Radiator capable of reducing flow resistance

Abstract

The utility model discloses a radiator capable of reducing flow resistance. The radiator comprises a uniform temperature plate, an evaporation cavity, a radiating pipe, a positioning connection support, a first radiating fin, a second radiating fin, a supporting connection part, a limiting groove, a radiating flow channel, a profiling connection hole and a turbulent flow wave part. Through the mode, the radiator capable of reducing the flow resistance can not only increase the radiating area, but also effectively reduce the flow resistance and improve the uniformity and the high efficiency of heat conduction, so that the radiating capacity of the radiator is better improved, the weight of the radiator can be reduced, and the practicability of the radiator is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a radiator with reduced flow resistance. Background Art

[0002] Servers are a type of computer, widely used due to their high-speed CPU (or multiple CPUs), long-term reliable operation, strong I / O external data throughput, and excellent scalability. The internal structure of a server is relatively complex, and the heat sink / module is a key component.

[0003] With the continuous updating of technology and the improvement of server system computing power, higher requirements are also placed on the heat dissipation performance of servers. However, there are problems with the current radiator structure and the flow resistance of fluid through the radiator, resulting in the actual heat dissipation performance of the heat dissipation module being very unsatisfactory and unable to perform at its optimal state, which is not conducive to the normal operation of the server. In addition, many radiators increase their own volume to improve heat dissipation performance, but as the volume increases, the weight also increases, which is even more inconsistent with the needs of weight reduction, cost reduction and environmental protection. Utility Model Content

[0004] In order to solve the above technical problems, a technical solution adopted by the present invention is:

[0005] Provided is a radiator for reducing flow resistance, comprising: a temperature equalizing plate, an evaporation chamber, a heat dissipation pipe, a positioning connection bracket, a first heat dissipation fin, a second heat dissipation fin, a supporting connection portion, a limiting groove, a heat dissipation flow channel, a contoured connection hole, and a spoiler wave portion.

[0006] 12. The heat dissipation device as described in claim 9, wherein the bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a round shank which is located adjacent the bridge to the mounting plate, the wires being collected by the bridge. The wires are then transferred to the bridge by the bridge to the mounting plate, whereupon the bridge is disconnected from the mounting plate to form a cutout between the bridge and the mounting plate.

[0007] A plurality of the contoured connection holes are provided on the first heat sink and the second heat sink, the heat pipes are connected to the contoured connection holes and in contact with the heat sinks, the spoiler wave portions are horizontally provided on the front and rear end faces of the first heat sink arranged along the fluid direction, and the top and bottom surfaces of the spoiler wave portions are flush with the top and bottom surfaces of the first heat sink respectively, and the front and rear end faces of the second heat sink are planar structures.

[0008] In a preferred embodiment of the present invention, the diameter of the heat dissipation pipe gradually increases along the fluid direction.

[0009] In a preferred embodiment of the present invention, a liquid inlet communicating with the evaporation chamber is provided at the end of the temperature uniformity plate.

[0010] In a preferred embodiment of the present invention, a plurality of groups of heat dissipation pipes are arranged on the temperature homogenizing plate in parallel or staggered.

[0011] In a preferred embodiment of the present invention, the positioning and connecting brackets are arranged at both ends of the top of the temperature homogenizing plate.

[0012] In a preferred embodiment of the present invention, the heat sink and the supporting connection portion are an integrated structure.

[0013] In a preferred embodiment of the present invention, the cross-section of each single tooth in the spoiler wave portion adopts a circular, rectangular, trapezoidal, triangular or special-shaped structure.

[0014] In a preferred embodiment of the present invention, the first heat sink and the second heat sink are arranged at an interval of 1:1.

[0015] In a preferred embodiment of the present invention, the first heat sink and the second heat sink are provided with arc-shaped protrusions, and the rear portions of the arc-shaped protrusions are provided with openings to connect two adjacent heat dissipation channels.

[0016] In a preferred embodiment of the present invention, the arc-shaped protrusion and the heat sink are an integrated structure.

[0017] The beneficial effects of the present invention are: it can not only increase the heat dissipation area, but also effectively reduce the flow resistance, improve the uniformity and efficiency of heat conduction, thereby better improving the heat dissipation capacity of the radiator, and can also reduce the weight of the radiator and improve the practicality of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. Among them:

[0019] Figure 1 This is a structural schematic diagram of a preferred embodiment of a heat sink for reducing flow resistance according to the present invention;

[0020] Figure 2 This is a schematic structural diagram of the first heat sink of a preferred embodiment of a heat sink for reducing flow resistance according to the utility model;

[0021] Figure 3 This is a schematic layout diagram of a preferred embodiment of a heat sink for reducing flow resistance according to the present invention. DETAILED DESCRIPTION

[0022] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] See also Figure 1-3 , the embodiments of the present utility model include:

[0024] A heat sink 11 for reducing flow resistance is arranged between a fan 13 and a CPU (or other heat-generating electronic device) 14 in a server 12. Its structure includes: a temperature-averaging plate 1, an evaporation chamber, a heat dissipation pipe 2, a positioning and connecting bracket 3, a first heat sink 4, a second heat sink 5, a supporting connection portion 6, a limiting groove 7, a heat dissipation flow channel 8, a contoured connection hole 9, and a spoiler wave portion 10.

[0025] The heat spreader 1 is provided with an evaporation chamber, and the heat pipe 2 is arranged on the top surface of the heat spreader 1. The cavity within the heat pipe 2 is connected to the evaporation chamber. The front and rear end surfaces of the heat pipe 2, arranged along the flow direction, are curved spoiler surfaces 21. The diameter of the front end of the heat pipe 2 is smaller than that of the rear end, forming a water droplet-like cross-section. This not only increases the heat dissipation area, but also reduces flow resistance and improves the heat dissipation effect. The heat spreader 1 can directly adopt an existing conventional structure, and the connection method between the heat spreader 1 and the heat pipe 2 is also conventional technical means.

[0026] Further preferably, the diameter or width of the heat dissipation pipe 2 gradually increases along the fluid direction.

[0027] Further preferably, the end of the temperature homogenizing plate 1 is provided with a liquid inlet connected to the evaporation chamber for vacuuming and inputting the heat dissipation medium.

[0028] Further preferably, a plurality of groups of heat dissipation tubes 2 are arranged in parallel on the temperature homogenizing plate 1 , or the heat dissipation tubes 2 can be staggeredly arranged on the temperature homogenizing plate 1 .

[0029] A U-shaped positioning and connecting bracket 3 is provided on the temperature equalizing plate 1 to place and position the heat sink. The first heat sink 4 and the second heat sink 5 are stacked up and down on the positioning and connecting bracket 3. Support connection parts 6 are provided on both sides of the first heat sink 4 and the second heat sink 5. Limiting grooves 7 are provided on both sides of the top surfaces of the first heat sink 4 and the second heat sink 5. The bottom of the supporting connection part 6 on one heat sink is movably connected to the limiting groove 7 on the adjacent heat sink, so that a heat dissipation channel 8 is formed between adjacent heat sinks, and the installation of the heat sink connection and the accuracy and stability of the connection are improved.

[0030] Further preferably, the positioning and connecting brackets 3 are arranged at both ends of the top of the temperature homogenizing plate 1 .

[0031] Further preferably, the heat sink and the supporting connection portion 6 are an integrated structure.

[0032] The first heat sink 4 and the second heat sink 5 are provided with a plurality of contoured connection holes, the heat pipe is connected to the contoured connection hole 9 and in contact with the heat sink, and the first heat sink 4 is provided with a horizontally arranged spoiler wave portion 10 on the front and rear end surfaces arranged along the fluid direction, so that the wave surfaces of the spoiler wave portion 10 at both ends are respectively facing the cold air emitting device such as the fan 13 and the CPU 14, and the top surface and the bottom surface of the spoiler wave portion 10 are respectively flush with the top surface and the bottom surface of the first heat sink 4, which can not only reduce the fluid flow path, speed up the flow speed, reduce the flow resistance, and improve the heat dissipation capacity, but also reduce the weight and volume of the heat sink to a certain extent. The front and rear end surfaces of the second heat sink 5 are planar structures.

[0033] Further preferably, the cross section of each single tooth in the spoiler wave portion 10 can be circular, rectangular, trapezoidal, triangular or a special-shaped structure.

[0034] Further preferably, the first heat sink 4 and the second heat sink 5 can be matched in proportion, for example, arranged at a 1:1 interval, which can effectively reduce the fluid flow resistance and effectively improve the heat dissipation performance. Alternatively, all first heat sinks can be used.

[0035] Further preferably, the first heat sink 4 and the second heat sink 5, especially the heat sink located at the bottom, are provided with an upwardly protruding arc-shaped convex portion, and an opening is provided at the rear of the arc-shaped convex portion to connect the two adjacent heat dissipation flow channels, which can more reasonably and effectively adjust the distribution of hot air, reduce the local heat dissipation pressure of the radiator, and improve the overall heat dissipation efficiency and effect.

[0036] Further preferably, the arc-shaped protrusion and the heat sink are an integrated structure.

[0037] The beneficial effects of the radiator with reduced flow resistance of the utility model are: it can not only increase the heat dissipation area, but also effectively reduce the flow resistance, improve the uniformity and efficiency of heat conduction, thereby better improving the heat dissipation capacity of the radiator, and can also reduce the weight of the radiator and improve the practicality of the radiator.

[0038] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A heat sink for reducing flow resistance, characterized in that: include: Temperature balancing plate, evaporation chamber, heat dissipation pipe, positioning connection bracket, first heat sink, second heat sink, support connection part, limiting groove, heat dissipation flow channel, contour connection hole, spoiler wave part, 12. The heat dissipation device as described in claim 9, wherein the bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a round shank which is located adjacent the bridge to the mounting plate, the wires being collected by the bridge. The wires are then transferred to the bridge by the bridge to the mounting plate, whereupon the bridge is disconnected from the mounting plate to form a cutout between the bridge and the mounting plate. A plurality of the contoured connection holes are provided on the first heat sink and the second heat sink, the heat pipes are connected to the contoured connection holes and in contact with the heat sinks, the spoiler wave portions are horizontally provided on the front and rear end faces of the first heat sink arranged along the fluid direction, and the top and bottom surfaces of the spoiler wave portions are flush with the top and bottom surfaces of the first heat sink respectively, and the front and rear end faces of the second heat sink are planar structures.

2. The heat sink for reducing flow resistance according to claim 1, characterized in that: The diameter of the heat dissipation pipe gradually increases along the direction of the fluid.

3. The heat sink for reducing flow resistance according to claim 1, characterized in that: The end of the temperature equalizing plate is provided with a liquid inlet communicated with the evaporation chamber.

4. The heat sink for reducing flow resistance according to claim 1, characterized in that: A plurality of groups of heat dissipation pipes are arranged on the temperature homogenizing plate in parallel or staggered.

5. The heat sink for reducing flow resistance according to claim 1, characterized in that: The positioning and connecting brackets are arranged at both ends of the top of the temperature homogenizing plate.

6. The heat sink for reducing flow resistance according to claim 1, characterized in that: The heat sink and the supporting connection portion are an integrated structure.

7. The heat sink for reducing flow resistance according to claim 1, characterized in that: The cross section of each single tooth in the spoiler wave portion adopts a circular, rectangular, trapezoidal, triangular or special-shaped structure.

8. The heat sink for reducing flow resistance according to claim 1, characterized in that: The first heat sink and the second heat sink are arranged at an interval of 1:

1.

9. The heat sink for reducing flow resistance according to claim 1, characterized in that: The first heat sink and the second heat sink are provided with arc-shaped convex portions, and the rear portions of the arc-shaped convex portions are provided with openings to connect two adjacent heat dissipation channels.

10. The heat sink for reducing flow resistance according to claim 9, characterized in that: The arc-shaped convex portion and the heat sink are an integrated structure.

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