Wavelength-adjustable optical receiving assembly based on ETALON

Abstract

The utility model discloses an ETALON-based wavelength-adjustable light receiving assembly, comprising a packaging shell, a first mounting groove, a second mounting groove, a third mounting groove and a fourth mounting groove are arranged in the packaging shell from left to right, a photoelectric receiving diode is arranged in the first mounting groove, a semiconductor cooler is arranged in the second mounting groove, the semiconductor cooler is annular, and the photoelectric receiving diode is arranged in the fourth mounting groove. An optical etalon is inserted in an inner hole of the semiconductor cooler, an insertion core is inserted in the third installation groove, the diameter of the insertion core is larger than that of the inner hole of the semiconductor cooler, one end of the insertion core abuts against one side of the optical etalon, the other end of the insertion core is located in a fourth installation groove, and the fourth installation groove is located on the rear side of the packaging shell. A pluggable packaging shell is inserted in the fourth installation groove, one end of the pluggable packaging shell is inserted in the fourth installation groove, and an inner hole channel of the pluggable packaging shell is connected to the insertion core in a sleeved mode, the structure is reasonable, the product size is small, the wavelength can be adjusted, and the pluggable packaging shell is compatible with current mainstream module packaging.

Description

Technical Field

[0001] The utility model relates to the field of optical receivers, in particular to an ETALON-based optical receiving component with adjustable wavelength. Background Art

[0002] Optical receivers are devices that receive optical signals from optical cables and convert them into electrical signals for transmission into the cable network. Due to the technical complexity, optical coating filters can be used to filter wavelengths, but simultaneous use of multiple wavelengths is difficult. Therefore, there are currently very few wavelength-tunable optical receiver components on the market. Alternatively, external MEMS-based wavelength-tunable filters are used, which are bulky and have poor reliability. Currently, there is no effective, low-cost solution for wavelength-tunable optical receiver components on the market. To address these issues, the following proposes a solution. Utility Model Content

[0003] The purpose of the utility model is to provide an ETALON-based optical receiving component with adjustable wavelength, which has the advantages of small size, low power consumption and compatibility with current mainstream module packaging.

[0004] The above technical objectives of the present invention are achieved through the following technical solutions:

[0005] A wavelength-adjustable optical receiving component based on ETALON includes a packaging shell, wherein mounting slot 1, mounting slot 2, mounting slot 3, and mounting slot 4 are arranged inside the packaging shell from left to right, and the centers of the four mounting slots are on the same straight line. The diameters of mounting slot 1, mounting slot 2, and mounting slot 3 decrease in sequence, and the diameter of mounting slot 4 is larger than the diameter of mounting slot 3. A photoelectric receiving diode is arranged in mounting slot 1, and the rear end of the photoelectric receiving diode is located directly in front of mounting slot 2. A semiconductor cooler is arranged in mounting slot 2, and the semiconductor cooler is annular. An optical standard is inserted into the inner hole of the semiconductor cooler, and the side of the optical standard away from the photoelectric receiving diode is flush with the side of the semiconductor cooler. A ferrule is inserted into the third mounting groove, and the diameter of the ferrule is larger than the inner hole diameter of the semiconductor cooler. One end of the ferrule is against one side of the optical standard, and the other end of the ferrule is located in the fourth mounting groove, and the fourth mounting groove is located on the rear side of the packaging shell. A plug-in packaging shell is inserted into the fourth mounting groove, and one end of the plug-in packaging shell is plugged into the fourth mounting groove, and the inner channel of the plug-in packaging shell is sleeved on the ferrule.

[0006] Preferably, the semiconductor refrigerator is provided with an anode connector and a cathode connector, and the anode connector and the cathode connector are inserted into the interior of the packaging shell.

[0007] Preferably, the outer side wall of the semiconductor cooler is a hot side, and the inner side wall of the semiconductor cooler is a cold side.

[0008] Preferably, one end of the ferrule is fixedly connected to the packaging shell by epoxy glue.

[0009] Preferably, the optical etalon is fixedly connected to the inner hole wall of the semiconductor device via a thermally conductive adhesive.

[0010] Preferably, the semiconductor cooler is fixedly connected to the second mounting groove via thermally conductive adhesive.

[0011] Preferably, the photoelectric receiving diode and the packaging shell are collimated and packaged via optical coupling.

[0012] The beneficial effects of the utility model are:

[0013] 1. Effectively solve the lack of small wavelength-tunable optical receiving devices in the market.

[0014] 2. Reduce the cost of wavelength-tunable optical receiving devices on the market. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of an embodiment;

[0016] Figure 2 Schematic diagram of the structure of the semiconductor refrigerator in the embodiment;

[0017] Figure 3 is a cross-sectional view of a semiconductor refrigerator according to an embodiment;

[0018] Figure 4 It is a structural diagram of an existing external MEMS solution in the background technology.

[0019] Figure numerals: 1. Package shell; 2. Photoreceiving diode; 3. Semiconductor cooler; 4. Optical standard; 5. Insert core; 6. Plug-in package shell; 7. Anode terminal; 8. Cathode terminal; 9. Hot side; 10. Cold side. DETAILED DESCRIPTION

[0020] The following is only a preferred embodiment of the present invention, and the scope of protection is not limited to this embodiment. All technical solutions under the concept of the present invention should fall within the scope of protection of the present invention. The same parts are represented by the same figure marks. It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to the directions in the accompanying drawings, and the words "bottom" and "top", "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively.

[0021] like Figures 1 to 3As shown, an ETALON-based wavelength-adjustable optical receiving assembly includes a housing 1. Inside the housing 1, mounting slots 1, 2, 3, and 4 are arranged from left to right. The centers of the four mounting slots are collinear. The diameters of slots 1, 2, and 3 decrease in order, with slot 4 having a larger diameter than slot 3. For ease of description, the direction in which slot 1 is located is referred to as the front side, and the direction in which slot 4 is located is referred to as the rear side. The housing 1 in this design is constructed of metal or plastic.

[0022] A photodiode 2 is disposed within mounting groove 1. Optically coupled, the photodiode 2 and the package shell 1 are collimated and packaged together. The rear side of the photodiode 2 is located within mounting groove 1, and the front side of the photodiode 2 is located outside the package shell 1. The photodiode 2 can receive external optical signals.

[0023] A semiconductor cooler 3 is provided within the second mounting groove. The semiconductor cooler 3 is embedded within the second mounting groove and fixedly connected to the second mounting groove via thermally conductive adhesive. The semiconductor cooler 3 is located directly behind the photoreceiving diode 2. The semiconductor cooler 3 is provided with an anode connector 7 and a cathode connector 8. The package 1 includes receptacles that mate with the anode connector 7 and the cathode connector 8. When the semiconductor cooler 3 is installed within the second mounting groove, the anode connector 7 and the cathode connector 8 are inserted into the receptacles.

[0024] The semiconductor cooler 3 in this design is annular. The sidewall of the annular inner hole of the semiconductor cooler 3 is the cold side 10, and the outer wall of the semiconductor cooler 3 is the hot side 9. An optical etalon 4 is located within the cold side 10 of the semiconductor cooler 3, i.e., within the inner hole of the semiconductor cooler 3. The optical etalon 4 is fixedly connected to the inner hole wall of the semiconductor cooler via thermally conductive adhesive. The rear side of the optical etalon 4 is flush with the rear side of the semiconductor cooler 3. The optical etalon 4 is an existing component, and in this design, a silicon-based optical etalon 4 is used.

[0025] The temperature characteristics of the silicon-based etalon are as follows: the correlation between the change in refractive index and temperature can be expressed by the formula n=n0+(A+B / (λ 2 It can be expressed as n0 − C)) × ΔT, where n0 represents the refractive index at a reference temperature, ‌A, ‌B, and ‌C are the temperature coefficients of the medium, ‌λ is the wavelength of light, and ‌ΔT is the temperature change. This formula accurately describes the relationship between the refractive index and temperature. Furthermore, silicon has a refractive index of approximately 3.4 across most of the optical spectrum and is widely used in fiber optic communication transmission.

[0026] Inserted into mounting slot three is a ferrule 5. Its diameter is larger than the inner diameter of semiconductor cooler 3, preventing it from being inserted into the inner bore of semiconductor cooler 3. However, one end of the ferrule 5 abuts against one side of optical etalon 4. Ferrule 5 is press-fitted into mounting slot three and secured to package 1 via epoxy adhesive. In this design, ferrule 5 is a ceramic ferrule, with its other end positioned within mounting slot four.

[0027] The mounting slot 4 is located at the rear side of the package shell 1. A plug-in package shell 6 is inserted into the mounting slot 4. One end of the plug-in package shell 6 is inserted into the mounting slot 4, and the inner channel of the plug-in package shell 6 is sleeved on the ferrule 5. The plug-in package shell 6 in this design is a metal shell.

[0028] The manufacturing method of the product of the present application includes the following process steps:

[0029] 1. Combine the ceramic ferrule and metal package shell by press-fitting and epoxy glue;

[0030] 2. Combine the silicon-based optical etalon and TEC (semiconductor cooler) together through thermal conductive adhesive;

[0031] 3. Assemble the TEC and optical standard into a whole and the package metal shell using thermal conductive adhesive;

[0032] 4. The light receiving component and the package shell are packaged together through optical path coupling and collimation;

[0033] 5. When working, the PIN pins and PCBA board are packaged and welded together through the flexible circuit board or PIN pins;

[0034] 6. Control the TEC temperature through circuit firmware and software to achieve the selective entry of external input light into the light receiving diode;

[0035] 7. Signal decoding and transmission are achieved through photoelectric conversion effect.

[0036] Assume that the refractive index of silicon is n2, the refractive index of air is n1, and the thickness of the medium is h. The upper and lower surfaces of the medium are represented by an equivalent interface. The reflectivity of this equivalent interface is the reflectivity of the medium. The reflectivity of the medium is set to R, then:

[0037]

[0038] Where φ is the phase difference produced, r1 and r2 are the light emission coefficients of the equivalent air and silicon dielectric surfaces respectively;

[0039] When the light is incident normally, we have:

[0040] ;

[0041] The reflectivity of the medium is obtained as follows:

[0042] .

[0043] By effectively controlling the temperature of silicon-based optical etalon 4, and thereby controlling its refractive index, the transmittance of light at different wavelengths can be controlled and regulated through the principles of light transmission and refraction. When light of multiple wavelengths is incident on silicon-based optical etalon 4, light of the corresponding wavelength will be transmitted into photodiode 2, generating a photoelectric effect. Light of other wavelengths will be reflected back and cannot enter photodiode 2. Photodiode 2 is prior art, and this application does not explain its principles, but only its characteristics.

[0044] The specific embodiments described above further illustrate the technical problems, technical solutions and beneficial effects solved by the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wavelength-adjustable optical receiving component based on ETALON, comprising a packaging shell (1), wherein a first mounting groove, a second mounting groove, a third mounting groove, and a fourth mounting groove are provided inside the packaging shell (1) from left to right, wherein the centers of the four mounting grooves are on the same straight line, wherein the diameters of the first mounting groove, the second mounting groove, and the third mounting groove decrease in sequence, wherein the diameter of the fourth mounting groove is larger than the diameter of the third mounting groove, and wherein: A photoelectric receiving diode (2) is provided in the first installation groove, and the rear end of the photoelectric receiving diode (2) is located just in front of the second installation groove. A semiconductor cooler (3) is provided in the second installation groove, and the semiconductor cooler (3) is annular. An optical standard tool (4) is inserted into the inner hole of the semiconductor cooler (3), and the side of the optical standard tool (4) away from the photoelectric receiving diode (2) is flush with the side of the semiconductor cooler (3). A core (5) is inserted into the third installation groove, and the diameter of the core (5) is larger than the inner hole diameter of the semiconductor cooler (3). One end of the core (5) abuts against one side of the optical standard tool (4), and the other end of the core (5) is located in the fourth installation groove, and the fourth installation groove is located at the rear side of the packaging shell (1). A plug-in packaging shell (6) is inserted into the fourth installation groove, and one end of the plug-in packaging shell (6) is plugged into the fourth installation groove, and the inner hole of the plug-in packaging shell (6) is sleeved on the core (5).

2. The wavelength-adjustable optical receiving component based on ETALON according to claim 1, characterized in that: The semiconductor refrigerator (3) is provided with an anode connector (7) and a cathode connector (8), and the anode connector (7) and the cathode connector (8) are inserted into the interior of the packaging shell (1).

3. The wavelength-adjustable optical receiving component based on ETALON according to claim 2, characterized in that: The outer side wall of the semiconductor cooler (3) is a hot side (9), and the inner side wall of the semiconductor cooler (3) is a cold side (10).

4. The wavelength-adjustable optical receiving component based on ETALON according to claim 1, characterized in that: One end of the insert (5) is fixedly connected to the packaging shell (1) via epoxy glue.

5. The wavelength-adjustable optical receiving component based on ETALON according to claim 1, characterized in that: The optical etalon (4) is fixedly connected to the inner hole wall of the semiconductor device via heat-conducting glue.

6. The wavelength-adjustable optical receiving component based on ETALON according to claim 1, characterized in that: The semiconductor refrigerator (3) is fixedly connected to the second mounting groove via heat-conducting glue.

7. The wavelength-adjustable optical receiving component based on ETALON according to claim 1, characterized in that: The photoelectric receiving diode (2) and the packaging shell (1) are collimated and packaged via optical path coupling.

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