MEMS micromirror assembly with high-strength packaging structure

Abstract

The MEMS micromirror assembly with the high-strength packaging structure comprises a top shell and a lower supporting plate, the overlooking cross section of the top shell is of a rectangular structure, the inner sides of four sets of external corners of the top shell are provided with a set of inner fixing holes used for connecting and fixing the top shell and a lower shell, the top shell and the lower shell are connected and fixed through a plurality of sets of bolts, and the top shell and the lower shell are connected and fixed through bolts. The lower end of the top shell is provided with a group of inner sealing gaskets used for providing a sealing effect between the top shell and the lower shell, and compared with the prior art, the MEMS micro-mirror module has the following beneficial effects that the sealing effect between the top shell and the lower shell is provided by using the inner sealing gaskets, and the MEMS micro-mirror module can be conductively connected with an MEMS micro-mirror assembly by using the contact pins; the sealing effect between the contact pins and the lower shell is improved through the outer sealing gaskets, external water is prevented from entering from the upper ends of the contact pins through the outer waterproof rings, meanwhile, the conduction contacts and the corresponding contact pins are mutually embedded and positioned, and displacement of the contact pins is prevented.

Description

Technical Field

[0001] The utility model belongs to the technical field of MEMS micromirror components and relates to a MEMS micromirror component with a high-strength packaging structure. Background Art

[0002] The shortcomings of existing MEMS micromirror assemblies in terms of packaging strength primarily manifest themselves in insufficient mechanical strength of the packaging materials, weaknesses in the packaging structure design, and improper stress control during the packaging process. The root cause of these shortcomings is the extremely high miniaturization and precision requirements of MEMS micromirror assemblies, which existing packaging technologies struggle to fully meet. Conventional approaches include selecting stronger packaging materials and optimizing the packaging structure design. Metal packaging can replace traditional plastic packaging, or support structures can be added to the package design to improve overall mechanical stability. Optimizing the packaging structure design may increase the component size, contradicting the original intention of miniaturization. While improving the packaging process can improve packaging quality, it may also increase production complexity and cost, reducing production efficiency. Furthermore, even with these measures, due to the extremely small size of MEMS micromirror assemblies, minor defects or stress concentration points may still lead to insufficient packaging strength, thereby affecting product reliability and lifespan. Therefore, there is an urgent need for a MEMS micromirror assembly with a high-strength packaging structure to address these issues. Utility Model Content

[0003] In view of the deficiencies in the prior art, the present invention aims to provide a MEMS micromirror assembly with a high-strength packaging structure to solve the problems raised in the above-mentioned background technology.

[0004] The utility model is realized by the following technical solutions: a MEMS micromirror assembly with a high-strength packaging structure, comprising: a top shell and a lower support plate, wherein the top shell has a rectangular cross-section when viewed from above;

[0005] A set of internal fixing holes is provided on the inner side of the four groups of positive corners of the top shell for connecting and fixing the top shell to the lower shell. The top shell and the lower shell are connected and fixed by a plurality of groups of bolts. A set of internal sealing gaskets is provided at the lower end of the top shell for providing a sealing effect between the top shell and the lower shell.

[0006] A group of lower shells for encapsulating the MEMS micromirror assembly are provided at the lower end of the inner sealing gasket, and several groups of contact pins for conducting connections with the MEMS micromirror assembly are provided inside the upper end of the lower shell. The left side cross-section of the contact pins is an inverted concave structure, which can provide a sealing effect between the top shell and the lower shell by using the inner sealing gasket, and can conduct a connection with the MEMS micromirror assembly by using the contact pins.

[0007] As a preferred embodiment, the upper end of the lower shell is provided with several groups of internal mounting grooves for interlocking with the tactile pins, and the several groups of internal mounting grooves are arranged horizontally, and each group of internal mounting grooves is provided with a group of external sealing gaskets on the front and back sides for improving the sealing effect between the tactile pins and the lower shell. The sealing effect between the tactile pins and the lower shell can be improved by using the external sealing gaskets.

[0008] As a preferred embodiment, each group of the inner mounting grooves is provided with one or two groups of conductive contacts for mutual engagement and conduction with the contact pins. The conductive contacts are circular structures, and each group of the conductive contacts is provided with a group of outer waterproof rings on the outside for preventing external water from entering from the upper ends of the contact pins. The outer waterproof rings can be used to prevent external water from entering from the upper ends of the contact pins, and at the same time, the conductive contacts are used to engage with the corresponding contact pins for positioning and prevent the contact pins from displacement.

[0009] As a preferred embodiment, an inner packaging cavity for packaging the MEMS micromirror is provided inside the lower shell. The cross-section of the inner packaging cavity is a rectangular structure when viewed from above. An insulating inner layer is provided on the inner side of the inner packaging cavity. The use of the insulating inner layer can prevent leakage alternating current from occurring inside the inner packaging cavity.

[0010] As a preferred embodiment, several groups of lower support plates for positioning and supporting the conductive contacts are provided inside the inner packaging cavity. The lower support plates are a diamond structure, and the lower ends of every two groups of conductive contacts are connected and fixed to a group of lower support plates.

[0011] As a preferred embodiment, two groups of the conductive contacts pass through the interior of the lower support plate, several groups of the lower support plates are connected to each other, and are all connected and fixed to the upper end of the inner packaging cavity, and each group of the lower support plates is provided with a group of side support frames on the front and rear sides for strengthening the supporting strength of the lower support plates. The side support frames can be used to strengthen the supporting strength of the lower support plates, thereby ensuring the packaging strength of the MEMS micromirror assembly.

[0012] As a preferred embodiment, the cross-section of the side support frame as viewed from the right is an L-shaped structure, and the two groups of side support frames corresponding to each group of lower support plates are fixed by bolt connection.

[0013] After adopting the above technical solution, the beneficial effects of the utility model are: by using the inner sealing gasket to provide a sealing effect between the top shell and the lower shell, it can be possible to use the contact pins to conduct a connection with the MEMS micromirror assembly, by using the outer sealing gasket to improve the sealing effect between the contact pins and the lower shell, by using the outer waterproof ring to prevent external water from entering from the upper end of the contact pins, and at the same time by using the conductive contacts to engage with the corresponding contact pins to position and prevent the contact pins from displacement, by using the insulating inner layer to prevent leakage AC from occurring inside the inner packaging cavity, by using the side support frame to strengthen the support strength of the lower support plate, thereby ensuring the packaging strength of the MEMS micromirror assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0015] Figure 1 This is a schematic diagram of a top-down view of the right front oblique side of a MEMS micromirror assembly with a high-strength packaging structure according to the present invention;

[0016] Figure 2 This is a schematic diagram of the bottom plate of a MEMS micromirror assembly with a high-strength packaging structure according to the present invention, viewed from the left;

[0017] Figure 3 This is a schematic diagram of the top right front structure of the interior of the upper end of the lower shell of a MEMS micromirror assembly with a high-strength packaging structure of the present invention;

[0018] Figure 4 This is a schematic diagram of the upward structure of the inner packaging cavity of a MEMS micromirror assembly with a high-strength packaging structure of the present invention;

[0019] In the figure: 100-top shell, 110-inner fixing hole, 120-inner sealing gasket, 130-contact foot, 140-lower shell, 150-bottom plate, 160-lower bolt, 170-inner mounting groove, 180-outer sealing gasket, 190-conductive contact, 200-outer waterproof ring, 210-inner packaging cavity, 220-side support frame, 230-lower support plate. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-Figure 4 A MEMS micromirror assembly with a high-strength packaging structure includes: a top shell 100, a bottom shell 140, a conductive contact 190, and a bottom support plate 230. The top shell 100 has a rectangular cross-section when viewed from above.

[0022] A set of internal fixing holes 110 are provided on the inner side of the four sets of external corners of the top shell 100 for connecting and fixing the top shell 100 to the lower shell 140. The top shell 100 and the lower shell 140 are connected and fixed by a plurality of sets of bolts. A set of internal sealing gaskets 120 are provided at the lower end of the top shell 100 for providing a sealing effect between the top shell 100 and the lower shell 140.

[0023] A group of lower shells 140 for encapsulating the MEMS micromirror assembly are provided at the lower end of the inner sealing gasket 120, and several groups of contact pins 130 for conductively connecting with the MEMS micromirror assembly are provided inside the upper end of the lower shell 140. The cross-section of the contact pins 130 on the left side is an inverted concave structure, which can provide a sealing effect between the top shell 100 and the lower shell 140 by using the inner sealing gasket 120, and can conduct conductively connect with the MEMS micromirror assembly by using the contact pins 130.

[0024] Several groups of internal mounting grooves 170 for interlocking with the contact pins 130 are provided inside the upper end of the lower shell 140. The several groups of internal mounting grooves 170 are arranged horizontally, and a group of external sealing gaskets 180 for improving the sealing effect between the contact pins 130 and the lower shell 140 are provided on the front and back sides of each group of internal mounting grooves 170. The sealing effect between the contact pins 130 and the lower shell 140 can be improved by using the external sealing gaskets 180.

[0025] An inner packaging cavity 210 for packaging the MEMS micromirror is provided inside the lower shell 140. The cross-section of the inner packaging cavity 210 is a rectangular structure when viewed from above. An insulating inner layer is provided on the inner side of the inner packaging cavity 210, which can prevent leakage AC from occurring inside the inner packaging cavity 210.

[0026] The cross section of the side support frame 220 as viewed from the right is an L-shaped structure, and the two groups of side support frames 220 corresponding to each group of lower support plates 230 are fixed by bolts.

[0027] See also Figure 1-Figure 4As the first embodiment of the present invention: First, before packaging the MEMS micromirror, the staff removes the bottom plate 150 and exposes the inner packaging cavity 210. Then, the staff packages the MEMS micromirror through the lower end of the inner packaging cavity 210. Since the inner packaging cavity 210 is provided with a plurality of groups of lower support plates 230 for positioning and supporting the conductive contacts 190, the lower support plates 230 are a diamond-shaped structure. The lower ends of every two groups of conductive contacts 190 are connected and fixed to a group of lower support plates 230. The lower support plates 230 can position and support the two groups of conductive contacts. 190 for support, and are all connected and fixed to the upper end of the inner packaging cavity 210, and each group of lower support plates 230 is provided with a group of side support frames 220 on the front and rear sides for strengthening the supporting strength of the lower support plates 230. Subsequently, after the MEMS micromirror assembly is packaged inside the inner packaging cavity 210, its side support frames 220 can cooperate with the lower support plates 230 to improve the overall supporting strength, thereby ensuring the packaging strength of the MEMS micromirror assembly. At the same time, its conductive contacts 190 can separate the connection ends of the MEMS micromirror assembly, thereby reducing the impact on the packaging strength during external use.

[0028] See also Figure 1-Figure 4 As a second embodiment of the present invention: based on the description in the above embodiment, further, since each group of inner mounting grooves 170 is provided with one or two groups of conductive contacts 190 for mutual engagement and conduction with the contact pins 130, the conductive contacts 190 are circular in structure, and each group of conductive contacts 190 is provided with a group of outer waterproof rings 200 on the outside for preventing external water from entering from the upper ends of the contact pins 130. By using the outer waterproof rings 200, external water is prevented from entering from the upper ends of the contact pins 130. At the same time, the conductive contacts 190 are used to engage with the corresponding contact pins 130 for positioning, and displacement of the contact pins 130 is prevented, thereby causing corrosion damage to the MEMS micromirror assembly.

[0029] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A MEMS micromirror assembly with a high-strength packaging structure, comprising: A top shell (100), a bottom shell (140), an inner packaging cavity (210) and a bottom support plate (230), characterized in that the top shell (100) has a rectangular cross-section when viewed from above; A group of internal fixing holes (110) for connecting and fixing the top shell (100) and the lower shell (140) are provided on the inner side of the four groups of positive corners of the top shell (100); the top shell (100) and the lower shell (140) are connected and fixed by a plurality of groups of bolts; and a group of internal sealing gaskets (120) for providing a sealing effect between the top shell (100) and the lower shell (140) are provided at the lower end of the top shell (100); A group of lower shells (140) for packaging the MEMS micromirror assembly are provided at the lower end of the inner sealing gasket (120); a plurality of groups of contact pins (130) for conducting connections with the MEMS micromirror assembly are provided inside the upper end of the lower shell (140); the contact pins (130) are an inverted concave structure when viewed from the left side in cross section.

2. The MEMS micromirror assembly with a high-strength packaging structure according to claim 1, characterized in that: The upper end of the lower shell (140) is provided with a plurality of groups of internal mounting grooves (170) for interlocking with the contact pins (130), and the plurality of groups of internal mounting grooves (170) are arranged horizontally, and each group of internal mounting grooves (170) is provided with a group of external sealing gaskets (180) on the front and rear sides for improving the sealing effect between the contact pins (130) and the lower shell (140).

3. The MEMS micromirror assembly with a high-strength packaging structure according to claim 2, characterized in that: Each set of the inner mounting grooves (170) is provided with one or two groups of conductive contacts (190) for interlocking and conducting with the contact pins (130), the conductive contacts (190) being of a circular structure, and each set of the conductive contacts (190) is provided with an outer waterproof ring (200) on the outside for preventing external water from entering from the upper end of the contact pins (130).

4. The MEMS micromirror assembly with a high-strength packaging structure according to claim 2, wherein: An inner packaging cavity (210) for packaging the MEMS micromirror is provided inside the lower shell (140); the inner packaging cavity (210) has a rectangular structure in a top view cross section; an insulating inner layer is provided inside the inner packaging cavity (210).

5. The MEMS micromirror assembly with a high-strength packaging structure according to claim 4, characterized in that: Several groups of lower support plates (230) for positioning and supporting the conductive contacts (190) are provided inside the inner packaging cavity (210); the lower support plates (230) are of a diamond-shaped structure; the lower ends of every two groups of conductive contacts (190) are connected and fixed to a group of lower support plates (230).

6. The MEMS micromirror assembly with a high-strength packaging structure according to claim 5, characterized in that: Two groups of conductive contacts (190) penetrate the interior of the lower support plate (230), and several groups of lower support plates (230) are connected to each other and are all connected and fixed to the upper end of the inner packaging cavity (210). Each group of lower support plates (230) is provided with a group of side support frames (220) on both the front and rear sides for reinforcing the support strength of the lower support plate (230).

7. The MEMS micromirror assembly with a high-strength packaging structure according to claim 6, characterized in that: The side support frame (220) has an L-shaped cross-section when viewed from the right, and the two groups of side support frames (220) corresponding to each group of lower support plates (230) are fixed by bolt connection.

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