Electrode holder and laser pumping source

Abstract

The utility model provides an electrode holder and a laser pumping source, the electrode holder comprises an electrode holder body and electrode pins, the electrode pins are arranged in the electrode holder body in a penetrating manner, the electrode holder body adopts an insulating ceramic structure, and the electrode pins adopt a red copper structure of which the outer layer is plated with nickel, so that the insulativity between the two electrode pins is stronger; the electric leakage risk is avoided, and meanwhile the electric conductivity and the welding quality of the electrode holder are improved; the welding part is formed at the first end of the electrode pin, and the groove is formed at the second end of the electrode pin, so that connection between the pin and the chip is facilitated, and a welding pool can be formed while the groove supports a wire; soldering tin in a molten state is prevented from falling out in the welding process, the welding speed can be increased, the welding quality can be improved, and meanwhile the welding time and the welding cost of the electrode holder are reduced. The electrode holder is applied to the pumping source of the laser, so that the stability of electrical connection is improved, and the output quality of pumping laser is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of electrode bases, and in particular to an electrode base and a laser pump source. Background Art

[0002] A continuous fiber laser utilizes the unique structure of optical fiber to create an all-fiber link consisting of a pump source, a pump combiner, rare-earth-doped fiber, a grating, and an output cable. The pump light is generated by coupling the beam from one or more high-power laser chips into a single optical fiber.

[0003] In the prior art, the pump source electrode holder is constructed of aluminum, with the two electrode pins separated from the electrode holder's mounting holes by a glass insulating sleeve. However, this design suffers from low conductivity, difficulty in welding, weak insulation, and high manufacturing costs, making it difficult to meet the production and application requirements of laser pump sources. Utility Model Content

[0004] In response to the above problems, the present application discloses an electrode holder and a laser pump source to achieve the technical effects of improving the welding quality of the electrode holder, improving conductivity, reducing manufacturing costs, achieving higher integration, and improving the connection stability of the pump source circuit.

[0005] According to the first aspect of the present application, an electrode seat is provided, which includes an electrode seat body and an electrode pin, wherein the electrode pin is inserted into the electrode seat body, the electrode seat body adopts an insulating ceramic structure, and the electrode pin adopts a copper structure with a nickel-plated outer layer; wherein a welding portion is formed at the first end of the electrode pin, and a groove is formed at the second end of the electrode pin, and the groove is used to support the wire and form a welding molten pool.

[0006] Furthermore, the welding portion includes a semi-cylindrical planar welding portion, and the groove includes a semi-arc groove.

[0007] Furthermore, a gap is reserved between the wire welded in the groove and the end surface of the second end of the electrode pin, and is used to fill with solder.

[0008] Furthermore, the electrode holder body is provided with a pin connection portion, and the electrode pin is inserted into the pin connection portion.

[0009] Furthermore, a recessed groove is provided on one side of the pin connection portion, a pin mounting hole is provided in the recessed groove, and the electrode pin is inserted into the pin mounting hole.

[0010] Furthermore, the edges of the electrode holder body and the outer edges of the pin mounting holes are both provided with chamfers.

[0011] Furthermore, a metallized welding layer is provided on the chamfered surface of the pin mounting hole.

[0012] Furthermore, a raised welding structure is formed in the middle of the electrode pin, and the welding surface of the welding structure can be combined and sealed with the metallized welding layer.

[0013] Furthermore, a countersunk hole is provided at the lower end of the electrode holder body.

[0014] According to the second aspect of the present application, a laser pump source is provided, comprising: a light-emitting unit, and an electrode holder as described in any one of the first aspects above, wherein the electrode holder is fixed to both ends of a heat dissipation copper block of a pump source base so that the first end of the electrode pin faces the light-emitting unit and the second end of the electrode pin faces away from the light-emitting unit.

[0015] The advantages and beneficial effects of the present application are as follows: an electrode holder and a laser pump source are provided, wherein the electrode holder includes an electrode holder body and an electrode pin. By inserting the electrode pin into the electrode holder body, and the electrode holder body adopts an insulating ceramic structure, and the electrode pin adopts a copper structure with an outer layer of nickel plating, the insulation between the two electrode pins is made stronger, thereby avoiding the risk of leakage, and at the same time improving the conductivity and welding quality of the pump source electrode holder; by forming a welding portion at the first end of the electrode pin and forming a groove at the second end of the electrode pin, an electrical connection between the pin and the chip is achieved, and the groove can form a welding molten pool while supporting the wire; it not only avoids the fall of molten solder during welding, but also improves the welding speed and welding quality, while reducing the welding time and welding cost of the electrode holder. In addition, by applying the electrode holder to the laser pump source, the stability of the electrical connection of the pump source is improved, thereby ensuring the output quality of the pump laser and reducing the cost of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0017] Figure 1 This is one of the structural diagrams of the electrode base in Example 1 of the present application;

[0018] Figure 2 This is the second structural diagram of the electrode base in the first embodiment of the present application;

[0019] Figure 3 This is a schematic structural diagram of the electrode base in Example 2 of the present application;

[0020] Figure 4 This is one of the structural diagrams of the electrode base body in the second embodiment of the present application;

[0021] Figure 5 This is the second structural diagram of the electrode holder body in the second embodiment of the present application;

[0022] Figure 6 This is a schematic diagram of the structure of the electrode pins in the second embodiment of the present application;

[0023] In the figure: 1. Electrode holder; 2. Wire; 11. Electrode holder body; 12. Electrode pin; 13. Welding structure; 111. Pin connection portion; 112. Countersunk groove; 113. Pin mounting hole; 114. Metallized welding layer; 115. Countersunk hole; 121. First end of electrode pin; 122. Second end of electrode pin; 123. Groove; 131. Welding surface; S represents the reserved gap between the welding end face of the wire and the end face of the second end of the electrode pin. DETAILED DESCRIPTION

[0024] To make the purpose, technical solutions, and advantages of the present invention more clear, the following will provide a clear and complete description of the technical solutions of the present invention in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0025] The following describes in detail the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0026] Example 1

[0027] This embodiment provides an electrode holder, referring to Figure 1 and Figure 2 As shown, a structural schematic diagram of the electrode holder of this embodiment is provided; the electrode holder 1 includes an electrode holder body 11 and an electrode pin 12, the electrode pin 12 is inserted into the electrode holder body 11, the electrode holder body 11 adopts an insulating ceramic structure, and the electrode pin 12 adopts a copper structure with an outer layer of nickel plating; wherein, the first end 121 of the electrode pin is formed with a welding portion, and the second end 122 of the electrode pin is formed with a groove 123, and the groove 123 is used to support the wire 2 and form a welding pool.

[0028] Specifically, in this embodiment, the electrode holder body 11 is improved from traditional aluminum material to a sintered insulating ceramic structure, and the two pin mounting holes 113 on the electrode holder body 11 are metallized, so that the two electrode pins 12 can be fixed to the electrode holder body 11 by brazing. Since the brazing temperature is much higher than that of soldering, the subsequent connection of the wire 2 and the electrode pin 12 by the soldering process will not affect the fixation of the electrode pin 12 on the electrode holder body 11; preferably, the electrode pin 12 adopts a copper structure with nickel plating on the surface. Since the copper structure has a higher conductivity, it not only improves the conductivity of the electrode pin, but also has good weldability.

[0029] It can be seen that, different from the existing electrode seat design of the aluminum electrode seat body and the glass insulating ring, the technical solution of the electrode seat of this embodiment is to insert the electrode pin into the electrode seat body, and the electrode seat body adopts an insulating ceramic structure, and the electrode pin adopts a copper structure with a nickel-plated outer layer, so that the insulation between the two electrode pins is stronger, avoiding the risk of leakage, and at the same time improving the conductivity and welding quality of the pump source electrode seat; by forming a welding portion at the first end of the electrode pin and forming a groove at the second end of the electrode pin, it is more convenient to connect the pin to the chip, so that the groove can form a welding pool while supporting the wire; it not only avoids the solder in a molten state from falling out during welding, but also can improve the welding speed and welding quality, and at the same time reduces the welding time and welding cost of the electrode seat.

[0030] In some embodiments, the electrode holder body 11 is provided with a pin connection portion 111, and the electrode pin 12 is inserted into the pin connection portion 111; the two electrode pins 12 are respectively inserted into the two pin mounting holes 113 of the pin connection portion 111. Since the two electrode pins 12 are separated by an insulating ceramic structure instead of a thin glass insulating ring, their insulation performance depends on the distance between the two electrode pins 12. The size of the distance can be adjusted according to actual conditions and determined according to the withstand voltage level, thereby greatly improving the insulation strength, avoiding the risk of leakage, and eliminating the need for leakage testing.

[0031] In some embodiments, see Figure 1 As shown, the welding portion includes a semi-cylindrical planar welding portion, and the groove 123 includes a semi-arc groove.

[0032] Specifically, the first end 121 of the electrode pin is formed with a semi-cylindrical planar welding portion with its plane facing upward, which facilitates the electrical connection between the pin and the chip. The semi-cylindrical planar welding portion is connected to the light-emitting unit of the laser pump source through an aluminum wire, and the current passing through the electrode pin 12 is not less than 100A. In other words, unlike the structurally limited electrode pins in the prior art, the size of the electrode pin 12 in the embodiment of the present application is no longer restricted, and therefore the current it can carry is no longer restricted; for example, the length of the semi-cylindrical planar welding portion of this embodiment is not less than 4mm, and its radius is not less than 4mm; for another example, the diameter of the wire welded to the groove 123 is 5.5mm, and its cross-sectional area is 23.74mm 2 , which is 4.3 times the cross-sectional area of ​​the existing electrode pin. The inner diameter of the groove is preferably 6 mm, the outer diameter is preferably 8 mm, and the length is preferably 8.5 mm. Therefore, the maximum current value theoretically passing through the electrode pin 12 in this embodiment is not less than 100 A, which further improves the conductivity while ensuring the welding quality.

[0033] The front end of the second end 122 of the electrode pin extends outward to form a groove 123, which is preferably a semi-arc groove. The groove 123 is used to support the wire 2 and form a welding pool, which can prevent the molten solder from falling during the welding process, thereby further improving the welding speed and welding quality, and reducing the overall processing cost of the electrode holder.

[0034] In some embodiments, see Figure 2 As shown, a gap is reserved between the wire 2 soldered in the groove 123 and the end surface of the second end 122 of the electrode pin for filling with solder. Furthermore, to ensure conductivity and welding quality, the optimal size of gap S should be determined through process testing. Preferably, gap S between the welded end surface of the wire 2 and the second end 122 of the electrode pin is 1.5 mm.

[0035] In some preferred embodiments, a recessed groove 112 is provided on one side of the pin connection portion close to the light-emitting unit, and a pin mounting hole 113 is provided in the recessed groove 112; in addition, a countersunk hole 115 is also provided on the electrode holder body 11, so that the electrode holder 1 can be fixedly installed on both ends of the heat dissipation copper block of the pump source base through the countersunk hole 115 provided below the electrode holder body 11.

[0036] It should be noted that the present application does not impose any restrictions on the polarity of the two electrode pins on the electrode holder. For example, when only one pump source electrode holder is used, the polarity of the two electrode pins can be set to different, that is, they are set to the positive pin and the negative pin respectively, and the pump source electrode holder is fixed on one side of the heat dissipation copper block of the pump source base; for another example, when more than two electrode holders are used, the polarity of the two electrode pins can be set to the same, that is, both are positive pins or both are negative pins, and multiple pump source electrode holders are respectively fixed on both ends of the heat dissipation copper block of the pump source base.

[0037] Optionally, when the temperature of the pump source is relatively low, the electrode holder body can adopt a plastic structure, so that the electrode pins can be directly encapsulated on the electrode holder body by a plastic molding method without the need to open metallized pin mounting holes, thereby eliminating the process of welding the electrode pins to the electrode holder body and saving manufacturing time.

[0038] Of course, the above descriptions of the material, quantity, size, polarity and connection relationship of each structure in the electrode holder 1 are merely exemplary descriptions and cannot be understood as limitations on the present application.

[0039] Example 2

[0040] In the second embodiment, the components that are the same as or corresponding to those in the first embodiment are marked with the same reference numerals as those in the first embodiment. For the sake of simplicity, only the differences between the second embodiment and the first embodiment are described. Figures 3 to 6 As shown, the difference between this embodiment and the first embodiment is that the electrode holder in this embodiment has added edge chamfering, welding structure and other designs, and the size of the sink groove and the countersunk hole is improved.

[0041] Specifically, if Figure 3 As shown, a structural schematic diagram of the electrode holder of this embodiment is provided; the electrode holder 1 includes an electrode holder body 11 and an electrode pin 12, the electrode holder body 11 adopts an insulating ceramic structure, the electrode pin 12 includes a welding structure 13, the electrode holder body 11 is provided with a pin connecting portion 111, the electrode pin 12 is inserted into the pin connecting portion 111, and the second end 122 of the electrode pin extends outward to form a groove 123, the groove 123 is used to support the wire 2 and form a welding molten pool.

[0042] like Figure 4 and Figure 5As shown, a schematic diagram of the structure of the electrode base body of this embodiment is provided; a recessed groove 112 is provided on one side of the pin connection portion 111 close to the light emitting unit, and a pin mounting hole 113 is provided in the recessed groove 112, and the electrode pin 12 is inserted into the pin mounting hole 113. Specifically, in order to facilitate dry pressing of the insulating ceramic structure, the depth of the recessed groove 112 is set to 1.5mm-3.5mm, preferably 1.5mm, and the distance from the edge of the recessed groove 112 to the side wall is 0.7mm-1mm, preferably 0.7mm. Figure 6 As shown, the sinking depth of the countersunk hole 115 is set to 2.5 mm-5.5 mm, preferably 2.5 mm.

[0043] In some embodiments, continue with reference to Figure 4 and Figure 5 As shown, each edge of the electrode holder body 11 and the outer edge of the pin mounting hole 113 are provided with chamfers. Such a design can prevent the product from breaking during processing and improve the strength and aesthetics of the parts. Figure 5 As shown, the lower end of the electrode holder body 11 is provided with a countersunk hole 115, and the outer edge of the countersunk hole 115 is also chamfered; that is, rounded corners are provided around the openings of the pin mounting hole 113 and the countersunk hole 115 to improve the quality and strength of the product. Preferably, the chamfer includes a rounded corner provided around the hole, such as a rounded corner of R0.2mm-R0.3mm, and can also include a chamfer provided on each edge, such as a 45° chamfer of C0.2mm-C0.3mm, without limitation here.

[0044] In some preferred embodiments, the chamfered surface of the pin mounting hole 113 is also provided with a metallized welding layer 114 so as to be welded with the welding surface 131 on the electrode pin 12. The height of the metallized welding layer 114 is preferably 0.5 mm, and the single-side gap between the electrode pin 12 and the pin mounting hole 113 is preferably 0.1 mm.

[0045] In some embodiments, as Figure 6 As shown, a schematic diagram of the structure of the electrode pin of this embodiment is provided; a radially protruding welding structure 13 is formed in the middle of the electrode pin 12, and the welding surface 131 of the welding structure 13 can be combined and sealed with the metallized welding layer 114 on the pin mounting hole 113; for example, the surface of the metallized welding layer 114 is printed with molybdenum-manganese slurry and metallized, and the sealing is treated with silver-copper, so that the welding airtightness can reach 1x10 -10 Pa*m 3 / s, thereby further improving the welding quality.

[0046] In addition, in other embodiments of the present application, a laser pump source is provided, which adopts the electrode holder in the first or second embodiment.

[0047] The laser pump source of this embodiment includes a light-emitting unit and the electrode base 1 in the aforementioned embodiment; the electrode base 1 is fixed to both ends of the heat dissipation copper block of the pump source base so that the first end 121 of the electrode pin faces the light-emitting unit and the second end 122 of the electrode pin faces away from the light-emitting unit.

[0048] Specifically, the light-emitting unit is arranged above the heat-dissipating copper block of the pump source base, and the electrode holder 1 is fixed to both ends of the heat-dissipating copper block of the pump source base. The light-emitting unit is electrically connected to the laser driver board through the electrode holder 1, so that the laser beam emitted by the light-emitting unit is coupled to an optical fiber output after spatial optical path shaping;

[0049] The first end 121 of the electrode pin faces the light-emitting unit and is electrically connected to the light-emitting unit. The first end 121 of the electrode pin is formed with a semi-cylindrical flat welding portion with its flat surface facing upward. The second end 122 of the electrode pin faces away from the light-emitting unit and is connected to an external wire. The second end 122 of the electrode pin extends outward to form a groove 123, which is used to support the wire 2 and form a welding pool. Preferably, the electrode holder 1 can be fixedly mounted on both ends of the heat dissipation copper block of the pump source base through the countersunk holes 115 provided below its electrode holder body 11. Preferably, multiple electrode holders 1 can be electrically connected to each other via wires 2, and aluminum wire is used to electrically connect the light-emitting unit and the electrode holder 1. In addition, the heat dissipation copper block of the pump source base can serve as a heat sink for the pump source and is preferably made of copper material so that a pump source cooling flow channel can be provided within the heat dissipation copper block of the pump source base to achieve heat dissipation of the pump source.

[0050] Thus, the laser pump source of this embodiment achieves electrical connection between multiple laser chip arrays in the light-emitting unit and their corresponding electrode holders, enabling the multiple laser chip arrays connected in series to emit light simultaneously after power is applied. This allows the emitted light to be spatially shaped and then coupled to a single optical fiber for output, resulting in a more stable, high-quality pump laser output. Of course, the above information regarding the number, layout, and connection relationship of the electrode holders and light-emitting units is merely an exemplary embodiment and should not be construed as limiting this application.

[0051] It is understandable that, since the pump source uses the electrode holder in the aforementioned embodiment, it includes all the technical solutions of the above-mentioned embodiment 1 or embodiment 2, which will not be described in detail here.

[0052] In summary, this embodiment proposes an electrode holder and a laser pump source. The electrode holder includes an electrode holder body and an electrode pin. By inserting the electrode pin into the electrode holder body, and the electrode holder body adopts an insulating ceramic structure, and the electrode pin adopts a copper structure with an outer layer of nickel plating, the insulation between the two electrode pins is made stronger, avoiding the risk of leakage, and at the same time improving the conductivity and welding quality of the pump source electrode holder; by forming a welding portion at the first end of the electrode pin and forming a groove at the second end of the electrode pin, it is more convenient to connect the pin to the chip, so that the groove can form a welding pool while supporting the wire; it not only avoids the solder in a molten state from falling out during the welding process, but also can improve the welding speed and welding quality, while reducing the welding time and welding cost of the electrode holder. At the same time, by applying the above-mentioned electrode holder to the laser pump source, while improving the reliability of the electrical connection, the stability of the pump laser output power is improved, and the manufacturing cost is reduced.

[0053] It should be noted that, in the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0054] It should be noted that, in the description of the present invention, unless otherwise specified, “plurality” means two or more.

[0055] In this utility model, unless otherwise specified or limited, terms such as "connection" and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0056] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, product or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, product or apparatus.

[0057] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature. Throughout this specification, references to terms such as "one embodiment," "some embodiments," or "examples" indicate that the specific features, structures, materials, or characteristics described in connection with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in any one or more embodiments or examples.

[0058] The above description is only a specific embodiment of the present invention. Based on the above teachings of the present invention, those skilled in the art may make other improvements or modifications based on the above embodiments. Those skilled in the art should understand that the above description is only a better explanation of the purpose of the present invention, and the scope of protection of the present invention shall be based on the scope of protection of the claims.

Claims

1. An electrode holder, characterized in that: The electrode base (1) comprises an electrode base body (11) and an electrode pin (12). The electrode pin (12) is inserted into the electrode base body (11); the electrode base body (11) adopts an insulating ceramic structure; and the electrode pin (12) adopts a copper structure with an outer layer of nickel plating; The first end (121) of the electrode pin is formed with a welding portion, and the second end (122) of the electrode pin is formed with a groove (123), and the groove (123) is used to support the wire (2) and form a welding pool.

2. The electrode holder according to claim 1, wherein: The welding portion comprises a semi-cylindrical plane welding portion, and the groove (123) comprises a semi-arc groove.

3. The electrode holder according to claim 1, wherein: A gap is reserved between the wire (2) welded in the groove (123) and the end surface of the second end (122) of the electrode pin, and is used to fill with solder.

4. The electrode holder according to claim 1, wherein: The electrode seat body (11) is provided with a pin connection portion (111), and the electrode pin (12) is inserted into the pin connection portion (111).

5. The electrode holder according to claim 4, characterized in that: A recessed groove (112) is provided on one side of the pin connection portion (111), a pin mounting hole (113) is provided in the recessed groove (112), and the electrode pin (12) is inserted into the pin mounting hole (113).

6. The electrode holder according to claim 5, characterized in that: The edges of the electrode seat body (11) and the outer edges of the pin mounting holes (113) are both provided with chamfers.

7. The electrode holder according to claim 6, characterized in that: The chamfered surface of the pin mounting hole (113) is further provided with a metallized welding layer (114).

8. The electrode holder according to claim 7, characterized in that: A raised welding structure (13) is formed in the middle of the electrode pin (12), and a welding surface (131) of the welding structure (13) can be combined and sealed with the metallized welding layer (114).

9. The electrode holder according to claim 1, wherein: A countersunk hole (115) is provided at the lower end of the electrode seat body (11).

10. A laser pump source, characterized in that: include: The electrode holder (1) and the light-emitting unit according to any one of claims 1 to 9, The electrode base (1) is fixed to both ends of the heat dissipation copper block of the pump source base, so that the first end (121) of the electrode pin faces the light-emitting unit, and the second end (122) of the electrode pin faces away from the light-emitting unit.

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