Buffering device and conveying equipment

Abstract

The utility model provides a temporary storage device and conveying equipment. The temporary storage device comprises a rack, a conveying belt and a buffer device, a first cache component and a second cache component, wherein the first cache component and the second cache component are distributed along a first direction; and the driving module is arranged on the rack, the driving module is connected with the first caching assembly and the second caching assembly, and the driving module is configured to be capable of driving the first caching assembly and the second caching assembly to move in the second direction. According to the caching device provided by the utility model, the driving module capable of respectively driving the first caching assembly and the second caching assembly to move is arranged, so that the caching device can independently control the first caching assembly and the second caching assembly to work; according to the invention, the first cache assembly and the second cache assembly can be independently controlled to perform silicon wafer cache or patch operation according to requirements, unnecessary cache space waste can be avoided, and a subsequent patch process is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cell manufacturing, and more particularly to a buffer device and a conveying device comprising the buffer device. Background Art

[0002] In solar cell production lines, the double half-cell process is becoming increasingly popular due to its many advantages. However, the two columns of the existing buffering device cannot be driven independently, making it impossible to independently buffer each column of silicon wafers. This limitation is particularly prominent in specific production processes, such as the NG (non-conforming product) removal process. If one wafer in a row is removed due to quality issues, leaving only one wafer, the buffering device will still buffer it according to the space requirements of the entire row. This not only wastes buffer space but also affects the subsequent patching process for the entire row. Utility Model Content

[0003] The utility model provides a new technical solution for a cache device, which can at least solve the problem that the existing cache device cannot fully utilize the cache space.

[0004] The utility model also provides a conveying device, comprising the above-mentioned buffer device.

[0005] According to a first aspect of the present invention, a cache device is provided, comprising: a rack; a first cache component and a second cache component, wherein the first cache component and the second cache component are distributed along a first direction; a drive module, wherein the drive module is arranged on the rack, the drive module is connected to the first cache component and the second cache component, and the drive module is configured to be able to drive the first cache component and the second cache component to move along a second direction respectively.

[0006] Optionally, the drive module includes: a first drive component, the first drive component is arranged on the frame, the first drive component is provided with a first drive part movable along the second direction, the first drive part is connected to the first cache component to drive the first cache component to move along the second direction; a second drive component, the second drive component is arranged on the frame, the second drive component is provided with a second drive part movable along the second direction, the second drive part is connected to the second cache component to drive the second cache component to move along the second direction.

[0007] Optionally, the rack includes: a first bracket, the first drive assembly is arranged on the first bracket; a second bracket, the second drive assembly is arranged on the second bracket, and the first cache assembly and the second cache assembly are located between the first bracket and the second bracket.

[0008] Optionally, the rack is an integrated structural component, and the first cache component and the second cache component are located on the same side of the rack.

[0009] Optionally, the first cache component includes: a first base, the first base is connected to the driving module, and the first base is provided with a first connecting part and a second connecting part; a first cache rack, the first cache rack is movably provided at the first connecting part along a first direction; a second cache rack, the second cache rack is spaced apart from the first cache rack along the first direction, and the second cache rack is movably provided at the second connecting part along the first direction; wherein, a plurality of groups of first cache teeth spaced apart and distributed along the second direction are respectively provided on a side where the first cache rack and the second cache rack are close to each other.

[0010] Optionally, the second cache assembly includes: a second base, the second base is connected to the driving module, the second base is provided with a third connecting part and a fourth connecting part; a third cache rack, the third cache rack is movably provided at the third connecting part along the first direction; a fourth cache rack, the fourth cache rack is spaced apart from the third cache rack along the first direction, the fourth cache rack is movably provided at the fourth connecting part along the first direction; wherein, the third cache rack and the third cache rack are provided with a plurality of groups of second cache teeth spaced apart and distributed along the second direction on one side where the third cache rack is close to each other.

[0011] Optionally, a first protrusion is provided on a side of the first base close to the second base, and a second protrusion is provided on a side of the second base close to the first base; wherein, the second protrusion and the first protrusion are staggered in a third direction, at least a portion of the first connecting portion is provided on the first protrusion, and at least a portion of the third connecting portion is provided on the second protrusion.

[0012] Optionally, the first cache rack and / or the second cache rack is provided with a first pointer, and the first base is provided with a first scale corresponding to the first pointer; and / or the third cache rack and / or the fourth cache rack is provided with a second pointer, and the second base is provided with a second scale corresponding to the second pointer.

[0013] Optionally, the first cache support teeth are detachably connected to the corresponding first cache rack or the second cache rack; and / or the second cache support teeth are detachably connected to the corresponding third cache rack or the fourth cache rack.

[0014] Optionally, the first cache tooth and / or the second cache tooth are polyformaldehyde cache teeth.

[0015] According to the second aspect of the present invention, a conveying equipment is provided, including: a double-column conveying device, which is suitable for conveying double-column materials along a third direction; a cache device described in any of the above items, wherein the first cache component is suitable for caching materials in the first column, and the second cache component is suitable for caching materials in the second column.

[0016] According to the cache device of the present invention, a driving module is provided which can respectively drive the activities of the first cache component and the second cache component, so that the cache device can independently control the operation of the first cache component and the second cache component, and can independently control the first cache component and the second cache component to perform silicon wafer caching or patching operations as required, thereby avoiding unnecessary waste of cache space and being beneficial to subsequent patching processes, thereby effectively improving the applicability of the cache device.

[0017] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0019] Figure 1 This is an exploded view of the structure of a cache device according to an embodiment of the present invention;

[0020] Figure 2 This is a three-dimensional diagram of a cache device according to an embodiment of the present invention;

[0021] Figure 3 yes Figure 2 A magnified view of the structure at the center circle A;

[0022] Figure 4 This is a schematic structural diagram of a second cache component of a cache device according to an embodiment of the present invention;

[0023] Figure 5 It is a structural schematic diagram of a conveying device according to an embodiment of the present invention.

[0024] Reference numerals

[0025] 100. Cache device;

[0026] 10. Frame; 11. First bracket; 12. Second bracket;

[0027] 20. First cache assembly; 21. First base; 211. First connecting portion; 212. Second connecting portion; 213. First protrusion; 214. First scale; 22. First cache rack; 221. First pointer; 23. Second cache rack; 24. First cache tooth;

[0028] 30. Second cache assembly; 31. Second base; 311. Third connecting portion; 312. Fourth connecting portion; 313. Second protrusion; 32. Third cache rack; 33. Fourth cache rack; 34. Second cache support teeth;

[0029] 40. First drive assembly; 50. Second drive assembly;

[0030] 200. Double-row conveying device; 210. First conveyor belt; 220. Second conveyor belt. DETAILED DESCRIPTION

[0031] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.

[0033] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0034] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0035] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0036] The following first describes in detail the cache device 100 according to an embodiment of the present invention with reference to the accompanying drawings.

[0037] like Figures 1 to 4 As shown, the cache device 100 according to an embodiment of the present invention includes: a rack 10, a first cache component 20, a second cache component 30 and a drive module.

[0038] Specifically, the first cache component 20 and the second cache component 30 are distributed along the first direction, the driving module is arranged on the rack 10, the driving module is connected to the first cache component 20 and the second cache component 30, and the driving module is configured to be able to drive the first cache component 20 and the second cache component 30 to move along the second direction respectively.

[0039] In other words, if Figures 1 to 4 As shown, the cache device 100 according to an embodiment of the present invention mainly includes a rack 10, a first cache component 20, a second cache component 30 and a drive module, wherein the first cache component 20 and the second cache component 30 are both used to cache silicon wafers, the first cache component 20 and the second cache component 30 are distributed along a first direction, and the first cache component 20 and the second cache component 30 can be movably arranged on the rack along a second direction (for example, a direction perpendicular to the first direction). The drive module is installed on the rack 10, and the drive module is connected to the first cache component 20 and the second cache component 30. In this embodiment, the drive module can independently drive the first cache component 20 to move along the second direction, and can also independently drive the second cache component 30 to move along the second direction, so that the first cache component 20 and / or the second cache component 30 can be driven as needed to cache silicon wafers at different positions.

[0040] When the cache device 100 according to the embodiment of the present invention is in use, the second direction is adjusted to a vertical direction, so that the driving module can drive the first cache component 20 and the second cache component 30 to rise and fall respectively; and the first direction is adjusted to be perpendicular to the conveying direction of the silicon wafers, so that the first cache component 20 corresponds to the position of the first column of silicon wafers (i.e., the first half of the battery silicon wafers) conveyed on the double-column conveying device 200, and the second cache component 30 corresponds to the position of the second column of silicon wafers (i.e., the second half of the battery silicon wafers) conveyed on the double-column conveying device 200.

[0041] When the first row of silicon wafers needs to be buffered, the driver module controls the first buffer assembly 20 to rise and lift the first row of silicon wafers to achieve wafer buffering. When the position where the first row of silicon wafers are conveyed needs to be patched, the driver module controls the first buffer assembly 20 to descend and place the buffered silicon wafers in the corresponding position to achieve wafer patching. When the second row of silicon wafers needs to be buffered, the driver module controls the second buffer assembly 30 to rise and lift the second row of silicon wafers to achieve wafer buffering. When the position where the second row of silicon wafers is conveyed needs to be patched, the driver module controls the second buffer assembly 30 to descend and place the buffered silicon wafers in the corresponding position to achieve wafer patching.

[0042] Therefore, according to the cache device 100 provided in this embodiment, a driving module is set up that can respectively drive the activities of the first cache component 20 and the second cache component 30, so that the cache device 100 can independently control the operation of the first cache component 20 and the second cache component 30, and can independently control the first cache component 20 and the second cache component 30 to perform silicon wafer caching or patching operations as needed, which can avoid unnecessary waste of cache space and is beneficial to subsequent patching processes, effectively improving the applicability of the cache device 100.

[0043] In some embodiments of the present invention, the drive module includes: a first drive component 40 and a second drive component 50, the first drive component 40 is arranged on the frame 10, the first drive component 40 is provided with a first drive part movable along the second direction, the first drive part is connected to the first cache component 20 to drive the first cache component 20 to move along the second direction; the second drive component 50 is arranged on the frame 10, the second drive component 50 is provided with a second drive part movable along the second direction, the second drive part is connected to the second cache component 30 to drive the second cache component 30 to move along the second direction.

[0044] That is to say, the driving module mainly includes a first driving component 40 and a second driving component 50. The first driving component 40 and the second driving component 50 are both fixedly mounted on the frame 10. The first driving component 40 is provided with a first driving portion movable along a second direction (for example, a direction perpendicular to the first direction). The first cache component 20 is fixedly connected to the first driving portion, so that the first cache component 20 can be driven to move along the second direction by the first driving component 40; the second driving component 50 is provided with a second driving portion movable along the second direction, and the second cache component 30 is connected to the second driving portion, so that the second cache component 30 can be driven to move along the second direction by the second driving component 50.

[0045] Thus, the first cache component 20 and the second cache component 30 can be independently driven to move along the second direction through the first drive component 40 and the second drive component 50, and subsequent maintenance only requires replacing the damaged drive component without replacing the entire drive module, which can effectively reduce subsequent maintenance costs.

[0046] According to some embodiments of the present invention, the first drive assembly 40 and the second drive assembly 50 are both electric cylinders, and the nuts of the electric cylinders form the drive parts of the first drive assembly 40 and the second drive assembly 50 (ie, the first drive part and the second drive part).

[0047] In some optional examples of the present invention, the side walls of the first drive component 40 and the second drive component 50 are both provided with photoelectric sensors, and the first drive part and the second drive part are both provided with detection parts corresponding to the photoelectric sensors, which is beneficial to the cache device 100 or the first cache component 20 and the second cache component 30 at the origin in the second direction.

[0048] In some embodiments of the present invention, the rack 10 includes: a first bracket 11 and a second bracket 12, the first drive assembly 40 is arranged on the first bracket 11, the second drive assembly 50 is arranged on the second bracket 12, and the first cache assembly 20 and the second cache assembly 30 are located between the first bracket 11 and the second bracket 12.

[0049] Specifically, if Figure 1 and Figure 2 As shown, the rack 10 mainly includes a first bracket 11 and a second bracket 12, and the first bracket 11 and the second bracket 12 are spaced apart and distributed along the first direction. The first drive assembly 40 is installed on the side of the first bracket 11 close to the second bracket 12, and the second drive assembly 50 is installed on the side of the second bracket 12 close to the first bracket 11, and the first cache assembly 20 and the second cache assembly 30 are located between the first bracket 11 and the second bracket 12, so as to avoid the spacing between the first cache assembly 20 and the second cache assembly 30 being too large, which is beneficial to cache two columns of silicon wafers with a smaller spacing, so that the cache device 100 can be used in conjunction with the highly integrated double-column conveying device 200.

[0050] In this embodiment, the first bracket 11 and the second bracket 12 are independent components, so that the buffer device 100 can be divided into two parts, which is conducive to assembling the buffer device 100 on the conveying equipment.

[0051] According to one embodiment of the present invention, the rack 10 is an integrated structural component, and the first cache assembly 20 and the second cache assembly 30 are located on the same side of the rack 10 .

[0052] That is to say, the rack 10 can be configured as an integrated structural component, so as to effectively improve the integration of the cache device 100, and the first cache component 20 and the second cache component 30 are located on the same side of the rack 10, so as to avoid the spacing between the first cache component 20 and the second cache component 30 being too large, which is beneficial to cache two columns of silicon wafers with smaller spacing.

[0053] In some embodiments of the present invention, the first cache assembly 20 includes: a first base 21, a first cache rack 22 and a second cache rack 23. The first base 21 is connected to the driving module. The first base 21 is provided with a first connecting portion 211 and a second connecting portion 212. The first cache rack 22 is movably provided at the first connecting portion 211 along the first direction. The second cache rack 23 is spaced apart from the first cache rack 22 along the first direction. The second cache rack 23 is movably provided at the second connecting portion 212 along the first direction. The side where the first cache rack 22 and the second cache rack 23 are close to each other is respectively provided with a plurality of groups of first cache teeth 24 spaced apart and distributed along the second direction.

[0054] In other words, if Figure 2 and Figure 3 As shown, the first cache assembly 20 according to an embodiment of the present invention mainly includes a first base 21, a first cache rack 22 and a second cache rack 23, wherein the first base 21 can be fixed to the first driving part of the first driving assembly 40 by bolts, and the first base 21 is provided with a first connecting part 211 and a second connecting part 212 extending along the first direction, and the first connecting part 211 and the second connecting part 212 are spaced apart and distributed along the first direction, and the first connecting part 211 and the second connecting part 212 are provided to provide installation positions for the first cache rack 22 and the second cache rack 23.

[0055] like Figure 2 and Figure 3 As shown, the first cache rack 22 and the second cache rack 23 are disposed on one side of the first base 21, for example, on the lower side of the first base 21. The upper end of the first cache rack 22 is disposed on the first connecting portion 211, and the upper end of the second cache rack 23 is disposed on the second connecting portion 212. A plurality of groups of first cache support teeth 24 are provided on the side of the first cache rack 22 near the second cache rack 23, spaced apart along the second direction. The side of the second cache rack 23 near the first cache rack 22 is also provided with a plurality of groups of first cache support teeth 24 spaced apart along the second direction. In the second direction, the positions of the first cache support teeth 24 on the first cache rack 22 correspond to the positions of the first cache support teeth 24 on the second cache rack 23. This allows the first cache rack 22 and the second cache rack 23 to cooperate and stably support the silicon wafer.

[0056] In this embodiment, the upper end of the first cache rack 22 is movably provided at the first connecting portion 211 along the first direction, and the upper end of the second cache rack 23 is movably provided at the second connecting portion 212 along the first direction, so that the overall position of the first cache rack 22 and the second cache rack 23 relative to the first base 21 can be adjusted, and the distance between the first cache rack 22 and the second cache rack 23 can be adjusted, so that the first cache component 20 can cache silicon wafers of different sizes, effectively improving the applicability of the cache device 100.

[0057] In some examples of the present invention, the first base 21 is provided with a plurality of first connection parts 211, the first connection part 211 can be a first slot body, and one end of the first cache rack 22 is movably provided in the first slot body along the first direction; the first base 21 is also provided with a plurality of second connection parts 212, the second connection part 212 can be a second slot body, and one end of the second cache rack 23 is movably provided in the second slot body along the first direction.

[0058] Optionally, the first cache assembly 20 further includes a first fastener and a second fastener; after the position of the first cache rack 22 is adjusted, the position of the first cache rack 22 can be fixed by the first fastener; after the position of the second cache rack 23 is adjusted, the position of the second cache rack 23 can be fixed by the second fastener; thereby effectively avoiding the positional offset of the first cache rack 22 and the second cache rack 23, and ensuring the reliability of the cache device 100.

[0059] According to one embodiment of the present invention, the second cache assembly 30 includes: a second base 31, a third cache rack 32 and a fourth cache rack 33. The second base 31 is connected to the driving module. The second base 31 is provided with a third connecting part 311 and a fourth connecting part 312. The third cache rack 32 is movably provided at the third connecting part 311 along the first direction. The fourth cache rack 33 is spaced apart from the third cache rack 32 along the first direction. The fourth cache rack 33 is movably provided at the fourth connecting part 312 along the first direction, wherein the third cache rack 32 and the third cache rack 32 are close to each other on one side and are respectively provided with a plurality of groups of second cache teeth 34 spaced apart and distributed along the second direction.

[0060] In other words, if Figures 2 to 4 As shown, the second cache assembly 30 mainly includes a second base 31, a third cache rack 32 and a fourth cache rack 33, wherein the second base 31 can be fixed to the second driving part of the second driving assembly 50 by bolts, and the second base 31 is provided with a third connecting part 311 and a fourth connecting part 312 extending along the first direction, and the third connecting part 311 and the fourth connecting part 312 are spaced apart and distributed along the first direction, and the third connecting part 311 and the fourth connecting part 312 are provided to provide installation positions for the third cache rack 32 and the fourth cache rack 33.

[0061] like Figures 2 to 4As shown, the third cache rack 32 and the fourth cache rack 33 are disposed on one side of the second base 31, for example, on the lower side of the second base 31. The upper end of the third cache rack 32 is disposed on the third connecting portion 311, and the upper end of the fourth cache rack 33 is disposed on the fourth connecting portion 312. Multiple groups of second cache support teeth 34 are spaced apart along the second direction on the side of the third cache rack 32 near the fourth cache rack 33. Multiple groups of second cache support teeth 34 are also spaced apart along the second direction on the side of the fourth cache rack 33 near the third cache rack 32. In the second direction, the positions of the second cache support teeth 34 on the third cache rack 32 correspond to those on the fourth cache rack 33. This allows the third cache rack 32 and the fourth cache rack 33 to cooperate and stably support the silicon wafer.

[0062] In this embodiment, the upper end of the third cache rack 32 is movably provided at the third connection portion 311 along the first direction, and the upper end of the fourth cache rack 33 is movably provided at the fourth connection portion 312 along the first direction, so that the overall position of the third cache rack 32 and the fourth cache rack 33 relative to the second base 31 can be adjusted, and the distance between the third cache rack 32 and the fourth cache rack 33 can be adjusted, so that the second cache assembly 30 can cache silicon wafers of different sizes, further improving the applicability of the cache device 100.

[0063] In some examples of the present invention, the second base 31 is provided with a plurality of third connection parts 311, the third connection part 311 can be a third slot body, and one end of the third cache rack 32 is movably provided in the third slot body along the first direction; the second base 31 is also provided with a plurality of fourth connection parts 312, the fourth connection part 312 can be a fourth slot body, and one end of the fourth cache rack 33 is movably provided in the fourth slot body along the first direction.

[0064] Optionally, the second cache assembly 30 also includes a third fastener and a fourth fastener; after the position of the third cache rack 32 is adjusted, the position of the third cache rack 32 can be fixed by the third fastener; after the position of the fourth cache rack 33 is adjusted, the position of the fourth cache rack 33 can be fixed by the fourth fastener; thereby, the position offset of the third cache rack 32 and the fourth cache rack 33 can be effectively avoided, and the reliability of the cache device 100 can be ensured.

[0065] Specifically, the first fastener, the second fastener, the third fastener, and the fourth fastener are all screws.

[0066] In some optional examples of the present invention, each group of first cache teeth 24 has two first cache teeth 24, and the two first cache teeth 24 are spaced apart and distributed along a third direction (for example, a direction perpendicular to the first direction and the second direction, that is, the conveying direction of the silicon wafers), so that the first cache component 20 can stably support the silicon wafers in the first column; further, each group of second cache teeth 34 has two second cache teeth 34, and the two second cache teeth 34 are spaced apart and distributed along the third direction, so that the second cache component 30 can stably support the silicon wafers in the second column.

[0067] In some embodiments of the present invention, a first protrusion 213 is provided on a side of the first base 21 close to the second base 31, and a second protrusion 313 is provided on a side of the second base 31 close to the first base 21, wherein the second protrusion 313 and the first protrusion 213 are staggered in the third direction, at least a portion of the first connecting portion 211 is provided on the first protrusion 213, and at least a portion of the third connecting portion 311 is provided on the second protrusion 313.

[0068] Specifically, if Figures 2 to 4 As shown, the first base 21 and the second base 31 are each provided with a protrusion extending toward each other on the side close to each other. The protrusion located on the first base 21 is a first protrusion 213, so that a first notch is formed on the side of the first base 21 close to the second base 31, and at least a portion of the first connecting portion 211 is located on the first protrusion 213, so that the first cache rack 22 can be mounted on the first protrusion 213. The protrusion located on the second base 31 is a second protrusion 313, so that a second notch is formed on the side of the second base 31 close to the first base 21, and at least a portion of the third connecting portion 311 is located on the second protrusion 313, so that the third cache rack 32 can be mounted on the second protrusion 313.

[0069] In the third direction, the first bump 213 and the second bump 313 are alternately arranged, that is, when the first bump 213 and the second bump 313 are at the same height, at least part of the first bump 213 is located in the first notch, and at least part of the second bump 313 is located in the second notch.

[0070] Thus, the space in the first direction can be fully utilized, the structure is compact, and the space occupied by the cache device 100 is reduced, which is beneficial for caching two rows of silicon wafers with a smaller spacing, so that the cache device 100 can be used in conjunction with the highly integrated dual-row conveying device 200.

[0071] According to one embodiment of the present invention, the first cache rack 22 and / or the second cache rack 23 is provided with a first pointer 221, and the first base 21 is provided with a first scale 214 corresponding to the first pointer 221; and / or the third cache rack 32 and / or the fourth cache rack 33 is provided with a second pointer, and the second base 31 is provided with a second scale corresponding to the second pointer.

[0072] Specifically, if Figure 2 and Figure 3 As shown, the side walls of the first cache rack 22 and the second cache rack 23 close to one end of the first base 21 are respectively fixedly connected with first pointers 221. Correspondingly, the first base 21 is provided with first scales 214 corresponding to the two first pointers 221. The specific positions of the first cache rack 22 and the second cache rack 23 can be accurately displayed through the cooperation of the first pointer 221 and the first scale 214, which is conducive to quickly and accurately adjusting the positions of the first cache rack 22 and the second cache rack 23 according to the specifications of the silicon wafer.

[0073] Furthermore, the side walls of the third cache rack 32 and the fourth cache rack 33 at one end close to the second base 31 are respectively fixedly connected with second pointers. Accordingly, the second base 31 is provided with second scales corresponding to the two second pointers. The specific positions of the third cache rack 32 and the fourth cache rack 33 can be accurately displayed through the cooperation of the second pointers and the second scales, which is conducive to quickly and accurately adjusting the positions of the third cache rack 32 and the fourth cache rack 33 according to the specifications of the silicon wafer.

[0074] In some embodiments of the present invention, the first cache tooth 24 is detachably connected to the corresponding first cache rack 22 or second cache rack 23; and / or the second cache tooth 34 is detachably connected to the corresponding third cache rack 32 or fourth cache rack 33.

[0075] That is to say, the first cache support tooth 24 on the first cache rack 22 is detachably connected to the first cache rack 22, and the first cache support tooth 24 on the second cache rack 23 is detachably connected to the second cache rack 23; the second cache support tooth 34 on the third cache rack 32 is detachably connected to the third cache rack 32, and the second cache support tooth 34 on the fourth cache rack 33 is detachably connected to the fourth cache rack 33.

[0076] Therefore, when the first cache teeth 24 and the second cache teeth 34 are damaged, the damaged first cache teeth 24 and the damaged second cache teeth 34 can be replaced, which effectively reduces the maintenance cost of the cache device 100.

[0077] In one example, a side of the first cache rack 22 adjacent to the second cache rack 23 is provided with an insertion hole suitable for inserting the first cache tooth 24. One end of the first cache tooth 24 is inserted into the corresponding insertion hole and secured with a screw, thereby achieving a detachable connection between the first cache tooth 24 and the first cache rack 22. The connection between the first cache tooth 24 and the second cache rack 23, as well as the connection between the second cache tooth 34 and the third and fourth cache racks 32 and 33, can all adopt the above-described connection method, and will not be further described in this embodiment.

[0078] According to one embodiment of the present invention, the first cache teeth 24 and / or the second cache teeth 34 are polyoxymethylene cache teeth.

[0079] Specifically, the first cache teeth 24 and the second cache teeth 34 are both configured as polyformaldehyde cache teeth, which have high structural strength, can meet usage requirements, and have low production costs.

[0080] like Figure 5 As shown, an embodiment of the present invention also provides a conveying device, including a double-column conveying device 200 and a cache device 100 described in any of the above embodiments, the double-column conveying device 200 is suitable for conveying double-column materials (for example, silicon wafers) along a third direction, the first cache component 20 is suitable for caching the materials in the first column, and the second cache component 30 is suitable for caching the materials in the second column.

[0081] In other words, the conveying equipment according to the embodiment of the present invention mainly includes a double-column conveying device 200 and a cache device 100, wherein the double-column conveying device 200 can be a double-belt conveyor, the first conveyor belt 210 of the double-column conveying device 200 is suitable for conveying the first column of silicon wafers along the third direction, the second conveyor belt 220 of the double-column conveying device 200 is suitable for conveying the second column of silicon wafers along the third direction, the first cache component 20 corresponds to the position of the first conveyor belt 210 to cache the silicon wafers of the first column, and the second cache component 30 corresponds to the position of the second conveyor belt 220 to cache the silicon wafers of the second column.

[0082] Since the cache device 100 according to the embodiment of the present invention has the above-mentioned technical effects, the conveying equipment according to the embodiment of the present invention also has corresponding technical effects, which will not be described in detail in this embodiment.

[0083] like Figure 5As shown, when the conveying device according to an embodiment of the present invention is in use, the first buffer assembly 20 and the second buffer assembly 30 are both located at the bottom, and the dual-row conveyor 200 conveys the dual-row silicon wafers along the third direction. When the first row of silicon wafers needs to be buffered, the topmost first buffer teeth 24 of the first buffer assembly 20 are adapted to buffer the first half-cell silicon wafer. When the half-cell silicon wafer aligns with the position of the first buffer teeth 24, the first drive assembly 40 drives the first buffer assembly 20 upward by the spacing of the buffer teeth in the second direction. The topmost first buffer teeth 24 lift the corresponding half-cell silicon wafer. The second set of first buffer teeth 24 wait for the second half-cell silicon wafer to arrive before rising again by the spacing of the buffer teeth in the second direction. This process continues in this manner, completing the buffering operation according to the pre-buffering quantity set by the program. When the first row of silicon wafers needs to be patched, the first drive assembly 40 drives the first buffer assembly 20 downward, placing the buffered half-cell silicon wafers onto the first conveyor belt 210 to perform the patching function. The second cache component 30 implements the cache and patch functions in the same manner as the first cache component 20, and will not be described in detail in this embodiment.

[0084] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will appreciate that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A cache device, characterized in that: include: frame; A first cache component and a second cache component, wherein the first cache component and the second cache component are distributed along a first direction; A driving module is provided on the rack, the driving module is connected to the first cache component and the second cache component, and the driving module is configured to drive the first cache component and the second cache component to move along the second direction respectively.

2. The cache device according to claim 1, wherein: The driving module includes: a first drive assembly, the first drive assembly being disposed on the frame, the first drive assembly being provided with a first drive portion movable along a second direction, the first drive portion being connected to the first cache assembly to drive the first cache assembly to move along the second direction; The second drive component is arranged on the frame, and the second drive component is provided with a second drive part movable along the second direction, and the second drive part is connected to the second cache component to drive the second cache component to move along the second direction.

3. The cache device according to claim 2, wherein: The frame includes: a first bracket, wherein the first driving assembly is disposed on the first bracket; The second bracket, the second drive component is arranged on the second bracket, and the first cache component and the second cache component are located between the first bracket and the second bracket.

4. The cache device according to claim 1, wherein: The rack is an integrated structural component, and the first cache component and the second cache component are located on the same side of the rack.

5. The cache device according to claim 1, wherein: The first cache component includes: a first base, the first base being connected to the driving module, and the first base being provided with a first connecting portion and a second connecting portion; a first cache rack, the first cache rack being movably disposed on the first connecting portion along a first direction; a second cache rack, the second cache rack being spaced apart from the first cache rack along a first direction, and the second cache rack being movably disposed on the second connecting portion along the first direction; Wherein, a plurality of groups of first cache teeth spaced apart and distributed along the second direction are respectively provided on the side where the first cache rack and the second cache rack are close to each other.

6. The cache device according to claim 5, wherein: The second cache component includes: a second base, the second base being connected to the driving module, and the second base being provided with a third connecting portion and a fourth connecting portion; a third cache rack, the third cache rack being movably disposed on the third connecting portion along the first direction; a fourth cache rack, the fourth cache rack being spaced apart from the third cache rack along the first direction, and the fourth cache rack being movably disposed on the fourth connecting portion along the first direction; Wherein, a plurality of groups of second cache teeth spaced apart and distributed along the second direction are respectively provided on the side of the third cache rack close to each other.

7. The cache device according to claim 6, wherein: A first protrusion is provided on a side of the first base close to the second base, and a second protrusion is provided on a side of the second base close to the first base; The second protrusions and the first protrusions are staggered in the third direction, at least a portion of the first connection portion is disposed on the first protrusion, and at least a portion of the third connection portion is disposed on the second protrusion.

8. The cache device according to claim 6, wherein: The first cache rack and / or the second cache rack is provided with a first pointer, and the first base is provided with a first scale corresponding to the first pointer; and / or, The third cache rack and / or the fourth cache rack is provided with a second pointer, and the second base is provided with a second scale corresponding to the second pointer.

9. The cache device according to claim 6, wherein: The first cache tooth is detachably connected to the corresponding first cache rack or the second cache rack; and / or, The second cache support teeth are detachably connected to the corresponding third cache rack or the fourth cache rack.

10. The cache device according to claim 6, wherein: The first cache teeth and / or the second cache teeth are polyoxymethylene cache teeth.

11. A conveying device, characterized in that: include: A double-row conveying device, wherein the double-row conveying device is suitable for conveying double-row materials along a third direction; The cache device according to any one of claims 1 to 10, wherein the first cache component is suitable for caching materials in a first column, and the second cache component is suitable for caching materials in a second column.

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