Test board

Abstract

The embodiment of the utility model relates to the technical field of testing, in particular to a test board. The test board comprises a signal processing unit, a circuit board, a movable board, a signal compensation chip and test pins. The moving plate stands above the circuit board, the signal processing unit and the signal compensation chip are located on one side, facing the moving plate, of the circuit board, and a plurality of pairs of differential signal transmission lines are arranged on the top surface and / or the bottom surface of the moving plate; the signal compensation chip is used for supplementing high-speed signals. According to the technical scheme provided by the invention, a plurality of test interfaces of a project can be universally used by using one Colay design, so that the design cost of the test board is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of testing technology, and in particular to a testing board. Background Art

[0002] With the advancement of science and technology, the transmission rate of high-speed signals is increasing, requiring the installation of corresponding high-speed signal transmission lines. Given the increasingly smaller motherboard space requirements, how to layout high-speed signal transmission lines within the limited motherboard space while minimizing signal loss and improving signal integrity has become a challenging issue for product development.

[0003] To improve signal integrity, high-speed signal compensation chips can be incorporated into the high-speed signal transmission path. However, designers also need to try designs without the high-speed signal compensation chip. Consequently, multiple colay designs (or compatible designs) are often found on circuit boards. Consequently, a test board is designed that incorporates multiple colay designs to verify high-speed signal transmission with and without the signal compensation chip. However, existing test boards are expensive to design. Utility Model Content

[0004] Based on this, it is necessary to address the above technical issues. This application provides a test board that can use one Colay design to be universal for multiple test interfaces of a project, thereby reducing the design cost of the test board.

[0005] In a first aspect, the present application provides a test board, comprising:

[0006] Signal processing unit, circuit board, moving board, signal compensation chip and test pins;

[0007] The movable board is located above the circuit board, the signal processing unit and the signal compensation chip are located on a side of the circuit board facing the movable board, and a plurality of pairs of differential signal transmission lines are provided on the top surface and / or the bottom surface of the movable board;

[0008] The signal compensation chip is used to supplement high-speed signals.

[0009] In some embodiments, the signal compensation chip includes a signal transmission channel, the signal transmission channel is connected to the test signal output by the signal processing unit, and the test signal is transmitted to the test pin through the signal compensation chip;

[0010] The signal transmission channel is not connected to the signal to be tested, the differential signal transmission line is connected to the signal to be tested, and the signal to be tested is transmitted to the test pin through the movable board.

[0011] In some embodiments, the test board further comprises:

[0012] a first signal acting device and a second signal acting device, wherein the first signal acting device and the second signal acting device are respectively located at an input side and an output side of the signal transmission channel;

[0013] The input end of the first signal processing device is used to receive the test signal output by the signal processing unit; the input end of the second signal processing device is connected to the output end of the signal transmission channel, and the output end of the second signal processing device is connected to the test pin;

[0014] The output end of the first signal processing device is connected to the input end of the signal transmission channel, and the signal to be tested is transmitted to the test pin through the signal compensation chip.

[0015] In some embodiments, the test board further comprises:

[0016] a first signal acting device and a second signal acting device; the first signal acting device and the second signal acting device are respectively located at the input side and the output side of the signal transmission channel;

[0017] The input end of the differential signal transmission line is connected to the input end of the first signal-affecting device, the output end of the differential signal transmission line is connected to the output end of the second signal-affecting device, and the signal to be tested is transmitted to the test pin through the movable board.

[0018] In some embodiments, the first signal processing device includes a first device and a second device, and the input ends of the first device and the second device are connected to the signal processing unit;

[0019] The second signal-affecting device includes a third device and a fourth device, and the output ends of the third device and the fourth device are connected to the test pin;

[0020] The signal transmission channel includes a first channel and a second channel. The output end of the first channel is connected to the input end of the third device, and the output end of the second channel is connected to the input end of the fourth device.

[0021] In some embodiments, the output end of the first device is connected to the input end of the first channel, the output end of the second device is connected to the input end of the second channel, and the signal to be tested is transmitted to the test pin through the signal compensation chip.

[0022] In some embodiments, the output end of the first device and the output end of the second device are removable pads; the pair of differential signal transmission lines includes a first signal line and a second signal line;

[0023] The removable pad is removed, the input end of the first signal line is connected to the input end of the first device, and the output end of the first signal line is connected to the output end of the third device; the input end of the second signal line is connected to the input end of the second device, and the output end of the second signal line is connected to the output end of the fourth device; the signal to be tested is transmitted to the test pin through the movable board.

[0024] In some embodiments, the test board further comprises:

[0025] A supporting structure, one end of which is fixedly arranged on a side of the movable plate facing the circuit board, and the other end of which is movable to contact the circuit board.

[0026] In some embodiments, the test board further includes a first connecting line and a second connecting line;

[0027] The output end of the first signal processing device is disconnected from the input end of the signal transmission channel, and the input end of the differential signal transmission line is connected to the input end of the first signal processing device through the first connecting line;

[0028] The output end of the differential signal transmission line is connected to the output end of the second signal processing device through the second connecting line.

[0029] In some embodiments, the test board further comprises:

[0030] a first connecting pad and a second connecting pad, wherein the first connecting pad is provided at the input end of each pair of differential signal transmission lines, and the second connecting pad is provided at the output end of each pair of differential signal transmission lines,

[0031] The input end of each pair of differential signal transmission lines is connected to the first connection line through the first connection pad, and the output end of each pair of differential signal transmission lines is connected to the second connection line through the second connection pad.

[0032] In some embodiments, the test board further comprises:

[0033] A first grounding pad and a second grounding pad are located on the movable plate, and both the first grounding pad and the second grounding pad are connected to the ground terminal of the circuit board.

[0034] In a second aspect, the present application further provides a testing system, comprising the testing board according to the first aspect.

[0035] The test board provided in the embodiment of the present application includes: a signal processing unit, a circuit board, a mobile board, a signal compensation chip and a test pin; the mobile board stands above the circuit board, the signal processing unit and the signal compensation chip are located on the side of the circuit board facing the mobile board, and the top surface and / or bottom surface of the mobile board are provided with multiple pairs of differential signal transmission lines; the signal compensation chip is used to supplement high-speed signals. By setting up a mobile board and arranging multiple pairs of differential signal transmission lines on the mobile board, and utilizing the mobility of the mobile board, it is possible to achieve a test board that uses a Colay design to be reusable for a variety of signals to be tested. Therefore, the test board provided in the embodiment of the present application can achieve the use of a Colay design for multiple test interfaces of a project, thereby reducing the design cost of the test board. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0037] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0038] Figure 1 A schematic diagram of the structure of a test board provided in the related art;

[0039] Figure 2 A schematic diagram of the structure of a test board provided in an embodiment of the present application;

[0040] Figure 3 A schematic diagram of an application scenario of a test board provided in an embodiment of the present application;

[0041] Figure 4 A schematic structural diagram of a movable plate provided in an embodiment of the present application.

[0042] Among them, 11. signal processing unit; 12. circuit board; 13. moving board; 14. signal compensation chip; 151. first signal acting device; 152. second signal acting device; 16. test pin; 17. differential signal transmission; 171. first signal line; 172. second signal line; 18. signal transmission channel; 181. first channel; 182. second channel; 191. first connecting line; 192. second connecting line; 201. first connecting pad; 202. second connecting pad; 21. supporting structure; 221. first grounding pad; 222. second grounding pad; 01. first device; 02. second device; 03. third device; 04. fourth device. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0044] Figure 1 This is a schematic diagram of the structure of a test board provided in the related art. Figure 1 As shown, the test board includes a signal processing unit 11, a circuit board 12, a first signal processing device 151, a second signal processing device 152, a signal compensation chip 14, and a test pin 16. The circuit board 12 includes a first signal transmission path and a second signal transmission path. The test signal output by the signal processing unit 11 is transmitted to the test pin 16 through the first signal transmission path or the second signal transmission path, and the test interface receives the test signal through the test pin 16. The first signal processing device 151 can be any one of a resistor, an inductor, and a capacitor, and the second signal processing device 152 can be any one of a resistor, an inductor, and a capacitor. The test interface can be, for example, an HDMI interface, a USB3 interface, or a Typc-C interface.

[0045] Specifically, if Figure 1 The first signal transmission path shown is: test signal - first signal processing device 151 - signal compensation chip 14 - second signal processing device 152 - test pin 16; the second signal transmission path is: test signal - test pin 16. Therefore, a colay design is performed on the circuit board 12 to verify the two conditions of high-speed signal transmission: passing through the signal compensation chip 14 and not passing through the signal compensation chip 14.

[0046] However, for the same project, we take a notebook with one HDMI port, one USB3 port and one Type-C port as an example. Since the HDMI port, USB3 port and Type-C port correspond to different test signals, it is necessary to design multiple Colay solutions on the test board shown in 1 ( Figure 1 Only two Colay design schemes are shown as examples in the figure), and each Colay design scheme corresponds to verifying two situations in which a test signal passes through the signal compensation chip 14 and does not pass through the signal compensation chip 14 during signal transmission.

[0047] For example, when testing the HDMI interface, it is necessary to design the first signal transmission path and the second signal transmission path for transmitting the HDMI signal; when testing the USB3 interface, it is necessary to design the first signal transmission path and the second signal transmission path for transmitting the USB signal; when testing the Typc-C interface, it is necessary to design the first signal transmission path and the second signal transmission path corresponding to the Typc-C signal. Figure 2 The two Colay schemes shown in FIG can be used to verify HDMI signals and USB signals, for example.

[0048] Therefore, the same project includes multiple different test interfaces corresponding to different high-speed signals. A Colay design is required for each signal to be tested, which increases the design cost of the test board.

[0049] In response to the technical problems existing in the above-mentioned related technologies, embodiments of the present application provide a test board. The test board provided in embodiments of the present application, by providing a movable board and arranging multiple pairs of differential signal transmission lines on the movable board, utilizes the mobility of the movable board to achieve the reusability of the test board using a single Colay design for multiple test signals. Thus, the test board provided in embodiments of the present application can use a single Colay design to be universal for multiple test interfaces of a project, thereby reducing the design cost of the test board.

[0050] The test board provided in the embodiments of the present application is exemplarily described below with reference to the accompanying drawings.

[0051] Figure 2 This is a schematic diagram of the structure of a test board provided in an embodiment of the present application. Figure 2 As shown, the test board includes: a signal processing unit 11, a circuit board 12, a movable board 13, a signal compensation chip 14 and a test pin 16; the movable board 13 is located above the circuit board 12, the signal processing unit 11 and the signal compensation chip 14 are located on the side of the circuit board 12 facing the movable board 13, and multiple pairs of differential signal transmission lines 17 are provided on the top surface and / or bottom surface of the movable board 13; the signal compensation chip 14 is used to supplement high-speed signals.

[0052] Among them, the signal compensation chip 14 includes a signal transmission channel 18; the signal transmission channel 18 is connected to the test signal output by the signal processing unit 11, and the test signal is transmitted to the test pin 16 through the signal compensation chip 14; the signal transmission channel 18 is not connected to the test signal, a pair of differential signal transmission lines 17 are connected to the test signal, and the test signal is transmitted to the test pin 16 through the movable board 13.

[0053] The multiple pairs of differential signal transmission lines 17 are respectively used to transmit a variety of high-speed signals such as High Definition Multimedia Interface (HDMI) signals. Figure 2 exemplarily shows three pairs of differential signal transmission lines 17 , which are respectively used to transmit three signals to be tested.

[0054] The test pin 16 is used to plug into a test port on an electronic device, such as a laptop. For example, the laptop's test port may include, but is not limited to, an HDMI port, a USB3 port, and a Type-C port. The HDMI port receives HDMI signals, the USB3 port receives USB3 signals, and the Type-C port receives Type-C signals.

[0055] For example, when testing an HDMI interface, the signal processing unit 11 outputs the test signal, i.e., the HDMI signal. The signal transmission channel 18 receives the HDMI signal, which can be transmitted to the test pin 16 via the signal compensation chip 14. This verifies that the HDMI signal is transmitted to the HDMI interface via the signal compensation chip 14 (signal transmission channel 18). Subsequently, the test verifies that the HDMI signal is not transmitted to the HDMI interface via the signal compensation chip 14. Specifically, a pair of differential signal transmission lines 17 (for transmitting HDMI signals) receives the test signal, which is then transmitted to the test pin 16 via the movable board 13.

[0056] For example, when testing a USB3 interface, signal processing unit 11 outputs the test signal, i.e., the USB3 signal. Signal transmission channel 18 receives the USB3 signal, which is then transmitted to test pin 16 via signal compensation chip 14. This verifies that the USB3 signal is transmitted to the HDMI interface via signal compensation chip 14 (signal transmission channel 18). Subsequently, verification is performed to verify that the USB3 signal is not transmitted to the USB3 interface via signal compensation chip 14. Specifically, a pair of differential signal transmission lines 17 (for transmitting USB3 signals) receives the test signal, which is then transmitted to test pin 16 via movable board 13.

[0057] For example, when the Type-C interface is tested, the signal processing unit 11 outputs the signal to be tested, namely the Type-C signal, the signal transmission channel 18 is connected to the Type-C signal, and the USB3 signal can be transmitted to the test pin 16 through the signal compensation chip 14. Thus, a situation in which the Type-C signal is transmitted to the Type-C interface through the signal compensation chip 14 (signal transmission channel 18) can be verified. Afterwards, another situation in which the Type-C signal is not transmitted to the Type-C interface through the signal compensation chip 14 is verified. Specifically, a pair of differential signal transmission lines 17 (for transmitting the Type-C signal) are connected to the signal to be tested, and the signal to be tested is transmitted to the test pin 16 through the movable board 13.

[0058] Thus, for the same project including multiple test interfaces, such as an HDMI interface, a USB3 interface, and a Typc-C interface, by setting up a mobile board and arranging multiple pairs of differential signal transmission lines on the mobile board, and utilizing the mobility of the mobile board, the test board can be designed with one Colay to be reusable for a variety of signals to be tested. In the related art, a Colay design is required for each test interface of a project, thereby increasing the design cost of the test board. Compared with the related art, the test board provided in the embodiment of the present application can use one Colay design to be universal for multiple test interfaces of a project, thereby reducing the design cost of the test board.

[0059] In some embodiments, as Figure 2 As shown, the test board further includes: a first signal acting device 151 and a second signal acting device 152 , which are respectively located at the input side and the output side of the signal transmission channel 18 .

[0060] Among them, the input end A of the first signal-affecting device 151 is used to access the test signal output by the signal processing unit 11; the input end C of the second signal-affecting device 152 is connected to the output end F of the signal transmission channel 18, and the output end D of the second signal-affecting device 152 is connected to the test pin 16.

[0061] Specifically, the output terminal B of the first signal processing device 151 is connected to the input terminal E of the signal transmission channel 18 , and the signal to be tested is transmitted to the test pin 16 through the signal compensation chip 14 .

[0062] Specifically, the input end of the differential signal transmission line 17 is connected to the input end A of the first signal-affecting device 151 , and the output end of the differential signal transmission line 17 is connected to the output end D of the second signal-affecting device 152 . The signal to be tested is transmitted to the test pin 16 through the movable board 13 .

[0063] The test pin 16 is used to plug into a test port on an electronic device, such as a laptop. For example, the laptop's test port may include, but is not limited to, an HDMI port, a USB3 port, and a Type-C port. The HDMI port receives HDMI signals, the USB3 port receives USB3 signals, and the Type-C port receives Type-C signals.

[0064] For example, when testing the HDMI interface, the signal processing unit 11 outputs the test signal, i.e., the HDMI signal. When the output terminal B of the first signal processing device 151 is connected to the input terminal E of the signal transmission channel 18, the HDMI signal is transmitted to the test pin 16 via the signal compensation chip 14, and then to the HDMI interface. During the HDMI signal transmission process, the path from HDMI signal to first signal processing device 151 to signal compensation chip 14 (signal transmission channel 18) to second signal processing device 151 to test pin 16 can be the first signal transmission path. This allows verification of a situation in which the test signal, i.e., the HDMI signal, is transmitted to the HDMI interface via the signal compensation chip 14 (signal transmission channel 18).

[0065] Afterwards, another situation is verified in which the HDMI signal is not transmitted to the HDMI interface through the signal compensation chip 14. Accordingly, the output terminal B of the first signal processing device 151 is disconnected from the input terminal E of the signal transmission channel 18. The movable plate 13 can be moved on the circuit board 12 to position the pair of differential signal transmission lines 17 (for transmitting HDMI signals) at the current position. The current position is the position where the pair of differential signal transmission lines 17 are closest to the first signal processing device 151 and the second signal processing device 152.

[0066] Specifically, the input end of a pair of differential signal transmission lines 17 (for transmitting HDMI signals) is connected to input end A of a first signal processing device 151, and the output end of the pair of differential signal transmission lines 17 is connected to output end D of a second signal processing device 152. The HDMI signal is transmitted via the mobile board 13 (a pair of differential signal transmission lines 17) to the test pin 16, and then to the HDMI interface. During the HDMI signal transmission process, the path from HDMI signal to mobile board 13 (a pair of differential signal transmission lines) to test pin 16 can serve as a second signal transmission path. This allows verification of another situation where the HDMI signal is not transmitted to the HDMI interface via the high-speed signal compensation channel.

[0067] For example, Figure 3 This is a schematic diagram of an application scenario of a test board provided in an embodiment of the present application. Figure 3As shown, the test signal output by the signal processing unit 11 is transmitted through the first signal transmission path indicated by Y1 (through the signal compensation chip 14), and the test signal output by the signal processing unit 11 is transmitted through the second signal transmission path indicated by Y2 (through the movable plate 13). It should be noted that the surface of the circuit board 12 is generally arranged with a large number of electronic devices 23. In order to improve the space utilization of the circuit board 12, through holes are provided on the circuit board 12. The test signal can be transmitted through the microstrip line or stripline in the through holes.

[0068] Similarly, when testing a USB3 interface, signal processing unit 11 outputs the test signal, namely the USB3 signal. The first signal transmission path, which follows the USB3 signal path from first signal processing device 151 to signal compensation chip 14 to second signal processing device 152 and finally to test pin 16, can be verified. This allows verification that the USB3 signal is transmitted to the USB3 interface via signal compensation chip 14 (signal transmission path 18).

[0069] Afterwards, another situation is verified in which the USB3 signal is not transmitted to the HDMI interface through the signal compensation chip 14. Correspondingly, the output terminal B of the first signal effecting device 151 is disconnected from the input terminal E of the signal transmission channel 18, and the movable plate 13 can be moved on the circuit board 12 so that the pair of differential signal transmission lines 17 (for transmitting USB3 interface signals) are in the current position. During the USB3 signal transmission process, the USB3 signal-moving plate 13 (a pair of differential signal transmission lines)-test pin 16 can be the second signal transmission path. In this way, another situation in which the USB3 signal to be tested is not transmitted to the USB3 interface through the signal compensation chip 14 can be verified.

[0070] Similarly, when testing the Type-C signal interface, signal processing unit 11 outputs the test signal, namely the Type-C signal. The first signal transmission path is the path from Type-C signal to first signal processing device 151, signal compensation chip 14, second signal processing device 152, and test pin 16. This allows verification that the Type-C signal is transmitted to the Type-C interface via signal compensation chip 14 (signal transmission path 18).

[0071] Afterwards, verify another situation in which the Type-C signal is not transmitted to the Type-C interface through the signal compensation chip 14. Correspondingly, the output terminal B of the first signal action device 151 is disconnected from the input terminal E of the signal transmission channel 18, and the movable plate 13 can be moved on the circuit board 12 so that a pair of differential signal transmission lines 17 (for transmitting the Type-C signal) is in the current position. During the Type-C signal transmission process, the Type-C signal-moving plate 13 (a pair of differential signal transmission lines)-test pin 16 can be a second signal transmission path. Thus, another situation in which the Type-C signal is not transmitted to the Type-C interface through the signal compensation chip 14 can be verified.

[0072] In summary, when the same project includes multiple test interfaces, such as an HDMI interface, a USB3 interface, and a Typc-C interface, by setting up a mobile board and arranging multiple pairs of differential signal transmission lines on the mobile board, and utilizing the mobility of the mobile board, the test board can be designed with one Colay to be reusable for a variety of signals to be tested. In the related art, a Colay design is required for each test interface of a project, thereby increasing the design cost of the test board. Compared with the related art, the test board provided in the embodiment of the present application can use one Colay design to be universal for multiple test interfaces of a project, thereby reducing the design cost of the test board.

[0073] In some embodiments, as Figure 2 As shown, the first signal-affecting device 151 includes a first device 01 and a second device 02, and the input terminal A1 of the first device 01 and the input terminal A2 of the second device 02 are connected to the signal processing unit 11; the second signal-affecting device 152 includes a third device 03 and a fourth device 04, and the output terminal D3 of the third device 03 and the output terminal D4 of the fourth device 04 are connected to the test pin 16; the signal transmission channel 18 includes a first channel 181 and a second channel 182, and the output terminal F1 of the first channel 181 is connected to the input terminal C3 of the third device 03, and the output terminal F2 of the second channel 182 is connected to the input terminal C4 of the fourth device 04.

[0074] The signal to be tested output by the signal processing unit 11 is a pair of differential signals. When the output terminal B1 of the first device 01 is connected to the input terminal E1 of the first channel 181, and the output terminal B2 of the second device 02 is connected to the input terminal E2 of the second channel 182, the pair of differential signals can be transmitted to the third device 03 and the fourth device 04 through the first channel 181 and the second channel 182, thereby achieving the transmission of the signal to be tested to the test pin 16 through the signal compensation chip 14.

[0075] In some embodiments, as Figure 2As shown, the output terminal B1 of the first device 01 and the output terminal B2 of the second device 02 are removable pads; and a pair of differential signal transmission lines 17 includes a first signal line 171 and a second signal line 172. Specifically, because the output terminal B1 of the first device 01 and the output terminal B2 of the second device 02 are configured as removable pads, when the output terminal B1 of the first device 01 and the output terminal B2 of the second device 02 are removed, the conductive circuit between the first device 01 and the second device 02 and the signal transmission channel 18 can be disconnected.

[0076] At this time, the input end of the first signal line 171 is connected to the input end A1 of the first device 01, and the output end of the first signal line 171 is connected to the output end D3 of the third device 03; the input end of the second signal line 172 is connected to the input end A2 of the second device 02, and the output end of the second signal line 172 is connected to the output end D4 of the fourth device 04, thereby realizing the transmission of the signal to be tested to the test pin 16 through the movable board 13 (a pair of differential signal transmission lines 17).

[0077] In some embodiments, as Figure 2 As shown, the test board also includes a first connecting line 191 and a second connecting line 192; the output end B of the first signal-affecting device 151 is disconnected from the input end E of the signal transmission channel 18, and the input ends of a pair of differential signal transmission lines 17 are connected to the input end A of the first signal-affecting device 151 through the first connecting line 191; the output ends of a pair of differential signal transmission lines 17 are connected to the output end D of the second signal-affecting device 152 through the second connecting line 192.

[0078] Specifically, the first connection line 191 and the second connection line 192 can be welding connection lines. When the connection circuit between the first signal processing device 151 and the signal transmission channel 18 is disconnected, the input end of the pair of differential signal transmission lines 17 is connected to the input end A of the first signal processing device 151 via the first connection line 191, and the output end of the pair of differential signal transmission lines 17 is connected to the output end D of the second signal processing device 152 via the second connection line 192, thereby enabling the test signal to be transmitted to the test pin 16 via the movable board 13 (the pair of differential signal transmission lines 17).

[0079] For example, Figure 2 As shown, the test board further includes: a first connection pad 201 and a second connection pad 202, wherein the first connection pad 201 is provided at the input end of each pair of differential signal transmission lines 17, and the second connection pad 202 is provided at the output end of each pair of differential signal transmission lines 17. The input end of a pair of differential signal transmission lines 17 is connected to the first connection line 191 through the first connection pad 201, and the output end of the pair of differential signal transmission lines 17 is connected to the second connection line 192 through the second connection pad 202.

[0080] In some embodiments, Figure 4 A schematic diagram of the structure of a movable plate provided in an embodiment of the present application. Figure 2 and Figure 4 The test board also includes: a first grounding pad 221 and a second grounding pad 222 located on the mobile board 13, and the first grounding pad 221 and the second grounding pad 222 are both connected to the ground end of the circuit board 12 (not shown in the figure) for connecting the ground signal of the circuit board 12.

[0081] Specifically, the first connection pad 201 is located between adjacent first ground pads 221, and the second connection pad 202 is located between adjacent second ground pads 222. Thus, by providing the first ground pad 221 and the second ground pad 222, signal crosstalk is reduced and good ground return is maintained.

[0082] In some embodiments, as Figure 2 As shown, the test board further includes: a support structure 21 , one end of the support structure 21 is fixedly disposed on a side of the movable plate 13 facing the circuit board 12 , and the other end of the support structure is movable to contact the circuit board 12 .

[0083] Based on the above embodiments, the present application also provides a testing system, including a testing board as in the first aspect, and thus has the same or similar beneficial effects, which will not be described in detail here.

[0084] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The above embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the concept of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be based on the appended claims.

Claims

1. A test board, characterized in that: include: Signal processing unit, circuit board, moving board, signal compensation chip and test pins; The movable board is located above the circuit board, the signal processing unit and the signal compensation chip are located on a side of the circuit board facing the movable board, and a plurality of pairs of differential signal transmission lines are provided on the top surface and / or the bottom surface of the movable board; The signal compensation chip is used to supplement high-speed signals.

2. The test board according to claim 1, characterized in that The signal compensation chip includes a signal transmission channel, the signal transmission channel is connected to the test signal output by the signal processing unit, and the test signal is transmitted to the test pin through the signal compensation chip; The signal transmission channel is not connected to the signal to be tested, the differential signal transmission line is connected to the signal to be tested, and the signal to be tested is transmitted to the test pin through the movable board.

3. The test board according to claim 2, characterized in that Also includes: a first signal acting device and a second signal acting device; the first signal acting device and the second signal acting device are respectively located at the input side and the output side of the signal transmission channel; The input end of the first signal processing device is used to receive the test signal output by the signal processing unit; the input end of the second signal processing device is connected to the output end of the signal transmission channel, and the output end of the second signal processing device is connected to the test pin; The output end of the first signal processing device is connected to the input end of the signal transmission channel, and the signal to be tested is transmitted to the test pin through the signal compensation chip.

4. The test board according to claim 2, characterized in that Also includes: a first signal acting device and a second signal acting device; the first signal acting device and the second signal acting device are respectively located at the input side and the output side of the signal transmission channel; The input end of the differential signal transmission line is connected to the input end of the first signal-affecting device, the output end of the differential signal transmission line is connected to the output end of the second signal-affecting device, and the signal to be tested is transmitted to the test pin through the movable board.

5. The test board according to claim 3 or 4, characterized in that: The first signal processing device includes a first device and a second device, and the input ends of the first device and the second device are connected to the signal processing unit; The second signal-affecting device includes a third device and a fourth device, and the output ends of the third device and the fourth device are connected to the test pin; The signal transmission channel includes a first channel and a second channel. The output end of the first channel is connected to the input end of the third device, and the output end of the second channel is connected to the input end of the fourth device.

6. The test board according to claim 5, characterized in that The output end of the first device is connected to the input end of the first channel, the output end of the second device is connected to the input end of the second channel, and the signal to be tested is transmitted to the test pin through the signal compensation chip.

7. The test board according to claim 5, characterized in that The output end of the first device and the output end of the second device are removable pads; the pair of differential signal transmission lines includes a first signal line and a second signal line; The removable pad is removed, the input end of the first signal line is connected to the input end of the first device, and the output end of the first signal line is connected to the output end of the third device; the input end of the second signal line is connected to the input end of the second device, and the output end of the second signal line is connected to the output end of the fourth device; the signal to be tested is transmitted to the test pin through the movable board.

8. The test board according to claim 1, characterized in that Also includes: A supporting structure, one end of which is fixedly arranged on a side of the movable plate facing the circuit board, and the other end of which is movable to contact the circuit board.

9. The test board according to claim 3 or 4, characterized in that: Also includes: a first connecting line and a second connecting line; The output end of the first signal processing device is disconnected from the input end of the signal transmission channel, and the input end of the differential signal transmission line is connected to the input end of the first signal processing device through the first connecting line; The output end of the differential signal transmission line is connected to the output end of the second signal processing device through the second connecting line.

10. The test board according to claim 9, characterized in that: Also includes: a first connecting pad and a second connecting pad, wherein the first connecting pad is provided at the input end of each pair of differential signal transmission lines, and the second connecting pad is provided at the output end of each pair of differential signal transmission lines, The input end of each pair of differential signal transmission lines is connected to the first connection line through the first connection pad, and the output end of each pair of differential signal transmission lines is connected to the second connection line through the second connection pad.

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