Non-contact wafer transfer device

Abstract

The utility model discloses a wafer non-contact transfer device, which comprises a tray conveying device, a wafer conveying device, a mechanical arm and a positioning ring, the working end of the mechanical arm is connected with a first suction cup, and the mechanical arm is used for sucking a wafer and enabling the wafer to suspend at the top of the first suction cup. The wafer conveying device is connected with a second suction cup through a lifting device, and the second suction cup is used for adsorbing the wafer on the first suction cup and is suspended at the bottom of the second suction cup; the tray conveying device is connected with the adsorption disc, and the adsorption disc is used for adsorbing trays; the positioning ring is connected with the rotary moving device, and the rotary moving device is used for moving the positioning ring to the top of the tray and guiding the placing position of the wafer on the tray; according to the wafer non-contact transfer device, non-contact movement of the wafer is achieved through the suction cup, the mechanical arm and the moving device, the wafer is prevented from being polluted in the transfer process, the yield of the wafer is increased, and the production cost of the wafer is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer manufacturing, in particular to a wafer contactless transfer device. Background Art

[0002] Wafer processing is a highly precise and environmentally demanding manufacturing process, playing a crucial role in the semiconductor industry. To ensure product quality and performance, wafer processing is typically performed in cleanrooms, which are classified into different cleanliness levels based on the concentration of airborne particulate matter. Six-inch wafer processing is typically performed in Class 10 cleanrooms, where the number of dust particles 0.1 microns or larger is strictly controlled to 10 or fewer per cubic centimeter. These environmental requirements are designed to minimize the impact of external contamination on wafer processing, ensuring that wafers produced have extremely low defect rates and excellent electrical performance. Surface plating is a key step in the wafer processing process. Surface plating involves depositing one or more layers of metal or non-metallic materials (such as gold or carbon) to enhance the wafer's conductivity, corrosion resistance, or serve as a protective layer for subsequent processing. This step is crucial for ensuring wafer reliability and stability during subsequent packaging, testing, and final application.

[0003] Traditionally, wafer placement and transfer prior to electroplating relied on manual labor, typically through the use of vacuum pens. Vacuum pens utilize negative pressure, operating similarly to a vacuum cleaner, securing the wafer securely through the suction generated by the suction cup when activated. However, this method of operation has a significant drawback: because the vacuum pen draws in air from the suction cup to hold the wafer, this process can cause dust to accumulate around the suction cup opening. Despite the highly clean environment of a cleanroom, even the smallest dust particles can contaminate the wafer surface. When wafers are moved from one location to another using the vacuum pen, particularly from a pen to a coating machine tray, dust accumulated around the suction cup opening can adhere to the wafer surface if not effectively removed. Any contamination on the wafer surface, even the smallest amount, can pose a hazard during the electroplating process. During the electroplating process, these contaminants can act as "weak points" for poor coating adhesion, making the coating more susceptible to detachment during subsequent handling or use, impacting the wafer's electrical connectivity, mechanical strength, and long-term reliability.

[0004] Therefore, for the wafer processing industry, how to effectively avoid contamination of wafers before electroplating while maintaining efficient production has become a technical challenge that needs to be solved urgently. Summary of the Invention

[0005] In response to the problems existing in the prior art, the utility model provides a wafer contactless pick-and-place device to achieve contactless transfer of wafers and improve the electroplating efficiency and yield rate of wafers.

[0006] The utility model is realized through the following technical solutions:

[0007] A wafer contactless transfer device includes a tray warehouse, a tray conveying device, a wafer conveying device, a robotic arm, a wafer storage device, and a positioning ring;

[0008] The tray warehouse is used to store trays or trays with wafers, and multiple trays are arranged in the tray storage at intervals from top to bottom;

[0009] The wafer storage device is used for wafers, and a plurality of wafers are arranged at intervals from top to bottom;

[0010] The working end of the robot arm is connected to a first suction cup for sucking a wafer from the wafer storage device and suspending the wafer on top of the first suction cup;

[0011] The wafer conveying device is connected to the second suction cup via a lifting device, and the second suction cup is used to absorb the wafer on the first suction cup and suspend at the bottom of the second suction cup;

[0012] The pallet conveying device includes a rotating device, a vertical moving device and a horizontal moving device, the vertical moving device is connected to the rotating device, the horizontal moving device is connected to the vertical moving device, and the moving end of the horizontal moving device is connected to the adsorption plate, which is used to absorb the pallet;

[0013] The positioning ring is connected to a rotary moving device, and the rotary moving device is used to move the positioning ring to the top of the tray to guide the placement position of the wafer on the tray.

[0014] Furthermore, the first suction cup and the second suction cup each include a base plate, an airflow cavity and an airflow channel;

[0015] An array of multiple airflow cavities is distributed on the surface of the base plate. The air inlet of the airflow channel is connected to the air source, and the outlet of the airflow channel is connected to each airflow cavity respectively. The airflow flows in a rotational direction in the airflow cavity and forms a vacuum cavity in the center of the airflow cavity; an air film is formed between the wafer and the airflow cavity.

[0016] Furthermore, the base plate is provided with a plurality of positioning angles distributed circumferentially, and the plurality of positioning angles are used to position the wafer.

[0017] Furthermore, a positioning structure is provided between the positioning angles of the first suction cup and the second suction cup for positioning the two suction cups when the position of the wafer is converted.

[0018] Furthermore, the robotic arm includes multiple articulated arms, two adjacent articulated arms are connected by servo motors and the rotation angles are perpendicular to each other, the end of the robotic arm is fixed on the workbench, the head end of the robotic arm is connected to the rotating joint, and the first suction cup is connected to the rotating joint.

[0019] Furthermore, the rotating device includes a rotating disk, the bottom of which is connected to the workbench through a rotating shaft, a driven wheel is sleeved on the rotating shaft and fixed to the bottom of the rotating disk, a driving wheel is provided on the rotating disk, the driving wheel is connected to the output shaft of the driving motor, and the driving wheel is engaged with the impulse wheel.

[0020] Furthermore, the slider of the horizontal moving device is connected to one end of the cantilever, and the other end of the cantilever is connected to the adsorption plate, and the length direction of the cantilever is arranged along the movement direction of the horizontal moving device.

[0021] Furthermore, it also includes a coupling device, including a coupling platform, a tray slot is provided on the top of the coupling platform, and an air avoidance slot is provided on the coupling platform, the air avoidance slot is located in the middle of the tray slot and extends downward.

[0022] Furthermore, the rotary moving device includes a rotary cylinder, a lifting cylinder, a lifting arm and a lifting track;

[0023] The upper end of the lifting arm is fixed on one side of the coupling platform, the lifting cylinder is fixed on the lower end of the lifting arm, the upper end of the lifting cylinder is connected to the rotating cylinder through a connecting arm, the connecting arm is connected to the lifting arm through a lifting track, and the side wall of the positioning ring is connected to the rotating shaft of the rotating cylinder.

[0024] Furthermore, the inner wall of the positioning ring is a conical surface for guiding the wafer.

[0025] Compared with the prior art, the present invention has the following beneficial technical effects:

[0026] The contactless wafer transfer device provided by the present application adopts a robotic arm in combination with a suction cup to suck up the wafer in the wafer storage device during the wafer taking and placing process, and makes the wafer float on the surface of the suction cup to realize contactless suction of the wafer, and then adopts a second suction cup to transfer the position of the wafer on the first suction cup, so that the wafer is suspended at the bottom of the second suction cup under the action of negative pressure, and the wafer and the second suction cup are kept in a contactless state, and then the tray conveying device sucks the tray and moves the positioning ring to the surface of the tray and concentrically through the rotating moving device, and the wafer is transferred to the surface of the tray through the positioning ring and finally enters the tray warehouse. The contactless wafer transfer device realizes contactless movement of the wafer through the suction cup, the robotic arm and the moving device, avoids contamination of the wafer during the transfer process, improves the yield of the wafer, and reduces the production cost of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 This is a schematic diagram of the appearance of the wafer contactless transfer device of the present invention;

[0029] Figure 2 This is a layout diagram of the wafer contactless transfer device of the utility model;

[0030] Figure 3 This is a schematic diagram of the first direction structure of the coupling device of the utility model;

[0031] Figure 4 This is a schematic diagram of the second direction structure of the coupling device of the utility model;

[0032] Figure 5 This is a structural diagram of the displacement device of the positioning ring of the utility model;

[0033] Figure 6 This is a structural diagram of the light-filling device of the utility model;

[0034] Figure 7 This is a structural diagram of the wafer storage device of the present invention;

[0035] Figure 8 This is a schematic diagram of the positions of the pallet conveying device and the coupling device of the utility model;

[0036] Figure 9 This is a structural diagram of the wafer conveying device of the present invention;

[0037] Figure 10 This is a structural diagram of the first suction cup of the present utility model;

[0038] Figure 11 This is a structural diagram of the second suction cup of the present utility model;

[0039] Figure 12 This is a schematic diagram of the conveying of the pallet of the utility model;

[0040] Figure 13 This is a structural diagram of the pallet conveying device of the utility model in the first direction;

[0041] Figure 14 This is a structural diagram of the pallet conveying device of the utility model in the second direction;

[0042] Figure 15 This is a structural diagram of the adsorption disk of the utility model;

[0043] Figure 16 This is a structural diagram of the robotic arm of the utility model;

[0044] Figure 17 This is a structural diagram of the pallet warehouse of this utility model.

[0045] Figure: 1. Pallet bin; 2. Pallet conveyor; 3. Wafer conveyor; 4. Coupling device; 5. Robotic arm; 6. Wafer storage device; 7. Fill light device; 8. Identification device; 9. Rotational movement device; 10. First suction cup; 11. Positioning angle; 12. Positioning slot; 13. Airflow cavity; 14. Pallet slot; 21. Support arm; 22. Second suction cup; 23. Slider; 24. Linear module; 25. Positioning column; 26. Airflow hole; 27. Slide rail; 28 , cantilever; 29, adsorption plate; 30, vertical moving device; 31, horizontal moving device; 32, rotating device; 33, driving wheel; 34, driven wheel; 35, rotating disk; 36, air hole; 41, tray slot; 42, air avoidance slot; 61, wafer bin; 62, slot; 71, light plate; 72, track; 73, eccentric wheel; 91, rotating cylinder; 92, lifting cylinder; 93, lifting arm; 94, positioning ring; 95, lifting track; 100, graphite tray. DETAILED DESCRIPTION

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0047] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0048] A wafer is a silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it's called a wafer. Wafers are the fundamental raw material for integrated circuit (IC) manufacturing. Silicon wafers can be processed into various circuit component structures, creating IC products with specific electrical functions. Wafers are made from silicon, and silicon dioxide is abundantly available on the Earth's crust. These silicon dioxide ores, after refining and processing, can be made into high-purity polysilicon, which is then used to manufacture wafers.

[0049] The wafer manufacturing process needs to be carried out in a dust-free environment. At the same time, the wafer needs to be transferred contactlessly during the transfer process of each manufacturing process to reduce the probability of wafer contamination and improve the yield of the wafer. Based on this purpose, this application provides a contactless transfer device in the wafer manufacturing process.

[0050] See Figure 1-17 A wafer contactless transfer device includes a tray magazine 1, a tray conveying device 2, a wafer conveying device 3, a robotic arm 5, a wafer storage device 6 and a positioning ring 94.

[0051] The tray warehouse 1 is used to store trays. The trays serve as carriers in the wafer transfer process. Wafers are placed on the surface of the trays. Multiple trays are arranged in the storage trays from top to bottom.

[0052] The wafer storage device 6 is used for wafers, and multiple wafers are arranged in a storage tray from top to bottom;

[0053] It should be noted that the pallet warehouse is used to store pallets in the initial state. The function of the wafer contactless transfer device of the present application is to transfer the wafers to the pallet in a contactless state, and then move the pallet with the wafers to the pallet warehouse. Therefore, after the operation of the wafer contactless transfer device, the wafers are moved to the pallet, and finally the stored pallets in the pallet warehouse are all placed with wafers.

[0054] The working end of the robot arm 5 is connected to a first suction cup 10 for sucking a wafer from the wafer storage device and suspending the wafer on top of the first suction cup 10;

[0055] The wafer conveying device is connected to the second suction cup through the lifting device. The second suction cup is used to absorb the wafer on the first suction cup under the action of negative pressure and suspend it at the bottom of the second suction cup;

[0056] The pallet conveying device 2 includes a rotating device, a vertical moving device and a horizontal moving device. The vertical moving device is connected to the rotating device, and the horizontal moving device is connected to the vertical moving device. The moving end of the horizontal moving device is connected to the suction plate 29. The suction plate is used to absorb the pallet in the pallet bin, and the pallet is located on the top of the suction plate.

[0057] The positioning ring is connected to the rotary moving device 9, which is used to move the positioning ring 94 to the top of the tray 100 to guide the placement position of the wafer on the tray.

[0058] The wafer is then moved to the tray by the second suction cup, and the wafer is then moved to the tray by the second suction cup.

[0059] In some embodiments, see Figure 17 The pallet warehouse is fixed on the top of the support base, and at least the side of the pallet warehouse facing the pallet conveyor is an open side. A plurality of pallet grooves 14 are arranged on the side wall of the pallet warehouse from top to bottom. The edges of the pallets are overlapped in the pallet grooves, so that multiple pallets are arranged in the pallet warehouse from top to bottom. The distance between the bottommost pallet and the bottom of the pallet warehouse is greater than the thickness of the adsorption disk, ensuring that the adsorption disk can extend into the bottom of the value pallet. The pallet conveyor absorbs the pallets in sequence from bottom to top, and the pallets are graphite pallets 100.

[0060] In some embodiments, see Figure 16 The wafer storage device includes at least one wafer bin 61. One side of the wafer bin 61 is an open side for taking and placing wafers. The open side faces the robotic arm 5. A plurality of slots are arranged on the side wall of the wafer bin from bottom to top. The slots 62 on the two parallel side walls of the wafer bin are symmetrically arranged. The wafers are located in the slots, and the edges of the wafers are overlapped in the slots.

[0061] There can be multiple wafer bins, and the multiple wafer bins can be arranged horizontally in sequence or stacked up and down. It should be noted that no matter which arrangement method is adopted, the position of the wafer bin needs to be within the moving range of the robotic arm. Preferably, multiple wafer bins are stacked up and down, which can effectively reduce the space occupancy rate of the wafer bin.

[0062] In some embodiments, the robotic arm is a multi-degree-of-freedom joint robotic arm, and two adjacent joints are driven to rotate by servo motors. The end of the robotic arm is fixed on the workbench, the head end of the robotic arm is connected to the rotary joint, the first suction cup is connected to the rotary joint, the rotary joint drives the first suction cup to rotate, and the remaining joints serve as spatial position adjustment joints for the first suction cup.

[0063] In some embodiments, the first suction cup and the second suction cup have the same working principle and structure, and the difference lies in the positioning structure. The structure and working principle of the suction cup are described in detail below using the first suction cup as an example.

[0064] See Figure 10 The suction cup comprises a base plate, an airflow cavity 13, a fixing portion and an airflow channel;

[0065] An array of multiple airflow cavities 13 is distributed on the surface of the base, and the airflow channel is arranged inside the base. The air inlet of the airflow channel is connected to the air source, and the outlet of the airflow channel is connected to each airflow cavity 13 respectively. The airflows of two adjacent airflow cavities 13 rotate in opposite directions, and a vacuum cavity is formed in the center of the airflow cavity 13. The base is connected to the rotating joint of the robotic arm through a fixed part.

[0066] The air inlet of the air cavity is arranged at the bottom edge of the air cavity, and the angle formed between the air inlet and the center of the air cavity is 40°-50°. The side wall of the air cavity is a bell mouth, and the angle between the side wall of the air cavity and the axial direction of the air cavity is 70°-80°.

[0067] The suction cup is provided with multiple air flow cavities 13 on the base, and the air inlet of the air flow cavity 13 is provided at the bottom edge of the air cavity and forms an angle with the center of the air flow cavity 13, so that the air flow entering the air flow cavity 13 flows in a circular direction in the air flow and forms a vacuum area in the center of the air cavity. The side wall of the air flow cavity 13 forms a trumpet-mouth structure, and the circumferentially flowing air flow escapes along the side wall of the air cavity, so that an air film is formed between the top of the air cavity and the wafer, so that the wafer is isolated from the air flow cavity 13. The wafer is suspended on the suction cup under the action of vacuum, thereby realizing contactless suction of the wafer.

[0068] The number of airflow cavities is 4-8, and multiple airflow cavities are arranged along a rectangular array. The side walls of the airflow cavities are rough surfaces, and the roughness is controlled by a borax process. The roughness controls the diffusion rate of the gas to improve the adsorption force of the air cavity.

[0069] The fixing portion is disposed at the top end of the substrate and is provided with an air inlet channel, one end of which is connected to the air flow channel and the other end is connected to the air source. The fixing portion is provided with a bolt hole for connecting the suction cup to the robotic arm. The base is provided with a positioning angle 11 for positioning the wafer. The multiple positioning angles are arranged along the centers of the multiple air cavities. The positioning angles are formed as raised structures on the base. The contact side of the positioning angle with the wafer is an arc surface, so that the positioning angle forms a point contact with the side wall of the wafer, thereby reducing the contact area with the wafer and reducing the probability of damage to the wafer.

[0070] In some embodiments, the wafer conveying device 3 is used to move the wafers sucked by the robot arm to the tray. Figure 8 and 9The wafer conveying device 3 includes a fixed seat and a lifting device arranged on it. The lifting device is connected to the support arm 21. The second suction cup is arranged at the end of the support arm. When the robotic arm drives the first suction cup to the bottom of the second suction cup, the lifting device drives the second suction cup to move downward until the positioning angles of the two suction cups are in contact, and the wafer on the surface of the first suction cup is sucked under the action of negative pressure.

[0071] The lifting device includes a linear module 24 and a slider 23. The linear module is vertically arranged on a fixed seat, and the support arm is horizontally arranged, one end of which is connected to the slider of the linear module. The second suction cup is arranged at the bottom of the other end of the support arm, and the slider drives the second suction cup to connect through the support arm.

[0072] The structure of the second suction cup is similar to that of the first suction cup, except that the top of the second suction cup is connected via a flange, and the upper end of the flange is connected to the support arm.

[0073] In order to ensure the accuracy of the wafer position conversion between the first suction cup and the second suction cup, a positioning structure is provided between the first suction cup and the second suction cup. When the two suction cups are in contact, the positioning structure positions the two suction cups.

[0074] The positioning structure includes a positioning groove 12 and a positioning column 25 matching it. The positioning groove 12 and the positioning column 25 are respectively arranged at the positioning angles of the two suction cups. In this embodiment, the positioning groove 12 is arranged at the positioning angle of the first suction cup, and the positioning column 25 is arranged at the positioning angle of the second suction cup. The positioning column can be inserted into the positioning groove to achieve the positioning of the two suction cups.

[0075] The depth of the airflow cavity 26 of the second suction cup is greater than that of the first suction cup, so that the airflow can form a larger vortex when it swirls in the airflow cavity, thereby forming a negative pressure area. Under the action of negative pressure, a greater negative pressure suction force is formed, causing the wafer to suspend at the bottom of the second suction cup.

[0076] In some embodiments, see Figure 12-15 The pallet conveying device 2 is located between the positioning ring and the pallet bin. The pallet conveying device 2 realizes the movement of the pallet in three-dimensional space by coupling rotation, translation and lifting movements.

[0077] The rotating device 32 includes a rotating disk 35, the bottom center of which is connected to the workbench via a rotating shaft. A driven wheel 34 is sleeved on the rotating shaft and fixedly connected to the bottom of the rotating disk. A driving wheel 33 is provided on the rotating disk. The driving wheel is connected to the output shaft of the driving motor, and the driving wheel is engaged with the impulse wheel. The driving wheel drives the driven wheel to rotate, and the driven wheel drives the rotating disk to rotate.

[0078] A vertical motion mechanism is mounted atop the rotating disk, while a horizontal motion mechanism is connected to its slide rail 27. This rail drives the horizontal motion mechanism for height adjustment. The horizontal motion mechanism's slider is connected to one end of a cantilever 28, the other end of which is connected to a suction plate 29. The cantilever's length is aligned with the direction of motion of the horizontal motion mechanism. During operation, the pallet conveyor 2 moves the suction plate into the pallet bin, picks up the pallet, and then moves the pallet to its target location.

[0079] In this embodiment, the vertical moving device adopts a linear displacement module, and the horizontal moving device adopts a drag chain linear module.

[0080] See Figure 15 The adsorption disk is a disk structure with multiple air holes on its surface. The air holes are connected to the air source through the optical path. The air holes generate suction to adsorb the tray. It should be noted that the graphite tray serves as a carrier of the wafer. The graphite tray directly forms a stable contact with the adsorption disk under the action of air pressure.

[0081] In some embodiments, a coupling device 4 is further included, wherein the wafer is placed on the top of the tray. Figure 3-5 The coupling device includes a coupling platform, a tray slot 41 is provided on the top of the coupling platform, and the tray slot is used to position the tray. An air avoidance slot 42 is provided on the coupling platform, and the air avoidance slot 42 is located in the middle of the tray slot. The adsorption plate extends into the air avoidance slot to place the tray in the tray slot.

[0082] The coupling platform is provided with a fixing device for fixing the pallet. The fixing device is an electric push rod. A top block is provided at the end of the electric push rod. When the pallet is located in the pallet slot, the top block can abut against the edge of the pallet to fix it.

[0083] When the pallet is located in the pallet slot, the rotating moving device 9 drives the positioning ring to move to the top of the pallet and is set concentrically; the rotating moving device 9 includes a rotating cylinder 91, a lifting cylinder 92, a lifting arm 93 and a lifting rail 95, the upper end of the lifting arm 93 is fixed on one side of the coupling platform, the lifting cylinder 92 is fixed on the lower end of the lifting arm 93, the upper end of the lifting cylinder 92 is connected to the rotating cylinder 91 through a connecting arm, the connecting arm is connected to the lifting arm 93 through the lifting rail 95, and the side wall of the positioning ring is connected to the rotating axis of the rotating cylinder 91.

[0084] The lifting cylinder 92 is driven by the connecting arm, and the rotating cylinder 91 drives the positioning ring. A limit switch is provided at the upper end of the connecting arm to determine the rotation angle of the positioning ring, ensuring that the positioning ring is concentric with the pallet. During operation, when the wafer is located on top of the pallet and concentric, the wafer conveyor moves the second suction cup to the top of the positioning ring. The air pressure then disappears, and the wafer enters the positioning ring under the action of gravity and falls onto the pallet, achieving the coupling between the wafer and the pallet. That is, the wafer is pressed against the surface of the pallet. The pallet conveyor then moves the pallet with the wafer to the pallet bin again.

[0085] In some embodiments, the inner wall of the positioning ring is a cone to guide the wafer so that it falls accurately into the center of the tray.

[0086] In some embodiments, a fill light device 7 is also included, which is located on the back of the wafer bin to increase the brightness of the wafer bin during the process of the robot arm sucking the wafer. A camera is set on the robot arm so that the camera can obtain the image of the wafer in the wafer bin. The controller uses a self-calibration positioning algorithm to control the movement position of the robot arm to suck the wafer.

[0087] See Figure 6 The fill light device 7 includes a light panel 71, a track 72 and an eccentric wheel 73; the track 72 is installed on the workbench through a bracket, the light panel is vertically installed on the track 72 through a slider, and the eccentric wheel 73 is connected to the slider. The eccentric wheel 73 can rotate to abut against the side wall of the track to position the slider, thereby realizing the position adjustment and fixation of the light panel.

[0088] In some embodiments, an identification device is also included for identifying the wafer code. The identification device includes a CCD camera and a light source. The light source is arranged on both sides of the camera. A hollow area is provided on the first suction cup. The wafer code is located on the edge of the wafer. When the robot moves the wafer to the top of the camera, the camera can obtain the wafer code.

[0089] The wafer non-contact transfer device uses a robot to pick up the wafers in the wafer bin, and then the wafer conveyor device changes the position of the wafer so that it is located at the bottom of the second reel;

[0090] The tray conveying device sucks the tray and transports it to the tray slot of the coupling table. The rotary displacement device moves the positioning ring to the top of the tray. The wafer conveying device releases the air pressure and the wafer is placed on the tray through the positioning ring under the action of gravity. Finally, the tray conveying device moves the tray with the wafer to the tray warehouse again. After the tray warehouse is full, the entire tray warehouse is moved to the electroplating device to electroplate the wafers. This device realizes contactless transfer of wafers, improves the production efficiency of wafers, and improves the electroplating yield of wafers.

[0091] The above content is only for explaining the technical idea of ​​the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A wafer contactless transfer device, characterized in that: It includes a pallet bin, a pallet conveyor, a wafer conveyor, a robotic arm, a wafer storage device and a positioning ring; The tray warehouse is used to store trays or trays with wafers, and multiple trays are arranged in the tray storage at intervals from top to bottom; The wafer storage device is used for wafers, and a plurality of wafers are arranged at intervals from top to bottom; The working end of the robot arm is connected to a first suction cup for sucking a wafer from the wafer storage device and suspending the wafer on top of the first suction cup; The wafer conveying device is connected to the second suction cup via a lifting device, and the second suction cup is used to absorb the wafer on the first suction cup and suspend at the bottom of the second suction cup; The pallet conveying device includes a rotating device, a vertical moving device and a horizontal moving device, the vertical moving device is connected to the rotating device, the horizontal moving device is connected to the vertical moving device, and the moving end of the horizontal moving device is connected to the adsorption plate, which is used to absorb the pallet; The positioning ring is connected to a rotary moving device, and the rotary moving device is used to move the positioning ring to the top of the tray to guide the placement position of the wafer on the tray.

2. The wafer contactless transfer device according to claim 1, characterized in that: The first suction cup and the second suction cup each comprise a base, an airflow cavity and an airflow channel; An array of multiple airflow cavities is distributed on the surface of the base plate. The air inlet of the airflow channel is connected to the air source, and the outlet of the airflow channel is connected to each airflow cavity respectively. The airflow flows in a rotational direction in the airflow cavity and forms a vacuum cavity in the center of the airflow cavity; an air film is formed between the wafer and the airflow cavity.

3. The wafer contactless transfer device according to claim 2, characterized in that: The base plate is provided with a plurality of positioning angles distributed circumferentially, and the plurality of positioning angles are used for positioning the wafer.

4. The wafer contactless transfer device according to claim 3, characterized in that: A positioning structure is provided between the positioning angles of the first suction cup and the second suction cup, for positioning the two suction cups when the wafer position is converted.

5. The wafer contactless transfer device according to claim 1, characterized in that: The robotic arm includes multiple joint arms, two adjacent joint arms are connected by servo motors and the rotation angles are perpendicular to each other, the end of the robotic arm is fixed on the workbench, the head end of the robotic arm is connected to the rotation joint, and the first suction cup is connected to the rotation joint.

6. The wafer contactless transfer device according to claim 1, characterized in that: The rotating device includes a rotating disk, the bottom of which is connected to the workbench through a rotating shaft, a driven wheel is sleeved on the rotating shaft and fixed to the bottom of the rotating disk, a driving wheel is provided on the rotating disk, the driving wheel is connected to the output shaft of the driving motor, and the driving wheel is engaged with the impulse wheel.

7. A wafer contactless transfer device according to claim 1 or 6, characterized in that: The slider of the horizontal moving device is connected to one end of the cantilever, and the other end of the cantilever is connected to the adsorption disk. The length direction of the cantilever is arranged along the moving direction of the horizontal moving device.

8. The wafer contactless transfer device according to claim 1, characterized in that: It also includes a coupling device, including a coupling platform, a tray slot is provided on the top of the coupling platform, and an air avoidance slot is provided on the coupling platform. The air avoidance slot is located in the middle of the tray slot and extends downward.

9. The wafer contactless transfer device according to claim 8, characterized in that: The rotary moving device includes a rotary cylinder, a lifting cylinder, a lifting arm and a lifting track; The upper end of the lifting arm is fixed on one side of the coupling platform, the lifting cylinder is fixed on the lower end of the lifting arm, the upper end of the lifting cylinder is connected to the rotating cylinder through a connecting arm, the connecting arm is connected to the lifting arm through a lifting track, and the side wall of the positioning ring is connected to the rotating shaft of the rotating cylinder.

10. The wafer contactless transfer device according to claim 8, characterized in that: The inner wall of the positioning ring is a cone surface, which is used to guide the wafer.

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