Laser processing device and laser processing equipment

Abstract

The utility model discloses a laser processing device and laser processing equipment. The laser processing device comprises a supporting cross beam and a plurality of processing assemblies. Each machining assembly comprises at least two machining heads, at least one machining head is provided with a first driving assembly, each machining head is provided with a second driving assembly, the first driving assemblies are used for driving the machining heads to move in the first direction, and the second driving assemblies are used for driving the machining heads to move in the second direction perpendicular to the first direction. The at least two machining heads of the same machining assembly are used for machining workpieces on the same workbench. At least two machining heads are arranged, so that the machining speed of one workpiece to be machined is obviously increased; the multiple second driving assemblies are arranged to drive the machining heads to move in the second direction, and the machining heads are independently controlled and can adapt to more working conditions; at least one machining head is arranged and can move in the first direction, the distance between the machining heads can be adjusted, and the circuit board machining device can be used for machining circuit boards with different sizes and different drilling distances.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing devices, and more specifically, to a laser processing device and laser processing equipment. Background Art

[0002] When laser drilling equipment is drilling holes in PCB boards, one laser head usually processes one processing table. However, with the surge in the number of holes required for sheets such as AI servers, the utilization rate of existing laser processing equipment is low and cannot cope with the factory's increasing order scheduling needs. Utility Model Content

[0003] The purpose of the present invention is to overcome the above-mentioned defects in the prior art and to provide a laser processing device and a laser equipment.

[0004] To achieve the above purpose, the technical solution of the utility model is as follows:

[0005] A laser processing device comprises a supporting beam and a plurality of processing components arranged on the supporting beam along a first direction;

[0006] Each of the processing components includes at least two processing heads arranged in sequence along the first direction, at least one of the at least two processing heads is provided with a first drive component, and each of the processing heads is provided with a second drive component. The first drive component is used to drive the processing head to move along the first direction, and the second drive component is used to drive the processing head to move along a second direction perpendicular to the first direction. At least two processing heads of the same processing component are used to process the workpiece on the same workbench.

[0007] Optionally, one of the at least two processing heads is provided with a first drive assembly, and each of the processing heads is provided with a second drive assembly.

[0008] Optionally, the supporting beam is further connected to a plurality of dust collection components, and each of the dust collection components is correspondingly arranged below each of the processing components.

[0009] Optionally, a plurality of hollow areas are provided on the dust collection component, and each of the hollow areas is located directly below each of the processing heads, so that the dust generated by processing is adsorbed by the negative pressure formed by the hollow areas.

[0010] Optionally, the dust suction component is provided with an air knife, and the air knife is arranged on a side of the dust suction component close to the hollow area.

[0011] Optionally, a light source is installed on the side of one of the hollow areas on the dust collection component.

[0012] Optionally, a laser and a light path conduction component are also provided on the support beam; the laser and the multiple processing components are arranged relative to each other along a third direction, and the third direction is perpendicular to the first direction and the second direction; the light path conduction component is arranged on the support beam, and the bracket connects the light path conduction component and the support beam.

[0013] Optionally, the laser processing head includes a galvanometer motion assembly, the galvanometer motion assembly is provided with an optical path element, and the optical path element is connected to the optical path conduction assembly.

[0014] Optionally, at least one of the machining heads has a CCD positioning system on a side of the galvanometer motion assembly away from the supporting beam.

[0015] A laser processing device comprises a base, a plurality of workbenches arranged on the base, and any of the above-mentioned laser processing devices, wherein the laser processing device is arranged on the base, the plurality of workbenches are arranged in sequence along a first direction, and each workbench can independently move along a third direction, and at least two processing heads of the same processing component are used to process the workpiece on the same workbench.

[0016] The implementation of the present invention will have the following beneficial effects:

[0017] The present invention provides a laser processing device and laser equipment. The laser processing device includes a supporting beam and a plurality of processing assemblies arranged on the supporting beam along a first direction. Each processing assembly includes at least two processing heads arranged sequentially along the first direction. At least one of the at least two processing heads is provided with a first drive assembly. Each processing head is provided with a second drive assembly. The first drive assembly is used to drive the processing head to move along the first direction, and the second drive assembly is used to drive the processing head to move along a second direction perpendicular to the first direction. The at least two processing heads of the same processing assembly are used to process workpieces on the same workbench. By providing at least two processing heads to process the same PCB board, the processing efficiency of the PCB board to be processed is significantly improved. By enabling each processing head to move independently along the second direction and at least one processing head to move along the first direction, the flexibility of the laser equipment processing is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] in:

[0020] Figure 1 This is a schematic diagram of the laser processing device provided by the utility model.

[0021] Figure 2 This is another schematic diagram of the laser processing device provided by the present invention.

[0022] Figure 3 This is a schematic diagram of a processing head in the laser processing device provided by the present invention.

[0023] Figure 4 This is another schematic diagram of the processing head in the laser processing device provided by the present invention.

[0024] Figure 5 This is a schematic diagram of a dust collection component in a laser processing device provided by the present invention.

[0025] Figure 6 This is a schematic diagram of the laser processing equipment provided by the utility model.

[0026] 1-support beam, 2-processing assembly, 21-processing head, 211-first processing head, 212-second processing head, 22-first drive assembly, 221-first motor, 222-first linear rail, 223-first lead screw, 223-second drive assembly, 231-second motor, 222-second lead screw, 223-second linear rail, 3-dust suction assembly, 30-hollow area, 301-first hollow area, 302-second hollow area, 31-first part, 32-second part, 4-air knife, 5-light source, 6-laser, 7-optical path conduction assembly, 70-optical path element, 71-bracket, 8-CCD positioning system, X-first direction, Z-second direction, Y-third direction, 100-base, 200-workbench, 300-laser processing device. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] This embodiment provides a laser processing device, comprising a supporting beam 1 and a plurality of processing components 2 arranged on the supporting beam 1 along a first direction X;

[0029] Each processing assembly 2 includes at least two processing heads 21 arranged in sequence along the first direction X, at least one of the at least two processing heads 21 is provided with a first drive assembly 22, and each processing head 21 is provided with a second drive assembly 23. The first drive assembly 22 is used to drive the processing head 21 to move along the first direction X, and the second drive assembly 23 is used to drive the processing head 21 to move along a second direction Z perpendicular to the first direction X. At least two processing heads 21 of the same processing assembly 2 are used to process the workpiece on the same workbench.

[0030] Optionally, at least one of the two processing heads 2 is provided with a first drive assembly X, and each processing head 21 is provided with a second drive assembly 23 .

[0031] For example, refer to Figure 1 , Figure 1 The laser processing device includes a support beam 1 and two processing assemblies 2 mounted on the support beam 1, each of which includes two processing heads 21. In this embodiment, the processing heads 21 include a first processing head 211 and a second processing head 212. A first drive assembly 22 is used to drive the second processing head 212 to move in a first direction X. Two second drive assemblies 23 respectively drive the first processing head 211 and the second processing head 212 to move in a second direction Z. The first processing head 211 and the second processing head 212 are used to process a workpiece on the same workbench. The first direction X is the extension direction of the support beam 1, and the second direction Z is the direction from the support beam 1 toward the workbench.

[0032] It should be noted that, in this embodiment, the first drive assembly 22 and the second drive assembly 23 are both controlled and driven by a lead screw and a motor. Figure 1 The second driving assembly 23 includes a second motor 231 and a second lead screw 232 and a second linear rail 233. The second motor 231 drives the second lead screw 232 to drive the machining head 21 to reciprocate along the second linear rail 233, and the machining head 21 reciprocates along the second direction Z. Figure 3 、 Figure 4 The first driving assembly 22 includes a first motor 221, a first linear rail 222 and a first lead screw 223. The first motor 221 drives the first lead screw 223 to drive the second processing head 212 to reciprocate along the first linear rail 222, and the second processing head 212 reciprocates along the first direction X. Specifically, refer to Figure 3 The first linear rail 222 is fixed on the bottom plate 24, and the first linear rail 222 and the bottom plate 24 reciprocate along the second linear rail.

[0033] It can be understood that more than two processing components 2 can process more than two workpieces to be processed at the same time, and the processing speed is increased exponentially. Moreover, since the spacing between the two processing heads 21 of the processing component 2 can be adjusted, the sizes of the workpieces to be processed by optical processing can be the same or different, further broadening the applicable working conditions.

[0034] By providing each processing head 21 with a second drive assembly 23, this embodiment can independently control the laser processing of each processing head 21, adapting to a wider range of working conditions. By providing at least one of the at least two processing heads 21 with a first drive assembly 22, the spacing between at least two processing heads 21 can be adjusted, enabling the laser processing apparatus to process circuit boards of varying sizes and with varying drilling spacings. By providing multiple sets of processing assemblies 2, with the first drive assembly 22 in each processing assembly 2 independently controlled, the laser processing apparatus can simultaneously process circuit boards with varying drilling spacings.

[0035] In some optional embodiments, combined with Figure 1 、 Figure 5 The supporting beam 1 is connected to a plurality of dust collection components 3 , and each dust collection component is correspondingly arranged below each processing component 2 and fixedly connected to the supporting beam 1 .

[0036] Specifically, a plurality of hollow areas 30 are provided on the dust collecting assembly 3 , and each hollow area 30 is located directly below each processing head 21 . The negative pressure formed by the hollow area 30 adsorbs the dust generated during processing.

[0037] For example, continue to refer to Figure 1 , refer to Figure 1 , Figure 1 In the example, a laser processing device includes a supporting beam 1 and two processing components 2 arranged on the supporting beam 1, each processing component 2 includes two processing heads 21; Figure 5 The dust collection assembly 3 includes a first part 31 and a second part 32. The first part 31 and the second part 32 are connected to form a V-shaped dust collection assembly 3. The first part 31 is correspondingly arranged below the first processing head 211, and the second part 32 is correspondingly arranged below the second processing head 212.

[0038] A first hollow area 301 is provided at the end of the first part 31 away from the supporting beam 1, and along the second direction, the orthographic projection of the first processing head 211 at least partially overlaps with the first hollow area 301; a second hollow area 302 is provided at the end of the second part 32 away from the supporting beam 1, and along the second direction, the orthographic projection of the second processing head 212 at least partially overlaps with the second hollow area 302.

[0039] It should be noted that, while in the prior art, the dust collection assembly moves with the processing head, in this embodiment, the dust collection assembly 3 is fixed to the support beam 1, reducing the weight of the processing head and ensuring a more stable connection. The dust collection assembly 3 is positioned at the bottom of the support beam 1, closer to the workbench, effectively collecting dust generated during processing. In this embodiment, the first processing head 211 and the second processing head 212 process the same workpiece. The first and second parts 31, 32 corresponding to the first and second processing heads 211, 212 are integrated into a single dust collection assembly 3, reducing installation steps and improving installation accuracy.

[0040] Optional, see Figure 5 , along the first direction X, the width D1 of the second hollow area 302 is greater than the width D2 of the first hollow area 301 .

[0041] It can be understood that since the first processing head 211 corresponds to the first hollow area 301 and the second processing head corresponds to the second hollow area 302, the first processing head 211 is fixed in position along the x-axis direction, and the second processing head 212 is movable in position along the x-axis direction, so the width of the second hollow area 302 is greater than the width of the first hollow area 301, ensuring that the laser of the second processing head 212 can be emitted from the second hollow area 302.

[0042] In some optional embodiments, referring to Figure 5 The dust collection component 3 is provided with an air knife 4, which is arranged on one side of the dust collection component 3 close to the hollow area 30.

[0043] It can be understood that a wind knife 4 structure is designed at the light outlet of the dust suction component 3, and the wind knife 4 blows air in the direction close to the workpiece to form a wind wall. Specifically, one end of the wind knife can be connected to an external air source (such as a high-pressure air pump), and the opening of the other end faces downward, so that the wind knife 4 can blow air downward to prevent dust from flying upward and contaminating the lens.

[0044] In some optional embodiments, combined with Figure 1 、 Figure 2 A laser 6 and an optical path conduction component 7 are also provided on the supporting beam 1; the laser 6 and the multiple processing components 2 are arranged opposite to each other along the third direction Y, and the third direction Y is perpendicular to the first direction X and the second direction Z; the optical path conduction component 7 is arranged on the supporting beam 1, and the bracket 71 connects the optical path conduction component 7 and the supporting beam 1.

[0045] Optionally, when the laser processing apparatus includes multiple processing components 2, the number of lasers 6 is also multiple, and the number of lasers 6 corresponds to the number of processing components 2, with each laser 6 independently controlling each processing component 2. The laser processing apparatus can simultaneously laser process multiple workpieces, and the sizes of the workpieces to be laser processed can be the same or different.

[0046] It can be understood that the laser 6 provides laser light to the processing component 2 through the optical path conduction component 7 on the supporting beam 1. The optical path conduction component 7 is built above the supporting beam 1 through the bracket design, and optical design space is reserved, which fully utilizes all the space of the supporting beam 1.

[0047] In some optional embodiments, combined with Figure 1 、 Figure 2 The processing component 2 includes a galvanometer motion component 20 , on which an optical path element 70 is provided, and the optical path element 70 is connected to the optical path conduction component 7 .

[0048] It is understood that laser 6 provides lasers with multiple power parameters, primarily providing wide pulses for micro-hole machining. Optical path transmission assembly 7 is used for selective transmission, such as laser redirection and beam expansion. The galvanometer assembly is primarily responsible for focusing and adjusting the focus, adjusting the defocus to allow machining of different types of holes, such as pits, counterbores, blind holes, tapered holes, straight holes, and barrel holes. Laser 6 emits laser light, which, after passing through the galvanometer motion assembly 20, is directed to a laser that meets the drilling requirements, thereby drilling the FPC board.

[0049] In some optional embodiments, at least one of the machining heads 21 further includes a CCD positioning system 8 on a side of the galvanometer motion assembly 20 away from the supporting beam 1 .

[0050] For example, continue to refer to Figure 1 There is also a CCD positioning system 8 on the side of the galvanometer motion assembly 20 of the first processing head 211 away from the supporting beam 1.

[0051] It is understood that laser 6 emits laser light, which passes through galvanometer motion assembly 20 and then outputs laser light that meets the drilling requirements, thereby drilling the FPC board. The first processing head 211 is designed with a CCD positioning system 8 to meet the machine's automatic processing target positioning. The first processing head 211 and the second processing head 212 are a group processing the same board, so the CCD positioning system 8 of the second processing head 212 is eliminated, effectively reducing the machine cost.

[0052] In some optional embodiments, a light source is installed on the side of one of the hollow areas 30 of the dust collection assembly 3.

[0053] Exemplary, continue to combine Figure 1 、 Figure 5 A light source 5 is provided at one end of the hollow area 301 of the first portion 31 away from the supporting beam 1 .

[0054] It is understandable that the light source 5 may be an infrared light source, which provides illumination for the CCD positioning system 8 to assist in positioning.

[0055] This embodiment provides a laser processing device, including a base 100, a plurality of workbenches 200 arranged on the base 100, and a laser processing device 300. The laser processing device 300 is the laser processing device in any of the above embodiments. The laser processing device 300 is arranged on the base 100, and the plurality of workbenches 200 are arranged in sequence along a first direction X, and each workbench 200 can independently move along a third direction Y. At least two processing heads 21 of the same processing component 2 are used to process the workpiece on the same workbench 200.

[0056] It can be understood that the laser processing equipment provided in this embodiment processes the workpiece on the same workbench 200 by setting two processing parts, thereby significantly improving the processing speed.

[0057] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A laser processing device, characterized in that: It includes a supporting beam and a plurality of processing components arranged on the supporting beam along a first direction; Each of the processing components includes at least two processing heads arranged in sequence along the first direction, at least one of the at least two processing heads is provided with a first drive component, and each of the processing heads is provided with a second drive component. The first drive component is used to drive the processing head to move along the first direction, and the second drive component is used to drive the processing head to move along a second direction perpendicular to the first direction. At least two processing heads of the same processing component are used to process the workpiece on the same workbench.

2. The laser processing device according to claim 1, wherein One of the at least two processing heads is provided with the first driving assembly, and each of the processing heads is provided with the second driving assembly.

3. The laser processing device according to claim 1, wherein The supporting beam is also connected to a plurality of dust collection components, and each of the dust collection components is correspondingly arranged below each of the processing components.

4. The laser processing device according to claim 3, wherein: The dust collection component is provided with a plurality of hollow areas, each of which is located directly below each of the processing heads. The negative pressure formed by the hollow areas adsorbs the dust generated by processing.

5. The laser processing device according to claim 4, characterized in that The dust collection component is provided with an air knife, and the air knife is arranged on a side of the dust collection component close to the hollow area.

6. The laser processing device according to claim 4, characterized in that A light source is installed on the side of one of the hollow areas on the dust collection component.

7. The laser processing device according to claim 1, wherein A laser and an optical path conduction component are also provided on the supporting beam; the laser and the plurality of processing components are arranged relative to each other along a third direction, and the third direction is perpendicular to the first direction and the second direction; the optical path conduction component is arranged on the supporting beam, and a bracket connects the optical path conduction component and the supporting beam.

8. The laser processing device according to claim 7, wherein: The processing head includes a galvanometer motion assembly, an optical path element is provided on the galvanometer motion assembly, and the optical path element is connected to the optical path conduction assembly.

9. The laser processing device according to claim 8, characterized in that At least one of the machining heads has a CCD positioning system on a side of the galvanometer motion assembly away from the supporting beam.

10. A laser processing device, characterized in that: It includes a base, a plurality of workbenches arranged on the base, and the laser processing device according to any one of claims 1 to 9, wherein the laser processing device is arranged on the base, the plurality of workbenches are arranged in sequence along a first direction, and each of the workbenches can independently move along a third direction, and at least two processing heads of the same processing component are used to process the workpiece on the same workbench.

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