Composite busbar and IGBT module

Abstract

The utility model discloses a composite busbar and an IGBT module, the composite busbar comprises a plurality of conductive layers, a slot and an insulation structure, the plurality of conductive layers are respectively used for connecting different interfaces of an IGBT device, the plurality of conductive layers are parallel to each other and are insulated and spaced, the slot passes through the plurality of conductive layers, the insulation structure comprises an isolation plate, and the isolation plate is arranged in the slot. The isolation plate comprises an insertion part and an isolation part which are connected with each other, the insertion part is arranged in the slot in a penetrating manner, the isolation part comprises a plurality of vertical ribs and a connecting part, the plurality of vertical ribs are arranged between adjacent interfaces of the IGBT device at intervals, and the plurality of vertical ribs are sequentially connected through the connecting part. According to the embodiment, the creepage distance and the electrical gap distance of the composite busbar can be increased.

Description

Technical Field

[0001] The present application relates to the technical field of composite busbars, and in particular to a composite busbar and an IGBT module. Background Art

[0002] The composite busbar is a critical component of the power system, responsible for transmitting electrical energy, supporting operation, and establishing grid connections. Furthermore, the composite busbar must ensure the normal operation and stable power supply of the power system. In related technologies, the insulated-gate bipolar transistor (IGBT) modules used in three-level converters are small in size and have complex structures between the positive and negative electrodes. Conventional insulation structures increase the creepage of the composite busbar and may directly connect to the positive and negative interfaces of the IGBT module, causing a short circuit and instability. Utility Model Content

[0003] The embodiments of the present application provide a composite busbar and an IGBT module, which can help increase the creepage and electrical clearance distances of the composite busbar.

[0004] In the first aspect, an embodiment of the present application provides a composite busbar, which includes: multiple conductive layers, slots and an insulating structure, the multiple conductive layers are respectively used to connect different interfaces of the IGBT device, the multiple conductive layers are parallel to each other and insulated, the slots pass through the multiple conductive layers, the insulating structure includes an isolation plate, the isolation plate includes an interconnected plug-in portion and an isolation portion, the plug-in portion is passed through the slot, the isolation portion includes a plurality of vertical ribs and a connecting portion, the plurality of vertical ribs are arranged at intervals between adjacent interfaces of the IGBT device, and the connecting portion connects the plurality of vertical ribs in sequence.

[0005] The embodiment of the present application sets a slot passing through multiple conductive layers, and the insulation structure includes an isolation plate inserted in the slot, the isolation plate includes a plug-in part passing through the slot, and the isolation part includes a plurality of vertical ribs. The plurality of vertical ribs are arranged at intervals between adjacent interfaces of the IGBT device, which is beneficial to avoid the occurrence of direct bridging connection due to high voltage. The provision of multiple vertical ribs can help increase the creepage and electrical clearance distance of the composite busbar, and also increase the creepage clearance between different interfaces of the IGBT device, which can meet the safety requirements of the overall structure of the IGBT module, is easy to install, and improves the stability and safety of long-term use.

[0006] According to the aforementioned embodiment of the first aspect of the present application, there is a notch between two adjacent vertical ribs.

[0007] According to the aforementioned embodiment of the first aspect of the present application, multiple conductive layers are hot-pressed together. In the above embodiment, by hot-pressing multiple conductive layers together, the composite busbar structure is made more compact, facilitating the overall modularization of the composite busbar, which is beneficial for subsequent installation with IGBT devices.

[0008] According to the aforementioned embodiments of the first aspect of the present application, the plug-in portion is sealed with an insulating adhesive between the inner wall of the slot. In this embodiment, by providing an insulating adhesive seal between the isolation plate and the inner wall of the slot, the adhesive layer at the interface between the positive, negative, and neutral layers is effectively isolated, thereby preventing direct electrical creepage through the adhesive layer, reducing the impact of external knocks and impacts on the stability of the composite busbar, and improving the stability and safety of long-term use.

[0009] According to the aforementioned embodiment of the first aspect of the present application, the multiple conductive layers include a positive electrode layer, a negative electrode layer and a neutral electrode layer, and the positive electrode layer, the neutral electrode layer and the negative electrode layer are parallel and insulated in sequence. The insulating structure also includes: an insulating film and an insulating block. The insulating film is arranged outside the insulating block, and an insulating film and an insulating block are respectively arranged between the positive electrode layer and the neutral electrode layer, and between the neutral electrode layer and the negative electrode layer, and the slot is also arranged through the insulating film and the insulating block. In the above embodiment, by arranging the slot through the insulating film and the insulating block, it is helpful to avoid the situation of direct creepage from the glue layer, thereby improving the stability and safety of long-term use.

[0010] According to the aforementioned embodiments of the first aspect of the present application, the insulating film is thermoformed and bonded between the positive electrode layer and the neutral electrode layer, and between the negative electrode layer and the neutral electrode layer, respectively. In the above embodiments, by bonding the thermoformed insulating film between the positive electrode layer and the neutral electrode layer, and between the negative electrode layer and the neutral electrode layer, it is beneficial for the insulating film to be tightly adhered to the positive electrode layer, the neutral electrode layer, and the negative electrode layer, eliminating air gaps, improving the insulation effect, preventing the risk of short circuits between the positive electrode layer, the neutral electrode layer, and the negative electrode layer, and thus improving safety.

[0011] In a second aspect, an embodiment of the present application further provides an IGBT module, the IGBT module comprising: an IGBT device and a composite busbar according to any of the aforementioned embodiments of the first aspect of the present application. The IGBT device comprises a positive electrode interface, a neutral electrode interface, and a negative electrode interface. The composite busbar is disposed on top of the IGBT device and is connected to the IGBT device. The multiple conductive layers comprise a positive electrode layer, a neutral electrode layer, and a negative electrode layer. The positive electrode layer is connected to the positive electrode interface, the neutral electrode layer is connected to the neutral electrode interface, and the negative electrode layer is connected to the negative electrode interface. An isolation plate separates adjacent interfaces of the IGBT device, and there is an installation gap between the isolation plate and the IGBT device.

[0012] The embodiment of the present application sets a composite busbar in the IGBT module, wherein slots are set in the composite busbar and pass through multiple conductive layers. The insulating structure includes an isolation plate inserted in the slot, the isolation plate includes a plug-in portion passing through the slot, and the isolation portion includes multiple vertical ribs. The multiple vertical ribs are spaced between adjacent interfaces of the IGBT device. The isolation plate isolates the positive interface, neutral interface, and negative interface of the IGBT device from each other, which helps to avoid the occurrence of direct bridging connection due to high voltage. The provision of multiple vertical ribs can help increase the creepage and electrical clearance distance of the composite busbar, and also increase the creepage clearance between different interfaces of the IGBT device, which can meet the safety requirements of the overall structure of the IGBT module and improve the stability and safety of long-term use. The structural design of the composite busbar allows it to be easily integrated with the IGBT module, simplifying the assembly process.

[0013] According to the aforementioned embodiment of the second aspect of the present application, the composite busbar includes a connecting blind hole, and the IGBT device is connected to the composite busbar via a fastener, and the fastener can be matched and connected with the connecting blind hole.

[0014] According to the aforementioned embodiment of the second aspect of the present application, a gap is provided between adjacent interfaces of the IGBT device, and the isolation plate is disposed opposite the gap. In this embodiment, disposing the isolation plate opposite the gap facilitates increasing the creepage clearance between different interfaces of the IGBT device, thereby meeting the safety regulations for the overall structure of the IGBT module and improving long-term stability and safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural diagram of an embodiment of an IGBT module of the present application;

[0016] Figure 2 This is a side cross-sectional schematic diagram of an embodiment of an IGBT module of the present application;

[0017] Figure 3 This is a structural diagram of an embodiment of an isolation plate in a composite busbar of the present application;

[0018] Figure 4 This is a structural schematic diagram of another embodiment of the isolation plate in the composite busbar of the present application;

[0019] Figure 5 Schematic diagram of the distance between the isolation plate and the IGBT device in an embodiment of the IGBT module of the present application.

[0020] Description of Figure Numbers:

[0021] Composite busbar - 100, IGBT module - 200;

[0022] Positive electrode layer 110 , negative electrode layer 120 , neutral electrode layer 130 , slot 140 , separator 150 , insulating film 160 , insulating block 170 , first connection blind via 180 , IGBT device 210 ;

[0023] Inserting portion 151, isolating portion 152, positive electrode interface 211, neutral electrode interface 212, second connecting blind hole 213;

[0024] Vertical ribs-1521, connecting parts-1522, notches-1523;

[0025] Installation gap-S1, gap-S2, first distance-S3, second distance-S4. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0027] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0029] The embodiments of the present application provide a composite busbar and an insulated-gate bipolar transistor (IGBT) module, which can help increase the creepage and electrical clearance distances of the composite busbar.

[0030] like Figures 1 to 2As shown, the embodiment of the present application provides a composite busbar 100, which includes: multiple conductive layers, slots 140 and an insulating structure. The multiple conductive layers are respectively used to connect different interfaces of the IGBT device. The multiple conductive layers are parallel to each other and insulated. The multiple conductive layers include a positive electrode layer 110, a negative electrode layer 120 and a neutral electrode layer 130. The slots 140 pass through the multiple conductive layers, and the insulating structure includes an isolation plate 150, as shown in FIG. Figures 3 and 4 As shown, the isolation plate 150 includes a plug-in portion 151 and an isolation portion 152 that are connected to each other. The plug-in portion 151 is inserted into the slot 140. The isolation portion 152 includes a plurality of vertical ribs 1521 and a connecting portion 1522. The plurality of vertical ribs 1521 are arranged at intervals between adjacent interfaces of the IGBT device. The connecting portion 1522 connects the plurality of vertical ribs 1521 in sequence.

[0031] In the embodiment of the present application, a slot 140 is provided to pass through multiple conductive layers. The insulating structure includes an isolation plate 150 inserted in the slot 140. The isolation portion 152 includes a plurality of vertical ribs 1521. The plurality of vertical ribs 1521 are arranged at intervals between adjacent interfaces of the IGBT device, which is beneficial to avoid the occurrence of direct bridging connection due to high voltage. The provision of multiple vertical ribs 1521 can help increase the creepage and electrical clearance distance of the composite busbar 100, and also increase the creepage clearance between different interfaces of the IGBT device, which can meet the safety requirements of the overall structure of the IGBT module, is easy to install, and improves the stability and safety of long-term use.

[0032] In the embodiment of the present application, there is no limit on the number of vertical ribs 1521. Those skilled in the art can determine the number of vertical ribs 1521 based on the distances between different interfaces of an actual IGBT device. Figure 3 As shown, in one embodiment, the isolation portion 152 includes three vertical ribs 1521. Figure 4 As shown, in another embodiment, the isolation portion 152 includes a plurality of vertical ribs 1521 .

[0033] like Figures 3 and 4 As shown, there is a notch 1523 between two adjacent vertical ribs 1521. The shape of the notch 1523 can be V-shaped, U-shaped or other shapes. Those skilled in the art can determine the shape of the notch 1523 according to actual needs. Preferably, the notch 1523 is a U-shaped groove.

[0034] It should be noted that in the embodiment of the present application, the distance between two adjacent vertical ribs 1521 is more than 2 mm. In the above embodiment, by setting the distance between two adjacent vertical ribs 1521 to be more than 2 mm, it is helpful to avoid the situation where high voltage directly bridges the connection. It is understandable that those skilled in the art can determine the distance between two adjacent vertical ribs 1521 according to actual conditions. When encountering components that need to be isolated and have a large creepage distance requirement, the distance between two adjacent vertical ribs 1521 can be increased or the length of the vertical rib 1521 can be extended to increase the creepage distance.

[0035] In an embodiment of the present application, multiple conductive layers are hot-pressed together. In the above embodiment, by hot-pressing multiple conductive layers together, the composite busbar structure is made more compact, which facilitates the overall modularization of the composite busbar, so as to facilitate the subsequent installation with IGBT devices. The plug-in portion 151 is sealed with an insulating glue to the inner wall of the slot 140. In the above embodiment, by providing an insulating glue sealing connection between the isolation plate and the inner wall of the slot, it is beneficial to isolate the glue layer between the interfaces of the positive electrode layer, the negative electrode layer and the neutral electrode layer, avoid the direct creepage of the glue layer, reduce the influence of external bumps and shocks on the stability of the composite busbar, and improve the stability and safety of long-term use.

[0036] In the above embodiment, after the multiple conductive layers of the composite busbar 100 are integrally hot-pressed and sealed, an isolation plate 150 is inserted into the slot 140, and the plug-in portion 151 and the inner wall of the slot 140 are sealed and connected by insulating glue, which is beneficial for isolating the glue layer between the interfaces of the positive electrode layer 110, the negative electrode layer 120 and the neutral electrode layer 130, avoiding direct creepage through the glue layer, reducing the impact of external bumps and shocks on the stability of the composite busbar 100, and improving the stability and safety of long-term use.

[0037] like Figure 2 As shown, the insulating structure also includes: an insulating film 160 and an insulating block 170. The insulating film 160 is arranged on the outside of the insulating block 170, and the insulating film 160 and the insulating block 170 are arranged between the positive electrode layer 110 and the neutral electrode layer 130, and the insulating film 160 and the insulating block 170 are also arranged between the neutral electrode layer 130 and the negative electrode layer 120. The slot 140 is also arranged through the insulating film 160 and the insulating block 170. In the above embodiment, by setting the slot 140 to pass through the insulating film 160 and the insulating block 170, it is helpful to avoid the situation of direct creepage by the glue layer, thereby improving the stability and safety of the composite busbar 100 during long-term use. In the embodiment of the present application, the insulating film 160 is hot-pressed and bonded between the negative electrode layer 120 and the neutral electrode layer 130.

[0038] like Figures 1 to 2As shown, the embodiment of the present application also provides an IGBT module 200, and the IGBT module 200 includes: an IGBT device 210 and a composite busbar 100 of any of the aforementioned embodiments. The IGBT device 210 includes a positive electrode interface 21, a neutral electrode interface 212, and a negative electrode interface. The composite busbar 100 is arranged on the upper part of the IGBT device 210 and is connected to the IGBT device 210. The multiple conductive layers include a positive electrode layer 110, a neutral electrode layer 130, and a negative electrode layer. The positive electrode layer 110 is connected to the positive electrode interface 211, the neutral electrode layer 130 is connected to the neutral electrode interface 212, and the negative electrode layer is connected to the negative electrode interface. The isolation plate 150 separates the adjacent interfaces of the IGBT device, as shown in FIG. Figure 5 As shown, a mounting gap S1 exists between the isolation plate 150 and the IGBT device 210. This increases the creepage clearance between the various interfaces of the IGBT device 210, meeting the safety regulations for the overall structure of the IGBT module 200 and improving long-term stability and safety. It should be noted that in this embodiment of the present application, the mounting gap S1 between the isolation plate 150 and the IGBT device 210 is at least 1 mm.

[0039] like Figures 1 to 2 As shown, an embodiment of the present application provides a composite busbar 100, which includes: multiple conductive layers, slots 140 and an insulating structure. The multiple conductive layers are respectively used to connect different interfaces of the IGBT device 210. The multiple conductive layers are parallel to each other and insulated. The slots 140 pass through the multiple conductive layers. The insulating structure includes an isolation plate 150, which includes a plug-in portion 151 and an isolation portion 152 that are connected to each other. The plug-in portion 151 is inserted into the slot 140. The isolation portion 152 includes a plurality of vertical ribs 1521 and a connecting portion 1522. The plurality of vertical ribs 1521 are arranged at intervals between adjacent interfaces of the IGBT device 210, and the connecting portion 1522 connects the plurality of vertical ribs 1521 in sequence.

[0040] The embodiment of the present application provides a composite busbar 100 in an IGBT module 200. A slot 140 is provided in the composite busbar 100, passing through multiple conductive layers. The insulating structure includes an isolation plate 150 inserted into the slot 140. The isolation plate 150 includes a plug-in portion 151 extending through the slot 140. The isolation portion 152 includes multiple vertical ribs 1521. The multiple vertical ribs 1521 are spaced apart between adjacent interfaces of the IGBT device 210, which helps prevent direct bridging due to high voltage. The provision of multiple vertical ribs 1521 can help increase the creepage and electrical clearance distance of the composite busbar 100, and also increase the creepage clearance between different interfaces of the IGBT device 210. This can meet the safety requirements of the overall structure of the IGBT module 200 and improve the stability and safety of long-term use. The structural design of the composite busbar 100 allows it to be easily integrated with the IGBT module 200, simplifying the assembly process.

[0041] It is understandable that the isolation plate 150 can be provided between any two adjacent interfaces of the IGBT device 210, such as between the positive interface 211 and the negative interface, between the negative interface and the neutral interface 212, and between the positive interface 211 and the neutral interface 212. Figure 2 As shown, in one embodiment of the present application, an isolation plate 150 is disposed between the positive electrode interface 211 and the neutral electrode interface 212 to separate the positive electrode interface 211 and the neutral electrode interface 212 , thereby increasing the creepage gap between the positive electrode interface 211 and the neutral electrode interface 212 .

[0042] In the embodiment of the present application, the composite busbar 100 includes a first connection blind hole 180, and the IGBT device 210 includes a second connection blind hole 213. Fasteners can be matched and connected with the first connection blind hole 180 and the second connection blind hole 213 to mount the composite busbar 100 and the IGBT device 210. It is understood that the fasteners can take the form of snap-on or latch-type connectors, rivets, or bolt and nut connectors. Those skilled in the art will be able to determine the form of the fasteners based on actual needs. Preferably, in the embodiment of the present application, the fasteners are in the form of bolts and nuts, which not only ensures a tight connection between the composite busbar 100 and the IGBT device 210, but also further enhances the overall stability and reliability of the IGBT module 200.

[0043] like Figure 5 As shown, a gap S2 is provided between adjacent interfaces of the IGBT device 210, the isolation plate 150 is arranged opposite to the gap S2, and there is an installation gap S1 between the isolation plate 150 and the gap S2, which increases the creepage clearance between different interfaces of the IGBT device 210, can meet the safety requirements of the overall structure of the IGBT module 200, and improves the stability and safety of long-term use.

[0044] It should be noted that the distances between the two opposite sides of the isolation plate 150 and the interface of the IGBT device are equal. Figure 5 As shown, the distance between one side of the isolation plate 150 and the positive electrode interface 211 is a first distance S3, and the distance between the other side of the isolation plate 150 and the neutral electrode interface 212 is a second distance S4. The first distance S3 and the second distance S4 are equal, which increases the creepage clearance, can meet the safety requirements of the overall structure of the IGBT module 200, and improves the stability and safety of long-term use.

[0045] The above description is only a preferred embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application description and drawings under the inventive concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A composite busbar, characterized in that: The composite busbar comprises: A plurality of conductive layers, each of which is used to connect different interfaces of the IGBT device, and the plurality of conductive layers are parallel to each other and insulated; a slot passing through the plurality of conductive layers; and An insulating structure, wherein the insulating structure includes an isolation plate, the isolation plate includes an interconnected plug-in portion and an isolation portion, the plug-in portion is inserted into the slot, the isolation portion includes a plurality of vertical ribs and a connecting portion, the plurality of vertical ribs are arranged at intervals between adjacent interfaces of the IGBT device, and the connecting portion connects the plurality of vertical ribs in sequence.

2. The composite busbar according to claim 1, characterized in that: There is a notch between two adjacent vertical ribs.

3. The composite busbar according to claim 1, characterized in that: The multiple conductive layers are integrated by hot pressing.

4. The composite busbar according to claim 3, characterized in that: The plug-in portion is sealed and connected to the inner wall of the slot by insulating glue.

5. The composite busbar according to claim 1, characterized in that: The plurality of conductive layers include a positive electrode layer, a negative electrode layer and a neutral electrode layer, wherein the positive electrode layer, the neutral electrode layer and the negative electrode layer are sequentially parallel and insulated. The insulating structure further comprises: An insulating film and an insulating block, wherein the insulating film is arranged outside the insulating block, the insulating film and the insulating block are respectively arranged between the positive electrode layer and the neutral electrode layer, and between the neutral electrode layer and the negative electrode layer, and the slot is also arranged through the insulating film and the insulating block.

6. The composite busbar according to claim 5, characterized in that: The insulating film is hot-pressed and bonded between the positive electrode layer and the neutral electrode layer, and between the negative electrode layer and the neutral electrode layer.

7. An IGBT module, characterized in that: The IGBT module includes: An IGBT device, wherein the IGBT device includes a positive electrode interface, a neutral electrode interface, and a negative electrode interface; and The composite busbar according to any one of claims 1 to 6, wherein the composite busbar is arranged on the upper part of the IGBT device and is connected to the IGBT device, the multiple conductive layers include a positive electrode layer, a neutral electrode layer and a negative electrode layer, the positive electrode layer is connected to the positive electrode interface, the neutral electrode layer is connected to the neutral electrode interface, the negative electrode layer is connected to the negative electrode interface, the isolation plate separates adjacent interfaces of the IGBT device, and there is an installation gap between the isolation plate and the IGBT device.

8. The IGBT module according to claim 7, wherein: The composite busbar includes a first connection blind hole. The IGBT device is connected to the composite busbar via a fastener. The fastener can be matched and connected with the first connection blind hole.

9. The IGBT module according to claim 8, wherein: A gap is provided between adjacent interfaces of the IGBT device, and the isolation plate is arranged opposite to the gap.

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