; the OCP network card interface 125 is arranged above the plurality of M.2 slots 126.

[0041] In this embodiment, by horizontally disposing CPU 121 (Central Processing Unit) on motherboard 120 and evenly distributing memory DIMM (Dual-Inline Memory Module) slots on both sides of each CPU 121 (shown as a schematic diagram and not representing a specific number), dual-channel or multi-channel memory configuration can be more easily implemented and helps achieve balanced load distribution. In addition, due to the close physical distance between CPU 121 and memory, the liquid cooling system can more effectively remove the heat generated by these components, improving the heat removal efficiency and maintaining stable system operation.

[0042] The CPU 121 is connected to the memory DIMM and the first PCIe CONN (Peripheral Component Interconnect Express Connector) signal through the PCB (Printed Circuit Board) of the motherboard 120 and communicates. Specifically, the number of PCIe CONNs varies depending on the 1U server 100 platform. For example, in the Intel Whiltley platform, a single CPU has a total of 80 PCIe Lanes (Peripheral Component Interconnect Express Lanes), of which 48 are on the north side. If a PCIe CONN that supports 8 lane connections is used, 6 PCIe CONNs can be supported; if a PCIe CONN that supports 8 lane connections is used, 2 PCIe CONNs can be supported. The first PCIe CONN 123 can be docked with a riser card 124 with a cable to achieve flexible expansion of PCIe devices, and can also be connected to the backplane.

[0043] The motherboard 120 is also provided with two M.2 slots, which are compatible with PCIe signals and SATA (Serial Advanced Technology Attachment, hard disk interface specification) signals. They can support NVMe SSD (Non-Volatile Memory Express Solid State Drive, non-volatile memory host controller interface specification solid state drive) and SATA SSD (Serial Advanced Technology Attachment Solid State Drive, solid state drive using SATA interface), which helps to improve system performance, enhance system scalability, and improve system stability and compatibility.

[0044] It should be noted that the two M.2 slots provided on the motherboard 120 are only used to illustrate this embodiment. In this embodiment, the specific number of M.2 slots is not limited and can be set according to actual needs.

[0045] In one embodiment, if Figure 2 as well as Figure 4 As shown, a first Power CONN 127 is provided on the mainboard 120 near the bottom of the chassis; a first positioning pin 111 and a second positioning pin 112 are provided on the bottom of the chassis 110 .

[0046] In this embodiment, the first Power CONN 127 provided on the mainboard 120 is used to connect to the power backplane 300 to provide the power required for the normal operation of the mainboard 120. The first Power CONN 127 is provided on the mainboard 120 in an area close to the bottom of the chassis. The power supply is connected to the power backplane 300 through the first Power CONN 127, thereby avoiding the introduction of power lines and busbars, reducing the design risk of the liquid cooling system, and improving the reliability of the power supply. The bottom of the chassis 110 is provided with a first positioning pin 111 and a second positioning pin 112 to facilitate positioning of the 1U server 100 when it is inserted into the liquid cooling box. In addition, the bottom of the chassis 110 of the 1U server 100 is also provided with a plurality of liquid holes (not shown in the figure) to facilitate the flow of cooling liquid, thereby achieving a better heat dissipation effect.

[0047] In one embodiment, if Figure 4 As shown, the hard disk assembly 140 includes a hard disk, a hard disk backplane 141, an EDSFF CONN 142 and a second PCIe CONN; the hard disk is connected to the multiple M.2 slots 126; the EDSFF CONN 142 and the second PCIe CONN are both located on the hard disk backplane 141, wherein the second PCIe CONN is connected to the first PCIe CONN 123.

[0048] In this embodiment, the hard drive is not shown due to viewing angles. In addition to the EDSFF CONN (Enterprise and Data center SSD Form Factor, a connector for enterprise-class and data center-class solid-state drives), the hard drive backplane 141 is also provided with a PCIe CONN of the same type (i.e., a second PCIe CONN, not shown) that is connected to the PCIe CONN (i.e., the first PCIe CONN 123) of the motherboard 120. Therefore, the first PCIe CONN 123 on the motherboard 120 can be connected to different hard drive backplanes 141, thereby achieving flexible configuration of the storage capacity of the 1U server 100. The number of second PCIe CONNs on the hard drive backplane 141 varies depending on the number of E1.S hard drives supported (e.g., if an E1.S hard drive supports 4 PCIe Lanes, a PCIe CONN supporting 8 Lane connections is placed on the backplane, then two E1.S hard drives can be supported), thereby reducing costs and energy consumption and effectively improving storage density and capacity.

[0049] In one embodiment, if Figure 5 As shown, the power module 200 includes a power module body 210, a second hanging ring 220, a power interface 230, a third positioning pin 240 and a second Power CONN 250; the second hanging ring 220 and the power interface 230 are both arranged at the top of the power module body 210, wherein the power interface 230 is used to connect to the power wiring; the third positioning pin 240 and the second Power CONN 250 are both arranged at the bottom of the power module body 210; the second Power CONN 250 is connected to the power backplane 300; and the outer wall of the power module body 210 is provided with a plurality of honeycomb holes.

[0050] In this embodiment, since the height of the liquid cooling box does not exceed 1 meter, the server adopts a 1U highly modular design, making the server depth no more than 0.5 meters. Therefore, operation and maintenance personnel can easily remove the power module 200 from the liquid cooling box using the second lifting ring 220. In addition, the 1U server 100 can also be removed from the liquid cooling box using the handle 133 without the need for overhead crane equipment, greatly simplifying operation and maintenance and saving operation and maintenance costs.

[0051] The top of the power module body 210 is provided with a power interface 230 to facilitate power wiring; the bottom is provided with a second Power CONN 250 for connecting to the power backplane 300, so that the power cord does not need to be wrapped around the bottom of the liquid cooling box, which is convenient for operation and maintenance. The provision of the third locating pin 240 prevents misalignment when the power module 200 is inserted into the liquid cooling box. Since a number of honeycomb holes (not shown in the figure) are provided on the outer wall of the power module body 210, the effective contact area between the power module 200 and the coolant can be increased, which is beneficial to improving the overall heat dissipation efficiency.

[0052] In one embodiment, if Figure 6 As shown, the power backplane 300 is provided with a reinforcement frame, a first positioning hole 310, a second positioning hole 320, a third positioning hole 330, a third Power CONN 340 and a fourth Power CONN 350; the reinforcement frame is used to fix the power backplane 300; the first positioning pin 111 is aligned with the first positioning hole 310, the second positioning pin 112 is aligned with the second positioning hole 320, and the third positioning pin 240 is aligned with the third positioning hole 330; the first Power CONN 127 is connected to the third Power CONN 340, and the second Power CONN 250 is connected to the fourth Power CONN 350.

[0053] In this embodiment, holes are opened on the power backplane 300 (not shown in the figure) to avoid the internal wiring of the PCB, and the coolant circulates through the holes, which can achieve an effective heat dissipation effect. By setting a reinforcing frame (not shown in the figure), the power backplane 300 can be effectively fixed to the bottom of the liquid cooling box. In addition, the power backplane 300 can appropriately increase the opening rate on the power backplane 300 according to actual needs. The increase in the opening rate can improve the circulation of the coolant and accelerate the heat dissipation rate, thereby effectively reducing the operating temperature of the power backplane 300. By matching the first positioning pin 111 with the first positioning hole 310, the second positioning pin 112 with the second positioning hole 320, and the third positioning pin 240 with the third positioning hole 330, the accuracy of the insertion and positioning of the 1U server 100 and the power module 200 with the power backplane 300 can be effectively improved.

[0054] The second Power CONN 250 on the power module body 210 is connected to the fourth Power CONN 350 on the power backplane 300 to provide power to the power backplane 300. The first Power CONN 127 on the mainboard 120 is connected to the third Power CONN 340 on the power backplane 300 to obtain power.

[0055] In one embodiment, a partition plate is further included. The partition plate is provided between the 1U server 100 and the power module 200 and is used to fix the 1U server 100 and the power module 200 .

[0056] In this embodiment, the 1U server 100 power module 200 is secured by a partition plate (not shown in the figure), which can improve the overall strength of the liquid cooling system and provide greater stability when the 1U server 100 power module 200 is placed in the liquid cooling box. Because the 1U server 100 and power module 200 generate a large amount of heat during operation, a plurality of honeycomb holes are also provided on the partition plate. The honeycomb hole design allows the coolant to circulate and fully contact the 1U server 100 and power module 200, effectively dissipating heat and achieving a good heat dissipation effect.

[0057] The present invention also provides a liquid cooling system. Figure 7 As shown, the liquid cooling system includes an immersion liquid cooling server as in any of the aforementioned embodiments, and also includes a liquid cooling box 400. The immersion liquid cooling server is arranged in the liquid cooling box 400. Among the several 1U server units included in the immersion liquid cooling server, the power backplane 300 of each 1U server unit is arranged on the bottom inner wall of the liquid cooling box 400.

[0058] In this embodiment, if Figure 7 As shown, among the several 1U server units included in the immersion liquid cooling server, each 1U server unit includes two 1U servers 100, two power modules 200 and a power backplane 300. Among them, a power module 200 is provided on one side of each 1U server 100, and every two 1U servers 100 and two power modules 200 are connected to a power backplane 300. Every two 1U servers 100 and power modules 200 share a power backplane 300, that is, two power modules 200 are used to achieve 1+1 redundancy and supply power to two 1U servers 100 at the same time. When one of the power modules 200 fails or loses power, the other power module 200 can immediately take over the power supply to ensure the continuous operation of the 1U server 100, thereby improving the reliability and stability of the liquid cooling system.

[0059] An embodiment of the present utility model provides an immersion liquid-cooled server and a liquid cooling system, comprising a plurality of 1U server units; each of the plurality of 1U server units comprises a plurality of 1U servers, a plurality of power modules and a power backplane; the bottom end of each of the 1U servers and the bottom end of each of the power modules in the plurality of 1U server units are connected to the power backplane, and the 1U server is arranged adjacent to the power module; each of the plurality of 1U server units comprises a chassis, an upper panel and a hard disk assembly; the upper panel is fixed to the top of the chassis, and the hard disk assembly is arranged adjacent to the upper panel. In an embodiment of the present utility model, connecting the bottom end of the 1U server to the power backplane and arranging the hard disk assembly adjacent to the upper panel greatly reduces the difficulty of operation and maintenance of the 1U server while achieving higher heat dissipation efficiency.

[0060] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An immersion liquid cooling server, characterized in that: The system comprises a plurality of 1U server units; each of the plurality of 1U server units comprises a plurality of 1U servers, a plurality of power modules, and a power backplane; the bottom of each of the 1U servers and the bottom of each of the power modules in the plurality of 1U server units are connected to the power backplane, and the 1U servers and the power modules are arranged adjacent to each other; a gap is provided between the bottom of the plurality of 1U servers and the plurality of power modules and the power backplane; Each of the 1U server units includes a chassis, an upper panel, and a hard disk assembly; the upper panel is fixed to the top of the chassis, and the hard disk assembly is arranged adjacent to the upper panel; and the chassis contains cooling liquid.

2. The immersion liquid cooling server according to claim 1, characterized in that: The upper panel includes an upper panel body, and a first functional area and a second functional area are provided on the upper panel body. The first functional area is provided with an Mgt RJ45 network port, an OCP3.0 interface, an HHHLPCIe Slot plug, several USB interfaces, a VGA interface, a power button, a display digital tube, and several EDSFF E1.S SSD slots; The Mgt RJ45 network port, the OCP3.0 interface, the HHHLPCIe Slot pin, the multiple USB interfaces, the VGA interface, the power button, and the display digital tube are all arranged around the outer edge of the upper panel body; the multiple EDSFFE1.S SSD slots are arranged in the second functional area.

3. The immersion liquid cooling server according to claim 2, characterized in that: The upper panel also includes a first hanging ring, a handle and a plurality of liquid holes; the first hanging ring is arranged on both sides of the upper panel body; the handle is arranged in the middle of the upper panel body; the plurality of liquid holes are used for passing cooling liquid.

4. The immersion liquid cooling server according to claim 1, characterized in that: The 1U server also includes a motherboard; the motherboard is provided with a plurality of CPUs, a plurality of memory DIMM slots, a first PCIe CONN, a riser card, an OCP network card interface and a plurality of M.2 slots; the plurality of CPUs are arranged on the motherboard at intervals on the horizontal direction and are connected to the plurality of memory DIMM slots and the first PCIe CONN; the plurality of memory DIMM slots are evenly arranged on both sides of the plurality of CPUs; the riser card is connected to the first PCIe CONN; the OCP network card interface is arranged above the plurality of M.2 slots.

5. The immersion liquid cooling server according to claim 4, characterized in that: A first Power CONN is provided on the mainboard in an area near the bottom of the chassis; and a first positioning pin and a second positioning pin are provided on the bottom of the chassis.

6. The immersion liquid cooling server according to claim 5, characterized in that: The hard disk assembly includes a hard disk, a hard disk backplane, an EDSFF CONN and a second PCIe CONN; the hard disk is connected to the multiple M.2 slots; the EDSFF CONN and the second PCIe CONN are both located on the hard disk backplane, wherein the second PCIe CONN is connected to the first PCIe CONN.

7. The immersion liquid cooling server according to claim 6, characterized in that: The power module includes a power module body, a second lifting ring, a power interface, a third positioning pin and a second Power CONN; the second lifting ring and the power interface are both located at the top of the power module body, wherein the power interface is used to connect to the power wiring; the third positioning pin and the second Power CONN are both located at the bottom of the power module body; the second Power CONN is connected to the power backplane; the outer wall of the power module body is provided with a plurality of honeycomb holes.

8. The immersion liquid cooling server according to claim 7, characterized in that: The power backplane is provided with a reinforcement frame, a first positioning hole, a second positioning hole, a third positioning hole, a third Power CONN and a fourth Power CONN; the reinforcement frame is used to fix the power backplane; the first positioning pin is aligned with the first positioning hole, the second positioning pin is aligned with the second positioning hole, and the third positioning pin is aligned with the third positioning hole; the first Power CONN is connected to the third Power CONN, and the second Power CONN is connected to the fourth Power CONN.

9. The immersion liquid cooling server according to claim 1, characterized in that: It also includes a partition plate, which is arranged between the 1U server and the power module and is used to fix the 1U server and the power module.

10. A liquid cooling system, characterized in that: It includes an immersive liquid-cooled server as described in any one of claims 1 to 9, and also includes a liquid cooling box. The immersive liquid-cooled server is arranged in the liquid cooling box. Among the several 1U server units included in the immersive liquid-cooled server, the power backplane of each 1U server unit is arranged on the bottom inner wall of the liquid cooling box.

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