Forced air cooling controller heat dissipation structure
Through the combination of fixing devices and heat dissipation devices, the problem of low heat dissipation efficiency of the new energy heat management controller in the front cabin of the sealed car is solved, and efficient forced air-cooled heat dissipation is achieved, ensuring that components quickly cool down at high temperatures, improving the stability and practicality of the device.
Patent Information
- Application Number
- CN202422270695.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-09-18
AI Technical Summary
The existing new energy thermal management controller has low heat dissipation efficiency, especially in the front cabin of the sealed car, which cannot meet the needs of components with huge heat generation.
The combination of fixing devices and heat dissipation devices is adopted to fix the motherboard through the coordination of the cardboard and the slot, and the temperature is monitored and forced air cooling is activated. The design of the fan frame and the cooling fan is used to improve the heat dissipation efficiency.
It realizes efficient heat dissipation effect in confined space, ensures that components quickly cool down at high temperatures, and improves the stability and practicality of the device.
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Figure CN223297891U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation structures, in particular to a forced air-cooling controller heat dissipation structure. Background Art
[0002] New energy thermal management controllers are generally installed in the front cabin of a car. The front cabin of a car is a closed space, and its heat dissipation relies on natural cooling. Therefore, for some heating systems with huge heat generation, heat dissipation is not possible. With the intervention of forced air cooling by fans, the heat dissipation efficiency will be greatly improved. The principle is that thermistors are arranged on the printed circuit board to sense the temperature around key components. When the temperature reaches the set protection value, the fan starts to intervene and quickly cools down. When natural cooling can meet the heat dissipation needs of the components, the fan is not started and works intermittently.
[0003] In the prior art, a Chinese utility model patent application numbered CN201120055932.8 relates to a forced air-cooled motor controller structure, which includes a radiator and a cooling fan, is easy to disassemble and repair, and has a good heat dissipation effect.
[0004] However, in actual use, the above device is in close contact with the printed circuit board, and the heat dissipation efficiency is low. Utility Model Content
[0005] In order to solve the above technical problems, the utility model provides a forced air-cooled controller heat dissipation structure which provides stable structural support through a fixing device, improves the heat dissipation efficiency of the equipment through a heat dissipation device, and improves the practicality of the device.
[0006] The utility model discloses a forced air-cooled controller heat dissipation structure, which comprises a fixing device and a heat dissipation device, wherein the heat dissipation device is mounted on the fixing device. The fixing device provides stable structural support, and the heat dissipation device improves the heat dissipation efficiency of the equipment and the practicability of the device.
[0007] Preferably, the fixing device includes a base shell, a mainboard, a heat sink, a card plate, a card slot and heat sinks, the mainboard is placed on the upper end surface of the base shell, the heat sink is placed on the upper end surface of the mainboard, a card slot is provided on the edge of the heat sink, a card plate is provided on the side surface of the base shell, the card plate is bent and clamped in the card slot on the edge of the heat sink, and multiple groups of heat sinks are provided on the upper end surface of the heat sink; the position of the mainboard is covered and fixed by the card plate on the base shell and the card slot on the heat sink, and the heat sink on the heat sink increases the heat dissipation effect of the equipment, thereby improving the stability and practicality of the device.
[0008] Preferably, it also includes a thermistor and a power socket. A thermistor is provided on the upper end surface of the mainboard, and a power socket is installed in the middle of the upper end surface of the heat sink. Power is provided to the heat dissipation device through the power socket, and the main body temperature of the mainboard is monitored through the thermistor. When the temperature is higher than the set protection temperature, the heat dissipation device is controlled to operate, and the mainboard is quickly cooled using forced air cooling, thereby improving the practicality of the device.
[0009] Preferably, the heat dissipation device includes a bolt seat, a fan bracket, a heat dissipation fan and a fixing nut. A group of fan brackets are respectively installed on the left and right sides of the upper end surface of the heat plate. The installation positions of the two groups of fan brackets are staggered front and back and symmetrical about the center of the heat plate. Four groups of bolt seats are respectively provided on the left and right sides of the heat plate. The fan bracket is installed on the heat plate through the fixing nuts and the four groups of bolt seats. There is a fixed angle of five degrees between the fan bracket itself and the heat plate, and the heat dissipation fan is installed in the fan bracket. By setting a fixed angle of five degrees between the lower end surface of the fan bracket and the upper surface of the heat plate when the fan bracket is installed, the air intake at the bottom of the fan bracket is increased, thereby increasing the heat dissipation efficiency of the equipment, reducing the anti-turbance ability, and improving the practicality of the device.
[0010] Compared with the prior art, the beneficial effects of the present invention are: providing stable structural support through the fixing device, improving the heat dissipation efficiency of the equipment through the heat dissipation device, and improving the practicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 This is a first axonometric structural diagram of the present invention;
[0012] Figure 2 It is a side structural schematic diagram of the utility model;
[0013] Figure 3 This is a second axonometric structural diagram of the present invention;
[0014] Figure 4 It is a schematic diagram of the explosion structure of the utility model;
[0015] Markings in the accompanying drawings: 1. bottom plate shell; 2. main board; 3. heat sink; 4. card board; 5. card slot; 6. heat sink; 7. thermistor; 8. power socket; 9. bolt seat; 10. fan bracket; 11. cooling fan; 12. fixing nut. DETAILED DESCRIPTION
[0016] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.
[0017] Example
[0018] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The heat sink is shown mounted on a fixture;
[0019] First, the motherboard is secured in place by using the clamps on the bottom shell and the slots on the heat sink. The fan bracket is then secured with bolts and nuts. During use, the temperature of the motherboard is monitored by a thermistor. When the temperature exceeds the set protection temperature, the heat sink is activated, and forced air cooling is used to quickly cool the motherboard.
[0020] The fixing device includes a bottom plate shell, a mainboard, a heat sink, a card plate, a card slot and a heat sink. The mainboard is placed on the upper end surface of the bottom plate shell, the heat sink is placed on the upper end surface of the mainboard, a card slot is provided on the edge of the heat sink, a card plate is provided on the side surface of the bottom plate shell, the card plate is bent and clamped in the card slot on the edge of the heat sink, and multiple groups of heat sinks are provided on the upper end surface of the heat sink;
[0021] It also includes a thermistor and a power socket. The thermistor is arranged on the upper end surface of the main board, and the power socket is installed in the middle of the upper end surface of the heat sink.
[0022] The heat dissipation device includes a bolt seat, a fan frame, a heat dissipation fan, and a fixing nut. A set of fan frames are respectively installed on the left and right sides of the upper end surface of the heat dissipation plate. The installation positions of the two sets of fan frames are staggered front and back and symmetrical about the center of the heat dissipation plate. Four sets of bolt seats are respectively provided on the left and right sides of the heat dissipation plate. The fan frames are mounted on the heat dissipation plate through the fixing nuts and the four sets of bolt seats. There is a fixed angle of five degrees between the fan frame itself and the heat dissipation plate. The heat dissipation fan is installed in the fan frame.
[0023] The fixing device provides stable structural support, and the heat dissipation efficiency of the equipment is improved through the heat dissipation device, thereby improving the practicality of the device.
[0024] like Figures 1 to 4 As shown, the utility model is a forced air cooling controller heat dissipation structure. When it is working, the position of the mainboard is first covered and fixed by the clamping plate on the bottom shell and the clamping slot on the heat dissipation plate, and then the position of the fan frame is fixed by the bolt seat and the fixing nut. During use, the temperature of the main body of the mainboard is monitored by the thermistor. When the temperature is higher than the set protection temperature, the heat dissipation device is controlled to operate, and the mainboard can be quickly cooled by forced air cooling.
[0025] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
Claims
1. A controller heat dissipation structure with forced air cooling; characterized in that, The invention comprises a fixing device and a heat dissipation device, wherein the heat dissipation device is installed on the fixing device; the fixing device comprises a bottom plate shell (1), a main board (2), a heat dissipation plate (3), a card board (4), a card slot (5) and a heat dissipation fin (6); the main board (2) is placed on the upper end surface of the bottom plate shell (1); the heat dissipation plate (3) is placed on the upper end surface of the main board (2); a card slot (5) is provided on the edge of the heat dissipation plate (3); a card board (4) is provided on the side surface of the bottom plate shell (1); the card board (4) is bent and stuck in the card slot (5) on the edge of the heat dissipation plate (3); and a plurality of heat dissipation fins (6) are provided on the upper end surface of the heat dissipation plate (3).
2. The forced air cooling controller heat dissipation structure according to claim 1, characterized in that: It also includes a thermistor (7) and a power socket (8). The thermistor (7) is provided on the upper end surface of the mainboard (2), and the power socket (8) is installed in the middle of the upper end surface of the heat sink (3).
3. The forced air cooling controller heat dissipation structure according to claim 2, characterized in that: The heat dissipation device comprises a bolt seat (9), a fan frame (10), a heat dissipation fan (11) and a fixing nut (12). A group of fan frames (10) are respectively installed on the left and right sides of the upper end surface of the heat dissipation plate (3). The installation positions of the two groups of fan frames (10) are staggered front and back and symmetrical about the center of the heat dissipation plate (3). Four groups of bolt seats (9) are respectively provided on the left and right sides of the heat dissipation plate (3). The fan frame (10) is mounted on the heat dissipation plate (3) by means of the fixing nut (12) and the four groups of bolt seats (9). There is a fixed angle of five degrees between the fan frame (10) itself and the heat dissipation plate (3). The heat dissipation fan (11) is installed in the fan frame (10).
Citation Information
Patent Citations
Forced air cooling motor controller structure
CN201947595U