BTB test socket

Abstract

The utility model provides a BTB test seat comprising a connecting assembly, and the connecting assembly comprises a PCB, a welding disc, a gold wire conductive adhesive, a BTB connector, a gold wire, an upper pressing seat, a sliding seat, a sliding groove, a spring, a mounting groove, a pressing block and a pressing plate. And the lower surface of the gold wire conductive adhesive is fixedly connected to the upper surface of the PCB. According to the utility model, the upper pressing seat and the lower testing seat are clamped by using the buckle, at the moment, under the pushing of the spring, the sliding seat moves downwards and pushes the pressing block, and the pressing block presses the testing circuit board through the pressing plate, so that a conductor of the testing circuit board can be tightly attached to a gold wire to establish stable electrical connection; at the moment, the gold thread is conducted with the test circuit board, the BTB connector, the gold thread conductive adhesive, the welding disc and the PCB, the test work can be carried out on the test circuit board, the gold thread, the BTB connector and other structures are used for replacing a traditional microchip needle or a Pogo Pin to serve as a conductor, pricking marks cannot be left on the surface of the test circuit board, the structure is simple, and the cost is low.

Description

Technical Field

[0001] The utility model relates to a test socket, in particular to a BTB test socket, and belongs to the technical field of circuit board testing. Background Art

[0002] A BTB test socket is a device or tool specifically designed for testing board-to-board (BTB) connectors. BTB connectors, also known as board-to-board connectors, evolved from flexible printed circuits (FPCs) to better accommodate the miniaturization and modularization of electronic devices. These connectors are simple to install, typically achieving electrical continuity through the mating of springs between male and female connectors. They are widely used in high-precision mobile devices such as mobile phones, medical devices, automobiles, and aerospace applications.

[0003] Currently, the structure of BTB test sockets on the market basically uses micro-pins or Pogo Pins as BTB connectors. With these two types of connectors, during the test process, the test circuit board needs to be in close contact with the contact points of the BTB connector to establish a stable electrical connection. If the contact pressure is too high, it will leave marks on the surface of the test circuit board. Therefore, a BTB test socket is proposed. Utility Model Content

[0004] In view of this, the present invention provides a BTB test socket to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0005] The technical solution of the embodiment of the utility model is achieved as follows: a BTB test socket includes a connection assembly, wherein the connection assembly includes a PCB board, a welding pad, a gold wire conductive adhesive, a BTB connector, a gold wire, an upper pressure seat, a sliding seat, a slide groove, a spring, a mounting groove, a pressure block and a pressure plate;

[0006] The lower surface of the gold wire conductive glue is fixedly connected to the upper surface of the PCB board, the BTB connector is fixedly connected to the upper surface of the gold wire conductive glue, the welding pad is arranged on the upper surface of the PCB board, the position of the gold wire conductive glue corresponds to the position of the welding pad, the gold wire is equidistantly fixedly connected to the upper surface of the BTB connector, the upper surface of the gold wire is a plane, the slide groove is opened on the lower surface of the upper pressure seat, the two mounting grooves are symmetrically opened on the upper surface of the sliding seat, the pressure block is fixedly connected to the lower surface of the sliding seat, the pressure plate is fixedly connected to the lower surface of the pressure block, the bottom end of the spring is installed inside the mounting groove, and the sliding seat is slidably connected to the inner side wall of the slide groove.

[0007] Further preferably, the top end of the spring is fixedly connected to the inner top wall of the sliding groove, and the size of the pressure plate is adapted to the size of the BTB connector.

[0008] Further preferably, a main body component is installed on the lower surface of the upper pressure seat, and the main body component includes a lower test seat and a buckle;

[0009] The rear portion of the lower surface of the upper press seat is rotatably connected to the rear portion of the upper surface of the lower test seat, and the front portion of the upper press seat is clamped with the lower test seat through the buckle.

[0010] Further preferably, a mounting frame is installed inside the lower test socket, and the gold wire conductive adhesive is embedded in the inner wall of the mounting frame.

[0011] Further preferably, the PCB board is mounted on the lower surface of the lower test socket, the gold wire conductive glue is electrically connected to the PCB board through the welding pad, and the BTB connector is electrically connected to the gold wire conductive glue.

[0012] Further preferably, the BTB connector is located inside the installation frame, and a test circuit board is installed inside the installation frame.

[0013] Further preferably, the lower surface of the pressing plate is attached to the upper surface of the test circuit board.

[0014] Further preferably, the conductor of the test circuit board is in contact with the upper surface of the gold wire.

[0015] Due to the adoption of the above technical solution, the embodiment of the present invention has the following advantages: the present invention connects the upper pressure seat and the lower test seat by using a snap buckle. At this time, under the push of the spring, the sliding seat moves downward and pushes the pressure block, and the pressure block presses the test circuit board through the pressure plate, so that the conductor of the test circuit board can be closely fitted with the gold wire to establish a stable electrical connection. At this time, the gold wire is connected to the test circuit board, the BTB connector, the gold wire conductive glue, the welding pad and the PCB board, and the test circuit board can be tested. The present invention replaces the traditional micro-pin or Pogo Pin as a conductor through structures such as gold wire and BTB connector, and will not leave puncture marks on the surface of the test circuit board.

[0016] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 It is a structural diagram of the utility model;

[0019] Figure 2 This is a structural diagram of the main components of the utility model;

[0020] Figure 3 This is a structural diagram of the PCB board of the present utility model;

[0021] Figure 4 This is a schematic diagram of the connection between the gold wire and the BTB connector of the present invention;

[0022] Figure 5 This is a structural diagram of the upper pressure seat of the utility model;

[0023] Figure 6 This is a structural diagram of the sliding seat of the utility model.

[0024] Figure numerals: 101, connection component; 11, PCB board; 12, welding pad; 13, gold wire conductive glue; 14, BTB connector; 15, gold wire; 16, upper pressure seat; 17, sliding seat; 18, slide groove; 19, spring; 20, mounting groove; 21, pressure block; 22, pressure plate; 301, main body component; 31, lower test seat; 32, buckle; 33, mounting frame; 34, test circuit board. DETAILED DESCRIPTION

[0025] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0026] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0027] like Figures 1-6 As shown, the embodiment of the present invention provides a BTB test socket, including a connection assembly 101, which includes a PCB board 11, a welding pad 12, a gold wire conductive adhesive 13, a BTB connector 14, a gold wire 15, an upper pressure seat 16, a sliding seat 17, a slide groove 18, a spring 19, a mounting groove 20, a pressure block 21 and a pressure plate 22;

[0028] The lower surface of the gold wire conductive adhesive 13 is fixedly connected to the upper surface of the PCB board 11, the BTB connector 14 is fixedly connected to the upper surface of the gold wire conductive adhesive 13, the welding pad 12 is provided on the upper surface of the PCB board 11, the position of the gold wire conductive adhesive 13 corresponds to the position of the welding pad 12, the gold wire 15 is equidistantly fixedly connected to the upper surface of the BTB connector 14, the upper surface of the gold wire 15 is flat, the slide groove 18 is defined on the lower surface of the upper pressure seat 16, two mounting grooves 20 are symmetrically defined on the upper surface of the sliding seat 17, the pressure block 21 is fixedly connected to the lower surface of the sliding seat 17, the pressure plate 22 is fixedly connected to the lower surface of the pressure block 21, the bottom end of the spring 19 is installed inside the mounting groove 20, and the sliding seat 17 is slidably connected to the inner side wall of the slide groove 18;

[0029] The BTB connector 14 is in sheet shape. The gold wire 15 is electrically connected to the BTB connector 14 . The thickness of the BTB connector 14 is 1 mm. The diameter of the gold wire 15 is 0.03 mm. The spacing between the gold wires 15 is 0.075 mm.

[0030] In one embodiment, the top end of the spring 19 is fixedly connected to the inner top wall of the slide groove 18, and the size of the pressure plate 22 is adapted to the size of the BTB connector 14. The spring 19 pushes the sliding seat 17 to slide in the slide groove 18, which can achieve a tightening effect.

[0031] In one embodiment, a main body assembly 301 is installed on the lower surface of the upper press seat 16 , and the main body assembly 301 includes a lower test seat 31 and a buckle 32 ;

[0032] The rear part of the lower surface of the upper press seat 16 is rotatably connected to the rear part of the upper surface of the lower test seat 31, and the front part of the upper press seat 16 is clamped to the lower test seat 31 through the buckle 32. When the upper press seat 16 and the lower test seat 31 are opened, the test circuit board 34 can be placed in the installation frame 33. When the upper press seat 16 and the lower test seat 31 are closed, the test circuit board 34 can be pressed for testing.

[0033] In one embodiment, a mounting frame 33 is installed inside the lower test seat 31, the gold wire conductive glue 13 is embedded in the inner side wall of the mounting frame 33, the PCB board 11 is installed on the lower surface of the lower test seat 31, the gold wire conductive glue 13 is electrically connected to the PCB board 11 through the welding pad 12, the BTB connector 14 is electrically connected to the gold wire conductive glue 13, and then the gold wire 15 is sequentially connected to the BTB connector 14, the gold wire conductive glue 13, the welding pad 12 and the PCB board 11 to complete the transmission of the test signal.

[0034] In one embodiment, the BTB connector 14 is located inside the mounting frame 33, and a test circuit board 34 is installed inside the mounting frame 33. The lower surface of the pressure plate 22 is in contact with the upper surface of the test circuit board 34, and the conductor of the test circuit board 34 is in contact with the upper surface of the gold wire 15. When the upper pressure seat 16 and the lower test seat 31 are closed, the spring 19 pushes the sliding seat 17, the sliding seat 17 pushes the pressure block 21, the pressure block 21 pushes the pressure plate 22, and the pressure plate 22 presses the test circuit board 34, thereby making the conductor of the test circuit board 34 fit tightly with the gold wire 15 to establish a stable electrical connection. At this time, the gold wire 15 is sequentially connected to the BTB connector 14, the gold wire conductive adhesive 13, the welding pad 12 and the PCB board 11, and the test circuit board 34 can be tested.

[0035] By using structures such as the gold wire 15 and the BTB connector 14 to replace traditional micro-pins or Pogo Pins as conductors, no marks will be left on the surface of the test circuit board 34.

[0036] When the present invention is in operation: the upper pressure seat 16 and the lower test seat 31 are opened, and the test circuit board 34 is placed in the installation frame 33. Then, the upper pressure seat 16 and the lower test seat 31 are rotated to close and fixed with the snap 32. At this time, under the push of the spring 19, the sliding seat 17 moves downward and pushes the pressure block 21. The pressure block 21 presses the test circuit board 34 through the pressure plate 22, so that the conductor of the test circuit board 34 can be tightly fitted with the gold wire 15 to establish a stable electrical connection. At this time, the gold wire 15 is conductive with the test circuit board 34, the BTB connector 14, the gold wire conductive glue 13, the welding pad 12 and the PCB board 11, and the test circuit board 34 can be tested.

[0037] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope of protection of the claims.

Claims

1. A BTB test socket, comprising a connection assembly (101), characterized in that: The connecting assembly (101) includes a PCB board (11), a welding plate (12), a gold wire conductive adhesive (13), a BTB connector (14), a gold wire (15), an upper pressure seat (16), a sliding seat (17), a sliding groove (18), a spring (19), a mounting groove (20), a pressure block (21) and a pressure plate (22); The lower surface of the gold wire conductive glue (13) is fixedly connected to the upper surface of the PCB board (11), the BTB connector (14) is fixedly connected to the upper surface of the gold wire conductive glue (13), the welding pad (12) is arranged on the upper surface of the PCB board (11), the position of the gold wire conductive glue (13) corresponds to the position of the welding pad (12), the gold wire (15) is fixedly connected to the upper surface of the BTB connector (14) at an equal distance, and the upper surface of the gold wire (15) is fixedly connected to the upper surface of the BTB connector (14). The surface is flat, the slide groove (18) is opened on the lower surface of the upper pressure seat (16), the two mounting grooves (20) are symmetrically opened on the upper surface of the sliding seat (17), the pressure block (21) is fixedly connected to the lower surface of the sliding seat (17), the pressure plate (22) is fixedly connected to the lower surface of the pressure block (21), the bottom end of the spring (19) is installed inside the mounting groove (20), and the sliding seat (17) is slidably connected to the inner wall of the slide groove (18).

2. The BTB test socket according to claim 1, characterized in that: The top end of the spring (19) is fixedly connected to the inner top wall of the slide groove (18), and the size of the pressure plate (22) is adapted to the size of the BTB connector (14).

3. The BTB test socket according to claim 2, characterized in that: A main body component (301) is mounted on the lower surface of the upper pressure seat (16), and the main body component (301) includes a lower test seat (31) and a buckle (32); The rear portion of the lower surface of the upper press seat (16) is rotatably connected to the rear portion of the upper surface of the lower test seat (31), and the front portion of the upper press seat (16) is snap-connected to the lower test seat (31) via the buckle (32).

4. The BTB test socket according to claim 3, characterized in that: A mounting frame (33) is installed inside the lower test seat (31), and the gold wire conductive glue (13) is embedded in the inner wall of the mounting frame (33).

5. The BTB test socket according to claim 4, characterized in that: The PCB board (11) is mounted on the lower surface of the lower test seat (31), the gold wire conductive glue (13) is electrically connected to the PCB board (11) through the welding plate (12), and the BTB connector (14) is electrically connected to the gold wire conductive glue (13).

6. The BTB test socket according to claim 5, characterized in that: The BTB connector (14) is located inside the installation frame (33), and a test circuit board (34) is installed inside the installation frame (33).

7. The BTB test socket according to claim 6, characterized in that: The lower surface of the pressing plate (22) is attached to the upper surface of the testing circuit board (34).

8. The BTB test socket according to claim 7, characterized in that: The conductor of the test circuit board (34) is bonded to the upper surface of the gold wire (15).

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