Chip high-temperature rapid cooling and heat dissipation platform mechanism

Abstract

The utility model relates to a chip high-temperature rapid cooling and heat dissipation platform mechanism, which is characterized in that a plurality of chip grooves for accommodating chips are arranged at the upper end of a product positioning support plate; a vacuum gas guide groove and a guide hole are formed in the upper end of the gas guide groove plate, and a plurality of gas flow holes are formed in the gas flow guide plate; the airflow holes, the guide holes and the chip slots are in one-to-one correspondence; a vacuum breaking hole is formed in the bottom end of the chip groove of the product positioning carrier plate, the vacuum breaking hole is used for accommodating a floating plug, and the floating plug can block the vacuum breaking hole; the vacuum air guide groove is communicated with the vacuum breaking hole and is used as a vacuumizing channel; the inner side of an airflow hole of the airflow guide plate is matched with the floating plug and is longitudinally communicated with the guide hole; the guide hole is transversely communicated with the vacuum air guide groove; a plurality of guide holes are formed in the vacuum air guide groove, and the guide holes are communicated with the upper ends of the airflow holes; the bottom end of the airflow hole is communicated with the vacuum breaking blowing nozzle; and the lower part of the floating plug can block the airflow hole. The device can meet the requirement of high-speed production.

Description

Technical Field

[0001] The utility model relates to automobile electronic chip production technology, in particular to a high-temperature rapid cooling and heat dissipation platform mechanism for chips. Background Art

[0002] To ensure electrical performance and reliability during the manufacturing process, automotive electronic chip products require repeated testing and verification at room temperature, high temperature, and again at room temperature (25°C). This process is designed to examine the impact of high-temperature environments on chip performance and stability. Under high-temperature conditions, the electronic components within the chip may suffer from thermal expansion, leakage, aging, and other problems, which can lead to chip performance degradation, unstable operation, or even failure. Therefore, high-temperature testing is a key step in evaluating chip performance. After high-temperature testing, the chip is usually quickly restored to room temperature (25°C) for QA (quality assurance) electrical testing. This test is designed to verify the chip's performance stability under temperature changes, thereby improving the chip's reliability and service life. After high-temperature testing, the chip product needs to be quickly cooled for subsequent processing. Existing heat dissipation devices generally have problems such as difficult gripping and cumbersome structural operation, which cannot meet the needs of efficient production. Utility Model Content

[0003] The purpose of the utility model is to provide a high-temperature rapid cooling heat dissipation platform mechanism for chips, which is used to solve the problem of low production efficiency of the above-mentioned existing heat dissipation devices.

[0004] The utility model discloses a high-temperature rapid cooling and heat dissipation platform mechanism for chips, which includes: a product positioning carrier plate, an air guide groove plate and an airflow guide plate; wherein, a plurality of chip grooves for accommodating chips are provided at the upper end of the product positioning carrier plate; a vacuum air guide groove and a guide hole are provided at the upper end of the air guide groove plate, and a plurality of air flow holes are provided at the air flow guide plate; the air flow holes, the guide holes and the chip grooves correspond to each other one by one; the bottom end of the chip groove of the product positioning carrier plate is provided with a vacuum-breaking hole, which is used to accommodate a floating plug, and the floating plug can block the vacuum-breaking hole; the vacuum air guide groove is connected to the vacuum-breaking hole and is used as a vacuum extraction channel; the inner side of the air flow hole of the airflow guide plate is matched with the floating plug and is longitudinally connected to the guide hole; the guide hole is horizontally connected to the vacuum air guide groove; a plurality of guide holes are provided on the vacuum air guide groove, and the guide hole is connected to the upper end of the air flow hole; the bottom end of the air flow hole is connected to the vacuum-breaking blowing nozzle; the lower part of the floating plug can block the air flow hole.

[0005] According to an embodiment of the chip high-temperature rapid cooling heat dissipation platform mechanism of the present invention, the vacuum breaking hole is tapered from top to bottom.

[0006] According to an embodiment of the chip high-temperature rapid cooling heat dissipation platform mechanism of the present invention, the upper portion of the air flow hole is funnel-shaped and the lower portion is cone-shaped, and the floating plug can seal the bottom end of the upper portion of the vacuum hole.

[0007] According to an embodiment of the chip high-temperature rapid cooling heat dissipation platform mechanism of the present invention, the floating plug is a floating steel ball.

[0008] According to an embodiment of the chip high-temperature rapid cooling heat dissipation platform mechanism of the present invention, the vacuum blowing nozzle matches the conical lower portion of the air flow hole.

[0009] According to one embodiment of the chip high-temperature rapid cooling and heat dissipation platform mechanism of the present invention, the product positioning carrier, the air guide groove plate and the airflow guide plate are in strip shape and are installed in matching relationship with each other, and a plurality of chip grooves are arranged in an array on the product positioning carrier.

[0010] According to an embodiment of the chip high-temperature rapid cooling heat dissipation platform mechanism of the present invention, the vacuum air guide groove includes a plurality of longitudinal grooves opened along the air guide groove plate, and a plurality of transverse grooves vertically connected to the longitudinal grooves, and a plurality of guide holes are arranged on the plurality of longitudinal grooves.

[0011] According to one embodiment of the chip high-temperature rapid cooling and heat dissipation platform mechanism of the present invention, the chip is accommodated in the chip slot, and the bottom of the chip slot is sealed, the floating steel ball seals the air flow hole, and the vacuum equipment performs vacuuming through the vacuum air guide groove, so that the chip is adsorbed in the chip slot.

[0012] According to one embodiment of the chip high-temperature rapid cooling and heat dissipation platform mechanism of the present invention, a vacuum blow nozzle blows air to blow up the floating steel ball, sealing the upper end of the vacuum breaking hole to disconnect the vacuum state between the chip and the vacuum air guide groove, so that the chip no longer continues to be adsorbed in the chip groove.

[0013] According to one embodiment of the chip high-temperature rapid cooling and heat dissipation platform mechanism of the present invention, an air intake groove is opened in the middle of the air flow guide plate, and the air intake groove is connected to multiple horizontal short grooves of the vacuum air guide groove. The air intake quick head of the vacuum equipment is connected to the central air intake groove of the air flow guide plate to provide negative pressure vacuum to the vacuum air guide groove.

[0014] The chip high-temperature rapid cooling and heat dissipation platform of the utility model has an ingenious structural design, can quickly break the vacuum, and meets the needs of high-speed production. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is an exploded view of the high-temperature rapid cooling and heat dissipation platform mechanism of the utility model;

[0016] Figure 2The figure shows a cross-sectional view of the high-temperature rapid cooling heat dissipation platform mechanism of the present invention;

[0017] Figure 3 The figure shows the vacuum material suction state diagram of the high-temperature rapid cooling and heat dissipation platform mechanism of the utility model chip;

[0018] Figure 4 The figure shows the schematic diagram of the vacuum breaking material taking state using the new chip high temperature rapid cooling and heat dissipation platform mechanism. DETAILED DESCRIPTION

[0019] In order to make the purpose, content, and advantages of the present invention more clear, the specific implementation methods of the present invention are further described in detail below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is an exploded diagram of the high-temperature rapid cooling and heat dissipation platform mechanism of the utility model chip, as shown Figure 1 As shown, the high-temperature rapid cooling and heat dissipation platform mechanism for chips of the present invention comprises: a product positioning carrier plate 9, an air guide plate 11, and an airflow guide plate 12. The upper end of the product positioning carrier plate 9 is arranged with multiple chip slots 2 for accommodating chips. The upper end of the air guide plate 11 is provided with vacuum air guide grooves 10 and guide holes 5. The airflow guide plate 12 is provided with multiple airflow holes 7. The positions of the airflow holes 7, guide holes 5, and chip slots 2 correspond one to one.

[0021] Figure 2 The figure shows a cross-sectional view of the high-temperature rapid cooling heat dissipation platform mechanism of the present invention. Figure 2 As shown, the bottom end 3 of the chip slot 2 of the product positioning carrier 9 has a vacuum breaking hole 92. The vacuum breaking hole 92 is used to accommodate the floating plug 6, and the floating plug 6 can block the upper end of the vacuum breaking hole 92. The vacuum air guide groove 10 is connected to the vacuum breaking hole 92 and is used as a vacuum channel. The inner side of the air flow hole 7 of the air flow guide plate 12 matches the lower part of the floating plug 6 and is longitudinally connected to the guide hole 5. The guide hole 5 is horizontally connected to the vacuum air guide groove 10. Multiple guide holes 5 are opened on the vacuum air guide groove 10, and the guide hole 5 is connected to the upper end of the air flow hole 7. The vacuum air guide groove 10 is connected to the external vacuum equipment. The bottom end of the air flow hole 7 is connected to the vacuum breaking blow nozzle. The floating plug 6 can block the air flow hole 7.

[0022] Further, such as Figure 2 As shown, in one embodiment, the vacuum breaking hole 92 is tapered from top to bottom.

[0023] Further, such as Figure 2 As shown, in one embodiment, the upper portion of the airflow hole 7 is funnel-shaped and the lower portion is conical. The floating plug 6 can block the bottom end of the upper portion of the airflow hole 7.

[0024] Further, such as Figure 2 As shown, the floating plug 6 is spherical, specifically a floating steel ball.

[0025] Further, such as Figure 2 As shown, the vacuum blowing nozzle 8 matches the tapered lower portion of the air flow hole 7. The blowing air source of the vacuum blowing nozzle is controlled by a solenoid valve.

[0026] Further, such as Figure 2 As shown, the product positioning carrier plate 9, air guide plate 11, and airflow guide plate 12 are all strip-shaped, matched and sealed together to form a vacuum channel. Multiple chip slots 2 are arranged in an array on the product positioning carrier plate 9. The airflow holes 7, vacuum-breaking holes 92, and guide holes 5 are matched one by one and interconnected.

[0027] like Figure 2 As shown, the vacuum air guide groove 10 includes a plurality of longitudinal long grooves opened along the air guide groove plate 11, and a plurality of transverse short grooves perpendicularly connected to the longitudinal grooves. A plurality of guide holes 5 are provided on the plurality of longitudinal grooves.

[0028] like Figure 1 as well as Figure 2 As shown, an air inlet slot is provided in the middle of the air flow guide plate 12, which is connected to a plurality of transverse short slots of the vacuum air guide slot 10 to provide vacuum to the vacuum air guide slot 10. An air inlet quick head 21 is connected to the middle air inlet slot of the air flow guide plate 12.

[0029] Figure 3 The figure shows the vacuum material suction state diagram of the high temperature rapid cooling and heat dissipation platform mechanism of the utility model chip. Figure 3 As shown, a negative-pressure vacuum air source is introduced from an air intake head 21. This air flows through the central air intake slot of the airflow guide plate 12 and connects to the multiple transverse short slots of the vacuum guide 10. This distributes the vacuum beneath each chip slot on the product positioning carrier 9. Chip 1 is accommodated in chip slot 2, and the vacuum attracts chip 1. At this point, floating steel balls 6 block airflow holes 7 to prevent chip 1 from shaking.

[0030] Figure 4 The figure shows the schematic diagram of the vacuum breaking state of taking materials with the new chip high temperature rapid cooling and heat dissipation platform mechanism. Figure 4 As shown, when the chip 1 needs to be removed, the vacuum nozzle 8 blows air in the vacuum blowing direction 13 to provide a positive pressure air source to offset the vacuum suction force, thereby blowing up the floating steel ball 6 and blocking the upper end of the vacuum breaking hole 92, thereby breaking the vacuum state between the chip 1 and the vacuum air guide groove 10, so that the chip 1 is no longer adsorbed in the chip groove 2, thereby facilitating the nozzle mechanism 20 to pick up the chip 1.

[0031] This new high-temperature, rapid-cooling heat dissipation platform for chips utilizes optimized structural design to reduce overall volume. It can be combined as needed to accommodate diverse space requirements. By designing more heat sinks, the product's capacity is increased, cooling time is extended, and an air shower mechanism is used for efficient cooling and heat dissipation. A vacuum airflow mechanism is designed beneath the heat sinks to maintain vacuum during movement, quickly breaking the vacuum when the product is removed.

[0032] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A high-temperature rapid cooling and heat dissipation platform mechanism for chips, characterized in that: include: Product positioning carrier plate, air guide plate and air flow guide plate; The upper end of the product positioning carrier is provided with a plurality of chip slots for accommodating chips; the upper end of the air guide plate is provided with a vacuum air guide slot and a guide hole; the air flow guide plate is provided with a plurality of air flow holes; the air flow holes, guide holes and chip slots correspond one to one; The bottom of the chip slot of the product positioning carrier is provided with a vacuum breaker hole, which is used to accommodate a floating plug, which can seal the vacuum breaker hole; the vacuum guide groove is connected to the vacuum breaker hole and is used as a vacuum channel; The inner side of the air flow hole of the air flow guide plate matches the floating plug and is longitudinally connected to the guide hole; the guide hole is horizontally connected to the vacuum air guide groove; multiple guide holes are opened on the vacuum air guide groove, and the guide holes are connected to the upper end of the air flow hole; the bottom end of the air flow hole is connected to the vacuum breaking nozzle; the lower part of the floating plug can block the air flow hole.

2. The high-temperature rapid cooling and heat dissipation platform mechanism for chips according to claim 1, characterized in that: The vacuum breaking hole is tapered from top to bottom.

3. The high-temperature rapid cooling and heat dissipation platform mechanism for chips according to claim 1, characterized in that: The upper part of the air flow hole is funnel-shaped, and the lower part is cone-shaped. The floating plug can seal the bottom end of the upper part of the vacuum hole.

4. The high-temperature rapid cooling and heat dissipation platform mechanism for chips according to claim 1, characterized in that: The floating plug is a floating steel ball.

5. The high-temperature rapid cooling and heat dissipation platform mechanism for chips according to claim 1, characterized in that: The vacuum mouthpiece matches the tapered lower portion of the airflow hole.

6. The high-temperature rapid cooling and heat dissipation platform mechanism for chips according to claim 1, characterized in that: The product positioning carrier plate, the air guide groove plate and the airflow guide plate are in strip shape, matched with each other, and sealed and installed. A plurality of chip slots are arranged in an array on the product positioning carrier plate.

7. The high-temperature rapid cooling and heat dissipation platform mechanism for chips according to claim 1, characterized in that: The vacuum air guide groove comprises a plurality of longitudinal grooves opened along the air guide groove plate and a plurality of transverse grooves vertically connected to the longitudinal grooves, and a plurality of guide holes are arranged on the plurality of longitudinal grooves.

8. The high-temperature rapid cooling and heat dissipation platform mechanism for chips according to claim 4, characterized in that: The chip is placed in the chip slot, and the bottom of the chip slot is sealed. The floating steel ball seals the air flow hole. The vacuum equipment performs vacuuming through the vacuum air guide groove, so that the chip is adsorbed in the chip slot.

9. The high-temperature rapid cooling and heat dissipation platform mechanism for chips according to claim 1, characterized in that: The vacuum nozzle blows air to lift the floating steel ball and seal the upper end of the vacuum hole to disconnect the vacuum state between the chip and the vacuum gas guide groove, so that the chip is no longer adsorbed in the chip groove.

10. The high-temperature rapid cooling and heat dissipation platform mechanism for chips according to claim 1, characterized in that: An air inlet groove is opened in the middle of the air flow guide plate, which is connected to multiple horizontal short grooves of the vacuum air guide groove. The air inlet quick head of the vacuum equipment is connected to the middle air inlet groove of the air flow guide plate to provide negative pressure vacuum to the vacuum air guide groove.

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