Fin type heat dissipation device

Abstract

The utility model discloses a fin type heat dissipation device which comprises a base, a panel opposite to the base, an inverted-U-shaped heat pipe located between the base and the panel and a fin set installed on the panel and making contact with the heat dissipation device for heat conduction, the lower surface of the base is flat, and at least one lower groove used for installing the heat pipe is formed in the upper surface of the base; the panel is concavely provided with a downward bent protrusion opposite to the lower groove, when the panel is matched with the base, the panel is tightly attached to the upper surface of the base, and the bent protrusion is matched with the lower groove to form an installation position used for fixing the heat pipe. The fin set is composed of a plurality of fins which are arranged in parallel at intervals, the fins are perpendicular to the panel, and the lower end faces of the fins are tightly attached to and fixed to the panel. Fins in the fin set make contact with the side faces of the heat pipes. The heat pipe is a hollow flat pipe. The heat dissipation device is compact in structure and good in heat dissipation performance.

Description

Technical Field

[0001] The present application relates to the field of radiators, and in particular to a fin-type heat dissipation device. Background Art

[0002] With the increasing functionality and computing speed of electronic devices, electronic components, especially IC chips, generate significant heat during operation. If this heat is not dissipated promptly and effectively, it can cause the chip temperature to rise sharply, affecting its operational stability and lifespan. Therefore, the design of heat dissipation devices has become particularly important in the development of electronic products, especially for high-performance IC chips. The effectiveness of the heat dissipation solution is directly related to the operational quality and stability of the entire system.

[0003] Among existing heat dissipation technologies, common methods include air cooling and water cooling. Air cooling mainly relies on a combination of fans and heat sinks to remove the heat generated by the chip through air convection. This method has a relatively simple structure and low cost, and is suitable for scenarios with relatively low heat dissipation requirements. However, as the power consumption of IC chips increases, air cooling is limited by the thermal conductivity of air, making it difficult to transfer and discharge heat quickly and effectively, resulting in the heat dissipation effect gradually becoming less than expected. Although water cooling can significantly improve heat dissipation performance, its complex structure, difficulty in installation and maintenance, and the safety risk of leakage have limited its application in consumer electronic devices. Utility Model Content

[0004] The purpose of this application is to overcome at least one of the shortcomings of the prior art and to provide a fin-type heat dissipation device with a compact structure and good heat dissipation performance.

[0005] To achieve the above-mentioned purpose, the present application discloses a fin-type heat dissipation device, which includes a base, a panel opposite to the base, an inverted U-shaped heat pipe located between the base and the panel, and a fin group installed on the panel and in contact with the heat dissipation and heat conduction, wherein the lower surface of the base is flat, and at least one lower groove for mounting the heat pipe is provided on the upper surface; the panel is concavely provided with a downwardly bent protrusion opposite to the lower groove, and when the panel is matched with the base, the panel is tightly attached to the upper surface of the base, and the bent protrusion cooperates with the lower groove to form a mounting position for fixing the heat pipe; the fin group is composed of The heat pipe is composed of a plurality of parallel and spaced fins, the fins are perpendicular to the panel and the lower end surfaces of the fins are tightly fixed to the panel; the fins in the fin group are in contact with the side surfaces of the heat pipe; the heat pipe is a hollow flat tube with a square or quasi-square cross-section and at least a flat bottom surface, and there is a working medium in the heat pipe; the heat pipe includes a lower straight tube section as an evaporation section, an upper straight tube section opposite to the lower straight tube section and serving as a condensation section, and an arc section connecting the upper straight tube section and the lower straight tube section and used for conduction and expansion absorption, and the inner surface of the lower straight tube section is provided with a capillary groove arranged axially of the lower straight tube section.

[0006] In some embodiments, thermal paste is filled between the outer surfaces of the upper and lower straight pipe sections and the mounting locations to further enhance heat conduction efficiency between the heat pipe and the base and panel. The thermal paste effectively fills the gaps between the upper and lower pipe sections and the mounting locations, reducing thermal resistance and allowing heat to be transferred more quickly from the heat pipe to the fin assembly, thereby improving the heat dissipation performance of the entire heat sink.

[0007] In some embodiments, the arc-shaped section of the heat pipe is embedded in the mounting position to form a more stable fixed structure, thereby enhancing the overall structural strength of the heat dissipation device and preventing loosening or falling off due to deformation of the heat pipe or mechanical vibration.

[0008] Compared with the prior art, this application has at least one of the following beneficial effects:

[0009] 1. Improved heat dissipation efficiency: By filling thermal paste between the heat pipe and the base and panel, the thermal resistance is effectively reduced, allowing heat to be transferred to the fin group more quickly, significantly improving the heat dissipation performance of the heat sink.

[0010] 2. Enhanced structural stability: The upper and lower grooves of the heat pipe are fixed together, and the arc section is embedded in the installation position design to form a stable installation structure, preventing loosening or falling off due to mechanical vibration or deformation of the heat pipe, thereby enhancing the overall structural strength of the device.

[0011] 3. Good heat pipe design: The heat pipe adopts an inverted U-shaped structure, equipped with an evaporation section, a condensation section and an arc section, which can better absorb and conduct heat. At the same time, it has good expansion absorption capacity, which improves the stability of heat dissipation performance.

[0012] 4. Wide adaptability: The device has a compact structure and reasonable design. It is suitable for the needs of efficient heat dissipation in electronic equipment. It can effectively solve the heat dissipation problem of high-performance IC chips while ensuring the operating stability and service life of the system.

[0013] The above-listed beneficial effects are not exhaustive and other potential beneficial effects and detailed technical implementations will be further disclosed in the examples or other description sections of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] After reading the following detailed description in conjunction with the accompanying drawings, you will better understand the various aspects of the present disclosure. The positions, sizes, and ranges of various structures shown in the drawings and the like sometimes do not represent the actual positions, sizes, and ranges. In the drawings:

[0015] Figure 1 It is a structural schematic diagram of an embodiment disclosed in the present application at one viewing angle.

[0016] Figure 2 It is a structural schematic diagram of an embodiment disclosed in this application from another perspective.

[0017] Figure 3 It is a structural explosion diagram of an embodiment disclosed in this application. DETAILED DESCRIPTION

[0018] The present disclosure will be described below with reference to the accompanying drawings, which illustrate several embodiments of the present disclosure. However, it should be understood that the present disclosure can be presented in many different ways and is not limited to the embodiments described below; in fact, the embodiments described below are intended to make the present disclosure more complete and fully illustrate the scope of protection of the present disclosure to those skilled in the art. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide many additional embodiments.

[0019] It should be understood that like reference numerals refer to like elements throughout the drawings. In the drawings, the dimensions of some features may be distorted for clarity.

[0020] It should be understood that the terms used in the specification are only used to describe specific embodiments and are not intended to limit the present disclosure. All terms (including technical and scientific terms) used in the specification have the meanings commonly understood by those skilled in the art unless otherwise defined. For the sake of brevity and / or clarity, the techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered part of the authorization specification.

[0021] As used in this specification, the singular forms "a," "an," "said," and "the" include the plural forms unless otherwise expressly stated. The terms "include," "comprise," and "contain" as used in this specification indicate the presence of the claimed features, but do not exclude the presence of one or more additional features. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items. Example

[0022] like Figures 1 to 3 As shown, this embodiment discloses a heat dissipation device. Structurally, the device includes a base 1, a panel 2 arranged opposite to the base 1, an inverted U-shaped heat pipe 5 located between the base 1 and the panel 2, and a fin group 6 installed on the panel 2 and in heat conduction contact with the heat pipe 5.

[0023] Specifically, the lower surface of the base 1 is flat to facilitate its combination and fixation with other structures. Its upper surface is provided with at least one lower groove 3 for mounting the heat pipe 5, providing space for positioning and mounting the heat pipe 5 so that the heat pipe 5 can fit tightly against the base 1. The base 1 is usually made of a metal material with high thermal conductivity, such as aluminum alloy or copper, to ensure that heat can be quickly transferred to the heat pipe 5, thereby improving the efficiency of the entire heat dissipation system. The processing accuracy of the base 1 also has an important impact on the heat dissipation effect, so the flatness of the surface of the base 1 is strictly controlled to reduce unnecessary thermal resistance.

[0024] In this embodiment, a bent protrusion 4 is provided in the panel 2, which is opposite to the lower groove 3 in the base 1. When the panel 2 is matched with the base 1, the panel 2 fits tightly against the upper surface of the base 1, thereby forming a stable overall structure. The bent protrusion 4 cooperates with the lower groove 3 to form a mounting position for fixing the heat pipe 5, so that the heat pipe 5 can be firmly fixed between the base 1 and the panel 2 to avoid loosening during operation. This double-groove design can effectively support the heat pipe 5 and ensure the stability of heat transfer. The panel 2 also uses a high thermal conductivity material to further reduce the loss during heat transfer. The design of the panel 2 also takes into account the mechanical strength of the overall structure to avoid deformation under thermal stress or external mechanical stress, thereby affecting the heat dissipation performance.

[0025] Specifically, the heat pipe 5 is a hollow flat tube with a square or quasi-square cross-section. Its outer shape is convenient for closely fitting with the grooves of the panel 2 and the base 1 and has a flat bottom surface.

[0026] The interior of the heat pipe 5 is filled with a working fluid, and the phase change principle is used to achieve heat transfer, thereby maximizing the heat dissipation efficiency. The structure of the heat pipe 5 includes a lower straight pipe section 501, an upper straight pipe section 502, and an arc section 503 connecting the upper and lower straight pipe sections. Among them, the lower straight pipe section 501 is an evaporation section, which is used to receive heat transferred from the base 1; the upper straight pipe section 502 is a condensation section, which is in direct contact with the fin group 6 and effectively dissipates heat to the external environment; the arc section 503 is used to connect the upper and lower straight pipe sections and conduct the flow of the working fluid, while absorbing the pressure generated by thermal expansion through its own deformation to prevent the heat pipe 5 from breaking due to thermal stress. The working fluid in the heat pipe 5 can be water, ammonia or other liquids with high latent heat properties. When selecting the working fluid, the operating temperature range and heat dissipation requirements must be considered to ensure that the heat pipe 5 can maintain efficient heat conduction capabilities under different working conditions.

[0027] The inner surface of the lower straight pipe section 501 is provided with capillary grooves arranged along the axial direction. The capillary grooves help to evenly distribute the working fluid inside the heat pipe 5, promote the effective circulation of the liquid, and further improve the heat dissipation performance. The design of the capillary grooves is crucial, and their depth and spacing need to be accurately calculated to achieve rapid reflux of the liquid and ensure that the evaporation section can continuously and effectively absorb heat. In addition, the outer surfaces of the upper and lower straight pipe sections 501 and 502 and the mounting positions are filled with thermal paste to improve the heat conduction efficiency between the heat pipe 5 and the base 1 and panel 2. The thermal paste can effectively fill the gap between the heat pipe 5 and the mounting position, reduce the contact thermal resistance, and ensure that heat can be quickly transferred from the heat pipe 5 to the fin group 6, thereby significantly improving the overall performance of the heat dissipation device. The selection of thermal paste must have good thermal conductivity, low volatility and a long service life to ensure the reliability of the heat dissipation device in long-term operation.

[0028] The fin group 6 mounted on the panel 2 is composed of a number of parallel and spaced fins. The fins are perpendicular to the panel 2, and the lower end surface is in close contact with the panel 2 to enhance the thermal contact between the fins and the panel 2, thereby ensuring that heat is efficiently transferred to the external environment. The fins are usually made of high thermal conductivity materials, such as aluminum alloy or copper, and are manufactured through precision stamping or extrusion molding processes to ensure that the fins have sufficient mechanical strength and thermal conductivity. The fins are in direct contact with the sides of the heat pipes 5. This design can make full use of the heat transferred by the heat pipes 5, and increase the heat exchange area of ​​the overall device through the heat dissipation function of the fins, effectively speeding up the heat dissipation process and improving the performance of the heat dissipation device. The spacing design of the fins also needs to take into account the heat dissipation effect and air circulation to achieve the best convective heat transfer effect and ensure efficient heat dissipation under natural convection or forced convection conditions.

[0029] Furthermore, as a preferred embodiment, the arcuate section 503 of the heat pipe 5 is partially embedded in the mounting position formed by the bent protrusion 4 and the lower groove 3, forming a more stable fixed structure. This design can effectively enhance the overall strength of the heat dissipation device, preventing loosening or falling due to deformation of the heat pipe 5 or external vibration, thereby ensuring the stability and reliability of the device during long-term use. In particular, in applications that require frequent thermal cycling, such as high-load servers and computing equipment, this embedded fixing method can effectively reduce the impact of mechanical stress on the device and extend the service life of the heat dissipation system.

[0030] In practical applications, such as high-load computing equipment, this heat sink, through the tight fit of the base 1, the filling of thermal paste, and the efficient heat dissipation of the fin assembly 6, can quickly reduce the operating temperature of the device, thereby improving the stability and operating efficiency of the device. The high efficiency of the heat sink not only helps prevent overheating and failure of electronic components, but also reduces energy consumption and noise by lowering operating temperatures and reducing the operating time of the system fan, further improving the overall performance of the device and the user experience.

[0031] In summary, the sheet-type heat sink, through reasonable structural design, utilizes the phase change heat dissipation principle of the heat pipe 5 and the effect of the fin group 6 to increase the heat dissipation area, effectively realizing efficient heat transfer and dissipation, and is suitable for a variety of application scenarios that require rapid heat dissipation, thereby improving the performance and reliability of the equipment. The device exhibits high heat dissipation efficiency in a variety of complex application environments and can meet the stringent requirements of modern high-performance electronic equipment for heat dissipation capabilities. It has a compact structure and significant heat dissipation effect, and is particularly suitable for high-power density equipment such as data centers, game consoles, and industrial control equipment. In addition, through modular design, the heat sink also has good scalability and can be flexibly adjusted according to the needs of different equipment to adapt to various specific application scenarios, providing long-lasting and stable heat dissipation guarantee for the equipment.

[0032] Although exemplary embodiments of the present disclosure have been described, it will be understood by those skilled in the art that various changes and modifications may be made to the exemplary embodiments of the present disclosure without departing substantially from the spirit and scope of the present disclosure. Therefore, all such changes and modifications are intended to be within the scope of protection of the present disclosure as defined by the appended claims. The present disclosure is defined by the appended claims, and equivalents of these claims are intended to be included therein.

Claims

1. A fin-type heat sink, characterized in that: The heat dissipation device includes: a base, a panel opposite to the base, an inverted U-shaped heat pipe located between the base and the panel, and a fin group installed on the panel and in contact with the heat dissipation for heat conduction, wherein the lower surface of the base is flat, and at least one lower groove for mounting the heat pipe is provided on the upper surface; the panel is concavely provided with a downwardly bent protrusion opposite to the lower groove, and when the panel is matched with the base, the panel is tightly attached to the upper surface of the base, and the bent protrusion cooperates with the lower groove to form a mounting position for fixing the heat pipe; the fin group consists of a plurality of parallel and spaced fins. The heat pipe is composed of a fin group, wherein the fins are perpendicular to the panel and the lower end surfaces of the fins are tightly fixed to the panel; the fins in the fin group are in contact with the side surfaces of the heat pipe; the heat pipe is a hollow flat tube with a square or quasi-square cross-section and at least a flat bottom surface, and a working medium is contained in the heat pipe; the heat pipe includes a lower straight tube section as an evaporation section, an upper straight tube section opposite to the lower straight tube section and serving as a condensation section, and an arc section connecting the upper straight tube section and the lower straight tube section and used for conduction and expansion absorption, and the inner surface of the lower straight tube section is provided with a capillary groove arranged axially of the lower straight tube section.

2. A fin-type heat sink as claimed in claim 1, characterized in that: Thermal paste is filled between the outer surface of the upper straight pipe section and the lower straight pipe section and the installation position to further enhance the heat conduction efficiency between the heat pipe and the base and panel; Thermal paste can effectively fill the gap between the upper and lower pipe sections and the mounting position, reducing thermal resistance, allowing heat to be conducted from the heat pipe to the fin group more quickly, and improving the heat dissipation performance of the entire heat dissipation device.

3. The fin-type heat sink as claimed in claim 1, characterized in that: The arc section of the heat pipe is embedded in the installation position to form a more stable fixed structure.

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