Electronic device and vehicle including same

Abstract

The utility model relates to the technical field of electronic devices, in particular to an electronic device with a cooling structure, and further relates to a vehicle comprising the electronic device. The utility model provides an electronic device (100), which comprises a shell (1) and a printed circuit board (2) accommodated in the shell (1), and is characterized in that the electronic device (100) further comprises a radiating fin (3) made of metal, and the radiating fin (3) is integrated with the shell (1) and is directly fixed on the printed circuit board (2). According to the utility model, the radiating fins are directly fixed on the printed circuit board, so that on one hand, the radiating performance is improved, on the other hand, the production cost is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, and in particular to an electronic device with a cooling structure, such as a zone controller of a vehicle. The utility model also relates to a vehicle comprising the electronic device. Background Art

[0002] With the advancement of electronic and intelligent products, electronic devices, including printed circuit boards (PCBs), have become widely used. For example, various controllers are used in vehicles to monitor and control vehicle driving conditions. As the number of required functions increases, the number of electronic components mounted on PCBs also increases. These components generate heat during operation, forming heating elements. If this heat cannot be dissipated promptly, the PCB's performance will degrade or even be damaged, affecting the efficiency and lifespan of the entire electronic device. Therefore, heat dissipation from PCBs is crucial.

[0003] In currently known PCB heat dissipation solutions, the PCB is housed in a plastic or metal housing and secured to the housing with screws. Heat dissipation adhesive is placed between the housing and the PCB, allowing heat from the PCB to be transferred to the housing and dissipated through the housing. This solution has the following drawbacks: Using metal materials with good heat dissipation properties for the housing results in high production costs; using low-cost plastic materials results in poor heat dissipation. Furthermore, the need for heat dissipation adhesive for heat conduction and screws for securing the housing reduces both production costs and efficiency.

[0004] Therefore, there is a need to improve electronic devices including printed circuit boards, so as to obtain a technical solution with good heat dissipation performance, low production cost and high production efficiency. Utility Model Content

[0005] The present invention aims to solve at least one aspect of the above-mentioned problems in the prior art.

[0006] To this end, the present invention provides an electronic device comprising a housing and a printed circuit board housed within the housing. The device also includes a metal heat sink integral with the housing and directly secured to the printed circuit board. In this technical solution, the heat sink is directly secured to the printed circuit board, improving heat dissipation performance compared to solutions that use heat dissipation adhesive for heat conduction. Furthermore, the heat dissipation adhesive and securing screws can be eliminated, thereby reducing production costs and improving efficiency.

[0007] In a preferred embodiment, the heat sink includes a body and a plurality of pins extending from the body, and the printed circuit board includes a plurality of sockets. Each pin is inserted into a corresponding socket to directly secure the heat sink to the printed circuit board. By providing the heat sink and printed circuit board with a plurality of mating pins and sockets, a fixed connection between the heat sink and printed circuit board can be achieved in a simple manner. Preferably, each pin is press-fitted into a corresponding socket.

[0008] In a preferred embodiment, the housing is made of plastic and is formed into one piece with the heat sink by injection molding. Using plastic to manufacture the housing can reduce production costs compared to metal housings.

[0009] Advantageously, the housing is provided with a groove extending toward the printed circuit board, and the heat sink is embedded in the bottom of the groove. Preferably, the thickness of the bottom of the groove is the same as the thickness of the housing. Thus, good heat dissipation performance can be achieved.

[0010] In a preferred embodiment, the heat sink is arranged close to the heat generating components of the printed circuit board. This allows direct heat conduction from the vicinity of the heat source, thereby improving the heat dissipation performance.

[0011] In a preferred embodiment, the electronic device includes multiple groups of heat sinks, each group of heat sinks includes multiple heat sinks, and the multiple heat sinks are arranged to be spaced apart from each other. Preferably, each group of heat sinks is arranged close to a corresponding heat generating component of the printed circuit board.

[0012] The utility model also provides a vehicle, which includes the above-mentioned electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be described in detail below by way of non-limiting embodiments with reference to the accompanying drawings, in which:

[0014] Figure 1 is a perspective view of an electronic device according to an exemplary embodiment of the present invention;

[0015] Figure 2 yes Figure 1 a cross-sectional view of the electronic device shown;

[0016] Figure 3 yes Figure 1 Exploded view of the electronic device shown.

[0017] The accompanying drawings are schematic only and are not necessarily drawn to scale. They show only those parts necessary to illustrate the present invention, and other parts may be omitted or mentioned only briefly. In addition to the parts or parts shown in the accompanying drawings, the present invention may also include other parts or parts. DETAILED DESCRIPTION

[0018] In the following description, many specific details are set forth to provide those skilled in the art with a more comprehensive understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention may be implemented without some of these specific details. Furthermore, it should be understood that the present invention is not limited to the specific embodiments described. Rather, any combination of the following features and elements may be considered to implement the present invention, regardless of whether they relate to different embodiments. Therefore, the following features, embodiments, and advantages are provided for illustrative purposes only and should not be considered as elements or limitations of the claims unless expressly set forth in the claims.

[0019] With the advancement of vehicle electronics and intelligence, traditional distributed architectures are struggling to meet the demands for higher-level intelligent functionality. Consequently, zone controllers (ZCUs) have emerged, capable of simultaneously managing multiple vehicle functions. Currently, the overall vehicle electrical and electronic architecture includes multiple zone controllers for the powertrain, body, chassis, cockpit, and autonomous driving domains. Because each zone controller integrates multiple functions, it places higher demands on the heat dissipation of the printed circuit boards within it.

[0020] Based on such practical needs, the present invention proposes a novel electronic device with excellent heat dissipation performance. This electronic device can be used as a zone controller for a vehicle, for example. However, the use of this electronic device is obviously not limited to this scenario, and can be applied to any electronic device including a printed circuit board.

[0021] Figure 1 、 Figure 2 and Figure 3 The electronic device 100 according to an exemplary embodiment of the present invention is shown in the form of a perspective view, a cross-sectional view, and an exploded view, respectively.

[0022] Electronic device 100 includes a housing 1 and a printed circuit board 2 housed within the housing 1. The printed circuit board 2 includes at least one electronic component (not shown). During operation, these electronic components, particularly power components, generate heat, forming heating elements. If this heat cannot be dissipated promptly, the performance of the printed circuit board 2 may be degraded or even damaged, thereby affecting the efficiency and lifespan of the entire electronic device 100.

[0023] To this end, the electronic device 100 also includes a heat sink 3 made of metal for excellent heat dissipation. For example, the heat sink 3 can be made of a copper alloy or aluminum alloy, both of which have excellent thermal conductivity. The heat sink 3 is integrally formed with the housing 1 and directly secured to the printed circuit board 2. In the present invention, by directly securing the heat sink 3 to the printed circuit board 2, heat dissipation is improved while eliminating the need for heat dissipation adhesive and fixing screws, thereby reducing production costs and improving efficiency.

[0024] like Figure 2 and Figure 3 As shown, the heat sink 3 includes a main body 31 and a plurality of pins 32 extending from the main body 31. Accordingly, the printed circuit board 2 includes a plurality of sockets 22 (such as Figure 3 As shown in FIG2 , each pin 32 is inserted into a corresponding socket 22 to fix the heat sink 3 directly to the printed circuit board 2. Here, each pin 32 is press-fitted into the corresponding socket 22. This allows a fixed connection between the heat sink 3 and the printed circuit board 2 to be achieved in a simple manner.

[0025] It should be understood that instead of the press-fit fixation between the pin 32 and the socket 22, any known suitable fixing method can also be envisioned, such as fixing the heat sink 3 to the printed circuit board 2 by riveting or form fit between the two.

[0026] In a preferred embodiment, the housing 1 is made of plastic, such as PBT+GF30 or PA66 industrial plastics commonly used in the art. The housing 1 is integrally formed with the heat sink 3 by injection molding. During manufacturing, the heat sink 3 is first positioned in a mold, then molten plastic is injected into the mold. Once the plastic cools, the integrated housing 1-heat sink 3 assembly is obtained. Finally, the pins 32 of the heat sink 3 are inserted into corresponding sockets 22 of the printed circuit board 2, securing the housing 1-heat sink 3 assembly to the printed circuit board 2. Compared to housings and heat sinks made entirely of metal, the technical solution of the present invention offers lower production costs. Compared to housings and heat sinks made entirely of plastic, the technical solution of the present invention offers better heat dissipation performance. Of course, it should be understood that the housing 1 can also be made of metal, and the heat sink 3 can be welded to the housing 1 or integrally formed with the housing 1 by casting. Such metal housing solutions have higher production costs than plastic housing solutions, but offer better heat dissipation performance.

[0027] like Figure 2 and Figure 3 As shown, the housing 1 is provided with a groove 10 extending toward the printed circuit board 2, and the heat sink 3 is embedded in the groove 10. Figure 3 As shown, recess 10 includes sidewalls 11 and a bottom 12. Heat sink 3 is embedded in these sidewalls 11 and bottom 12 and secured to printed circuit board 2 through bottom 12. Securement of heat sink 3 within recess 10 facilitates rapid dissipation of heat from printed circuit board 2 to the surrounding environment. Preferably, the thickness of bottom 12 of recess 10 is the same as that of housing 1. This ensures substantially consistent housing strength.

[0028] Preferably, the heat sink 3 is arranged close to the heat generating components of the printed circuit board 2, thereby allowing direct heat conduction from the vicinity of the heat source, thereby improving the heat dissipation performance.

[0029] like Figures 1 to 3 As shown, the heat sink 3 is in the form of a rectangular sheet. However, it should be understood that the heat sink 3 can have any suitable shape, such as a corrugated sheet.

[0030] As an example, Figure 1 The electronic device 100 is shown to include five groups of heat sinks, each group of heat sinks includes three heat sinks 3, wherein four groups of heat sinks are arranged horizontally along the housing 1 and near the corners of the housing 1, and another group of heat sinks are arranged longitudinally along the housing 1 and located in the center of the housing 1. However, it should be understood that the number of groups of heat sinks, the number of heat sinks in each group of heat sinks, and the arrangement direction and position of the heat sinks are all exemplary. Depending on the number, heat generation, arrangement direction and position of the heating elements, more or fewer groups of heat sinks can be provided, the number of heat sinks in each group of heat sinks can also be more or less, and the arrangement direction and position of the heat sinks can adapt to the arrangement direction and position of the heating elements. Advantageously, each group of heat sinks is arranged near a corresponding heating element of the printed circuit board.

[0031] In a specific embodiment, the plurality of heat sinks in each group of heat sinks are arranged parallel to each other and spaced apart from each other to achieve a good heat dissipation effect.

[0032] The present invention further provides a vehicle, which includes at least one electronic device 100 as described above. The electronic device 100 is, for example, a zone controller.

[0033] Although the present invention is disclosed above with reference to preferred embodiments, the present invention is not limited thereto. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. An electronic device, comprising a housing (1) and a printed circuit board (2) housed in the housing (1), characterized in that: The electronic device (100) further comprises a heat sink (3) made of metal, the heat sink (3) being integrally formed with the housing (1) and directly fixed to the printed circuit board (2), the housing (1) being provided with a groove (10) extending toward the printed circuit board (2), the heat sink (3) being embedded in the groove (10).

2. The electronic device according to claim 1, wherein: The heat sink (3) comprises a main body (31) and a plurality of pins (32) extending from the main body (31); the printed circuit board (2) comprises a plurality of sockets (22); each of the pins (32) is inserted into a corresponding socket (22) so as to directly fix the heat sink (3) to the printed circuit board (2).

3. The electronic device according to claim 2, wherein: Each of the pins (32) is press-fitted into the corresponding socket (22).

4. The electronic device according to any one of claims 1 to 3, characterized in that The housing (1) is made of plastic and is formed into one piece with the heat sink (3) by injection molding.

5. The electronic device according to any one of claims 1 to 3, characterized in that: The thickness of the bottom (12) of the groove (10) is the same as the thickness of the housing (1).

6. The electronic device according to any one of claims 1 to 3, characterized in that: The heat sink (3) is arranged close to the heating element of the printed circuit board (2).

7. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device (100) comprises a plurality of groups of heat sinks (3), each group of heat sinks (3) comprises a plurality of heat sinks (3), and the plurality of heat sinks (3) are arranged to be spaced apart from each other.

8. The electronic device according to claim 7, wherein: Each group of heat sinks (3) is arranged close to a corresponding heating element of the printed circuit board (2).

9. A vehicle, characterized in that: The vehicle comprises an electronic device (100) according to any one of claims 1 to 8.

Images