Stamping die for circuit board processing

Abstract

The utility model belongs to the technical field of stamping equipment, and particularly relates to a stamping die for circuit board processing, which comprises a lower die table, a stand column and an upper die table, the lower die table is fixedly connected with the upper die table through the stand column, a hydraulic cylinder is fixedly mounted at the center of the upper die table, an upper die seat is fixedly connected to the output end of the hydraulic cylinder, and a lower die seat is fixedly connected to the output end of the upper die seat. The upper die base slides on the upper die table through the guide rods. According to the utility model, the upper die holder can move up and down under the driving of the hydraulic cylinder and is matched with the lower die to complete the punching action; the upper die base slides stably through the guide rods, and the upper die base and the upper die body are rapidly assembled and disassembled through the clamping grooves. The overall replacement is convenient; the lower die is fixed on the lower die table through a bolt to ensure the accurate position; the design of the electric turntable and the electric push rod can provide additional control, the force arm and the electric sucker are used for adsorbing and positioning the circuit board, feeding and discharging are facilitated, and the design can improve the production efficiency and the operation convenience.

Description

Technical Field

[0001] The utility model relates to the technical field of stamping equipment, in particular to a stamping die for processing circuit boards. Background Art

[0002] Circuit board stamping dies are stamping tools specifically used to manufacture circuit boards; their function is to punch out mounting holes for various electronic components, connector slots, circuit patterns, etc. on the circuit board.

[0003] This mold is usually made of a high-hardness material to ensure that it will not deform or be damaged during the stamping process. The design and manufacture of the mold need to be very precise to ensure that the stamped circuit board meets the specifications and quality requirements.

[0004] When using a circuit board stamping die, the circuit board is first placed on the die of the die, and then pressure is applied by the stamping equipment to make the punch enter the die, thereby forming the desired shape on the circuit board; the stamping process can complete the processing of multiple parts at one time, improving production efficiency; the accuracy problem and blanking problem in the existing stamping process need to be solved in a timely manner. Therefore, we propose a stamping die for circuit board processing to solve the above problems. Utility Model Content

[0005] (1) Technical problems solved

[0006] In view of the deficiencies in the prior art, the present invention provides a stamping die for processing a circuit board, which solves the accuracy problem raised in the above-mentioned background technology.

[0007] (2) Technical solution

[0008] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0009] A stamping die for circuit board processing comprises a lower die table, a column and an upper die table, wherein the lower die table is fixedly connected to the upper die table via the column, a hydraulic cylinder is fixedly installed at the center of the upper die table, an upper die base is fixedly connected to the output end of the hydraulic cylinder, the upper die base slides with the upper die table via a guide rod, the upper die base slides and engages the upper die via an engaging groove, a lower die is engaged and slid in the lower die table, and the lower die is fixed to the lower die table via bolts; an electric turntable is provided at one place of the lower die table, an electric push rod is installed on the electric turntable, a force arm is fixedly installed on the electric push rod, and an electric suction cup is fixedly installed at one end of the force arm.

[0010] Furthermore, the upper mold base is rotated to connect the fastener, and the fastener bolts close the upper mold.

[0011] Furthermore, a buckle groove is provided on the lower mold.

[0012] Furthermore, the engaging shape between the upper die base and the upper die is different from the engaging shape between the lower die base and the lower die.

[0013] Furthermore, the engagement depth between the upper mold and the upper mold base, and between the lower mold base and the lower mold is to one point inside.

[0014] (3) Beneficial effects

[0015] Compared with the prior art, the present invention provides a stamping die for circuit board processing, which has the following beneficial effects:

[0016] The utility model is driven by a hydraulic cylinder, and the upper die base can move up and down to cooperate with the lower die to complete the stamping action; the upper die base can slide smoothly through the guide rod, and can be quickly installed and disassembled with the upper die through the engaging groove, so that the entire die can be replaced conveniently; the lower die is fixed to the lower die table by bolts to ensure accurate positioning; the design of the electric turntable and the electric push rod can provide additional control, and the force arm and the electric suction cup are used to adsorb and position the circuit board to facilitate unloading. Such a design can improve production efficiency and operational convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of the utility model;

[0018] Figure 2 It is a side view of the structure of the utility model.

[0019] In the figure: 1. Lower die table; 2. Column; 3. Upper die table; 4. Hydraulic cylinder; 5. Upper die base; 6. Guide rod; 7. Upper die; 8. Fastener; 9. Lower die; 10. Buckle slot; 11. Electric turntable; 12. Electric push rod; 13. Lever; 14. Electric suction cup. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Example

[0022] like Figure 1-2As shown, an embodiment of the present invention proposes a stamping die for circuit board processing, comprising a lower die table 1, a column 2 and an upper die table 3. The lower die table 1 is fixedly connected to the upper die table 3 through the column 2. A hydraulic cylinder 4 is fixedly installed at the center of the upper die table 3. The hydraulic cylinder 4 is the driving power. An upper die base 5 is fixedly connected to the output end of the hydraulic cylinder 4. The upper die base 5 slides with the upper die table 3 through a guide rod 6. The guide rod 6 can prevent the position from being cheap and ensure accuracy. The upper die base 5 slides and engages with the upper die 7 through the engaging groove. The lower die table 1 is engaged and slid with a lower die 9 to ensure that the accuracy will not deviate. The tool 9 is fixed to the lower die table 1 by bolts; an electric turntable 11 is provided at one part of the lower die table 1, and an electric push rod 12 is installed on the electric turntable 11, and a force arm 13 is fixedly installed on the electric push rod 12, and an electric suction cup 14 is fixedly installed on one end of the force arm 13. This part requires the assistance of circuit control. The circuit control of this part is the existing technology control. The electric suction cup 14 is used for adsorption, and then the electric push rod 12 is used for lifting and lowering. The electric turntable 11 is transformed to facilitate unloading. At the same time, the electric turntable 11, the electric push rod 12 and the electric suction cup 14 adopt conventional market models, which are not described in detail in this utility model.

[0023] like Figure 1 As shown, in some embodiments, the upper mold base 5 is rotated to connect the fastener 8, and the fastener 8 is bolted to the upper mold 7; this design can make the connection between the upper mold 7 and the upper mold base 5 more secure, and is also convenient for disassembly and maintenance; the bolt-fastening method can provide reliable fastening force to ensure that the upper mold 7 will not loosen or fall off during use.

[0024] like Figure 1 As shown, in some embodiments, a buckle groove 10 is provided on the lower mold 9 to facilitate installation and disassembly.

[0025] like Figure 2 As shown, in some embodiments, the engaging shape between the upper die base 5 and the upper die 7 is different from the engaging shape between the lower die base 1 and the lower die 9, forming a precise fit.

[0026] like Figure 2 As shown, in some embodiments, the engagement depth of the upper mold 7 and the upper mold base 5 as well as the lower mold base 1 and the lower mold 9 is to an internal point; if the engagement depth is too deep, it may cause damage to the mold or deformation of the stamping part; if the engagement depth is too shallow, looseness may occur.

[0027] When in use, first place the circuit board on the lower mold 9 of the mold, turn it by the electric turntable 11, lift it by the electric push rod 12, unload it by the electric suction cup 14, and then drive it by the hydraulic cylinder 4 for stamping.

[0028] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A stamping die for processing a circuit board, comprising a lower die table (1), a column (2) and an upper die table (3), characterized in that: The lower die table (1) is fixedly connected to the upper die table (3) through a column (2); a hydraulic cylinder (4) is fixedly installed at the center of the upper die table (3); an upper die seat (5) is fixedly connected to the output end of the hydraulic cylinder (4); the upper die seat (5) slides with the upper die table (3) through a guide rod (6); the upper die seat (5) slides and engages the upper die (7) through an engaging groove; a lower die (9) is engaged and slid in the lower die table (1); the lower die (9) is fixed to the lower die table (1) through bolts; an electric turntable (11) is provided at one part of the lower die table (1); an electric push rod (12) is installed on the electric turntable (11); a force arm (13) is fixedly installed on the electric push rod (12); an electric suction cup (14) is fixedly installed at one end of the force arm (13).

2. A stamping die for circuit board processing according to claim 1, characterized in that: The upper die base (5) is rotatably connected to a fastener (8), and the fastener (8) is bolted to the upper die (7).

3. The stamping die for circuit board processing according to claim 1, characterized in that: A buckle groove (10) is provided on the lower mold (9).

4. The stamping die for circuit board processing according to claim 1, characterized in that: The engaging shape between the upper die base (5) and the upper die (7) is different from the engaging shape between the lower die base (1) and the lower die (9).

5. The stamping die for circuit board processing according to claim 4, characterized in that: The engagement depth of the upper mold (7) and the upper mold base (5) as well as the lower mold platform (1) and the lower mold (9) reaches one point inside.

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