Silicon wafer cleaning tank

Abstract

The utility model provides a silicon wafer cleaning tank which comprises a box body with an opening in the top end, a plurality of overflow holes formed in the upper end of the box body, a bubbling pipe arranged at the bottom of the inner side of the box body, a supporting frame used for placing silicon wafers in a multi-layer mode and arranged on the outer side of the bubbling pipe, and the bubbling pipe is arranged at the bottom of the inner side of the box body. Spraying devices are arranged at the top ends of the two sides of the box body, a liquid level switch is arranged on one side of the box body, a rapid drainage valve is arranged at the bottom of the outer side of the box body, the supporting frame comprises two I-shaped supports fixed to the two ends in the box body respectively and an isolation plate erected on the two I-shaped supports, and a plurality of through holes are evenly distributed in the surface of the isolation plate. A layer of silicon wafer is laid on the upper end face of the isolation plate. According to the silicon wafer cleaning tank, the cleaning quality and the cleaning efficiency of silicon wafers are improved, and meanwhile the corrosion resistance of a novel device cannot be affected.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor silicon wafers, in particular to a silicon wafer cleaning tank. Background Art

[0002] In the semiconductor and photovoltaic industries, silicon wafers are basic materials used to manufacture electronic devices such as integrated circuit transistors and equipment that converts solar energy into electrical energy. Therefore, during their preparation and processing, the quality and performance of silicon wafers are affected by various pollutants such as grease, dust, and chemical residues. Proper cleaning is a key step to ensure the quality and performance of silicon wafers. After acid cleaning, the surface of the silicon wafer needs to be deacidified with pure water.

[0003] In the prior art, for deacidification cleaning of silicon wafers, semiconductor silicon wafers are mostly immersed in PFA tanks for decontamination treatment. This method not only has low cleaning efficiency and cleaning quality, but also has low corrosion resistance of the material inside the PFA tank.

[0004] Therefore, the utility model provides a silicon wafer cleaning tank to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a silicon wafer cleaning tank, which solves the problems of low cleaning quality and low cleaning efficiency, while not affecting the corrosion resistance of the new device.

[0006] A silicon wafer cleaning tank, characterized in that it includes a box body with an opening at the top, a plurality of overflow holes are provided at the upper end of the box body, a bubbling tube is provided at the inner bottom of the box body, one end of the bubbling tube extends to the outside of the box body, and a support frame for multi-layer placement of silicon wafers is also provided at the bottom of the box body, the support frame is arranged on the outside of the bubbling tube, spray devices are provided at the tops of both sides of the box body, a liquid level switch is provided on one side of the box body, and a quick drain valve is provided at the outer bottom of the box body.

[0007] The support frame includes two I-shaped brackets fixed at both ends of the box body, and an isolation plate mounted on the two I-shaped brackets;

[0008] A plurality of through holes are evenly distributed on the surface of the isolation plate, and a layer of silicon wafer is laid on the upper end surface of the isolation plate.

[0009] The support frames include multiple groups, and two groups of support frames adjacent to each other are connected in a separate manner;

[0010] The overall height of the multiple groups of support frames is lower than the spraying device.

[0011] The spray device includes two spray pipes, the sides of the two spray pipes are connected to the box body through connectors, one end of the two spray pipes is connected to the water inlet pipe, and the other end of the two spray pipes is tightened and sealed by pipe caps;

[0012] A plurality of spray holes are evenly distributed on the surfaces of the two spray pipes, and the spray holes are all facing the interior of the box.

[0013] There are two bubbling tubes, which are arranged in parallel at the inner bottom of the box body. A plurality of air outlet holes are evenly distributed on the sides of the two bubbling tubes, and the air outlet holes are all facing upwards.

[0014] The diameter of the quick drain valve is 100 mm and the drain time is 7 seconds.

[0015] The overflow hole is arranged around the upper end edge of the box body.

[0016] The liquid level switch is arranged at the upper right corner of one side of the box body.

[0017] The utility model achieves the following significant effects:

[0018] (1) Setting up multiple sets of support frames can divide the silicon wafers into multiple layers, so that more silicon wafers can be cleaned at the same time. At the same time, the isolation plates are set in a grid shape, and the silicon wafers are laid flat on the isolation plates. The upper surface of the silicon wafers can be flushed by the spray device, and the lower surface can be cleaned by the bubbles generated by the bubbling tube. In this way, the silicon wafers can be cleaned in all directions, which greatly improves the cleaning quality of the silicon wafers.

[0019] (2) A quick drain valve is provided at the bottom of the box. The diameter of the quick drain valve is 100 mm. When the set cleaning time is reached, the quick drain valve is opened to quickly drain the sewage. The time to completely drain the sewage inside the box is 7 seconds, which saves time for cleaning the next batch of silicon wafers and improves the cleaning efficiency.

[0020] (3) Box 1 is made of NPP material. NPP is a green building material with the characteristics of hygiene, high temperature resistance, heat preservation and energy saving. The most important thing is that it can improve the corrosion resistance of the box and prevent the box from being corroded and affecting normal use. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of the silicon wafer cleaning tank in an embodiment of the present utility model.

[0022] Figure 2 This is a schematic diagram of the overall structure of the silicon wafer cleaning tank support frame in an embodiment of the present utility model.

[0023] Among them, the figures are marked as: 1. Box body; 2. Overflow hole; 3. Connector; 4. Spray pipe; 5. Spray hole; 6. Liquid level switch; 7. Bubble tube; 8. Quick drain valve; 9. Air outlet; 10. Through hole; 11. Isolation plate; 12. I-shaped bracket; 13. Support frame. DETAILED DESCRIPTION

[0024] In order to more clearly illustrate the technical features of this solution, this solution is described below through specific implementation methods.

[0025] See also Figure 1-Figure 2 A silicon wafer cleaning tank comprises a box body 1 with an opening at the top, a plurality of overflow holes 2 provided at the upper end of the box body 1, the overflow holes 2 can control the fluid pressure within a set range to prevent the silicon wafer from being damaged due to excessive pressure, a bubbling tube 7 is provided at the bottom inner side of the box body 1, one end of the bubbling tube 7 extends to the outside of the box body 1 for adding gas to produce bubbles, a support frame 13 for multi-layer placement of silicon wafers is also provided at the bottom of the box body 1, the support frame 13 is provided on the outside of the bubbling tube 7, spray devices are provided at the tops of both sides of the box body 1, a liquid level switch 6 is provided on one side of the box body 1, and a quick drain valve 8 is provided at the bottom outer side of the box body 1.

[0026] The support frame 13 includes two I-shaped brackets 12 fixed at both ends of the box body, and an isolation board 11 mounted on the two I-shaped brackets 12;

[0027] A plurality of through holes 10 are evenly distributed on the surface of the isolation plate 11 , and a layer of silicon wafer is laid on the upper end surface of the isolation plate 11 .

[0028] The supporting frames 13 have multiple groups, and two groups of supporting frames 13 adjacent to each other are connected separately;

[0029] The overall height of the multiple groups of support frames 13 is lower than the spraying device.

[0030] Setting up multiple groups of support frames 13 can divide the silicon wafers into multiple layers, so that more silicon wafers can be cleaned at the same time. At the same time, the isolation plate 11 is set in a grid shape, and the silicon wafers are spread flat on the isolation plate 11. The upper surface of the silicon wafer can be flushed by the spray device, and the lower surface can be cleaned by the bubbles generated by the bubbling tube 7. In this way, the silicon wafer can be cleaned in all directions, which greatly improves the cleaning quality of the silicon wafer.

[0031] The spray device includes two spray pipes 4. The sides of the two spray pipes 4 are connected to the box body 1 through connectors 3. One end of the two spray pipes 4 is connected to the water inlet pipe, and the other end of the two spray pipes 4 is tightened and sealed by pipe caps.

[0032] A plurality of spray holes 5 are evenly distributed on the surfaces of the two spray pipes 4 , and the spray holes 5 all face the interior of the box 1 .

[0033] There are two bubbling tubes 7, which are arranged in parallel at the inner bottom of the box body 1. A plurality of air outlet holes 9 are evenly distributed on the sides of the two bubbling tubes 7, and the air outlet holes 9 are all facing upward. When gas is added to one end of the bubbling tube 7, the bubbling tube 7 will generate a large number of bubbles. The bubbles can accelerate the flow rate of water inside the box body 1, so that it can quickly flush the silicon wafer, thereby improving the cleaning quality.

[0034] The diameter of the quick drain valve 8 is 100 mm. After cleaning is completed, it takes 7 seconds to completely drain the sewage inside the box 1, which saves time for cleaning the next batch of silicon wafers and improves cleaning efficiency.

[0035] The overflow hole 2 is arranged around the upper edge of the box body 1 .

[0036] The liquid level switch 6 is set in the upper right corner of one side of the box body 1. The liquid level switch 6 is an automatic control device used to monitor and control the liquid level height in the container. When the water level inside the box body 1 reaches a preset height, the liquid level switch 6 will issue an instruction to control the start and stop of other components to ensure that the liquid level is controlled within a safe range.

[0037] The box body 1 is made of NPP material. NPP is a green building material with the characteristics of hygiene, high temperature resistance, heat preservation and energy saving. The most important thing is that it can improve the corrosion resistance of the box body 1 and prevent the box body 1 from being corroded and affecting normal use.

[0038] The specific working process of this utility model:

[0039] See also Figure 1-Figure 2 , multiple groups of support frames 13 are set at the inner bottom of the box body, and the two adjacent groups of support frames 13 are connected separately. The support frames 13 can be disassembled and installed according to the number of silicon wafers, and the silicon wafers can be spread flat on the isolation plate 11. Multiple groups of support frames 13 can divide the silicon wafers into multiple layers, and more silicon wafers can be cleaned at the same time. However, the overall height of the multiple groups of support frames 13 needs to be lower than the spray device to prevent the spray device from being unable to flush the silicon wafers on the highest layer.

[0040] One end of the two spray pipes 4 is connected to the water inlet pipe respectively. A number of spray holes 5 are evenly distributed on the surface of the two spray pipes 4. The spray holes 5 are all facing the inside of the box 1. The surface of the isolation plate 11 is provided with a number of through holes 10 in a grid shape. When the water source is turned on, the spray pipe 4 can flush the upper surface of the chip, and the water can be flushed to each layer of silicon wafer through the grid-shaped isolation plate 11.

[0041] A quick drain valve 8 is provided at the outer bottom of the box body 1. After the quick drain valve 8 is closed, as the spray pipe 4 works, the water level inside the box body 1 rises, and two bubbling tubes 7 are arranged in parallel at the inner bottom of the box body 1. One end of the two bubbling tubes 7 extends to the outside of the box body 1 respectively. A plurality of air outlet holes 9 are evenly distributed on the sides of the two bubbling tubes 7, and the air outlet holes 9 are all facing upward. When gas is added to one end of the bubbling tube 7, a large number of bubbles will be generated. In the process of rising from a low level, the bubbles can be flushed to the lower surface of the silicon wafer. At the same time, the bubbles can accelerate the flow rate of the water inside the box body 1, so that it can quickly flush the silicon wafer. The spray device cooperates with the bubbling tube 7, and each layer of silicon wafers can be cleaned in an all-round way, which greatly improves the cleaning quality.

[0042] A liquid level switch 6 is provided on one side of the box body 1, and the liquid level switch 6 is set in the upper right corner of the box body 1. The liquid level switch 6 is an automatic control device for monitoring and controlling the liquid level height in the container. When the water level inside the box body 1 reaches a preset height, the liquid level switch 6 will issue instructions to control the start and stop of other components to ensure that the liquid level is controlled within a safe range. Several overflow holes 2 are provided around the upper edge of the box body 1. The overflow holes 2 can control the fluid pressure within a set range to prevent the silicon wafer from being damaged due to excessive pressure.

[0043] The diameter of the quick drain valve 8 is 100 mm. When the set cleaning time is reached, the quick drain valve 8 is opened to quickly drain the sewage. The time to completely drain the sewage inside the box 1 is 7 seconds, which saves time for cleaning the next batch of silicon wafers and improves cleaning efficiency.

[0044] In addition, the box body 1 is made of NPP material, which is a green building material with the characteristics of hygiene, high temperature resistance, heat preservation and energy saving. The most important thing is that it can improve the corrosion resistance of the box body 1 and prevent the box body 1 from being corroded and affecting normal use.

[0045] The technical features not described in the present invention can be realized by or by adopting the existing technology, and will not be described in detail here. Of course, the above description is not a limitation of the present invention, and the present invention is not limited to the above examples. Changes, modifications, additions or substitutions made by ordinary technicians in this technical field within the essential scope of the present invention should also fall within the scope of protection of the present invention.

Claims

1. A silicon wafer cleaning tank, characterized in that: The invention comprises a box body (1) with a top opening, a plurality of overflow holes (2) are provided at the upper end of the box body (1), a bubbling tube (7) is provided at the inner bottom of the box body (1), one end of the bubbling tube (7) extends to the outside of the box body (1), a support frame (13) for multi-layer placement of silicon wafers is further provided at the bottom of the box body (1), the support frame (13) is provided on the outside of the bubbling tube (7), spray devices are provided at the top ends of both sides of the box body (1), a liquid level switch (6) is provided on one side of the box body (1), and a quick drain valve (8) is provided at the outer bottom of the box body (1).

2. A silicon wafer cleaning tank according to claim 1, characterized in that: The support frame (13) comprises two I-shaped brackets (12) respectively fixed to the two ends of the interior of the box (1), and an isolation plate (11) mounted on the two I-shaped brackets (12); A plurality of through holes (10) are evenly distributed on the surface of the isolation plate (11), and a layer of silicon wafer is laid on the upper end surface of the isolation plate (11).

3. A silicon wafer cleaning tank according to claim 2, characterized in that: The support frames (13) have multiple groups, and two groups of the support frames (13) adjacent to each other are connected in a separate manner; The overall height of the multiple groups of support frames (13) is lower than the spraying device.

4. A silicon wafer cleaning tank according to claim 1, characterized in that: The spray device comprises two spray pipes (4), the sides of the two spray pipes (4) are connected to the box (1) via connectors (3), one end of the two spray pipes (4) is connected to a water inlet pipe, and the other ends of the two spray pipes (4) are respectively sealed by tightening pipe caps. A plurality of spray holes (5) are evenly distributed on the surfaces of the two spray pipes (4), and the spray holes (5) are all oriented toward the interior of the box (1).

5. The silicon wafer cleaning tank according to claim 1, wherein: There are two bubbling tubes (7), which are arranged in parallel at the inner bottom of the box body (1). A plurality of air outlet holes (9) are evenly distributed on the sides of the two bubbling tubes (7), and the air outlet holes (9) are all facing upwards.

6. The silicon wafer cleaning tank according to claim 1, characterized in that: The diameter of the quick drain valve (8) is 100 mm, and the drain time is 7 seconds.

7. The silicon wafer cleaning tank according to claim 1, characterized in that: The overflow hole (2) is arranged around the upper edge of the box body (1).

8. The silicon wafer cleaning tank according to claim 1, characterized in that: The liquid level switch (6) is arranged at the upper right corner of one side of the box body (1).

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