Circuit board positioning jig and device for SMT (Surface Mount Technology) processing

Abstract

The utility model provides a circuit board positioning jig for SMT (Surface Mount Technology) processing and a device thereof. The circuit board positioning jig for SMT patch processing comprises a bottom plate and a positioning assembly. The positioning assembly comprises a first side surrounding plate, a second side surrounding plate and a high-temperature adhesive tape. The first side surrounding plate and the second side surrounding plate are both arranged on the bottom plate, a positioning area is defined by the first side surrounding plate, the second side surrounding plate and the bottom plate jointly, and the first side surrounding plate and the second side surrounding plate are perpendicular to each other to form a right-angle alignment area. When the two PCBs are placed in the positioning area side by side, the right-angle end of any PCB is arranged in the right-angle alignment area, a splicing area is formed at the position where the two PCBs abut against each other, and the high-temperature adhesive tape is arranged in the splicing area so that the two PCBs can be connected in an adhesive mode. And in this way, the multiple glued PCBs are stacked and placed in the material bin of the SMT board placing machine, so that the SMT board placing machine can push two PCBs to an SMT production line at the same time to be processed at the same time within the preset time interval, and then the production efficiency of SMT patch processing is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a circuit board positioning fixture and a device thereof for SMT patch processing. Background Art

[0002] The SMT patch processing of circuit boards usually includes steps such as material preparation, board loading, solder paste printing, patching, reflow soldering, and testing. Among them, board loading refers to fixing the PCB board on the SMT production line and using a conveyor track to automatically transport it to improve the processing efficiency of subsequent steps.

[0003] During the SMT patch processing of complex double-sided circuit boards, both sides of the PCB need to be processed separately. In particular, when processing the first side of a PCB, the traditional approach is to stack multiple PCBs and place them in the material bin of an SMT placement machine, which then automatically removes them. Specifically, the SMT placement machine automatically pushes one PCB from the material bin to the SMT production line at a preset interval. This means that the SMT placement machine can only push one PCB to the SMT production line within the preset interval, resulting in low board removal efficiency for the SMT placement machine and, consequently, low production efficiency for SMT patch processing. Therefore, how to further optimize and improve the production efficiency of SMT patch processing is an urgent problem that those skilled in the art need to solve. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the existing technology and provide a circuit board positioning fixture and device for SMT patch processing that can reliably position and glue two PCB boards so as to place the glued PCB boards into the material bin of the SMT board placement machine, thereby effectively improving the board output efficiency of the SMT board placement machine and further optimizing and improving the production efficiency of SMT patch processing.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A circuit board positioning jig for SMT patch processing is used to position two PCB boards with the same width. The circuit board positioning jig for SMT patch processing includes:

[0007] base plate;

[0008] A positioning assembly includes a first side panel, a second side panel, and a high-temperature adhesive tape; the first side panel and the second side panel are both disposed on the bottom panel, the first side panel, the second side panel, and the bottom panel collectively forming a positioning area, the first side panel and the second side panel being perpendicular to each other to form a right-angle alignment area;

[0009] When the two PCB boards are placed side by side in the positioning area, the right-angle end of any one of the PCB boards is arranged in the right-angle alignment area, and a splicing area is formed at the mutually abutting portion between the two PCB boards, and the high-temperature tape is arranged in the splicing area to glue the two PCB boards together.

[0010] In one embodiment, the high-temperature tape includes a connecting high-temperature tape and a plurality of reinforcing high-temperature tapes; the connecting high-temperature tape is arranged along the mutually abutting portion between the two PCB sheets, and the plurality of reinforcing high-temperature tapes are evenly distributed on the connecting high-temperature tape, and one end of each reinforcing high-temperature tape is glued to one PCB sheet, and the other end of each reinforcing high-temperature tape is glued to the other PCB sheet.

[0011] In one embodiment, the bottom plate is a rectangular bottom plate.

[0012] In one embodiment, the bottom plate is provided with a first groove;

[0013] A first convex portion is protruded from the bottom of the first side panel, and the first convex portion is arranged in the first groove.

[0014] In one embodiment, the bottom plate is further provided with a second groove;

[0015] A second convex portion is protruded from the bottom of the second side panel, and the second convex portion is arranged in the second groove.

[0016] In one embodiment, the first side panel is snap-connected, glued or screwed to the bottom panel.

[0017] In one embodiment, the second side panel is snap-connected, glued or screwed to the bottom panel.

[0018] In one embodiment, the first side panel, the second side panel and the bottom panel are all integrally formed structures.

[0019] In one embodiment, the area of ​​the positioning zone is larger than the area of ​​the two PCB boards.

[0020] A circuit board positioning device for SMT patch processing includes the circuit board positioning fixture for SMT patch processing described in any of the above embodiments.

[0021] Compared with the prior art, the present invention has at least the following advantages:

[0022] By placing two PCBs of the same width side by side in the positioning area, and adjusting the right-angle end of one of the PCBs to the right-angle alignment area so that the right-angle edge of the PCB abuts the first side panel and the second side panel, the PCBs are positioned. At this point, high-temperature tape is used to glue the two PCBs together along the splicing area. After this process, the staff can stack several glued PCBs and place them in the material bin of the SMT placement machine. This allows the SMT placement machine to simultaneously push two PCBs to the SMT production line for simultaneous processing within a preset interval, effectively improving the SMT placement machine's board output efficiency and further optimizing the production efficiency of SMT patch processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A schematic diagram of the structure of a circuit board positioning fixture for SMT patch processing in one embodiment;

[0025] Figure 2 for Figure 1 The exploded diagram of the structure of the circuit board positioning fixture used for SMT patch processing is shown;

[0026] Figure 3 for Figure 2 The enlarged view of the part A of the circuit board positioning fixture used for SMT patch processing shown in the figure;

[0027] Figure 4 for Figure 2 The enlarged view of the part B of the circuit board positioning fixture used for SMT patch processing is shown;

[0028] Figure 5 A physical picture of the circuit board positioning fixture used for SMT patch processing;

[0029] Figure 6 This is a physical picture of several glued PCB boards stacked and placed in the material bin of the SMT board placement machine;

[0030] Figure 7 This is a photo of two PCB boards after gluing on the conveyor track of the SMT production line;

[0031] Figure 1: Circuit board positioning jig 10 for SMT patch processing; PCB board 100; bottom plate 200; first groove 201; second groove 202; positioning assembly 300; first side panel 310; first protrusion 3110; second side panel 320; second protrusion 3120; high-temperature tape 330; connecting high-temperature tape 3310; reinforcing high-temperature tape 3320; positioning area 301; right-angle alignment area 302; splicing area 303. DETAILED DESCRIPTION

[0032] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present invention.

[0033] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended solely for the purpose of describing specific embodiments and are not intended to limit this invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0035] The present disclosure provides a circuit board positioning jig for SMT patch processing, which is used to position two PCB plates with the same width. The circuit board positioning jig for SMT patch processing includes a base plate and a positioning assembly. The positioning assembly includes a first side panel, a second side panel and a high-temperature adhesive tape; the first side panel and the second side panel are both arranged on the base plate, and the first side panel, the second side panel and the base plate together form a positioning area, and the first side panel and the second side panel are perpendicular to each other to form a right-angle alignment area; when the two PCB plates are placed side by side in the positioning area, the right-angle end of any one of the PCB plates is arranged in the right-angle alignment area, and the parts where the two PCB plates abut each other form a splicing area, and the high-temperature adhesive tape is arranged in the splicing area to glue the two PCB plates together.

[0036] See also Figures 1 to 4 In order to better understand the circuit board positioning jig 10 for SMT patch processing of the present application, the circuit board positioning jig 10 for SMT patch processing is further explained below:

[0037] A circuit board positioning fixture 10 for SMT patch processing according to one embodiment includes a base plate 200 and a positioning assembly 300. The positioning assembly 300 includes a first side panel 310, a second side panel 320, and high-temperature adhesive tape 330. The first side panel 310 and the second side panel 320 are both disposed on the base plate 200. The first side panel 310, the second side panel 320, and the base plate 200 collectively define a positioning area 301. The first side panel 310 and the second side panel 320 are perpendicular to each other to form a right-angle alignment area 302. When two PCB sheets 100 are placed side by side in the positioning area 301, the right-angle end of each PCB sheet 100 is located in the right-angle alignment area 302, and the mutually abutting portion of the two PCB sheets 100 forms a splicing area 303. The high-temperature adhesive tape 330 is disposed in the splicing area 303 to bond the two PCB sheets 100 together.

[0038] In this embodiment, two PCB sheets 100 of the same width are placed side by side in the positioning area 301. The right-angled end of one of the PCB sheets 100 is adjusted to be positioned in the right-angle alignment area 302, so that the right-angled edge of the PCB sheet 100 abuts against the first side panel 310 and the second side panel 310, thereby positioning the PCB sheet 100. At this point, high-temperature adhesive tape 330 is used to glue the two PCB sheets 100 together along the splicing area 303. After this process, the operator stacks several glued PCB sheets 100 and places them in the material bin of the SMT placement machine. This allows the SMT placement machine to simultaneously push out two PCB sheets 100 to the SMT production line for simultaneous processing within a preset interval, thereby effectively improving the SMT placement machine's board output efficiency and further optimizing the production efficiency of SMT patch processing.

[0039] like Figure 1 and Figure 2 As shown, in one embodiment, the high-temperature tape 330 includes a connecting high-temperature tape 3310 and a plurality of reinforcing high-temperature tapes 3320; the connecting high-temperature tape 3310 is arranged along the mutually abutting portion between the two PCB plates 100, and the plurality of reinforcing high-temperature tapes 3320 are evenly distributed on the connecting high-temperature tape 3310, and one end of each of the reinforcing high-temperature tapes 3320 is glued to one of the PCB plates 100, and the other end of each of the reinforcing high-temperature tapes 3320 is glued to the other PCB plate 100.

[0040] It can be understood that after the staff completes the positioning of the two PCB boards 100, they use the connecting high-temperature tape 3310 to bond the two PCB boards 100 along the mutually abutting parts, that is, to ensure that the splicing area 303 can be evenly bonded by the connecting high-temperature tape 3310; and then use a number of reinforcing high-temperature tapes 3320 to further bond the connecting high-temperature tape 3310 in the splicing area 303 and the mutually abutting parts between the two PCB boards 100, thereby effectively improving the accuracy and firmness of the bonding of the two PCB boards 100, thereby preventing the problem of loose connection between the two PCB boards 100 during transfer or transportation.

[0041] It should be noted that the high-temperature tape 330 has good anti-static properties, which can prevent static electricity from damaging the PCB board 100. It can be used in high-temperature application scenarios such as reflow soldering and wave soldering. It is a special tape that can still maintain good adhesion and durability in high-temperature environments, ensuring that the tape will not fall off or be damaged during the soldering process.

[0042] like Figure 1 and Figure 2 As shown, in one embodiment, the bottom plate 200 is a rectangular bottom plate 200. Thus, the first side panel 310 and the second side panel 320 can be arranged along two perpendicular right-angled sides of the rectangular bottom plate 200, so that the first side panel 310 and the second side panel 320 are perpendicular to each other.

[0043] Furthermore, the first side panel 310, the second side panel 320 and the bottom plate 200 are made of plastic sheets, which makes the manufacturing structure of the circuit board positioning jig 10 simple and practical, and there is no need to add positioning fixtures to the SMT board placement machine, which significantly reduces the manufacturing cost of the additional positioning fixtures, especially for the production of small batches of circuit boards, without the need to frequently manufacture or replace positioning fixtures; at the same time, the circuit board positioning jig 10 made of plastic sheets is lighter in weight and more convenient for use by workshop staff.

[0044] like Figure 3 and Figure 4 As shown, in one embodiment, the bottom plate 200 defines a first groove 201; the bottom of the first side panel 310 defines a first protrusion 3110, and the first protrusion 3110 is disposed in the first groove 201. In one embodiment, the bottom plate 200 further defines a second groove 202; the bottom of the second side panel 320 defines a second protrusion 3120, and the second protrusion 3120 is disposed in the second groove 202.

[0045] It can be understood that the first protrusion 3110 can be respectively arranged in the first groove 201 and the second protrusion 3120 can be arranged in the second groove 202, and then the first protrusion 3110 can be positioned in the first groove 201 and the second protrusion 3120 can be positioned in the second groove 202 by gluing, so as to effectively improve the structural connection stability between the first side panel 310 and the second side panel 320 and the bottom plate 200.

[0046] like Figure 1 and Figure 2 As shown, in one embodiment, the first side panel 310 is snap-fitted, glued or screwed to the bottom plate 200. In this way, the convenience of fixing and installing the first side panel 310 and the bottom plate 200 is ensured.

[0047] like Figure 1 and Figure 2 As shown, in one embodiment, the second side panel 320 is snap-fitted, glued or screwed to the bottom plate 200. In this way, the convenience of fixing and installing the second side panel 320 and the bottom plate 200 is ensured.

[0048] like Figure 1 As shown, in one embodiment, the first side panel 310, the second side panel 320 and the bottom plate 200 are all integrally formed, so that the first side panel 310, the second side panel 320 and the bottom plate 200 all have good structural strength support.

[0049] like Figure 1 and Figure 2 As shown, in one embodiment, the area of ​​the positioning area 301 is larger than the area of ​​the two PCB panels 100. Thus, when the two PCB panels 100 are placed side by side in the positioning area 301, the first side panel 310 and the second side panel 320 have sufficient positioning length to ensure that the two PCB panels 100 are completely within the positioning area 301. Furthermore, the right-angle end of any PCB panel 100 is positioned in the right-angle alignment area 302, so that the right-angle edge of the PCB panel 100 abuts against the first side panel 310 and the second side panel 320, thereby achieving relatively precise positioning of the PCB panel 100 and facilitating the gluing of the two PCB panels 100 along the splicing area 303.

[0050] The present application also provides a circuit board positioning device for SMT patch processing, including the circuit board positioning fixture 10 for SMT patch processing described in any of the above embodiments.

[0051] In this embodiment, two PCBs of identical width are placed side by side in the positioning area. The right-angled end of one of the PCBs is adjusted to the right-angle alignment area, so that the right-angled edge of the PCB abuts the first side panel and the second side panel, thereby achieving positioning for the PCBs. High-temperature tape is then used to glue the two PCBs together along the splicing area. After this process, the operator stacks the glued PCBs and places them in the material bin of the SMT placement machine. This allows the SMT placement machine to simultaneously push two PCBs to the SMT production line for simultaneous processing within a preset interval, effectively improving the SMT placement machine's board output efficiency and further optimizing the production efficiency of SMT patch processing.

[0052] Compared with the prior art, the present invention has at least the following advantages:

[0053] By placing two PCBs of the same width side by side in the positioning area, and adjusting the right-angle end of one of the PCBs to the right-angle alignment area so that the right-angle edge of the PCB abuts the first side panel and the second side panel, the PCBs are positioned. At this point, high-temperature tape is used to glue the two PCBs together along the splicing area. After this process, the staff can stack several glued PCBs and place them in the material bin of the SMT placement machine. This allows the SMT placement machine to simultaneously push two PCBs to the SMT production line for simultaneous processing within a preset interval, effectively improving the SMT placement machine's board output efficiency and further optimizing the production efficiency of SMT patch processing.

[0054] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A circuit board positioning fixture for SMT patch processing, used to position two PCB boards with the same width, characterized by: The circuit board positioning fixture for SMT patch processing includes: base plate; A positioning assembly includes a first side panel, a second side panel, and a high-temperature adhesive tape; the first side panel and the second side panel are both disposed on the bottom panel, the first side panel, the second side panel, and the bottom panel collectively forming a positioning area, the first side panel and the second side panel being perpendicular to each other to form a right-angle alignment area; When the two PCB boards are placed side by side in the positioning area, the right-angle end of any one of the PCB boards is arranged in the right-angle alignment area, and a splicing area is formed at the mutually abutting portion between the two PCB boards, and the high-temperature tape is arranged in the splicing area to glue the two PCB boards together.

2. The circuit board positioning jig for SMT patch processing according to claim 1, characterized in that: The high-temperature tape includes a connecting high-temperature tape and a plurality of reinforcing high-temperature tapes; the connecting high-temperature tape is arranged along the mutually abutting portion between the two PCB plates, and the plurality of reinforcing high-temperature tapes are evenly distributed on the connecting high-temperature tape, and one end of each reinforcing high-temperature tape is glued to one PCB plate, and the other end of each reinforcing high-temperature tape is glued to the other PCB plate.

3. The circuit board positioning jig for SMT patch processing according to claim 1, characterized in that: The bottom plate is a rectangular bottom plate.

4. The circuit board positioning jig for SMT patch processing according to claim 1, characterized in that: The bottom plate is provided with a first groove; A first convex portion is protruded from the bottom of the first side panel, and the first convex portion is arranged in the first groove.

5. The circuit board positioning jig for SMT patch processing according to claim 1, characterized in that: The bottom plate is further provided with a second groove; A second convex portion is protruded from the bottom of the second side panel, and the second convex portion is arranged in the second groove.

6. The circuit board positioning jig for SMT patch processing according to claim 1, characterized in that: The first side panel is snap-connected, glued or screwed to the bottom panel.

7. The circuit board positioning jig for SMT patch processing according to claim 1, characterized in that: The second side panel is snap-connected, glued or screwed to the bottom panel.

8. The circuit board positioning jig for SMT patch processing according to claim 1, characterized in that: The first side panel, the second side panel and the bottom panel are all integrally formed structures.

9. The circuit board positioning jig for SMT patch processing according to claim 1, characterized in that: The area of ​​the positioning zone is larger than the area of ​​the two PCB boards.

10. A circuit board positioning device for SMT patch processing, characterized in that: A circuit board positioning jig for SMT patch processing comprising the one of claims 1 to 9.

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