Efficient heat dissipation switch

Abstract

The utility model discloses a high-efficiency heat dissipation switch which comprises a switch interface board, an air flow type shell assembly and a heat dissipation tail board assembly. The airflow type shell assembly is fixedly assembled on one side of the switch interface board and comprises a lower heat dissipation cover shell, an exhaust fan is fixedly installed below the lower heat dissipation cover shell, an upper heat dissipation cover shell is connected to the upper portion of the lower heat dissipation cover shell in an inserted mode, and a flow guide top plate is integrally formed on the inner wall of the upper heat dissipation cover shell. And the upper heat dissipation housing and the flow guide top plate are matched to form a flow guide exhaust cavity. The heat dissipation tail board assembly is fixedly assembled on one side of the switch interface board, the heat dissipation tail board assembly comprises a heat dissipation tail board, and a plurality of heat dissipation fans are fixedly installed on the side, close to the lower heat dissipation housing, of the heat dissipation tail board. According to the utility model, through the arrangement of the air flow type shell assembly, the air circulation speed in the switch is improved, the situation of heat accumulation in the use process of the switch is reduced, and the heat dissipation efficiency of the switch is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation of switches, and in particular relates to a high-efficiency heat dissipation switch. Background Art

[0002] A switch is a type of network device suitable for forwarding optical and electrical signals. Common switches include Ethernet switches, telephone switches, and fiber optic switches. During operation, the internal electronic components of a switch generate a large amount of heat. If this heat is not accumulated in the switch, it will have an adverse effect on the performance and life of the switch. Therefore, ensuring the heat dissipation effect of the switch plays a vital role in the stable operation of the switch.

[0003] In the prior art, switches mainly use a cooling fan at the rear to guide the air inside the switch and dissipate heat by accelerating air circulation. Although this method can dissipate heat for the switch, there is a problem: the heat dissipation effect is good in the part close to the cooling fan, while the heat dissipation effect is poor in the part farther away from the cooling fan, resulting in poor heat dissipation efficiency of the switch.

[0004] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. Utility Model Content

[0005] The purpose of the utility model is to provide a high-efficiency heat dissipation switch, which can improve the heat dissipation efficiency of the switch.

[0006] In order to achieve the above-mentioned purpose, the technical solution provided by a specific embodiment of the present invention is as follows:

[0007] A high-efficiency heat dissipation switch comprises a switch interface board, an airflow type housing assembly, and a heat dissipation tail plate assembly.

[0008] The airflow housing assembly is fixedly assembled on one side of the switch interface board, and the airflow housing assembly includes a lower heat dissipation cover, which is fixedly assembled on one side of the switch interface board. The lower heat dissipation cover is hollow, and an exhaust fan is fixedly installed below the lower heat dissipation cover. The upper heat dissipation cover is plugged into the upper part of the lower heat dissipation cover, and a guide top plate is integrally formed on the inner wall of the upper heat dissipation cover. The upper heat dissipation cover and the guide top plate cooperate to form a guide exhaust cavity, and the guide exhaust cavity is connected to the lower heat dissipation cover.

[0009] The heat dissipation tail plate assembly is fixedly mounted on one side of the switch interface board. The heat dissipation tail plate assembly includes a heat dissipation tail plate. The heat dissipation tail plate is fixedly mounted on the side of the lower heat dissipation cover away from the switch interface board. Several heat dissipation fans are fixedly mounted on the side of the heat dissipation tail plate close to the lower heat dissipation cover.

[0010] In one or more embodiments of the present invention, mounting bosses are integrally formed on the side of the switch interface board and the heat sink tail plate proximate the lower heat sink housing. The mounting bosses engage and limit the lower heat sink housing and the upper heat sink housing, thereby facilitating assembly and fixation of the lower and upper heat sink housings. Mounting screws are fixedly connected between the mounting bosses and the lower and upper heat sink housings, respectively, using the mounting screws to secure the lower and upper heat sink housings.

[0011] In one or more embodiments of the present invention, both sides of the lower and upper heat dissipation housings are provided with assembly relief grooves, which correspond to the assembly bosses. The assembly bosses cooperate with the assembly relief grooves to secure the lower and upper heat dissipation housings. The inner walls of the assembly relief grooves are provided with assembly threaded holes. The threaded holes facilitate securing the assembly screws.

[0012] In one or more embodiments of the present invention, a plurality of evenly distributed support columns are fixedly mounted on the bottom of the lower heat dissipation housing. These support columns serve to support and limit the lower heat dissipation housing. The height of the support columns is lower than the height of the outer frame of the exhaust fan. By lowering the height of the support columns below the height of the outer frame of the exhaust fan, the exhaust fan facilitates the delivery of external air into the lower heat dissipation housing.

[0013] In one or more embodiments of the present invention, a heat dissipation guide block is fixedly mounted within the lower heat dissipation housing. The heat dissipation guide block is fixedly connected to the inner wall of the lower heat dissipation housing and is positioned above the exhaust fan. The heat dissipation guide block conducts heat to the lower heat dissipation housing and also diverts air delivered by the exhaust fan.

[0014] In one or more embodiments of the present invention, the heat dissipation guide block is tapered, with the center height of the heat dissipation guide block greater than the surrounding height. The tapered heat dissipation guide block facilitates diversion of air directed by the exhaust fan, improving air circulation and ensuring effective heat dissipation of the lower and upper heat dissipation housings.

[0015] In one or more embodiments of the present invention, plug-in bosses are integrally formed below both sides of the upper heat dissipation housing, and these plug-in bosses engage with the lower heat dissipation housing. The plug-in bosses engage with the lower heat dissipation housing to limit the assembly of the lower and upper heat dissipation housings, ensuring accurate assembly of the lower and upper heat dissipation housings. A flow channel is excavated within the plug-in bosses, communicating with the diversion and exhaust chamber. The flow channel provides airflow communication between the diversion and exhaust chamber and the lower heat dissipation housing.

[0016] In one or more embodiments of the present invention, both ends of the air guiding and exhausting cavity are provided with closing plates, which are fixedly mounted between the upper heat dissipation cover and the air guiding top plate to close and limit the air guiding and exhausting cavity.

[0017] In one or more embodiments of the present invention, the top guide plate is provided with multiple sets of evenly distributed heat dissipation holes, each of which is in communication with the guide exhaust cavity. The multiple sets of heat dissipation holes transport air within the guide exhaust cavity between the lower heat dissipation housing and the upper heat dissipation housing, thereby dissipating heat from multiple angles for electronic components mounted between the lower and upper heat dissipation housings.

[0018] In one or more embodiments of the present invention, the outer side of the heat dissipation tail plate is provided with multiple groups of evenly distributed conductive holes, and the multiple groups of conductive holes are provided corresponding to the heat dissipation fans. Gas extracted during the operation of the heat dissipation fans is discharged through the conductive holes.

[0019] Compared with the existing technology, the present invention can dissipate heat from multiple angles of the switch by setting up an airflow-type housing assembly, thereby increasing the air circulation speed inside the switch, reducing heat accumulation during use of the switch, and improving the heat dissipation efficiency of the switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A three-dimensional diagram of a high-efficiency heat dissipation switch in one embodiment of the present invention;

[0022] Figure 2 This is a side sectional view of a high-efficiency heat dissipation switch in one embodiment of the present invention;

[0023] Figure 3 for Figure 2 Schematic diagram of the structure at A in the middle;

[0024] Figure 4 This is a front cross-sectional view of a high-efficiency heat dissipation switch in one embodiment of the present utility model;

[0025] Figure 5 for Figure 4 Schematic diagram of the structure at B in the middle;

[0026] Figure 6 This is a three-dimensional diagram of an upper heat dissipation cover in one embodiment of the present utility model;

[0027] Figure 7 for Figure 6 Schematic diagram of the structure at C in the middle;

[0028] Figure 8 This is a three-dimensional view from another angle of the high-efficiency heat dissipation switch in one embodiment of the present invention.

[0029] Description of main reference numerals:

[0030] 1-Switch interface board, 2-Airflow housing assembly, 201-Lower heat sink cover, 202-Exhaust fan, 203-Upper heat sink cover, 204-Top guide plate, 205-Heat guide block, 206-Plug boss, 207-Enclosing plate, 208-Heat exhaust hole, 3-Heat sink tail plate assembly, 301-Heat sink tail plate, 302-Cooling fan, 303-Through hole, 4-Mounting boss, 5-Mounting screws, 6-Support column. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will be combined with the drawings of the embodiments of the present invention to clearly and completely describe the technical solutions of the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0032] like Figures 1 to 8 As shown, a high-efficiency heat dissipation switch in an embodiment of the present invention includes: a switch interface board 1, an airflow housing assembly 2, and a heat dissipation tail plate assembly 3.

[0033] like Figure 1 As shown, the switch interface board 1 and the heat sink tail plate 301 are integrally formed with mounting bosses 4 on the side proximal to the lower heat sink housing 201. The mounting bosses 4 engage and limit the lower heat sink housing 201 and the upper heat sink housing 203, thereby facilitating their assembly and fixation.

[0034] Specifically, both sides of the lower heat dissipation cover 201 and the upper heat dissipation cover 203 are provided with assembly avoidance grooves, which are correspondingly provided with the assembly bosses 4. The assembly bosses 4 cooperate with the assembly avoidance grooves so that the assembly bosses 4 can engage and limit the lower heat dissipation cover 201 and the upper heat dissipation cover 203.

[0035] like Figures 1 to 3 As shown, the airflow housing assembly 2 is fixedly assembled on one side of the switch interface board 1. The airflow housing assembly 2 assists in dissipating heat for electronic components in the switch, thereby improving the heat dissipation efficiency of the switch.

[0036] like Figures 2 to 5 As shown, the airflow housing assembly 2 includes a lower heat dissipation cover 201, which is fixedly mounted on one side of the switch interface board 1. Lower heat dissipation cover 201 secures the electronic components within the switch and also facilitates heat dissipation from the bottom of the electronic components within the switch.

[0037] The lower heat dissipation cover 201 is hollow so as to facilitate the air conveyed by the exhaust fan 202 to be guided through the lower heat dissipation cover 201 .

[0038] like Figures 2 to 5 As shown, an exhaust fan 202 is fixedly installed below the lower heat dissipation cover 201. By controlling the operation of the exhaust fan 202, the outside air is transported into the lower heat dissipation cover 201 under the action of the exhaust fan 202 blades.

[0039] Preferably, the model of the exhaust fan 202 is TNF250.

[0040] like Figure 1 As shown, the assembly boss 4 is fixedly connected to the lower heat dissipation cover 201 and the upper heat dissipation cover 203 by assembly screws 5. The assembly boss 4 is assembled and fixed to the lower heat dissipation cover 201 and the upper heat dissipation cover 203 respectively by the assembly screws 5.

[0041] Specifically, the inner wall of the assembly avoidance groove is provided with an assembly threaded hole, which facilitates the assembly limit of the assembly screw 5.

[0042] like Figure 1 As shown, an upper heat dissipation cover 203 is inserted above the lower heat dissipation cover 201. The lower heat dissipation cover 201 and the upper heat dissipation cover 203 cooperate with each other to assemble, limit and seal the electronic components of the switch.

[0043] like Figures 2 to 6As shown, a guide plate 204 is integrally formed on the inner wall of the upper heat dissipation housing 203. The upper heat dissipation housing 203 and the guide plate 204 cooperate to form a guide exhaust cavity, which is in communication with the lower heat dissipation housing 201. The air generated by the exhaust fan 202 during operation is transported along the guide exhaust cavity toward the top of the electronic components in the switch, thereby dissipating heat from the electronic components in multiple directions.

[0044] like Figures 2 to 6 As shown, a plurality of evenly distributed support columns 6 are fixedly mounted on the bottom of the lower heat dissipation cover 201. The plurality of support columns 6 serve to support and limit the lower heat dissipation cover 201.

[0045] Specifically, the height of the plurality of support columns 6 is lower than the height of the outer frame of the exhaust fan 202. By lowering the height of the plurality of support columns 6 to the outer frame of the exhaust fan 202, it is convenient to allow the outside air to be transported into the lower heat dissipation cover 201 under the action of the exhaust fan 202.

[0046] like Figures 2 to 5 As shown, a heat dissipation guide block 205 is fixedly mounted within the lower heat dissipation housing 201. The heat dissipation guide block 205 is fixedly connected to the inner wall of the lower heat dissipation housing 201 and is arranged above the exhaust fan 202. The heat dissipation guide block 205 conducts heat from the lower heat dissipation housing 201. Furthermore, the heat dissipation guide block 205 can divert the air delivered by the exhaust fan 202.

[0047] The heat dissipation guide block 205 is tapered, with the center height of the heat dissipation guide block 205 greater than the surrounding height. The tapered heat dissipation guide block 205 facilitates diversion of the air directed by the exhaust fan 202, improving air circulation and ensuring effective heat dissipation from the lower heat dissipation housing 201 and the upper heat dissipation housing 203.

[0048] like Figure 6 As shown, the lower sides of the upper heat dissipation housing 203 are integrally formed with plug bosses 206, which plug into and mate with the lower heat dissipation housing 201. By plugging and mating the plug bosses 206 with the lower heat dissipation housing 201, the lower heat dissipation housing 201 and the upper heat dissipation housing 203 are assembled and limited, ensuring the accuracy of the assembly of the lower heat dissipation housing 201 and the upper heat dissipation housing 203.

[0049] Specifically, a conducting channel is bored in the plug boss 206 , and the conducting channel is connected to the diversion and exhaust cavity, so that airflow is conducted between the diversion and exhaust cavity and the lower heat dissipation cover 201 through the conducting channel.

[0050] like Figures 6 and 7As shown, both ends of the air guiding and exhausting cavity are provided with closing plates 207, which are fixedly assembled between the upper heat dissipation cover 203 and the air guiding top plate 204. The closing plates 207 play a role of closing and limiting the air guiding and exhausting cavity.

[0051] like Figures 6 and 7 As shown, the top guide plate 204 is provided with multiple sets of evenly distributed heat dissipation holes 208, all of which are in communication with the guide exhaust cavity. The multiple sets of heat dissipation holes 208 transport air within the guide exhaust cavity to the space between the lower heat dissipation housing 201 and the upper heat dissipation housing 203, thereby dissipating heat from multiple angles for the electronic components mounted between the lower heat dissipation housing 201 and the upper heat dissipation housing 203.

[0052] like Figures 4 and 5 As shown, the heat sink assembly 3 is fixedly mounted on one side of the switch interface board 1. The heat sink assembly 3 includes a heat sink 301, which is fixedly mounted on the side of the lower heat sink housing 201 facing away from the switch interface board 1. The heat sink 301 assists in assembling and securing the lower heat sink housing 201 and the upper heat sink housing 203.

[0053] like Figures 4 and 5 As shown, a plurality of cooling fans 302 are fixedly mounted on one side of the heat dissipation tail plate 301 close to the lower heat dissipation cover 201. By controlling the operation of the cooling fans 302, the air between the lower heat dissipation cover 201 and the upper heat dissipation cover 203 is guided out, thereby assisting in cooling the electronic components in the switch.

[0054] Preferably, the model of the cooling fan 302 is DP200A.

[0055] like Figure 8 As shown, the outer side of the heat dissipation tail plate 301 is provided with multiple groups of evenly distributed conductive holes 303, and the multiple groups of conductive holes 303 are arranged corresponding to the heat dissipation fans 302. The conductive holes 303 are used to guide the gas extracted during the operation of the heat dissipation fans 302.

[0056] During specific use, the operation of the exhaust fan 202 is controlled so that the outside air is transported into the lower heat dissipation cover 201 along the fan blades of the exhaust fan 202. The airflow generated during the operation of the exhaust fan 202 is transported into the guide exhaust cavity along the guide channel in the plug-in boss 206 under the guiding action of the heat dissipation guide block 205. The heat dissipation guide block 205 can not only conduct heat dissipation on the top of the lower heat dissipation cover 201, but also guide the airflow transported by the exhaust fan 202.

[0057] The air in the exhaust chamber is transported to the top of the electronic components in the switch through the heat dissipation holes 208. Simultaneously, the operation of the heat dissipation fan 302 is controlled to guide the hot air between the lower heat dissipation cover 201 and the upper heat dissipation cover 203, thereby achieving efficient heat dissipation for the switch.

[0058] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0059] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A high-efficiency heat dissipation switch, characterized in that: include: Switch interface board; An airflow housing assembly is fixedly assembled on one side of the switch interface board, the airflow housing assembly includes a lower heat dissipation cover, the lower heat dissipation cover is fixedly assembled on one side of the switch interface board, the lower heat dissipation cover is hollow, an exhaust fan is fixedly installed below the lower heat dissipation cover, an upper heat dissipation cover is plugged into the upper part of the lower heat dissipation cover, a guide top plate is integrally formed on the inner wall of the upper heat dissipation cover, the upper heat dissipation cover and the guide top plate cooperate to form a guide exhaust cavity, and the guide exhaust cavity is conductively connected to the lower heat dissipation cover; The heat dissipation tail plate assembly is fixedly mounted on one side of the switch interface board. The heat dissipation tail plate assembly includes a heat dissipation tail plate. The heat dissipation tail plate is fixedly mounted on the side of the lower heat dissipation cover away from the switch interface board. A plurality of heat dissipation fans are fixedly mounted on the side of the heat dissipation tail plate close to the lower heat dissipation cover.

2. The high-efficiency heat dissipation switch according to claim 1, characterized in that: The switch interface board and the heat dissipation tail plate are both integrally formed with assembly bosses on one side close to the lower heat dissipation cover, and the assembly bosses are fixedly connected to the lower heat dissipation cover and the upper heat dissipation cover with assembly screws.

3. The high-efficiency heat dissipation switch according to claim 2, characterized in that: Both sides of the lower heat dissipation cover and the upper heat dissipation cover are provided with assembly avoidance grooves, the assembly avoidance grooves are arranged correspondingly to the assembly bosses, and assembly threaded holes are provided on the inner walls of the assembly avoidance grooves.

4. The high-efficiency heat dissipation switch according to any one of claims 1 or 2, characterized in that: A plurality of evenly distributed support columns are fixedly mounted on the bottom of the lower heat dissipation cover, and the horizontal heights of the plurality of support columns are lower than the horizontal height of the outer frame of the exhaust fan.

5. The high-efficiency heat dissipation switch according to claim 1, characterized in that: A heat dissipation guide block is fixedly mounted in the lower heat dissipation shell. The heat dissipation guide block is fixedly connected to the inner wall of the lower heat dissipation shell, and the heat dissipation guide block is arranged above the exhaust fan.

6. The high-efficiency heat dissipation switch according to claim 5, characterized in that: The heat dissipation guide block is arranged in a cone shape, and the height of the center position of the heat dissipation guide block is greater than the height of the surrounding area.

7. The high-efficiency heat dissipation switch according to claim 1, characterized in that: The lower parts of both sides of the upper heat dissipation cover are integrally formed with plug-in bosses, which are plugged into the lower heat dissipation cover. A conducting flow channel is bored in the plug-in boss, and the conducting flow channel is connected to the guide exhaust cavity.

8. The high-efficiency heat dissipation switch according to claim 1, characterized in that: Both ends of the air guide and exhaust cavity are provided with closing plates, and the closing plates are fixedly assembled between the upper heat dissipation cover and the air guide top plate.

9. The high-efficiency heat dissipation switch according to any one of claims 1, 2, 5, 7 or 8, characterized in that: The guide top plate is provided with a plurality of evenly distributed heat dissipation and exhaust holes, and the plurality of heat dissipation and exhaust holes are all communicated with the guide exhaust cavity.

10. The high-efficiency heat dissipation switch according to claim 1, characterized in that: The outer side of the heat dissipation tail plate is drilled with multiple groups of evenly distributed conducting holes, and the multiple groups of conducting holes are arranged corresponding to the heat dissipation fans.

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