Shell packaging structure of pin type electronic part and transformer thereof

Through the housing packaging structure of pin electronics, the sealing connection between the base and the top cover is used to solve the problems of winding slippage and epoxy resin sewage, achieving high reliability and efficient production of the product.

CN223308833UActive Publication Date: 2025-09-05陆桐岗
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422049458.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2025-09-05
Estimated Expiration
2034-08-22

AI Technical Summary

Technical Problem

In the prior art, the windings of pin electronic components are prone to slip or uncertain positioning, resulting in dummy or fake welding, and epoxy resin sewage affects the appearance and quality of the product.

Method used

A housing packaging structure of pin electronics is adopted, including a base and a top cover. The base is equipped with a stitching body and a winding post. The top cover and the base are sealed and connected through long strips of convex edges and docking grooves. The overflow is filled with epoxy resin adhesive to avoid overflowing to the outside.

Benefits of technology

It improves the overall strength and reliability of the product, saves manual cleaning costs, prevents false welding, expands internal space, facilitates line arrangement, and avoids short circuit problems.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223308833U_ABST
    Figure CN223308833U_ABST
Patent Text Reader

Abstract

The shell packaging structure of the pin type electronic part comprises a base and a top cover, the base is a square frame body which is of an integrated structure, the bottom face of the square frame body is closed, an inner cavity of the square frame body is arranged in a sunken mode, and a plurality of sets of pin bodies distributed in pairs are arranged on the two opposite sides of the square frame body respectively. The pin body extends upwards from the edge of an opening in the top side of the base to form a wrapping post, and the pin body extends downwards from the bottom surface of the base to form a welding leg for welding connection; the other two sides, distributed relative to the pin body, of the base are each provided with two long-strip-shaped protruding rubber edges which protrude and extend upwards and are used for being in butt joint with the top cover, and the two sides of the corresponding top cover are each provided with a butt joint groove in a sunken mode, and the butt joint grooves are in butt joint with the long-strip-shaped protruding rubber edges on the two sides in a clamped mode. The inner edge, corresponding to the butt joint groove, of the inner wall of the top cover is further provided with an overflow opening used for enabling an adhesive filled in the butt joint groove to overflow and be guided into an inner cavity of the top cover after being in butt joint and bonded with the long-strip-shaped convex rubber edge. The sealing connection structure facilitates reliable bonding and sealing between the winding wire and the shell, improves the product quality, greatly saves manpower and improves the working efficiency.
Need to check novelty before this filing date? Find Prior Art

Description

Technical field

[0001] The utility model relates to a pin sealing technology, and more particularly to a shell packaging structure of a pin-type electronic component and a transformer thereof. [Background Technology]

[0002] In the prior art, the pins used in transformers or other electronic components generally fix the winding at the notch of the pin to prevent the winding from slipping off. However, since the pin itself is small and the pin body is narrow, the notch on the pin cannot be opened too large. Therefore, when the pins are used in different transformers, the winding of the pin often slips off or is positioned uncertainly due to the lack of limit, resulting in the inability to effectively achieve consistency in the solder joints, resulting in cold solder joints or false solder joints during the tinning process, which is not conducive to the rapid mass production of products.

[0003] In addition, in the prior art, all pin covers of electronic components need to be sealed after welding. In the prior art, a long groove is generally opened on both sides of the pin corresponding to the base for filling epoxy resin, and then a long protruding plastic edge is designed at the corresponding position on both sides of the cover of the cover base. When the cover is placed into the base from top to bottom, the protruding plastic edge on the cover is inserted into the groove of the base filled with epoxy resin, and the epoxy resin overflows the groove to achieve a sealed connection between the two. In the existing connection method, after the base and the cover are butt-connected, the epoxy resin will overflow to the outer surface of the shell, which not only affects the appearance of the product, but also requires manual cleaning of the overflowed sealant. At the same time, since the groove is located next to the pin, the overflowing epoxy resin is often easy to stick to the solder joints of the pins. When the user performs high-temperature reflow soldering on the product, the epoxy resin may be temporarily dissolved, and the tin of the solder joints may be dissolved and flowed away at the same time, resulting in cold solder joints on the pins, that is, there is no tin at the solder joints or it is unstable, making the solder joints inside the product unreliable, posing potential risks and quality problems. [Utility Model Content]

[0004] In order to solve the above technical difficulties, the utility model provides a shell packaging structure of a pin-type electronic component and its transformer, which has a simple overall structure, facilitates the sealed connection between the winding and the shell, has high reliability, saves a lot of manpower and improves work efficiency.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A housing packaging structure for a pin-type electronic component comprises a base and a top cover, wherein the top cover is buckled to cover an opening on the top side of the base;

[0007] The base is a square frame with a closed inner cavity on the bottom and an integral structure. Two opposite sides of the frame are respectively provided with a plurality of needle legs distributed in pairs and integrally injection-molded with the base.

[0008] The needle foot body extends upward from the open edge of the top side of the base to form a winding column for winding copper wire, and the needle foot body extends downward from the bottom surface of the base and is folded 90 degrees and extends out of the outer edge of the bottom of the base for welding connection.

[0009] The other two sides of the base relative to the needle foot body are respectively provided with two long convex rubber edges protruding upward and used to dock with the top cover, and the corresponding two sides of the top cover are respectively recessed with docking grooves that dock with the long convex rubber edges on both sides. The inner edge of the inner wall of the top cover corresponding to the docking groove is also provided with an overflow port for the adhesive filled in the docking groove to dock and bond with the long convex rubber edges to introduce the overflow into the inner cavity of the top cover.

[0010] Preferably, both sides of the top cover are provided with a wire post protection cavity for accommodating the winding posts on all the needle legs, and the inner lower edge is connected to the inner cavity of the base to facilitate the winding of copper wire.

[0011] Preferably, the adhesive is an epoxy resin adhesive.

[0012] Preferably, each of the winding posts of the needle body is recessed with a C-shaped notch for facilitating the winding of the copper wire, and each of the winding posts is provided with an inclined inlet at the inner cavity wall of the base for facilitating the introduction of the wound copper wire.

[0013] Preferably, a single side surface of the winding post of each needle body is further recessed with an arc-shaped notch for facilitating the winding of the copper wire.

[0014] Preferably, both sides of the base corresponding to the winding posts of all the needle bodies are respectively protruded upward with strip-shaped side seals that support all the winding posts on each side and are inserted into the inner cavity of the top cover for sealing connection at the docking end faces.

[0015] Preferably, the winding post of each needle body is further recessed with a U-shaped inclined notch for facilitating the winding of the copper wire.

[0016] Preferably, both sides of the winding post of each needle body are further recessed with arc-shaped notches which are symmetrically arranged on both sides to facilitate the symmetrical winding of the copper wire on both sides.

[0017] Preferably, the inner cavity of the base is further provided with at least one front and rear longitudinal barrier wall for mutually independent insulation after the inner cavity is divided.

[0018] A transformer includes a base and a top cover. The base is integrally injection-molded on opposite sides with a pin body for winding and welding copper wires. The docking surface between the base and the top cover adopts the shell packaging structure of the above-mentioned pin-type electronic component.

[0019] The beneficial effects of the utility model are:

[0020] The utility model is provided with two long convex rubber edges protruding upward and extending on the other two sides of the base relative to the pin body for docking with the top cover, and the corresponding two sides of the top cover are respectively recessed with docking grooves for docking and engaging with the long convex rubber edges on both sides. The inner edge of the inner wall of the top cover corresponding to the docking groove is also provided with an overflow port for the adhesive filled in the docking groove to be docked and bonded with the long convex rubber edges to introduce the overflow into the inner cavity of the top cover; when the top cover is snapped to the base, the long convex rubber edges on both sides of the base will be inserted into the docking grooves on both sides of the top cover that are injected with epoxy resin adhesive and fixed until the epoxy resin adhesive hardens, and the top cover and the base can be firmly integrated into one, which can effectively improve the overall strength and reliability of the product.

[0021] Moreover, in the present invention, when the long convex edges on both sides of the base are inserted into the docking grooves on both sides of the top cover for combination, the epoxy resin adhesive will not overflow from the outside of the shell, and the epoxy resin adhesive will only stick to the long convex edges. The excess long convex edges enter the inner side of the base from the overflow port on the inner side of the docking groove of the top cover. The appearance of the product is not affected during the processing, and there is no need to waste manpower to wipe off the excess overflowed epoxy resin adhesive, which effectively saves process costs and improves processing efficiency, and is more convenient for improving the strength of the base and the top cover and firmly connecting them, effectively improving the quality and reliability of the product.

[0022] At the same time, since there is no need to set up slots for pouring epoxy resin adhesive on the side of the winding column, there is no need to reserve slots for pouring glue on the plastic edges of the two rows of pins on the base, so that the internal space of the base can be effectively expanded, and the wiring package outlet is easier, which can effectively avoid short circuits between wires and wires, and between wires and pins.

Brief Description of the Drawings

[0023] Figure 1 This is a schematic diagram of the bottom exploded structure of the first embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the exploded structure in the first embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the three-dimensional structure of the first embodiment of the present utility model;

[0026] Figure 4 This is a schematic diagram of a transverse cross-sectional structure of the first embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the longitudinal cross-sectional structure of the first embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of the three-dimensional structure of the base in the first embodiment of the present utility model;

[0029] Figure 7 This is a schematic diagram of the three-dimensional structure of the top cover in the first embodiment of the present utility model;

[0030] Figure 8 This is a schematic diagram of the transverse cross-sectional structure of the second embodiment of the present utility model;

[0031] Figure 9 This is a schematic diagram of the longitudinal cross-sectional structure of the second embodiment of the present utility model;

[0032] Figure 10 This is a schematic diagram of the three-dimensional structure of the base in the second embodiment of the present utility model;

[0033] Figure 11 This is a schematic diagram of the bottom exploded structure of the second embodiment of the present invention;

[0034] Figure 12 This is a schematic diagram of the three-dimensional structure of the third embodiment of the present invention;

[0035] Figure 13 This is a schematic diagram of a transverse cross-sectional structure in the third embodiment of the present invention;

[0036] Figure 14 This is a schematic diagram of the bottom view decomposition structure of the third embodiment of the present invention;

[0037] Figure 15 This is a schematic diagram of the decomposed structure of the third embodiment of the present invention;

[0038] Figure 16 This is a schematic diagram of the main structure of the fourth embodiment of the present utility model;

[0039] Figure 17 This is a schematic diagram of a transverse cross-sectional structure in the fourth embodiment of the present utility model;

[0040] Figure 18 This is a schematic diagram of the three-dimensional structure of the fourth embodiment of the present utility model;

[0041] Figure 19 This is a schematic diagram of the longitudinal cross-sectional structure of the fourth embodiment of the present invention;

[0042] Figure 20 This is a schematic diagram of the bottom exploded structure of the fourth embodiment of the present invention;

[0043] Figure 21 This is a schematic diagram of the exploded structure in the fourth embodiment of the present invention;

[0044] Figure 22 It is a schematic diagram of the three-dimensional structure of the fifth embodiment of the present utility model;

[0045] Figure 23 This is a schematic diagram of a transverse cross-sectional structure of the fifth embodiment of the present invention;

[0046] Figure 24 It is a schematic diagram of the longitudinal cross-sectional structure of the fifth embodiment of the present utility model;

[0047] Figure 25 This is a schematic diagram of the three-dimensional structure of the base in accordance with the fifth embodiment of the present invention;

[0048] Figure 26 This is a schematic diagram of the bottom exploded structure of the fifth embodiment of the present invention;

[0049] Figure 27 This is a schematic diagram of the exploded structure of the sixth embodiment of the present utility model;

[0050] Figure 28 This is a schematic diagram of the top view of the base in accordance with the sixth embodiment of the present invention;

[0051] Figure 29 It is a bottom exploded structural diagram of a sixth embodiment of the present invention. [Specific implementation method]

[0052] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0053] It should be noted here that in order to avoid obscuring the present invention due to unnecessary details, only the structures and / or processing steps closely related to the scheme according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0054] Example 1

[0055] A shell packaging structure for pin-type electronic components, such as Figures 1 to 7As shown, it is used for connecting pins and wound copper wires and can be applied to transformers, including a base 1 and a top cover 2, the top cover 2 is buckled on the open part of the top side of the base 1; the base 1 is a square frame with a closed inner cavity and an integral structure, and a plurality of pin bodies 3 are respectively provided on opposite sides of the square frame and distributed in pairs and injection-molded as a whole with the base 1; the pin bodies 3 extend upward from the edge of the open top side of the base 1 to form a winding column 30 for winding copper wire, the pin bodies 3 extend downward from the bottom surface of the base 1, and are folded 90 degrees and extend out of the bottom outer edge of the base 1 for welding connection. There are also two sides of the top cover 2 for accommodating The winding posts 30 on all the needle and pin bodies 3 are covered, and the lower inner edge is connected to the inner cavity of the base 1 to facilitate the winding of the copper wire through the wire post protection cavity 4; the other two sides of the base 1 relative to the needle and pin bodies 3 are respectively provided with two long convex rubber edges 5 protruding upward for docking with the top cover 2, and the corresponding two sides of the top cover 2 are respectively recessed with docking grooves 6 for docking and engaging with the long convex rubber edges 5 on both sides. The inner edge of the inner wall of the top cover 2 corresponding to the docking groove 6 is also provided with an overflow port 7 for the adhesive filled in the docking groove 6 to dock and bond with the long convex rubber edges 5 and then overflow into the inner cavity of the top cover 2, wherein the adhesive is an epoxy resin adhesive.

[0056] In this embodiment, each winding post 30 of the needle body 3 is recessed with a C-shaped notch 32 for facilitating copper wire winding. The winding notch is generally axe-shaped. Each winding post 30 also has an inclined inlet 8 formed on the inner wall of the base 1 to facilitate the introduction of the winding copper wire. Side seals 9 protrude upward from both sides of the base 1 corresponding to the winding posts 30 of all needle bodies 3. These strips support all winding posts 30 on each side and are inserted into the inner cavity of the top cover 2 for sealing the butt joints.

[0057] When the top cover 2 is snapped onto the base 1, the long convex edges 5 on both sides of the base 1 will be inserted into the docking grooves 6 on both sides of the top cover 2 filled with epoxy resin adhesive and fixed. After the epoxy resin adhesive hardens, the top cover 2 and the base 1 can be firmly integrated, which can effectively improve the overall strength and reliability of the product.

[0058] Example 2

[0059] like Figures 8 to 11 As shown, the difference between this embodiment and the first embodiment is that the winding post 30 of each needle and foot body 3 is recessed on one side with an arc-shaped notch 33 for facilitating the winding of the copper wire; at the same time, the wire post protection cavity 4 on both sides of the top cover 2 is enlarged, and no side seals are provided on both sides of the base 1 corresponding to the winding posts 30 of all needle and foot bodies 3.

[0060] Example 3

[0061] like Figures 12 to 15As shown, in this embodiment, the difference between this embodiment and the second embodiment is that a U-shaped inclined notch 34 is recessed on one side of the winding post 30 of each needle leg body 3 to facilitate the winding of the copper wire.

[0062] Example 4

[0063] like Figures 16 to 21 As shown, in this embodiment, the difference between this embodiment and embodiment 2 is that the winding post 30 of each needle body 3 is recessed with arc-shaped notches 35 symmetrically arranged on both sides to facilitate the symmetrical winding of the copper wire on both sides, and the winding notches of the winding post are T-shaped as a whole.

[0064] Example 5

[0065] like Figures 22 to 26 As shown, in this embodiment, the difference from the first embodiment is that a circular arc-shaped notch 35' is recessed on one side of the winding post 30 of each needle body 3 to facilitate the winding of the copper wire, and the winding notch of the winding post is also in a T-shaped structure as a whole.

[0066] Example 6

[0067] like Figures 27 to 29 As shown, in this embodiment, the difference between this embodiment and embodiment 1 is that two longitudinally parallel barriers 36 are further provided in the inner cavity of the base 1 to separate the inner cavity into two independent and insulated cavities.

[0068] In the above embodiment, when the long convex edges 5 on either side of the base 1 are inserted into the mating grooves 6 on either side of the top cover 2, which are filled with epoxy resin adhesive, the epoxy resin adhesive does not overflow outside the housing and only adheres to the long convex edges 5. Excess epoxy resin adhesive flows into the interior of the base 1 through the overflow port 7 inside the mating grooves 6 of the top cover 2. This does not affect the product appearance during processing, and there is no need to manually wipe off excess epoxy resin adhesive, effectively saving processing costs and improving processing efficiency. It also facilitates the strengthening and secure connection between the base 1 and the top cover 2, effectively improving product quality and reliability. Furthermore, since no slots for filling epoxy resin adhesive are required on the sides of the winding post 30, no space is required for filling the plastic edges of the two rows of pin bodies 3 on the base 1. This effectively expands the internal space of the base 1, facilitating the wiring and routing of wires, and effectively preventing problems such as short circuits between wires and between wires and pins.

[0069] In the description of the present invention, it should be noted that the terms "upper" and "lower" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the present invention is usually placed when in use. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0070] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced within the present invention.

[0071] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0072] Therefore, any equivalent changes made based on the shape, structure and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A housing packaging structure for a pin-type electronic component, characterized in that: It includes a base and a top cover, wherein the top cover is buckled to cover the opening on the top side of the base; The base is a square frame with a closed inner cavity on the bottom and an integral structure. Two opposite sides of the frame are respectively provided with a plurality of needle legs distributed in pairs and integrally injection-molded with the base. The needle foot body extends upward from the open edge of the top side of the base to form a winding column for winding copper wire, and the needle foot body extends downward from the bottom surface of the base and is folded 90 degrees and extends out of the outer edge of the bottom of the base for welding connection. The other two sides of the base relative to the needle foot body are respectively provided with two long convex rubber edges protruding upward and used to dock with the top cover, and the corresponding two sides of the top cover are respectively recessed with docking grooves that dock with the long convex rubber edges on both sides. The inner edge of the inner wall of the top cover corresponding to the docking groove is also provided with an overflow port for the adhesive filled in the docking groove to dock and bond with the long convex rubber edges to introduce the overflow into the inner cavity of the top cover.

2. The housing packaging structure of a pin-type electronic component according to claim 1, characterized in that: Both sides of the top cover are respectively provided with a wire post protection cavity for accommodating the winding posts on all the needle and pin bodies, and the inner lower edge is connected to the inner cavity of the base to facilitate the winding of copper wire.

3. The housing packaging structure of a pin-type electronic component according to claim 1, characterized in that: The adhesive is an epoxy resin adhesive.

4. The housing packaging structure of a pin-type electronic component according to claim 1, characterized in that: A C-shaped notch is recessed on the winding post of each needle foot body for facilitating the winding of the copper wire, and an inclined inlet is tilted on the inner cavity wall of the base corresponding to each winding post for facilitating the introduction of the wound copper wire.

5. The housing packaging structure of a pin-type electronic component according to claim 1, characterized in that: A single side surface of the winding post of each needle foot body is further provided with an arc-shaped notch for facilitating the winding of the copper wire.

6. The housing packaging structure of a pin-type electronic component according to claim 5, characterized in that: The two sides of the base corresponding to the winding posts of all the needle bodies are respectively protruded upward with strip-shaped side seals that support all the winding posts on each side and are inserted into the inner cavity of the top cover for sealing connection at the docking end faces.

7. The housing packaging structure of a pin-type electronic component according to claim 1, characterized in that: The winding post of each needle foot body is also recessed with a U-shaped inclined notch for facilitating the winding of the copper wire.

8. The housing packaging structure of a pin-type electronic component according to claim 1, characterized in that: Both sides of the winding post of each needle foot body are recessed with arc-shaped notches which are symmetrically arranged on both sides and are convenient for symmetrical winding of the copper wire on both sides.

9. The housing packaging structure of a pin-type electronic component according to claim 1, characterized in that: The inner cavity of the base is also provided with at least one longitudinal barrier wall for separating the inner cavity and insulating the inner cavity from each other.

10. A transformer comprising a base and a top cover, wherein two opposite sides of the base are integrally injection-molded with pin bodies for winding and welding copper wires, characterized in that: The interface between the base and the top cover adopts a shell packaging structure of a pin-type electronic component as claimed in any one of claims 1 to 9.