Laser and ultrasonic composite tin soldering equipment

Abstract

The utility model relates to laser and ultrasonic composite tin soldering equipment. The laser and ultrasonic composite tin soldering equipment comprises a workbench, a moving mechanism, an ultrasonic soldering iron, a laser heater and a tin feeder, the ultrasonic soldering iron, the moving mechanism, the laser heater and the tin feeder are located on the workbench, and the moving mechanism comprises a first moving assembly and a second moving assembly. The ultrasonic soldering iron, the laser heater and the tin feeder are all connected to the first moving assembly and driven by the first moving assembly, the second moving assembly is used for driving a workpiece to move, and an extension line of the ultrasonic soldering iron, an extension line of the laser heater and an extension line of the tin feeder intersect at one point. According to the laser ultrasonic composite soldering equipment, the defects that ultrasonic soldering iron is poor in thermal conductivity and low in temperature returning speed can be overcome.

Description

Technical Field

[0001] The present application relates to the field of soldering technology, and in particular, to a laser ultrasonic composite soldering device. Background Art

[0002] Ultrasonic soldering, a related technology, utilizes ultrasonic vibrations to break down oxide films, allowing for soldering without flux, a green soldering technique. For example, patent number 2014202736617, "Ultrasonic Low-Temperature Soldering Device," states that ultrasonic soldering irons often require metals with poor thermal conductivity, such as titanium alloys or steel, to transmit sound waves. Traditional soldering irons, on the other hand, typically use copper, a metal with good thermal conductivity. Consequently, ultrasonic soldering irons often suffer from poor thermal conductivity and slow reheating speeds during soldering. Utility Model Content

[0003] The purpose of this application is to provide a laser ultrasonic composite soldering device to solve the problems pointed out in the background technology.

[0004] The present application provides a laser-ultrasonic composite soldering device, comprising a workbench, a moving mechanism, an ultrasonic soldering iron, a laser heater and a tin feeder, wherein the ultrasonic soldering iron, the moving mechanism, the laser heater and the tin feeder are located on the workbench, and the moving mechanism comprises a first moving component and a second moving component, wherein the ultrasonic soldering iron, the laser heater and the tin feeder are all connected to and driven by the first moving component, and the second moving component is used to drive the workpiece to move, and the extension line of the ultrasonic soldering iron, the extension line of the laser heater and the extension line of the tin feeder intersect at one point.

[0005] Optionally, the first moving component includes an X-axis motion mechanism, which is arranged above the workbench, and the ultrasonic soldering iron, the laser heater and the solder feeder are all connected to the X-axis motion mechanism to be driven by the X-axis motion mechanism to move along the X-axis.

[0006] Optionally, the first moving assembly further includes a Z-axis motion mechanism, the ultrasonic soldering iron, the laser heater and the solder feeder are all connected to the Z-axis motion mechanism, and the Z-axis motion mechanism is liftably connected to the X-axis motion mechanism.

[0007] Optionally, the Z-axis motion mechanism includes a first linear module.

[0008] Optionally, the tin feeder includes a connecting seat, a tin feeding plate for winding the tin wire, and a tin feeding conduit. The connecting seat is connected to the Z-axis motion mechanism, the tin feeding plate is rotatably arranged on the connecting seat, and the tin feeding conduit is arranged on the connecting seat and guides the tin wire from the tin feeding plate to the intersection of the ultrasonic soldering iron and the laser heater.

[0009] Optionally, the second moving assembly includes a Y-axis motion mechanism, which is arranged on the workbench and is used to drive the workpiece to move along the Y-axis.

[0010] Optionally, the Y-axis motion mechanism includes a second linear module.

[0011] Optionally, the laser-ultrasonic composite soldering equipment further includes a temperature measuring component, which is connected to the laser heater, and an extending direction of the temperature measuring component is the same as an extending direction of the laser heater.

[0012] Optionally, the ultrasonic soldering iron is perpendicular to the workbench.

[0013] The technical solution of the present application includes at least the following effects: the present application uses a laser heater to heat the ultrasonic soldering iron, which can improve the defects of the ultrasonic soldering iron such as poor thermal conductivity and slow temperature recovery speed. At the same time, by using the first movable component and the second movable component, soldering operations can be performed on different positions of the workpiece, thereby improving soldering efficiency.

[0014] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the following detailed description, they are used to explain the present application but do not constitute a limitation of the present application. In the accompanying drawings:

[0016] Figure 1 A schematic structural diagram of a laser ultrasonic composite soldering device provided as an exemplary embodiment of the present application;

[0017] Figure 2 for Figure 1 A structural diagram from another perspective.

[0018] Description of Reference Numerals

[0019] 10-workbench; 21-X-axis motion mechanism; 22-Z-axis motion mechanism; 23-Y-axis motion mechanism; 30-workpiece; 40-laser heater; 50-ultrasonic soldering iron; 61-connecting seat; 62-tin feeding tube; 63-tin wire; 71-first connecting part; 72-second connecting part; 73-third connecting part; 80-temperature measuring component. DETAILED DESCRIPTION

[0020] The following describes the specific embodiments of the present application in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present application and are not intended to limit the present application.

[0021] In this application, unless otherwise indicated, the terms "upper" and "lower" refer to the orientation or position of a product in its usual placement during use, and can be understood as referring to the upper and lower positions along the direction of gravity. These terms also correspond to the "upper" and "lower" positions in the accompanying drawings. Furthermore, it should be noted that terms such as "first" and "second" are used to distinguish one element from another and do not imply order or importance.

[0022] Figure 1 Shows the front view of the laser ultrasonic composite soldering equipment, Figure 2 Shows a top view of the laser ultrasonic composite soldering equipment, as shown in Figure 1 and Figure 2 As shown, an embodiment of the present application provides a laser ultrasonic composite soldering device, which includes a workbench 10, a moving mechanism, an ultrasonic soldering iron 50, a laser heater 40 and a solder feeder.

[0023] The shape of the workbench 10 is not fixed, and it can be circular, rectangular, or other shapes, which is not specifically limited in the embodiment of the present application.

[0024] The ultrasonic soldering iron 50 , the moving mechanism, the laser heater 40 and the solder feeder are located on the workbench 10 .

[0025] The moving mechanism includes a first moving component and a second moving component, wherein the ultrasonic soldering iron 50, the laser heater 40 and the tin feeder are all connected to the first moving component. Thus, the ultrasonic soldering iron 50, the laser heater 40 and the tin feeder can move synchronously under the action of the first moving component. For example, the first moving component can drive the ultrasonic soldering iron 50, the laser heater 40 and the tin feeder to move simultaneously in the length direction or width direction of the workbench 10.

[0026] It should be noted that the laser ultrasonic composite soldering equipment may further include a frame, the first movable assembly is arranged on the frame, and the frame is arranged on the workbench 10. For example, the frame may be an inverted U-shaped structure, and the inverted U-shaped structure includes a first connecting portion 71, a second connecting portion 72, and a third connecting portion 73 connected in sequence, the second connecting portion 72 being perpendicularly connected to the first connecting portion 71 and the third connecting portion 73, respectively, the first connecting portion 71 and the third connecting portion 73 being parallel to each other, and the first movable frame may be connected to the second connecting portion 72. The frame and the workbench 10 may be connected in any suitable manner, for example, the frame and the workbench 10 may be connected together by welding, clamping, or screwing, which is not specifically limited in this application.

[0027] The second movable component is arranged on the workbench 10, and the second movable component is used to drive the workpiece 30 to move. Thus, under the action of the second movable component, the workpiece 30 can be moved to a suitable working position on the workbench 10. Through the first movable component, the positions of the ultrasonic soldering iron 50, the laser heater 40 and the tin feeder can be changed, so that soldering operations can be performed on different positions of the workpiece 30. Thus, under the joint action of the first movable component and the second movable component, the workpiece 30 can be soldered from different positions and angles.

[0028] The extension line of the ultrasonic soldering iron 50, the extension line of the laser heater 40 and the extension line of the tin feeder intersect at one point. The intersection here does not mean that the extension line of the ultrasonic soldering iron 50, the extension line of the laser heater 40 and the extension line of the tin feeder completely overlap at one point, but means that the extension line of the ultrasonic soldering iron 50, the extension line of the laser heater 40 and the extension line of the tin feeder are roughly intersecting. For example, the extension line of the ultrasonic soldering iron 50, the extension line of the laser heater 40 and the extension line of the tin feeder may not be in the same plane, but the extension line of the ultrasonic soldering iron 50 and the extension line of the laser heater 40 are in the same vertical plane, and the extension line of the tin feeder is in another vertical plane parallel to the vertical plane. In this way, the extension lines of the three do not intersect at one point, but are relatively close. It should be noted that the ultrasonic soldering iron 50 can melt the tin wire 63 provided by the tin feeder and use ultrasonic vibration to break the oxide film on the surface of the tin wire.

[0029] The embodiment of the present application utilizes a laser heater 40 to heat the ultrasonic soldering iron 50, thereby improving the defects of the ultrasonic soldering iron 50, such as poor thermal conductivity and slow temperature recovery. At the same time, since the heat-affected zone of the laser heater 40 is small, the temperature at the handle position of the ultrasonic soldering iron 50 is minimally affected, thereby reducing the risk of burns during manual debugging and reducing interference with the ultrasonic components in the ultrasonic soldering iron 50, thereby increasing the stability of the ultrasonic wave.

[0030] like Figure 1 As shown, in an embodiment of the present application, the first moving component includes an X-axis motion mechanism 21, which is arranged above the workbench 10 and parallel to the workbench 10. The ultrasonic soldering iron 50, the laser heater 40 and the tin feeder are all connected to the X-axis motion mechanism 21 so as to be driven by the X-axis motion mechanism 21 to move along the X-axis, thereby driving the ultrasonic soldering iron 50, the laser heater 40 and the tin feeder to reciprocate through the X-axis motion mechanism 21.

[0031] like Figure 1As shown, in the embodiment of the present application, the first moving assembly further includes a Z-axis motion mechanism 22, wherein the motion direction of the X-axis motion mechanism 21 is perpendicular to the workbench 10, and the ultrasonic soldering iron 50, the laser heater 40, and the tin feeder are all connected to the Z-axis motion mechanism 22, and the Z-axis motion mechanism 22 is liftably connected to the X-axis motion mechanism 21. Under the action of the Z-axis motion mechanism 22, the ultrasonic soldering iron 50, the laser heater 40, and the tin feeder connected to the Z-axis motion mechanism 22 can approach or move away from the workbench 10, thereby being able to approach the workpiece 30 on the workbench 10 from different positions. For example, before soldering, the ultrasonic soldering iron 50, the laser heater 40, and the tin feeder are spaced a certain distance from the workpiece 30 in the vertical direction. When soldering is about to begin, under the action of the Z-axis motion mechanism 22, the ultrasonic soldering iron 50, the laser heater 40, and the tin feeder can be lowered to a suitable position to approach the workpiece 30. After soldering, the ultrasonic soldering iron 50, the laser heater 40, and the tin feeder can return to the starting point again.

[0032] In an embodiment of the present application, the Z-axis motion mechanism 22 may include a first linear module, so that the linear motion of the ultrasonic soldering iron 50 , the laser heater 40 and the solder feeder is achieved through the first linear module.

[0033] In other embodiments, the Z-axis motion mechanism 22 may also use a linear motor to accurately control the ultrasonic soldering iron 50, the laser heater 40 and the solder feeder to reach the appropriate positions.

[0034] like Figure 1 As shown, in an embodiment of the present application, the tin feeder includes a connecting seat 61, a tin feeding plate (not shown) for winding the tin wire 63, and a tin feeding conduit 62, wherein the tin feeding plate can be in a circular shape, so that the tin wire 63 can be evenly wound on the tin feeding plate, the connecting seat 61 is connected to the Z-axis motion mechanism 22, the tin feeding plate is rotatably set on the connecting seat 61, and the tin feeding conduit 62 is set on the connecting seat 61, and guides the tin wire 63 from the tin feeding plate to the intersection of the ultrasonic soldering iron 50 and the laser heater 40.

[0035] like Figure 2 As shown, in an embodiment of the present application, the second moving component includes a Y-axis motion mechanism 23, which is arranged on the workbench 10 and is used to drive the workpiece 30 to move along the Y-axis. The workbench 10 is used as a projection reference surface, and the projections of the X-axis motion mechanism 21 and the Y-axis motion mechanism 23 on the workbench 10 are perpendicular.

[0036] In the embodiment of the present application, the Y-axis motion mechanism 23 includes a second linear module, so that the linear motion of the workpiece 30 is achieved through the second linear module.

[0037] In other embodiments, the Z-axis motion mechanism 22 may also use a linear motor to accurately move the workpiece 30 to a suitable position.

[0038] like Figure 1 As shown, in an embodiment of the present application, the laser ultrasonic composite soldering device further includes a temperature measuring component 80, which is connected to the laser heater 40 and extends in the same direction as the laser heater 40. By providing the temperature measuring component 80, the heating temperature of the laser heater 40 can be measured, thereby facilitating the temperature control of the end of the ultrasonic soldering iron 50. The temperature measuring component 80 can be a temperature sensor.

[0039] The heating temperature of the ultrasonic soldering iron 50 may be in the range of 100-500° C., and the frequency of the ultrasonic soldering iron 50 may be in the range of 20-70 kHz.

[0040] In the embodiment of the present application, the wavelength of the laser emitted by the laser heater 40 may be 500-2000 nm.

[0041] The preferred embodiments of the present application are described in detail above with reference to the accompanying drawings. However, the present application is not limited to the specific details in the above embodiments. Within the technical concept of the present application, various simple variations can be made to the technical solution of the present application, and these simple variations all fall within the scope of protection of the present application. It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present application will not further describe various possible combinations.

[0042] In addition, the various implementation methods of the present application can also be arbitrarily combined, as long as they do not violate the concept of the present application, they should also be regarded as the content applied for in the present application.

Claims

1. A laser ultrasonic composite soldering device, characterized in that: It includes a workbench, a moving mechanism, an ultrasonic soldering iron, a laser heater and a tin feeder. The ultrasonic soldering iron, the moving mechanism, the laser heater and the tin feeder are located on the workbench. The moving mechanism includes a first moving component and a second moving component. The ultrasonic soldering iron, the laser heater and the tin feeder are all connected to the first moving component and driven by the first moving component. The second moving component is used to drive the workpiece to move. The extension line of the ultrasonic soldering iron, the extension line of the laser heater and the extension line of the tin feeder intersect at one point.

2. The laser ultrasonic composite soldering equipment according to claim 1, characterized in that: The first moving component includes an X-axis motion mechanism, which is arranged above the workbench. The ultrasonic soldering iron, the laser heater and the solder feeder are all connected to the X-axis motion mechanism to be driven by the X-axis motion mechanism to move along the X-axis.

3. The laser ultrasonic composite soldering equipment according to claim 2, characterized in that: The first moving assembly further includes a Z-axis motion mechanism, the ultrasonic soldering iron, the laser heater and the solder feeder are all connected to the Z-axis motion mechanism, and the Z-axis motion mechanism is connected to the X-axis motion mechanism in a liftable manner.

4. The laser ultrasonic composite soldering equipment according to claim 3, characterized in that: The Z-axis motion mechanism includes a first linear module.

5. The laser ultrasonic composite soldering equipment according to claim 3, characterized in that: The tin feeder includes a connecting seat, a tin feeding plate for winding the tin wire, and a tin feeding conduit. The connecting seat is connected to the Z-axis motion mechanism, the tin feeding plate is rotatably arranged on the connecting seat, and the tin feeding conduit is arranged on the connecting seat and guides the tin wire from the tin feeding plate to the intersection of the ultrasonic soldering iron and the laser heater.

6. The laser ultrasonic composite soldering equipment according to claim 1 or 2, characterized in that: The second moving assembly includes a Y-axis motion mechanism, which is arranged on the workbench and is used to drive the workpiece to move along the Y-axis.

7. The laser ultrasonic composite soldering equipment according to claim 6, characterized in that: The Y-axis motion mechanism includes a second linear module.

8. The laser ultrasonic composite soldering equipment according to claim 1, characterized in that: The laser ultrasonic composite soldering equipment further includes a temperature measuring component, which is connected to the laser heater, and an extending direction of the temperature measuring component is the same as an extending direction of the laser heater.

9. The laser ultrasonic composite soldering equipment according to claim 1, characterized in that: The ultrasonic soldering iron is perpendicular to the workbench.

Images