Chip assembly and ink box

Abstract

The utility model provides a chip assembly and an ink cartridge with the chip assembly, the chip assembly is used for forming electric contact with a contact pin so as to establish communication connection with imaging equipment, and the chip assembly comprises a radio frequency chip and a chip body which are separately arranged at an interval. The radio frequency chip comprises a first substrate, a plurality of contact parts and a first signal transceiving part, wherein the contact parts and the first signal transceiving part are arranged on the first substrate. The contact parts are used for being electrically contacted with contact pins of imaging equipment and electrically connected with the first signal transceiving part. The chip body comprises a second substrate, and a second signal transceiving part and a memory which are arranged on the second substrate, the memory stores the information of the ink box, and the second signal transceiving part is electrically connected with the memory; the first signal receiving part is used for converting the electric signal and the electromagnetic wave signal received by the radio frequency chip; the second signal receiving part is used for converting the electric signal and the electromagnetic wave signal received by the chip body; the chip assembly provided by the utility model can better protect the memory and avoid short circuit of the chip assembly.

Description

[0001] This utility model patent application claims priority to the applicant's prior application in China, entitled "Imaging Material Box" and application number 202322242221.7, filed on August 18, 2023, and the prior application in China, entitled "Imaging Material Box" and application number 202322338135.6, filed on August 29, 2023, and the prior application in China, entitled "Imaging Material Box" and application number 202322496455.4, filed on September 13, 2023. The entire contents of the prior applications are cross-referenced in this application. Technical Field

[0002] The utility model relates to the field of imaging, in particular to a chip component and an ink cartridge which are detachably installed in an imaging device. Background Art

[0003] Existing imaging devices include laser printers, copiers, inkjet printers, etc., and each of these imaging devices is equipped with a box containing imaging materials. The imaging materials vary depending on the type of imaging device. For example, when the imaging device is a laser printer, the imaging material is toner, and when the imaging device is an inkjet printer, the imaging material is ink.

[0004] Typically, in order to establish a communication connection between the box and the imaging device, a chip assembly including a chip and a substrate is mounted on the box. When the box is mounted to a predetermined position of the imaging device, the contact portion of the chip assembly contacts the contact pins of the imaging device. Multiple contact portions of existing chips are arranged on the same side of the same substrate. In the limited surface area of ​​the substrate, the arrangement density of these contact portions is relatively high, and the design of the contact portions will be greatly restricted. At the same time, these closely arranged contact portions are also prone to short circuits. Utility Model Content

[0005] The present invention provides a chip assembly and ink cartridge using the following technical solutions to solve or optimize at least one of the above technical problems. The specific technical solutions are as follows:

[0006] The first aspect of the present invention provides a chip component, which is arranged on an imaging material box that is detachably mounted on an imaging device having a contact pin, and is used to form an electrical contact with the contact pin to establish a communication connection with the imaging device. The chip component includes a radio frequency chip and a chip body that are separately arranged at intervals, and the radio frequency chip includes a first substrate and a plurality of contact portions and a first signal transceiver portion arranged on the first substrate, and the plurality of contact portions are used to electrically contact the contact pin of the imaging device and are electrically connected to the first signal transceiver portion; the chip body includes a second substrate and a second signal transceiver portion and a memory arranged on the second substrate, the memory stores information of the ink cartridge, and the second signal transceiver portion is electrically connected to the memory; the first signal receiving portion is used to convert the electrical signal received by the radio frequency chip into an electromagnetic wave signal; the second signal receiving portion is used to convert the electrical signal received by the chip body into an electromagnetic wave signal.

[0007] Furthermore, when the contact part is electrically connected to the contact pin, the radio frequency chip receives an electrical signal from the imaging device, and then the first signal transceiver part can convert the electrical signal received from the contact pin into an electromagnetic wave signal and transmit it to the chip body; when the second signal transceiver part converts the received electromagnetic wave signal into an electrical signal and exchanges information with the memory; when the second signal transceiver part converts the electrical signal received from the memory into an electromagnetic wave and sends it back to the first signal transceiver part; when the first signal transceiver part converts the electromagnetic wave signal received from the second signal transceiver part into an electrical signal and outputs it to the multiple contact parts.

[0008] Furthermore, the first signal receiving unit is a radio frequency tag, and the second signal receiving unit is a reader.

[0009] Furthermore, the radio frequency tag may be either an active tag or a passive tag.

[0010] Furthermore, the plurality of contact portions include a data terminal, a clock terminal, a reset terminal, a power terminal and a ground terminal.

[0011] Furthermore, the plurality of contact portions are asymmetrically distributed on the surface of the substrate.

[0012] Furthermore, the data terminal, the reset terminal and the power terminal are arranged on the -x side of the first substrate, and the ground terminal is arranged on the +x side of the first substrate.

[0013] A second aspect of the present invention provides an ink cartridge that is removably installed in an imaging device having a stylus. The ink cartridge includes a housing for containing ink and the aforementioned chip assembly, which is disposed on the housing and configured to establish electrical contact with the stylus to establish a communication connection with the imaging device. To more clearly illustrate the aforementioned objectives, technical solutions, and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of the ink cartridge involved in the utility model.

[0015] Figure 2A This is an exploded view of the chip assembly and the housing after being separated according to the first embodiment of the present invention.

[0016] Figure 2B This is a three-dimensional diagram of the chip after the second group of contact parts in the chip assembly involved in the first embodiment of the present invention are deformed.

[0017] Figure 3A It is a three-dimensional diagram of the second positioning plate in the chip assembly involved in the first embodiment of the present invention.

[0018] Figure 3B It is along Figure 3A After cutting along the AA direction, the side view is observed along the z direction.

[0019] Figure 4 This is an exploded view of the chip assembly according to the first embodiment of the present invention after the third positioning plate is separated from the chip.

[0020] Figure 5A This is a plan view of the first chip in the chip assembly according to the second embodiment of the present invention observed along the x-direction.

[0021] Figure 5B This is a plan view of the second chip in the chip assembly according to the second embodiment of the present invention observed along the x-direction.

[0022] Figure 6 This is an exploded view of the chip assembly and the housing after being separated according to the third embodiment of the present invention.

[0023] Figure 7 This is an exploded view of the chip assembly involved in the fourth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0024] Figure 8 This is an exploded view of the chip assembly involved in the fifth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0025] Figure 9This is an exploded view of the chip assembly involved in Example 6 of the present utility model after the chip and the ink cartridge shell are separated.

[0026] Figure 10 This is an exploded view of the chip assembly involved in Example 7 of the present utility model after the chip and the ink cartridge shell are separated.

[0027] Figure 11A and Figure 11B This is an exploded view of the chip assembly involved in Example 8 of the present utility model after the chip and the ink cartridge shell are separated.

[0028] Figure 12 This is an exploded view of the chip assembly involved in the ninth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0029] Figure 13 This is an exploded view of the chip assembly involved in the tenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0030] Figure 14 It is a simplified plan view of the chip assembly involved in the eleventh embodiment of the present invention observed along the -x direction.

[0031] Figure 15 It is a simplified plan view of the chip involved in the eleventh embodiment of the present invention observed along the +x direction.

[0032] Figure 16 This is an exploded view of the chip assembly involved in Example 12 of the present utility model after the chip and the ink cartridge shell are separated.

[0033] Figure 17 This is the first exploded view of the chip assembly involved in Example 13 of the present utility model after the chip and the ink cartridge shell are separated.

[0034] Figure 18 This is a second exploded view of the chip assembly involved in Example 13 of the present utility model after the chip and the ink cartridge shell are separated.

[0035] Figure 19 This is an exploded view of the chip assembly involved in Example 14 of the present utility model after the chip and the ink cartridge shell are separated.

[0036] Figure 20 This is an exploded view of the chip assembly involved in Example 15 of the present utility model after the chip and the ink cartridge shell are separated.

[0037] Figure 21A and Figure 21B This is an exploded view of the chip assembly involved in Example 16 of the present utility model after the chip and the ink cartridge shell are separated.

[0038] Figure 21C This is a schematic diagram of the chip assembly involved in the sixteenth embodiment of the present invention when viewed along the y direction.

[0039] Figure 21D This is a schematic diagram of the chip assembly involved in the sixteenth embodiment of the present invention when viewed along the x-direction.

[0040] Figures 22A to 22C This is a schematic diagram of the internal structure of the ink cartridge involved in Example 16 of the present utility model.

[0041] Figure 22D This is a three-dimensional diagram of the ink cartridge involved in Example 16 of the present utility model when viewed from another angle. DETAILED DESCRIPTION

[0042] The embodiments of the present invention are described in detail below with reference to the accompanying drawings. Figure 1 It is a three-dimensional diagram of the ink cartridge involved in the utility model.

[0043] As described in the background art, the type of imaging material contained in the imaging material box 10 varies depending on the type of imaging device. The imaging material can be toner, in which case the imaging material box is a processing box or a powder cartridge. The imaging material can also be ink, in which case the imaging material box is an ink cartridge. However, regardless of the type of imaging material, the chip assembly 103 described below is applicable; the following description takes the ink cartridge as an example.

[0044] As shown in the figure, the ink cartridge 10 includes a shell 101 for containing ink, an ink outlet portion 102 (imaging material discharge portion) arranged on the shell 101, and a chip component 103. The ink outlet portion 102 is used to combine with an ink absorption component provided in the imaging device to supply ink to the imaging device. The chip component 103 is used to establish a communication connection with the imaging device so that the imaging device can obtain the ink cartridge information stored in the chip component 103. Specifically, the chip component 103 realizes the communication connection by forming electrical contact with the contact pin provided in the imaging device.

[0045] To make the following description clearer, the ink cartridge is defined as having the x-direction, y-direction and z-direction shown in the figure, based on the posture when the ink cartridge is installed in the imaging device. The x-direction, y-direction and z-direction intersect with each other. Preferably, the x-direction, y-direction and z-direction are perpendicular to each other, wherein the x-direction has opposite +x-direction (front) and -x-direction (back), the y-direction has opposite +y-direction (left) and -y-direction (right), the z-direction has opposite +z-direction (upper) and -z-direction (lower), and the -z-direction is the direction of gravity. The ink cartridge 10 can be installed and removed along the x-direction as well as along the z-direction.

[0046] The shell 101 is used to hold ink and has a front side wall 101a facing the +x direction and a lower side wall 101d facing the -z direction. The front side wall 101a and the lower side wall 101d are adjacent to each other. In the following embodiment, the ink outlet 102 is arranged on the lower side wall 101d, and the chip assembly 103 can be arranged on the lower side wall 101d or on a side wall different from the lower side wall 101d. The coupling 11 for locking the ink cartridge 10 in the imaging device is directly or indirectly arranged on the front side wall 101a, and along the x direction, at least a portion of the coupling 11 is located in front of the front side wall 101a.

[0047] Furthermore, the shell 101 is also provided with a chip component mounting portion 13, and the chip component 103 is mounted in the chip component mounting portion 13. In practice, the chip component 103 can be mounted in the chip component mounting portion 13 in a non-detachable manner or in a detachable manner. Obviously, when the chip component 103 is detachable relative to the chip component mounting portion 13 (shell 101), it is more conducive to the replacement, maintenance, upgrade, recycling, regeneration and other operations of the chip component 103, thereby reducing the use cost of the chip component 103.

[0048] [Example 1]

[0049] Figure 2A This is an exploded view of the chip assembly and the housing after being separated according to the first embodiment of the present invention.

[0050] In this embodiment, the chip component 103 is installed to the chip component mounting portion 13 in a detachable manner. For example, the chip component 103 is installed and removed along the z direction, or installed and removed along the y direction. The figure shows a structure in which the chip component mounting portion 13 is open to the -y direction. At this time, the chip component 103 is installed toward the chip component mounting portion 13 along the +y direction, and is removed from the chip component mounting portion 13 along the -y direction.

[0051] The chip assembly 103 includes a chip 104 and a positioning plate 105. The chip 104 is first mounted on the positioning plate 105, and then the positioning plate 105 is mounted on the chip assembly mounting portion 13. The chip 104 includes a substrate 1041, a memory 1044 (such as Figure 3B As shown) and multiple contact portions 1042, the substrate 1041 has a first side 1048 and a second side 1049 relative to each other, the memory 1044 stores information of the ink cartridge 10, the contact portion 1042 is used to electrically contact the contact pin, and the contact portion 1042 is also electrically connected to the memory 1044. Preferably, at least a portion of the contact portion 1042 and the memory 1044 are respectively arranged on different sides of the substrate 1041.

[0052] The plurality of contact portions 1042 can be divided into a first group of contact portions 1045 and a second group of contact portions 1046 according to their distribution on the substrate 1041, wherein the first group of contact portions 1045 are arranged on the first side 1048 and are referred to as front contact portions, and the second group of contact portions 1046 are not arranged on the first side 1048 and are referred to as back contact portions. The first group of contact portions 1045 can be set as one contact portion or as multiple contact portions. Similarly, the second group of contact portions 1046 can be set as one contact portion or as multiple contact portions. In the following, unless otherwise specified, the first group of contact portions 1045 is set as multiple contact portions. The second group of contact portions 1046 is set as a contact portion; specifically, the second group of contact portions 1046 can be set on the second side 1049, or can be set on the third side 104c located between the first side 1048 and the second side 1049. The first group of contact portions 1045 is used to directly form electrical contact with the contact pin, and the second group of contact portions 1046 is used to indirectly form electrical contact with the contact pin. It can be seen that the multiple contact portions 1042 are not set on the same side of the substrate 1041, so that the number of contact portions located on the same side is reduced, the design freedom of these contact portions and the design freedom of the substrate are improved, and the risk of short circuit between the contact portions is also reduced.

[0053] like Figure 2A As shown, the first side 1048 faces the +x direction, the second side 1049 faces the -x direction, and the third side 104c faces the y direction or the z direction intersecting the x direction. The figure shows that the third side 104c faces the +y direction. Accordingly, the positioning plate 105 will have a power transmission part 105f / 105i facing the -y / +y direction (as shown in FIG. Figure 3B As shown in FIG, the positioning plate 105 in this embodiment is provided with a conductor for electrically contacting the contact pin. The conductor can be a component mounted on the positioning plate 105 or a part of the positioning plate 105 itself, and the conductor is also electrically connected to the power transmission part 105f / 105i. Preferably, the power transmission part 105f / 105i and the conductor are both part of the positioning plate 105 itself. In this case, at least a part of the positioning plate 105 is made of conductive material. More preferably, the positioning plate 105 is entirely made of conductive material. When the ink cartridge 10 is installed in the imaging device, the positioning plate 105 is in direct electrical contact with the contact pin. Therefore, the contact portion 1042 (the second group of contact portions 1046) provided on the third side 104c is indirectly in electrical contact with the contact pin through the positioning plate 105.

[0054] Continue as Figure 2AAs shown, the positioning plate 105 includes a supporting portion 105a and at least one blocking portion. The supporting portion 105a is used to support the substrate 1041 (the second side 1049). The blocking portion is extended from the supporting portion 105a. On the one hand, the blocking portion is used to position the chip 104, and on the other hand, the blocking portion is used to prevent the chip 104 from falling off. Along the thickness direction of the chip 104 / substrate 1041 (the arrangement direction of the first side 1048 and the second side 1049), a chip accommodating portion 1050 is formed opposite to the supporting portion 105a. Figure 2A As shown, along the +y direction, the chip 104 is installed toward the chip accommodating portion 1050. Preferably, the positioning plate 105 is configured as the first blocking portion 105b and two second blocking portions 105d shown in the figure, wherein the two second blocking portions 105d are spaced apart in the z direction, and the chip accommodating portion 1050 is located between the two second blocking portions 105d.

[0055] In this embodiment, the third side 104c provided with the second group of contact portions 1046 is the surface of the substrate 1041 facing the +y direction. Correspondingly, the surface 105f of the first blocking portion 105b located in the +y direction of the chip accommodating portion 1050 facing the chip accommodating portion 1050 is formed as the above-mentioned power transfer portion, that is, the power transfer portion faces the direction intersecting with the thickness direction. When the chip 104 is mounted on the positioning plate 105, the power transfer portion 105f contacts the third side 104c along the direction intersecting with the thickness direction of the chip 104 / substrate 1041.

[0056] In some embodiments, the power transfer portion 105 f may also be a protrusion provided on the surface of the first barrier portion 105 b facing the chip receiving portion 1050 , that is, the protrusion extends in a direction intersecting with the thickness direction.

[0057] In some embodiments, when a conductor is provided in the positioning plate 105 , the conductor may further extend to the surface of the first blocking portion 105 b facing the chip receiving portion 1050 , thereby electrically contacting the second set of contact portions 1046 provided on the third side 104 c .

[0058] In some embodiments, the positioning plate 105 further includes a card slot 105e arranged between the second blocking portion 105d and the supporting portion 105a, and the card slot 105e is used to accommodate the substrate 1041 of the chip 104 to ensure that the chip 104 can be stably mounted on the positioning plate 105; in practice, a card slot 105e can be provided between both second blocking portions 105d and the supporting portion 105a, or a card slot 105e can be provided between only one of the second blocking portions 105d and the supporting portion 105a, or a card slot 105e can be not provided between both second blocking portions 105d and the supporting portion 105a, but the surface of the second blocking portion 105d facing the chip accommodating portion 1050 abuts against the substrate 1041, which can also ensure that the chip 104 is stably mounted on the positioning plate 105.

[0059] In some embodiments, the support portion 105 a is further provided with a first guide surface 105 g on a side where no blocking portion is provided, so that the chip 104 can be installed smoothly.

[0060] In some embodiments, the support portion 105a is further provided with an avoidance portion 105c. When the memory 1044 is provided on the second side 1049, the avoidance portion 105c is used to allow the memory 1044 to enter. On the contrary, when the memory 1044 is not provided on the second side 1049, the avoidance portion 105c does not need to be provided.

[0061] Figure 2B This is a three-dimensional diagram of the chip after the second group of contact parts in the chip assembly involved in the first embodiment of the present invention are deformed.

[0062] In this variation, the second group of contact portions 1046 is still configured as one contact portion, but the contact portion is simultaneously configured on the second side 1049 and the third side 104c, that is, a portion of the contact portion is configured on the second side 1049 and the other portion is configured on the third side 104c.

[0063] Based on this, when the second group of contact portions 1046 is set as multiple contact portions, the second contact portion 1046 can also be set on the second side 1049 and the third side 104c at the same time. For example, the second group of contact portions 1046 is further decomposed into multiple groups of sub-contact portions, and one contact portion or multiple contact portions can be set in each group of sub-contact portions. Among the multiple groups of sub-contact portions, at least one group of sub-contact portions is set on the second side 1049, and at least another group of sub-contact portions is set on the third side 104c.

[0064] Based on the inventive concept of this embodiment, two modified structures of the positioning plate are introduced below, and the same components will be numbered the same.

[0065] Figure 3AThis is a three-dimensional diagram of the second positioning plate in the chip assembly involved in the first embodiment of the present utility model; Figure 3B It is along Figure 3A After cutting along the AA direction, the side view is observed along the z direction.

[0066] For the sake of ease of distinction, the positioning plate introduced above is called the first positioning plate 105A. On the basis of the first positioning plate 105A, the second positioning plate 105B is further provided with a third blocking portion 105h that is movable relative to the support portion 105a. The chip 104 is installed toward the chip accommodating portion 1050 from the side where the third blocking portion 105h is provided. When the third blocking portion 105h is elastically deformed, the chip 104 is allowed to be installed toward or removed from the chip accommodating portion 1050.

[0067] Along the y direction, the third blocking portion 105h and the first blocking portion 105b are arranged opposite to each other, and the third blocking portion 105h is connected to the supporting portion 105a or the second blocking portion 105d. Preferably, the third blocking portion 105h is arranged in the form of a cantilever, so that the third blocking portion 105h can be formed integrally with the supporting portion 105a or the second blocking portion 105d.

[0068] like Figure 3A As shown, the free end of the third blocking portion 105h is provided with an extension portion 105i. When the chip 104 is mounted to the chip receiving portion 1050, at least the extension portion 105i of the third blocking portion 105h abuts against the chip 104. Furthermore, the extension portion 105i is provided with a second guide surface 105j. Figure 3B As shown, when viewed along the z direction, the extension line of the first guide surface 105g and the extension line of the second guide surface 105j intersect.

[0069] Along the y direction, at least a portion of the second guide surface 105j is located in the -y direction of the first guide surface 105g, so that the chip 104 will first contact the second guide surface 105j and force the third blocking portion 105h to undergo elastic deformation. Subsequently, the chip 104 is guided by the first guide surface 105g and smoothly enters the chip accommodating portion 1050; on the contrary, along the y direction, when the entire second guide surface 105j is located in the +y direction of the first guide surface 105g, although the chip 104 can be guided by the first guide surface 105g first, the chip 104 is not restricted in its +z direction, so that the chip 104 may detach from the first guide surface 105g and cannot enter the chip accommodating portion 1050.

[0070] Based on the first positioning plate 105A, in this variation, the second group of contact portions 1046 may also be provided on the surface of the substrate 1041 facing the second blocking portion 105d, or the second group of contact portions 1046 may also be provided on the surface 105i of the substrate 1041 facing the third blocking portion 105h, as shown in FIG. Figure 3B As shown, a surface 105f of the first barrier 105b facing the chip receiving portion 1050 and a surface 105i of the third barrier 105h facing the chip receiving portion 1050 can both serve as power transfer portions for electrically connecting to the third side 104c of the substrate 1041 .

[0071] Combine Figure 2A It can be seen that along the y direction, the first group of contact portions 1045 are more concentratedly arranged on the -y side of the substrate 1041, that is, along the y direction, compared with the surface of the substrate 1041 facing the +y direction, the first group of contact portions 1045 are closer to the surface of the substrate 1041 facing the -y direction. Then, when the second group of contact portions 1046 are arranged on the surface of the substrate 1041 facing the +y direction, it is more conducive to reducing the risk of short circuit in the contact portion.

[0072] Figure 4 This is an exploded view of the chip assembly according to the first embodiment of the present invention after the third positioning plate is separated from the chip.

[0073] In the third positioning plate 105C, the third blocking portion 105h is non-deformable relative to the supporting portion 105a, and the third positioning plate 105C also includes an anti-slip portion 105k arranged on each blocking portion. Along the thickness direction of the substrate 1041, the anti-slip portion 105k and the supporting portion 105a are arranged relative to each other, and the chip accommodating portion 1050 is located between the anti-slip portion 105k and the supporting portion 105a. Therefore, the chip 104 accommodated by the chip accommodating portion 1050 is restricted in the x-direction, y-direction and z-direction and will not fall off easily.

[0074] [Example 2]

[0075] Figure 5A This is a plan view of the first chip in the chip assembly according to the second embodiment of the present invention observed along the x-direction; Figure 5B This is a plan view of the second chip in the chip assembly according to the second embodiment of the present invention observed along the x-direction.

[0076] The multiple contact portions 1042 in the chip 104 include a data terminal, a clock terminal, a reset terminal, a power terminal and a ground terminal, wherein the power terminal is used to receive power supplied by the imaging device through a contact pin, and the ground terminal is used to be connected to the grounding device of the imaging device through the contact pin to be grounded. For example, the above-mentioned second group of contact portions 1046 is set as a ground terminal, and one of the above-mentioned first group of contact portions 1045 is set as a power terminal 10424.

[0077] like Figure 5A As shown, the first chip provided in this embodiment is also provided with a power supply 108, and the ground terminal 1046 is electrically connected to the power supply 108. The power supply 108 is used to supply a voltage to the chip 104 that is lower than the voltage received by the power terminal 10424 from the imaging device. Thus, the ground terminal 1046 can be replaced by the power supply 108.

[0078] like Figure 5B As shown, the second chip provided in this embodiment is also provided with a power supply 108. Unlike the first chip, the power supply 108 in this embodiment is electrically connected to the power terminal 10424 and is used to supply the voltage required for the chip to operate to the chip 104. That is to say, the power terminal 10424 in the second chip does not have to be electrically connected to the contact pin.

[0079] Similar to the first embodiment, the first group of contact portions 1045 and the second group of contact portions 1046 in this embodiment can also be arranged on different sides of the substrate 1041 to reduce the risk of short circuit of the contact portions.

[0080] [Example 3]

[0081] Figure 6 This is an exploded view of the chip assembly and the housing after being separated according to the third embodiment of the present invention.

[0082] The chip 104 provided in this embodiment uses a short-range wireless communication method, such as RFID in the prior art, which is not limited here. Figure 6 As shown, the chip 104 (chip assembly) includes a radio frequency chip 104d and a chip body 104e that are separately and spaced apart. There is no physical connection (no physical contact) between the two, but the connection is achieved through wireless communication.

[0083] Among them, the RF chip 104d includes a first substrate 104d1 and a plurality of contact portions 1042 and a RF tag 104d3 (first signal transceiver) arranged on the first substrate 104d1. The plurality of contact portions 1042 are used to electrically contact the contact pins of the imaging device so that the chip 104 establishes a communication connection with the imaging device, and the RF tag 104d3 is used to establish a wireless connection with the chip body 104e.

[0084] The chip body 104e includes a second substrate 104e1 and a reader 104e2 (second signal transceiver) and a memory 1044 provided on the second substrate 104e1. The memory 1044 stores information of the ink cartridge, and the reader 104e2 is also electrically connected to the memory 1044.

[0085] Similar to the second embodiment, the plurality of contact portions 1042 in the chip assembly 104 of this embodiment include a data terminal, a clock terminal, a reset terminal, a power terminal and a ground terminal; Figure 6 , the multiple contact portions 1042 are asymmetrically distributed on the surface of the substrate; specifically, the multiple contact portions 1042 are arranged on the first substrate 104d1, more specifically, the data terminal, reset terminal, power terminal and ground terminal are arranged on the -x side of the first substrate 104d1, and the ground terminal is arranged on the +x side of the first substrate 104d1.

[0086] After the contact portion 1042 is electrically connected to the contact pin, the RF chip 104d receives an electrical signal from the imaging device, and then the RF tag 104d3 can convert the electrical signal received from the contact pin into an electromagnetic wave signal and transmit it to the chip body 104e. The reader 104e2 converts the received electromagnetic wave signal into an electrical signal and exchanges information with the memory 1044. Subsequently, the reader 104e2 converts the electrical signal received from the memory 1044 into an electromagnetic wave and sends it back to the RF tag 104d3. The RF tag 104d3 converts the electromagnetic wave signal received from the reader 104e2 into an electrical signal and outputs it to the multiple contact portions 1042. Then, the contact pin can identify the signal output by the memory 1044 through the electrical signal output by the multiple contact portions 1042.

[0087] In the chip 104, the RF chip 104d and the chip body 104e are not in contact, and thus the risk of short circuit between the components inside the chip 104 can be effectively reduced. It is understandable that the positions of the RF chip 104d and the chip body 104e can also be interchanged, and the RF tag 104d3 can be either an active tag or a passive tag.

[0088] In some embodiments, the chip body 104 e is configured to be sealed relative to the RF chip 104 d . For example, the chip body 104 e is sealed with sealing glue, which can better protect the chip body 104 e having the memory 1044 .

[0089] The contact portion 1042 in this embodiment may also adopt the structural arrangement described in any of the above embodiments to further reduce the risk of short circuit at the contact portion. The technical solution of this embodiment may be applied to imaging material cartridges in the prior art, such as ink cartridges / toner drums.

[0090] [Example 4]

[0091] Figure 7 This is an exploded view of the chip assembly involved in the fourth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0092] On the basis of the above embodiment, this embodiment further sets the shell 101, the coupling 11 and the positioning plate 105 to be conductive. At this time, the coupling 11, the positioning plate 105 and the shell 101 can be formed as one piece, or in other words, the coupling 11 and the positioning plate 105 are regarded as part of the shell 101, and the conductor 107 does not need to be set separately, but is formed by at least a part of the positioning plate 105.

[0093] In an embodiment of the present invention, when no conductor is installed on the positioning plate 105, at least the positioning plate 105 is made of a conductive material. On the contrary, when a conductor is installed on the positioning plate 105, the positioning plate 105 still has conductivity. It can be seen that the positioning plate 105 always needs to be configured to have conductivity; in a deformable embodiment, the positioning plate 105 and the coupling 11 can also be made of a conductive material together, and the combination of the positioning plate 105 and the coupling 11 can be detachably arranged relative to the shell 101. It can also be that as mentioned above, the positioning plate 105, the coupling 11 and the shell 101 are formed integrally of a conductive material; in the following embodiments, the materials of the coupling 11 and the shell 101 are not limited, and it should be understood that at least the positioning plate 105 is made of a conductive material.

[0094] The conductor 107 includes a front conductive member 1074 and a back conductive member 1075 electrically connected to each other, wherein the front conductive member 1074 is used to contact the contact pin, and the back conductive member 1075 is used to contact the back contact portion 1046. In this way, the back contact portion 1046 provided on the second side 1049 can also form an electrical connection with the contact pin. In this embodiment, preferably, the back contact portion 1046 is the ground terminal 10425 (such as Figure 14 shown).

[0095] In some embodiments, the back contact portion 1046 may also be disposed on the third side 104 c , and the power transfer portion 105 f may be considered as a back conductive member 1075 .

[0096] like Figure 7 As shown, at least one supporting portion 105a is arranged in the chip accommodating cavity 1050, and the second side 1049 of the substrate 1041 is supported by the supporting portion 105a. In this embodiment, the supporting portion 105a is also made of conductive material. Therefore, the supporting portion 105a can be regarded as a reverse conductive part 1075, and the chip 104 is fixedly supported by the supporting portion 105a.

[0097] Furthermore, the positioning plate 105 also includes a positioning portion 105n arranged on the supporting portion 105a, and the chip 104 also includes a positioned portion 10411 arranged on the substrate 1041. Preferably, the positioning portion 105n is set as a protrusion, and the positioned portion 10411 is set as a positioned hole / positioned groove allowing the positioning portion 105n to enter. Through the positioning portion 105n, the chip 104 is positioned on the positioning plate 105. Subsequently, the positioning portion 105n is heated to melt the positioning portion 105n. Finally, the chip 104 is riveted to the positioning plate 105 by the positioning portion 105n.

[0098] [Example 5]

[0099] Figure 8 This is an exploded view of the chip assembly involved in the fifth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0100] Compared with the fourth embodiment, the chip 104 in this embodiment is movably arranged in the chip receiving cavity 1050. Figure 8 As shown, the chip assembly 103 also includes an elastic member 106 arranged in the chip accommodating cavity 1050, one end of the elastic member 106 abuts against the second side 1049 of the substrate 1041, and the other end abuts against the positioning plate 105, so that the chip 104 is pushed by the elastic member 106 in the direction away from the shell 101 (+x direction).

[0101] Specifically, a protrusion for contacting with the elastic member 106 is provided in the chip receiving cavity 1050, and the elastic member 106 is provided as a compression spring. Preferably, the protrusion and the elastic member 106 are made of conductive material, and thus, the protrusion can be regarded as the reverse conductive member 1075; similarly, the chip 104 in this embodiment can also be riveted on the positioning plate 105, but when the chip 104 is subjected to a force in the -x direction, the chip 104 can overcome the elastic force of the elastic member 106 and move in the x direction. At the same time, the chip 104 It is also restricted by the melted positioning portion 105n and will not fall off from the shell 101; for example, when the chip 104 contacts the contact pin and is squeezed, the elastic member 106 is elastically deformed, and the chip 104 moves toward the direction close to the shell 101 (-x direction). While ensuring that the chip 104 maintains good contact with the contact pin, the contact pin can also be prevented from being elastically deformed and damaged. In addition, the elastic member 106 supported by the conductive material can also ensure that the reverse contact portion 1046 maintains good contact with the reverse conductive member 1075.

[0102] [Example 6]

[0103] Figure 9 This is an exploded view of the chip assembly involved in Example 6 of the present utility model after the chip and the ink cartridge shell are separated.

[0104] The chip 104 in this embodiment is also movably disposed in the chip receiving cavity 1050. Unlike the fifth embodiment, the elastic member 106 in this embodiment does not need to be installed separately, but is formed by a part of the positioning plate 105 itself. Figure 9 As shown, the elastic member 106 in this embodiment is a cantilever formed in the chip receiving cavity 1050 . The cantilever 106 is made of a conductive material. Therefore, the cantilever 106 can be regarded as the reverse conductive member 1075 in this embodiment.

[0105] [Example 7]

[0106] Figure 10 This is an exploded view of the chip assembly involved in Example 7 of the present utility model after the chip and the ink cartridge shell are separated.

[0107] Different from the above embodiment, the chip 104 in this embodiment is no longer positioned (fixed or movably arranged) in the chip receiving cavity 1050 by riveting. Figure 10 As shown, the chip 104 in this embodiment is positioned in the chip receiving cavity 1050 by screws, that is, the positioning portion 105n in this embodiment is a screw.

[0108] Preferably, the chip 104 is fixed to the positioning plate 105 by at least two screws 105n. More preferably, the screws are arranged relative to each other in a direction intersecting the x-direction to ensure that the chip 104 can be stably positioned. Furthermore, according to the above embodiment, the chip 104 in this embodiment can be fixed in the chip accommodating cavity 1050 or can be movably set in the chip accommodating cavity 1050.

[0109] In this embodiment, the back contact portion 1046 can also be set on the third side 104c, so that the back contact portion 1046 can form an electrical connection with the conductive screw 105n, and thus, the back contact portion 1046 can form an electrical connection with the contact pin through the conductive screw 105n.

[0110] [Embodiment 8]

[0111] Figure 11A and Figure 11B This is an exploded view of the chip assembly involved in Example 8 of the present utility model after the chip and the ink cartridge shell are separated.

[0112] Similar to the fourth embodiment, the chip 104 in this embodiment is also fixedly supported by the support portion 105 a , that is, the chip 104 in this embodiment is immovable relative to the housing 101 . Therefore, the support portion 105 a in this embodiment can also be regarded as a reverse conductive member 1075 .

[0113] Different from the fourth to seventh embodiments, the chip 104 in this embodiment is no longer connected to the positioning plate 105 by riveting, but is connected to the positioning plate 105 by providing a slot 105e on the positioning plate 105. The slot 105e is used to clamp the substrate 1041. Figure 11A and Figure 11B As shown, at least one second blocking portion 105d is provided at both ends of the chip receiving cavity 1050 in the z direction, and the latching groove 105e is provided between the second blocking portion 105d and the supporting portion 105a.

[0114] The chip accommodating cavity 1050 is open toward the -y direction, and the chip 104 can be installed toward the chip accommodating cavity 1050 along the +y direction; preferably, the reverse conductive member 1075 in this embodiment includes a third guide surface 10751 and a support surface 10752 arranged adjacent to each other, and the third guide surface 10751 is located in the -y direction of the support surface 10752, or in other words, along the installation direction of the chip 104, the third guide surface 10751 is located upstream of the support surface 10752, and the third guide surface 10751 is set as an inclined surface inclined relative to the y direction, specifically, along the +y direction, the distance from the third guide surface 10751 to the rear side wall 101b of the shell 101 or the center line of the ink outlet portion 102 gradually increases, and the rear side wall 101b and the front side wall 101a are arranged opposite to each other in the x direction, so that the third guide surface 10751 can guide the installation of the chip 104.

[0115] Similarly, the chip accommodating cavity 1050 can also be set to be open toward the +y direction. In this case, the inclination direction of the third guide surface 10751 will be opposite to the above direction, and the chip 104 will be installed toward the chip accommodating cavity 1050 along the -y direction.

[0116] [Example 9]

[0117] Figure 12 This is an exploded view of the chip assembly involved in the ninth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0118] In combination with Example 5 and Example 8, the chip accommodating cavity 1050 in this embodiment is also set to be open in the -y direction, and the chip 104 can be installed along the +y direction toward the chip accommodating cavity 1050. At the same time, the chip assembly 103 also includes an elastic member 106 abutting against the chip 104, and a protrusion for abutting against the elastic member 106 is also provided in the chip accommodating cavity 1050. The protrusion and the elastic member 106 are both made of conductive material, and the protrusion can be regarded as the reverse conductive member 1075.

[0119] [Example 10]

[0120] Figure 13This is an exploded view of the chip assembly involved in the tenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0121] In combination with the sixth and eighth embodiments, the chip receiving cavity 1050 in this embodiment is also configured to be open toward the -y direction, and the chip 104 can be installed toward the chip receiving cavity 1050 along the +y direction. Similar to the sixth embodiment, the elastic member 106 in this embodiment is formed as a part of the positioning plate 105, such as Figure 13 As shown, the elastic member 106 is a cantilever formed in the chip receiving cavity 1050 . The cantilever 106 is made of a conductive material. Therefore, the cantilever 106 can be regarded as a reverse conductive member 1075 .

[0122] Furthermore, similar to the eighth embodiment, the cantilever 106 / 1075 in this embodiment is also configured to include a third guide surface 10751 and a support surface 10752 , and the third guide surface 10751 is tilted relative to the y-direction.

[0123] [Example 11]

[0124] Figure 14 It is a simplified plan view of the chip assembly involved in the eleventh embodiment of the present invention observed along the -x direction.

[0125] This embodiment further describes the position change of the back contact portion 1046. Similarly, the back contact portion 1046 in this embodiment is also configured as a ground terminal 10425. The surface of the substrate 1041 of the chip 104 on which the contact portion 1042 is provided extends along the y-direction and the d-direction. When viewed along the x-direction, the projection points C of the contact points formed by the two outermost contact portions of the front contact portion 1045 in the y-direction and the contact pins are projected onto a line D parallel to the y-direction at points N1 and N2, respectively, within the surface including the y-direction and the d-direction. The projection point C of the back contact portion 1046 in the surface including the y-direction and the d-direction is projected onto a line D parallel to the y-direction at point E. Along the y-direction, the projection point E is located on line segment N1N2. That is to say, along the y direction, the projection point C of the back contact portion 1046 on the surface including the y direction and the d direction is located within the range defined by the two outermost contact points of the front contact portion 1045 in the y direction, or in other words, along the y direction, the back contact portion 1046 is located between the two front contact portions 1045. This arrangement not only reduces the arrangement density of the contacts on the first side 1048, thereby reducing the short circuit risk of the chip 104, but also helps to make full use of the surface area of ​​the first side 1048 and the second side 1049 to reduce the volume of the chip 104.

[0126] In an embodiment of the present invention, the d direction can be parallel to the z direction or the x direction, or it can be neither parallel to the z direction nor parallel to the x direction, but inclined relative to the x direction or the z direction. The midline of the line segment N1N2 is L2. Along the y direction, the midline L2 divides the substrate 1041 into adjacent first areas Q1 and second areas Q2. Overall, the number of contact portions in the first area Q1 is different from the number of contact portions in the second area Q2. When only the front contact portion 1045 is observed, the number of contact portions on both sides of the midline L2 is equal. In this way, the substrate 1041 is subjected to uniform force in the y direction, which is beneficial for the chip 104 (front contact portion 1045) to form a stable electrical contact with the contact pin. In particular, when the chip 104 is configured to be movable relative to the housing 101, this contact portion distribution method is more conducive to ensuring that the chip 104 remains stable.

[0127] like Figure 14 As shown, the conductor 107 is electrically connected to the reverse contact portion 1046, and the front conductive member 1074 of the conductor 107 forms a contact point C2 with the stylus. Preferably, the resistance from the front conductive member 1074 to the reverse conductive member 1075 (including the front conductive member itself, the reverse conductive member itself, and the conductor located between the front conductive member and the reverse conductive member) does not exceed 1KΩ, and more preferably, the resistance does not exceed 700Ω. In actual testing, when the resistance exceeds 1KΩ, the stylus will not detect any signal.

[0128] Figure 15 It is a simplified plan view of the chip involved in the eleventh embodiment of the present invention observed along the +x direction.

[0129] On the basis of the above embodiments, the reverse contact portion 1046 in this embodiment is arranged adjacent to the positioned portion 10411. Preferably, the reverse contact portion 1046 is arranged in an arc shape extending around the edge of the positioned portion 10411. As described above, the chip 104 can be combined with the positioning portion 105n through the positioned portion 10411, and the chip 104 can be positioned on the positioning plate 105 by riveting. Even if the chip 104 is subjected to vibration, the reverse contact portion 1046 arranged near the positioned portion 10411 can form a stable electrical connection with the conductor 107.

[0130] Furthermore, the reverse contact portion 1046 can also be configured to extend to the positioned portion 10411. When the positioning portion 105n enters the positioned portion 10411, the reverse contact portion 1046 can directly contact the positioning portion 105n. In particular, when the positioning plate 105 itself is made of conductive material, a stable electrical connection will be formed between the reverse contact portion 1046 and the positioning portion 105n.

[0131] [Example 12]

[0132] Figure 16 This is an exploded view of the chip assembly involved in Example 12 of the present utility model after the chip and the ink cartridge shell are separated.

[0133] Based on the above embodiments, the chip 104 of this embodiment is substantially the same as that of the eleventh embodiment, with the difference being that: in this embodiment, the positioning plate 105 is integrally formed with the shell 101, and the positioning plate 105 is not conductive, and the second set of contact portions 1046 / 1042 (reverse contact portions) forms electrical contact with the conductor 107 under the elastic action and pressure of the elastic member 106.

[0134] The positioning plate 105 is used to accommodate and install the chip 104. At least a portion of the elastic member 106 and at least a portion of the conductor 107 are located in the chip accommodating cavity 1050. In this embodiment, the back contact portion ( Figure 16 ) is disposed on the second side 1049 of the substrate 1041.

[0135] Furthermore, the conductor 107 includes a front conductive member 1074 for electrically contacting the contact pins and a back conductive member 1075 for electrically contacting the second set of contact portions 1046. Specifically, the front conductive member 1074 is a portion of the conductive member 107 for contacting the contact pins, and the back conductive member 1075 is a portion of the conductor 107 for contacting the second set of contact portions 1046.

[0136] In this embodiment, similar to the fifth embodiment, a protrusion for abutting against the elastic member 106 is provided in the chip accommodating cavity 1050, and the elastic member 106 is configured as a compression spring. However, unlike the fifth embodiment, in this embodiment, the elastic member 106 is used to apply pressure to the conductor 107, pressing the reverse conductive member 1075 to form electrical contact with the reverse contact portion 1046 / 1042 of the chip 104 to form an electrical path: reverse contact portion-conductive member-contact pin; that is, the elastic member 106 in this embodiment does not play a conductive role in the electrical path; with the above configuration, the conductor 107 can form a stable electrical contact with the reverse contact portion 1046 / 1042 under the action of the elastic member 106, and poor contact is less likely to occur.

[0137] In some other embodiments, a method similar to that of Example 6 may also be adopted, and the elastic member 106 does not need to be installed separately, but is formed by a part of the positioning plate 105 itself, that is, the elastic member 106 is a cantilever formed on the positioning plate 105. In this embodiment, the elastic member 106 is used to apply pressure to the conductor 107, forcing the reverse conductive member 1075 to form electrical contact with the reverse contact portion 1046 / 1042 of the chip 104.

[0138] Regarding the fixing method of the chip 104 , this embodiment adopts a method substantially similar to that of the fourth embodiment, that is, by heating the positioning portion 105 n to melt the positioning portion 105 n , the chip 104 is riveted to the positioning plate 105 by the positioning portion 105 n .

[0139] Preferably, the reverse contact portion 1046 is a ground terminal.

[0140] [Example 13]

[0141] Figure 17 This is a first exploded view of the chip assembly according to the thirteenth embodiment of the present invention after the chip and the ink cartridge housing are separated; Figure 18 This is a second exploded view of the chip assembly involved in Example 13 of the present utility model after the chip and the ink cartridge shell are separated.

[0142] Based on the above embodiment, the difference between this embodiment and the twelfth embodiment is that the elastic member 106 is conductive, and the second group of contact portions 1046 / 1042 forms electrical contact with the conductor 107 under the conductive effect of the elastic member 106 .

[0143] In this embodiment, the back contact portion 1046 forms electrical contact with the conductor 107 through the elastic member 106, that is, an electrical path is formed: back contact portion - elastic member - conductive member - contact pin. Preferably, the elastic member 106 is a compression spring.

[0144] like Figure 17 and Figure 18 As shown, a plurality of protrusions are provided within the chip receiving cavity 1050. In addition to protrusions for contacting the elastic member 106, the chip receiving cavity 1050 also includes protrusions for positioning the conductor 107. A corresponding groove structure is provided on the conductor 107. More specifically, one of the protrusions simultaneously positions the conductor 107 and the elastic member 106.

[0145] [Example 14]

[0146] Figure 19 This is an exploded view of the chip assembly involved in Example 14 of the present utility model after the chip and the ink cartridge shell are separated.

[0147] Based on the above embodiment, the difference between this embodiment and the thirteenth embodiment is that the back contact portion 1046 / 1042 is provided on the third side 104 c between the first side 1048 and the second side 1049 , that is, the side surface of the substrate 1041 .

[0148] Along the direction in which the elastic member 106 extends, the chip 104 and the conductor 107 are spaced apart. Specifically, the direction in which the elastic member 106 extends refers to the direction in which the elastic member 106 extends toward the reverse contact portion / the second group of contact portions 1046. For example, Figure 19As shown, in this embodiment, the elastic member 106 extends along the y direction toward the reverse contact portion / second group of contact portions 1046. In the y direction, the elastic member 106 is located between the chip 104 and the conductor 107. That is, the chip 104 is located in the -y direction of the elastic member 106, and the conductor 107 is located in the +y direction of the elastic member 106.

[0149] In this embodiment, after the chip 104 is mounted to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the third side 104c of the substrate 1041, and the elastic member 106 and the conductor 107 can be located in the +y or -y direction of the third side 104c of the substrate 1041. In other embodiments, after the chip is mounted to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the third side 104c of the substrate 1041, and the elastic member 106 and the conductor 107 can be located in the +z or -z direction of the third side 104c of the substrate 1041.

[0150] Furthermore, the chip accommodating cavity 1050 is provided with a slot and a protrusion at the position corresponding to the conductor 107, and the conductor 107 is provided with a protrusion corresponding to the slot and a positioning hole corresponding to the protrusion. The conductor 107 is installed on the positioning plate 105 through the slot-protrusion and protrusion-positioning hole matching.

[0151] Furthermore, regarding the fixing method of the chip 104 , this embodiment adopts a method substantially similar to that of the fourth embodiment, that is, by heating the positioning portion 105 n so that the positioning portion 105 n melts, the chip 104 is riveted to the positioning plate 105 by the positioning portion 105 n.

[0152] [Example 15]

[0153] Figure 20 This is an exploded view of the chip assembly involved in Example 15 of the present utility model after the chip and the ink cartridge shell are separated.

[0154] Based on the above embodiment, the difference between this embodiment and the fourteenth embodiment lies in that the elastic member 106 and the conductor 107 are integrally formed; and the chip receiving cavity 1050 opens toward the −y direction and the +y direction respectively.

[0155] Along the extension direction of the elastic member 106, the chip 104 and the conductor 107 are spaced apart. Specifically, the extension direction of the elastic member 106 refers to the direction in which the elastic member 106 extends toward the reverse contact portion / the second group of contact portions 1046. For example, Figure 20As shown, the elastic member 106 and the conductor 107 are integrally formed, and the conductor 107 is electrically contacted with the back contact portion 1046 / 1042 through the elastic member 106. Furthermore, the elastic member 106 is arranged in the -x direction of the conductor 107, and the elastic member 106 extends in the -y direction and electrically contacts the back contact portion 1046 / 1042 of the chip 104. The back contact portion 1046 / 1042 can be arranged on the second side 1049 or the third side 104c of the substrate 1041, or can be partially arranged on the second side 1049 and extend to the third side 104c. When the chip 104 and the conductor 107 are both installed in the receiving cavity 1050, the back contact portion 1046 / 1042 electrically contacts the elastic member 106 and causes the elastic member 106 to elastically deform, thereby forming a stable electrical contact between the back contact portion 1046 / 1042 and the elastic member 106.

[0156] Furthermore, the elastic member 106 is bent to form a U-shaped or V-shaped structure, with the opening of the bent portion of the elastic member 106 facing away from the chip 104. The apex of the bend of the elastic member 106 is used to form an electrical contact with the back contact portion 1046 / 1042. After the chip 104 is installed, it can abut the apex of the bent portion of the elastic member 106, causing the elastic member 106 to elastically deform, making the electrical contact between the elastic member 106 and the back contact portion 1046 / 1042 more stable. In other embodiments, the back contact portion 1046 / 1042 of the chip 104 can also be in electrical contact with an end of the elastic member 106 away from the conductor 107.

[0157] In this embodiment, after the chip 104 is mounted to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the second side 1049 and / or the third side 104c of the substrate 1041, the elastic member 106 is located in the -x direction of the second side 1049 of the substrate 1041, and the conductor 107 is located in the +y direction or the -y direction of the third side 104c of the substrate 1041. In other embodiments, after the chip 104 is mounted to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the second side 1049 and / or the third side 104c of the substrate 1041, the elastic member 106 is located in the -x direction of the second side 1049 of the substrate 1041, and the conductor 107 is located in the +z direction or the -z direction of the third side 104c of the substrate 1041.

[0158] Regarding the opening direction of the chip accommodating cavity 1050, similar to the eighth embodiment, the chip 104 is combined with the positioning plate 105 by providing a card slot 105e on the positioning plate 105, and the card slot 105e is used to clamp the substrate 1041. At least one second blocking portion 105d is provided at both ends of the chip accommodating cavity 1050 in the z direction.

[0159] Furthermore, the chip-receiving cavity 1050 is open in both the -y and +y directions. The chip 104 can be installed along the +y direction toward the chip-receiving cavity 1050, and the conductor 107 can be installed along the -y direction toward the chip-receiving cavity 1050. Furthermore, the chip-receiving cavity 1050 is provided with protrusions in both the -y and +y directions. The protrusions in the -y direction of the chip-receiving cavity 1050 are used to position the chip 104 to prevent it from falling out of the chip-receiving cavity 1050, and the protrusions in the +y direction of the chip-receiving cavity 1050 are used to position the conductor 107 to prevent it from falling out of the chip-receiving cavity 1050.

[0160] It should be noted that, in the aforementioned embodiments, the connection relationship between the chip accommodating cavity 1050 and the chip, as well as the spatial position relationship between at least two of the back contact portion, the elastic member and the conductive member can be freely combined, as long as the back contact portion can form electrical contact with the contact pin through the conductive member.

[0161] [Example 16]

[0162] Figure 21A and Figure 21B This is an exploded view of the chip assembly according to the sixteenth embodiment of the present invention after the chip and the ink cartridge housing are separated; Figure 21C 1 is a schematic diagram of the chip assembly according to the sixteenth embodiment of the present invention when viewed along the y direction; Figure 21D This is a schematic diagram of the chip assembly involved in the sixteenth embodiment of the present invention when viewed along the x-direction.

[0163] Compared with the thirteenth embodiment, the elastic member is not provided in this embodiment. Figure 21A and Figure 21B As shown, the conductor 107 includes a first conductive member 107a and a second conductive member 107b. The first conductive member 107a is at least used to electrically contact the contact pin, and the second conductive member 107b is at least used to electrically contact the chip 104 / the back contact portion 1046 / the second group of contact portions 1046. Further, the second conductive member 107b is used to make electrical contact between the chip 104 and the first conductive member 107a. Further, the first conductive member 107a and the second conductive member 107b can be formed as one piece or separately. In this embodiment, the first conductive member 107a and the second conductive member 107b are preferably formed separately, that is, the first conductive member 107a and the second conductive member 107b are separated from each other.

[0164] Since the elastic member 106 in the fourteenth and fifteenth embodiments is conductive, it can be considered as the second conductive member 107b in this embodiment. Specifically, in the fourteenth embodiment, the elastic member 106 and the chip 104 are arranged in the y-direction. For example, in this case, the elastic member 106 can be electrically contacted with the back contact portion / second group of contact portions 1046 provided on the third side 104c. In the fifteenth embodiment, the elastic member 106 and the chip 104 are arranged in the x-direction. For example, in this case, the elastic member 106 and the chip 104 are electrically contacted with the back contact portion / second group of contact portions 1046 provided on the second side 1049 and / or the third side 104c. In other embodiments, the elastic member 106 and the chip 104 can also be arranged in the z-direction.

[0165] Along the direction in which the second conductive member 107b extends, the chip 104 is spaced apart from the first conductive member 107a. Specifically, the direction in which the second conductive member 107b extends refers to the direction in which the second conductive member 107b extends toward the reverse contact portion / second group of contact portions 1046. For example, in this embodiment, the second conductive member 107b extends along the x-direction toward the reverse contact portion / second group of contact portions 1046. In the x-direction, the second conductive member 107b is located in the +x direction of the first conductive member 107a, and the second conductive member 107b is located in the -x direction of the chip 104. That is, the second conductive member 107b is disposed between the chip 104 and the first conductive member 107a. Furthermore, the second conductive member 107b extends toward the reverse contact portion / second group of contact portions 1046. One end of b is in electrical contact with the chip 104, and the other end is in electrical contact with the first conductive member 107a. Furthermore, along the x direction / the thickness direction of the chip 104 (the arrangement direction of the first side 1048 and the second side 1049), the chip 104 is provided with a first mounting hole 10491, the first conductive member 107a is provided with a second mounting hole 107a1, and one end of the second conductive member 107b is combined with the first mounting hole 10491. Specifically, the second conductive member 107b has a first portion 107b1, a second portion 107b2, and a third portion 107b3 located between the first portion 107b1 and the second portion 107b2. The first portion 107b1 is used to connect with the first mounting hole 10491. The second portion 107b2 is used to be combined with the second mounting hole 107a1. When the first conductive member 107a and the second conductive member 107b are integrally formed, the second mounting hole 107a1 can be eliminated. Along the x-direction / thickness direction of the chip 104 (the arrangement direction of the first side 1048 and the second side 1049), the third portion 107b3 is a step surface formed between the first portion 107b1 and the second portion 107b2; the reverse contact portion / the second group of contact portions 1046 is provided on the second side 1049 of the chip 104. Preferably, the reverse contact portion / the second group of contact portions 1046 is provided to extend around the edge of the first mounting hole 10491. The reverse contact portion / the second group of contact portions 1046 is provided to extend around the edge of the first mounting hole 10491. 6 can be a complete ring extending around the edge of the first mounting hole 10491, for example, in the shape of a circular ring, or a strip-shaped structure extending around a portion of the edge of the first mounting hole 10491, for example, in the shape of a circular arc. When the first portion 107b1 of the second conductive member 107b is engaged with the first mounting hole 10491, the third portion 107b3 is in electrical contact with the reverse contact portion / second group of contact portions 1046, and the second portion 107b2 of the second conductive member 107b is engaged with the second mounting hole 107a1, thereby improving the electrical connection stability between the conductor 107 and the chip 104, thereby forming an electrical connection path: chip 104-second conductive member 107b-first conductive member 107a-contact pin;In some embodiments, the back contact portion / second group of contact portions 1046 may also be configured as: a portion is configured on the second side 1049 of the chip, and the other portion is configured on the inner wall of the first mounting hole 10491; in some embodiments, the back contact portion / second group of contact portions 1046 may also be configured as being entirely configured on the inner wall of the first mounting hole 10491. Furthermore, when the back contact portion / second group of contact portions 1046 is configured on the inner wall of the first mounting hole 10591, the second conductive member 107b may also be electrically connected to the back contact portion / second group of contact portions 1046 by welding / interference fit. In the x-direction / thickness direction of chip 104 (the arrangement direction of first side 1048 and second side 1049 ), second conductive member 107b is disposed between first conductive member 107a and chip 104, i.e., chip 104 is spaced apart from first conductive member 107a. This means that first conductive member 107a does not support chip 104, thus preventing friction between first conductive member 107a and chip 104 and thus preventing chip 104 from being damaged by first conductive member 107a. Furthermore, the contact area between second conductive member 107b and chip 104 is small, resulting in less friction between second conductive member 107b and chip 104, thereby reducing wear on chip 104 and preventing damage to chip 104. This, in turn, improves chip reusability when recycling ink cartridges.

[0166] In some embodiments, along the y-direction, the second conductive member 107 a is disposed between the first conductive member 107 a and the chip 104 , that is, the first conductive member 107 a and the chip 104 are spaced apart.

[0167] Further, such as Figure 21C As shown, in the x direction / thickness direction of the chip 104 (the arrangement direction of the first side 1048 and the second side 1049), the spacing distance between the first conductive member 107a and the chip 104 is D1, and along the +x direction (the direction of the first conductive member 107a toward the reverse contact portion / the second group of contact portions 1046), the size of the second conductive member 107b is D2. Preferably, D2 is greater than or equal to D1.

[0168] Further, such as Figure 21DAs shown, the contact area between the second conductive member 107b and the chip 104 is S1, and along the x direction / the thickness direction of the chip 104 (the arrangement direction of the first side 1048 and the second side 1049), the overlapping area of ​​the first conductive member 107a and the substrate 1041 / chip 104 is S2. Preferably, S1 is less than or equal to S2. Furthermore, the contact area S1 between the second conductive member 107b and the chip 104 includes a projection area S11 and a projection area S12 along the x-direction. Furthermore, the projection area in the x-direction of the region where the second conductive member 107b contacts the reverse contact portion / second group of contact portions 1046 is S12. The total projection area of ​​the second conductive member 107b on the second side 1049 along the x-direction minus the projection area S12 is the projection area S11. In addition, when the second conductive member 107b is electrically connected to the reverse contact portion / second group of contact portions 1046 by soldering, the portion formed by the solder can be regarded as a portion of the second conductive member 107b.

[0169] Since the size D2 of the second conductive member 107b is greater than or equal to the spacing distance D1 between the first conductive member 107a and the chip 104, the contact area S1 between the second conductive member 107b and the chip 104 is less than or equal to the area S2 of the overlap between the first conductive member 107a and the substrate 1041. Even if the chip 104 is squeezed by external force and produces elastic deformation / displacement, the first conductive member 107a is unlikely to rub against the non-contact portion of the substrate 1041, and only the second conductive member 107b in the conductor 107 rubs against the reverse contact portion / second group of contact portions 1046. Therefore, the conductor 107 is not likely to damage the chip 104 (for example, the insulating layer).

[0170] Along the -x direction, the chip 104 is installed toward the chip accommodating portion 1050. Specifically, during installation, the second conductive member 107b can be first fixed on the substrate 1041 of the chip 104, and then the first conductive member 107a can be fixed on the ink cartridge 10. Preferably, the first conductive member 107a is fixed on the positioning plate 105, and finally the combination of the chip 104 / substrate 1041 and the second conductive member 107b is installed on the ink cartridge 10 / positioning plate 105, or finally the chip 104 / substrate 1041 is installed on the ink cartridge 10 / positioning plate 105; or first the second conductive member 107b is fixed on the first conductive member 107a, and then subsequent installation steps are performed. Preferably, during installation, the second conductive member 107b is first welded to the substrate 1041 / chip 104, and then the combination of the substrate 1041 / chip 104 and the second conductive member 107b is installed on the ink cartridge 10; more preferably, the second conductive member 107b is fixed to the second mounting hole 107a1 on the first conductive member 107a by pressing (interference fit).

[0171] In this embodiment, in the y direction and / or the z direction, the first conductive member 107a overlaps with the chip 104. Furthermore, the first conductive member 107a is combined with the housing 101. Preferably, the first conductive member 107a is clamped to the positioning plate 105. In this embodiment, the second blocking portion 105d of the positioning plate 105 is provided on the side close to the +y direction. The second blocking portion 105d is used to cooperate with the first conductive member 107a. The clamping groove 105e of the positioning plate 105 extends along the z direction. The clamping groove 105e is used to cooperate with the first conductive member 107a to guide the first conductive member 107a to be slidably installed on the positioning plate 105. Furthermore, the first conductive member 107a is provided with a groove portion 107a2 at one end in the +y direction. When the first conductive member 107a is clamped, the first conductive member 107a is clamped to the positioning plate 105. When 107a is slid and installed toward the positioning plate 105 along the +z direction, the groove portion 107a2 of the first conductive member 107a is used to cooperate with the second blocking portion 105d, so that the combination of the first conductive member 107a and the positioning plate 105 is more stable. At the same time, along the x direction, the groove portion 107a2 is located in the -x direction of the front conductive member 1074, which can enable the front conductive member 1074 of the first conductive member 107a to have a sufficiently large surface area so that the contact pin can better make electrical contact with the front conductive member 1074.

[0172] Preferably, the reverse contact portion / the second group of contact portions 1046 is a ground terminal.

[0173] In some embodiments, the back contact portion / second group of contact portions 1046 can also be set on the third side 104c, and the back contact portion / second group of contact portions 1046 is electrically contacted with the first conductive member 107a. For example, the back contact portion / second group of contact portions 1046 is oriented in the +y direction or in the -z direction. At this time, the second conductive member 107b is set to be non-conductive and is only used to support the chip 104. In this way, the design freedom of the chip 104 and the conductor 107 can be improved.

[0174] In this embodiment, after the chip 104 is installed to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the second side 1049 of the substrate 1041, the second conductive member 107b is located in the -x direction of the second side 1049 of the substrate 1041, a portion of the first conductive member 107a is located in the -x direction of the second side 1049 of the substrate 1041, and another portion of the first conductive member 107a is located in the +y direction and / or -z direction of the third side 104c of the substrate 1041.

[0175] Figures 22A to 22C This is a schematic diagram of the internal structure of the ink cartridge involved in Example 16 of the present utility model; Figure 22D This is a three-dimensional diagram of the ink cartridge involved in Example 16 of the present utility model when viewed from another angle.

[0176] like Figures 22A-22DAs shown, in this embodiment, the ink cartridge 10 includes a first ink chamber 201a, a second ink chamber 201b and a third ink chamber 201c for accommodating ink, wherein the first ink chamber 201a and the second ink chamber 201b are communicated with each other, and the second ink chamber 201b and the third ink chamber 201c are communicated with each other. Further, the first ink chamber 201a is communicated with the ink outlet portion 102, and the ink in the first ink chamber 201a is supplied to the imaging device through the ink outlet portion 102. A sponge is provided in the third ink chamber 201c or the second air chamber 201e described later, and the sponge is used to absorb part of the ink and cover the third air guide port 202d described later to prevent ink from flowing back; the ink cartridge 10 also includes an air inlet chamber 201f, a first air chamber 201d and a second air chamber 201e, wherein the air inlet chamber 201f can be communicated with the atmosphere, the first air chamber 201d and the second air chamber 201e are communicated with each other, and the second air chamber 201e and the third ink chamber 201c are communicated with each other.

[0177] Furthermore, the atmosphere is communicated with the air inlet cavity 201f through the air inlet 202a. In the Z direction, the air inlet 202a and the ink outlet 1022 provided in the ink outlet portion 102 are both located on the side facing the -z direction, and the air inlet 202a and the ink outlet 1022 are adjacent to each other. The air inlet cavity 201f and the first air cavity 201d are communicated with each other through the first air guide 202b. After the atmosphere enters the air inlet cavity 201f from the air inlet 202a, it enters the air inlet cavity 201f from the first air guide 202b. The air guide port 202b enters the first air cavity 201d; the first air cavity 201d and the second air cavity 201e are connected to each other through the second air guide port 202c, the second air cavity 201e and the third ink cavity 201c are connected to each other through the third air guide port 202d, the third ink cavity 201c and the second ink cavity 201b are connected through the first connecting port 202e, and the second ink cavity 201b and the first ink cavity 201a are connected to each other through the second connecting port 202f.

[0178] Furthermore, before the ink cartridge 10 is used, the air inlet 202a and the ink outlet 1022 are sealed by the seal 1021 at the same time. Preferably, the seal 1021 is a sealing film. When the ink cartridge 10 is installed in place, the ink absorbing component provided in the imaging device pierces the seal 1021 and combines with the ink outlet portion 102. At this time, the air inlet 202a is connected to the atmosphere, and the atmosphere enters the interior of the ink cartridge 10 from the air inlet 202a to balance the air pressure inside and outside the ink cartridge 10, thereby allowing the ink to flow out.

[0179] Furthermore, the sponge provided in the third ink chamber 201c or the second air chamber 201e is used to retain ink to prevent the ink from flowing out of the third air port 202d. Moreover, even if the ink flows out of the third air port 202d, it will first be accommodated by the second air chamber 201e and will not immediately flow out of the ink cartridge 10, thereby avoiding contamination of the ink cartridge 10 and the imaging device.

[0180] Furthermore, the ink cartridge 10 also includes an ink level detection component 110, which is used to detect the amount of ink in the ink cartridge 10. Preferably, the ink level detection component 110 is arranged on the lower side wall 101d of the ink cartridge 10, and more preferably, the ink level detection component 110 is arranged as a prism.

Claims

1. A chip assembly, provided on an imaging material cartridge detachably mounted on an imaging device having a stylus, the chip assembly being configured to form electrical contact with the stylus to establish a communication connection with the imaging device, wherein: The chip assembly includes a radio frequency chip and a chip body that are separately and spaced apart. The radio frequency chip includes a first substrate and a plurality of contact portions and a first signal transceiver portion that are provided on the first substrate. The plurality of contact portions are used to electrically contact the contact pins of the imaging device and are electrically connected to the first signal transceiver portion. The chip body includes a second substrate, a second signal transceiver and a memory provided on the second substrate, the memory storing information of the ink cartridge, and the second signal transceiver being electrically connected to the memory; The first signal receiving unit is used to convert the electrical signal received by the radio frequency chip into an electromagnetic wave signal; The second signal receiving unit is used to convert the electrical signal and electromagnetic wave signal received by the chip body.

2. The chip assembly according to claim 1, wherein: When the contact portion is electrically connected to the contact pin, the radio frequency chip receives an electrical signal from the imaging device, and then the first signal transceiver unit can convert the electrical signal received from the contact pin into an electromagnetic wave signal and transmit it to the chip body; When the second signal transceiver converts the received electromagnetic wave signal into an electrical signal to exchange information with the memory; when the second signal transceiver converts the electrical signal received from the memory into an electromagnetic wave and sends it back to the first signal transceiver; The first signal transceiver converts the electromagnetic wave signal received from the second signal transceiver into an electrical signal and outputs the electrical signal to the plurality of contact parts.

3. The chip assembly according to claim 1, wherein: The first signal receiving unit is a radio frequency tag, and the second signal receiving unit is a reader.

4. The chip assembly according to claim 3, wherein: The radio frequency tag can be either an active tag or a passive tag.

5. The chip assembly according to claim 1, wherein: The plurality of contacts include a data terminal, a clock terminal, a reset terminal, a power terminal, and a ground terminal.

6. The chip assembly according to claim 5, wherein: The plurality of contact portions are asymmetrically distributed on the surface of the substrate.

7. The chip assembly according to claim 6, wherein: The data terminal, the reset terminal, and the power terminal are provided on the -x side of the first substrate, and the ground terminal is provided on the +x side of the first substrate.

8. An ink cartridge detachably mounted in an imaging device having a stylus, the ink cartridge comprising a housing for containing ink, wherein: The ink cartridge comprises the chip assembly according to any one of claims 1 to 7, wherein the chip assembly is disposed on a housing and is configured to form electrical contact with a contact pin to establish a communication connection with an imaging device.

Images