Super junction field effect transistor facilitating heat dissipation

Abstract

The utility model discloses a super junction field effect transistor facilitating heat dissipation, and relates to the technical field of field effect transistors. Comprising a mounting substrate, the top of the mounting substrate is provided with a super-junction field effect tube, the mounting substrate is connected with a heat dissipation plate pressed on the super-junction field effect tube, the top of the heat dissipation plate is uniformly provided with heat dissipation fins, the heat dissipation plate is provided with a first cavity, a connecting plate is connected between the top inner wall and the bottom inner wall of the first cavity, the mounting substrate is provided with a second cavity, and the second cavity is provided with a heat dissipation plate. And groove bodies are formed in the tops of the cooling fins. According to the super-junction field-effect tube facilitating heat dissipation, the heat dissipation plate with the top evenly provided with the heat dissipation fins is pressed on the super-junction field-effect tube, heat generated by the super-junction field-effect tube is conveniently transferred to the heat dissipation plate, heat dissipation is achieved through the heat dissipation fins, the heat dissipation plate is further provided with the first cavity, and heat dissipation of the super-junction field-effect tube is overall facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of field effect tubes, in particular to a super junction field effect tube which is conducive to heat dissipation. Background Art

[0002] Superjunction field-effect transistors (SFETs) have the advantages of high input resistance, low noise, low power consumption, large dynamic range, easy integration, no secondary breakdown, and a wide safe operating area. SFETs are a type of field-effect transistor, the most important material in superconducting electronic devices, and are currently the most widely used.

[0003] Superjunction field-effect transistors are basic elements in electronic circuits and are voltage-controlled semiconductor devices. When the field-effect transistor is working, its internal circuit will frequently turn on and off, thus generating a large amount of heat. However, the superjunction field-effect transistor itself has a limited volume, which makes its own heat dissipation speed and heat dissipation effect poor. Utility Model Content

[0004] The utility model provides a super junction field effect transistor which is conducive to heat dissipation, so as to solve the problems in the background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a superjunction field-effect transistor that is conducive to heat dissipation, comprising a mounting substrate, a superjunction field-effect transistor being provided on the top of the mounting substrate, a heat sink being connected to the mounting substrate and pressed against the superjunction field-effect transistor, heat sinks being evenly provided on the top of the heat sink, a first cavity being defined in the heat sink, a connecting plate being connected between the top inner wall and the bottom inner wall of the first cavity, a second cavity being defined on the mounting substrate, and a groove being defined on the top of the heat sink.

[0006] Furthermore, a separation block is provided on the top of the mounting substrate, and super junction field effect transistors are provided on both sides of the separation block on the top of the mounting substrate.

[0007] Furthermore, a stopper is fixedly connected to one side of the top of the mounting substrate.

[0008] Furthermore, a bump is fixedly connected to the top of the mounting substrate, and a groove that can be placed on the bump is formed on one side of the bottom of the super junction field effect transistor.

[0009] Furthermore, a mounting hole passing through the bump is provided at the bottom of the mounting substrate, a reserved hole corresponding to the mounting hole is provided on the super junction field effect transistor, and a connecting hole corresponding to the reserved hole is provided on the heat sink. The mounting substrate, the super junction field effect transistor and the heat sink are connected by bolts passing through the mounting hole, the reserved hole and the connecting hole.

[0010] Furthermore, ear blocks are fixedly connected to both sides of the mounting base plate.

[0011] Compared with the prior art, the present invention provides a superjunction field-effect tube that is conducive to heat dissipation and has the following beneficial effects: the superjunction field-effect tube that is conducive to heat dissipation, by pressing a heat sink with heat sinks evenly arranged on the top onto the superjunction field-effect tube, facilitates the transfer of heat generated by the superjunction field-effect tube to the heat sink, and dissipates heat through the heat sink, and the heat sink is further provided with a first cavity, which is conducive to the heat dissipation of the superjunction field-effect tube as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural diagram of the utility model;

[0013] Figure 2 This is a schematic diagram of the structure of the present invention without the heat dissipation plate;

[0014] Figure 3 This is a schematic structural diagram of the mounting base plate of the present utility model;

[0015] Figure 4 It is a schematic diagram of the planar structure of the present utility model.

[0016] In the figure: 1. Mounting substrate; 2. Superjunction field-effect transistor; 3. Heat sink; 4. Heat sink; 5. First cavity; 6. Connecting plate; 7. Separator; 8. Second cavity; 9. Stopper; 10. Bump; 11. Groove; 12. Mounting hole; 13. Reserved hole; 14. Bolt; 15. Ear block; 16. Trough body. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] See also Figure 1-4 The utility model discloses a super junction field effect transistor that is conducive to heat dissipation, including a mounting substrate 1, a super junction field effect transistor 2 is provided on the top of the mounting substrate 1, a heat sink 3 is connected to the mounting substrate 1 and pressed on the super junction field effect transistor 2, heat sink fins 4 are evenly provided on the top of the heat sink 3, a first cavity 5 is defined in the heat sink 3, a connecting plate 6 is connected between the top inner wall and the bottom inner wall of the first cavity 5, a second cavity 8 is defined on the mounting substrate 1, and a groove 16 is defined on the top of the heat sink 4.

[0019] The heat sink 4 , the connecting plate 6 and the heat sink 3 are made of aluminum or copper.

[0020] The grooves 16 on the heat sink 4 can reduce the weight of the heat sink 4 itself while facilitating air flow to dissipate heat from the heat sink 4 .

[0021] Specifically, a separation block 7 is provided on the top of the mounting substrate 1 , and super junction field effect transistors 2 are provided on both sides of the separation block 7 on the top of the mounting substrate 1 .

[0022] In this embodiment, the separation block 7 is used to separate the superjunction field effect transistors 2 mounted on the mounting substrate 1 . The interior of the separation block 7 is hollow, and the inner cavity thereof is connected to the second cavity 8 .

[0023] Specifically, a stopper 9 is fixedly connected to one side of the top of the mounting substrate 1 .

[0024] In this embodiment, when the super junction field effect transistor 2 is mounted on the mounting substrate 1 , one end of the super junction field effect transistor 2 is attached to the side wall of the stopper 9 .

[0025] Specifically, a bump 10 is fixedly connected to the top of the mounting substrate 1 , and a groove 11 that can be placed on the bump 10 is formed on one side of the bottom of the super junction field effect transistor 2 .

[0026] A mounting hole 12 passing through the bump 10 is provided at the bottom of the mounting substrate 1, a reserved hole 13 corresponding to the mounting hole 12 is provided on the super junction field effect transistor 2, and a connecting hole corresponding to the reserved hole 13 is provided on the heat sink 3. The mounting substrate 1, the super junction field effect transistor 2 and the heat sink 3 are connected by bolts 14 passing through the mounting hole 12, the reserved hole 13 and the connecting hole.

[0027] In this embodiment, the reserved hole 13 is opened on the groove 11 of the super junction field effect transistor 2 .

[0028] The connection hole on the heat dissipation plate 3 is connected to the second cavity 8 .

[0029] The mounting substrate 1 , the super junction field effect transistor 2 and the heat sink 3 are connected together by bolts 14 .

[0030] Specifically, ear blocks 15 are fixedly connected to both sides of the mounting substrate 1 .

[0031] In this embodiment, the mounting substrate 1 is mounted on the PCB board through the ear blocks 15 and screws.

[0032] To sum up, the super junction field effect tube that is conducive to heat dissipation, by pressing the heat sink 3 with heat sinks 4 evenly arranged on the top onto the super junction field effect tube 2, facilitates the transfer of heat generated by the super junction field effect tube 2 to the heat sink 3, and dissipates heat through the heat sink 4. The heat sink 3 is also provided with a first cavity 5, which is beneficial to the heat dissipation of the super junction field effect tube 2 as a whole.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A superjunction field effect transistor (SFET) that is advantageous for heat dissipation, comprising a mounting substrate (1), characterized in that: A superjunction field effect transistor (2) is provided on the top of the mounting substrate (1); a heat sink (3) pressed against the superjunction field effect transistor (2) is connected to the mounting substrate (1); heat sinks (4) are evenly provided on the top of the heat sink (3); a first cavity (5) is provided on the heat sink (3); a connecting plate (6) is connected between the top inner wall and the bottom inner wall of the first cavity (5); a second cavity (8) is provided on the mounting substrate (1); and a slot (16) is provided on the top of the heat sink (4).

2. The superjunction field effect transistor (SFET) with improved heat dissipation according to claim 1, characterized in that: A separation block (7) is provided on the top of the mounting substrate (1), and super junction field effect transistors (2) are provided on both sides of the separation block (7) on the top of the mounting substrate (1).

3. The superjunction field effect transistor with improved heat dissipation according to claim 1, characterized in that: A stopper (9) is fixedly connected to one side of the top of the mounting base plate (1).

4. The superjunction field effect transistor with improved heat dissipation according to claim 1, characterized in that: A bump (10) is fixedly connected to the top of the mounting substrate (1), and a groove (11) capable of being placed on the bump (10) is provided on one side of the bottom of the super junction field effect transistor (2).

5. The superjunction field effect transistor with improved heat dissipation according to claim 4, characterized in that: The bottom of the mounting substrate (1) is provided with a mounting hole (12) passing through the bump (10); the super junction field effect transistor (2) is provided with a reserved hole (13) corresponding to the mounting hole (12); the heat sink (3) is provided with a connection hole corresponding to the reserved hole (13); the mounting substrate (1), the super junction field effect transistor (2) and the heat sink (3) are connected by bolts (14) passing through the mounting hole (12), the reserved hole (13) and the connection hole.

6. The superjunction field effect transistor with improved heat dissipation according to claim 1, characterized in that: Ear blocks (15) are fixedly connected to both sides of the mounting base plate (1).

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