Micro-LED display chip packaging structure and display terminal

Abstract

The embodiment of the utility model discloses a Micro-LED display chip packaging structure and a display terminal.The Micro-LED display chip packaging structure comprises a substrate assembly, a Micro-LED display chip, a connector and a functional device, the substrate assembly comprises a first surface and a second surface, and therefore when the Micro-LED display chip and the connector are packaged through the substrate assembly, the first surface and the second surface are opposite to each other, and the first surface and the second surface are opposite to each other. The functional device is arranged on the first surface, and the connector is arranged on the second surface, so that the functional device and the connector can be arranged in a split mode and can be arranged on the front face and the back face of the substrate assembly respectively, the size of the Micro-LED display chip packaging structure can be reduced, especially the length of the substrate assembly is reduced, and the packaging efficiency of the Micro-LED display chip is improved. Therefore, the size of the Micro-LED display chip packaging structure is smaller, Micro LED display can have more use scenes, and the Micro-LED display chip packaging structure can be conveniently arranged in a terminal product.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of display chip technology, and in particular to a Micro-LED display chip packaging structure and a display terminal. Background Art

[0002] MicroLED display technology boasts high resolution, low power consumption, high brightness, high contrast, high color saturation, fast response time, thin thickness, and long lifespan, making it a promising candidate for the next generation of display technology. Traditionally, micro-LED display chip packaging involves a substrate consisting of two reinforcing steel plates. One plate is attached to the chip and then electrically connected to an FPC through wire bonding or other processes. The FPC has a reinforcing steel plate attached to the bottom, and electronic components and connectors are placed on top. This packaging method results in a larger product, limiting its use cases and making it particularly inconvenient for assembly into miniaturized display terminals. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art or related technologies.

[0004] To this end, a first aspect of the present invention provides a Micro-LED display chip packaging structure.

[0005] A second aspect of the present invention provides a display terminal.

[0006] In view of this, according to a first aspect of an embodiment of the present application, a Micro-LED display chip packaging structure is proposed, including:

[0007] a substrate assembly comprising a first surface and a second surface;

[0008] A Micro-LED display chip, wherein the Micro-LED display chip is arranged at one end of the substrate assembly;

[0009] A functional device and a connector, wherein the functional device is arranged on the first surface of the substrate assembly, and the connector is arranged on the second surface.

[0010] In a feasible embodiment, the substrate assembly includes a flexible circuit board and a rigid circuit board, and the flexible circuit board is connected to the rigid circuit board.

[0011] In a feasible embodiment, the Micro-LED display chip is connected to the flexible circuit board, the connector is connected to the rigid circuit board, and the functional device is connected to the rigid circuit board.

[0012] In a feasible implementation manner, the Micro-LED display chip packaging structure further includes: the Micro-LED display chip is arranged on the first surface of the substrate assembly or the second surface of the substrate assembly.

[0013] In a feasible implementation manner, the connector is a MIPI interface or a QSPI interface.

[0014] In a feasible implementation manner, the functional device includes:

[0015] One or more of driver devices, power management devices, and power control devices.

[0016] In a feasible embodiment, the micro-LED display chip packaging structure further includes: gold wires, wherein the gold wires electrically connect the micro-LED display chip to the substrate assembly;

[0017] A protective layer covers the gold wire.

[0018] In a feasible embodiment, the Micro-LED display chip packaging structure further includes: a reinforcement plate, which is arranged on the substrate assembly, and the Micro-LED display chip is arranged in the area of ​​the substrate assembly corresponding to the reinforcement plate, and the two are respectively located on two different surfaces of the substrate assembly.

[0019] In a feasible embodiment, the Micro-LED display chip packaging structure further includes:

[0020] A protective cover is connected to the substrate assembly and covers the functional device.

[0021] According to a second aspect of an embodiment of the present application, a display terminal is provided, including:

[0022] The Micro-LED display chip packaging structure as described in any of the above technical solutions;

[0023] A host module is connected to the connector.

[0024] Compared with the prior art, the present invention has at least the following beneficial effects:

[0025] The Micro-LED display chip packaging structure provided in the embodiment of the present application includes a substrate assembly, a Micro-LED display chip and a connector. The substrate assembly includes a first surface and a second surface. Based on this, when the Micro-LED display chip and the connector are packaged through the substrate assembly, the functional device is set on the first surface and the connector is set on the second surface, so that the functional device and the connector can be set separately. The functional device and the connector can be set on the front and back of the substrate assembly respectively, which can reduce the volume of the Micro-LED display chip packaging structure, especially reduce the length of the substrate assembly, so that the Micro-LED display chip packaging structure is smaller in size, enabling the MicroLED display to have more usage scenarios and facilitating the setting of the Micro-LED display chip packaging structure in the terminal product. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0027] Figure 1 A schematic structural diagram of the first surface of a Micro-LED display chip package structure according to an embodiment of the present application;

[0028] Figure 2 A schematic structural diagram of the second surface of a Micro-LED display chip package structure according to an embodiment of the present application;

[0029] Figure 3 A schematic structural diagram of the second surface of a Micro-LED display chip package structure according to another embodiment of the present application;

[0030] Figure 4 This is a schematic structural block diagram of a display terminal according to an embodiment of the present application.

[0031] in, Figures 1 to 4 The corresponding relationship between the reference numerals and component names is as follows:

[0032] 1000 Micro-LED display chip packaging structure, 2000 display terminal, 2100 host module;

[0033] 110 substrate assembly, 120 Micro-LED display chip, 130 connector, 140 functional device, 150 gold wire, 160 reinforcement plate, 170 protective cover;

[0034] 111 first surface, 112 second surface, 113 flexible circuit board, 114 rigid circuit board. DETAILED DESCRIPTION

[0035] In order to better understand the above technical solution, the technical solution of the embodiment of the present application is described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiment of the present application and the specific features in the embodiment are detailed descriptions of the technical solution of the embodiment of the present application, rather than limitations on the technical solution of the present application. In the absence of conflict, the embodiment of the present application and the technical features in the embodiment can be combined with each other.

[0036] Modern society has entered the information age and is developing towards intelligence. Display is a key link in achieving information exchange and intelligence.

[0037] In recent years, MicroLED, with its low power consumption, fast response, long lifespan, and high light efficiency, has been considered the "ultimate display technology" poised to revolutionize the industry after LCD and OLED. It is also the mainstream trend and development direction of future display technology, prompting major technology giants to increase their investment. While attention in this field continues to grow, it is undeniable that as a relatively new technology, MicroLED still faces numerous challenges and bottlenecks in achieving high brightness, high resolution, and single-chip full-color.

[0038] Among the many display technologies currently available, Micro-LED display technology is considered a disruptive next-generation display technology and has received widespread attention. Micro-LED display technology is a self-luminous display technology that integrates arrayed micron-sized LED units (also known as LED units) on an actively addressed drive panel to achieve individual control and lighting to output display images.

[0039] Micro-LED display has many advantages such as self-luminescence, high efficiency, low power consumption, high integration, and high stability. It is also small in size, highly flexible, and easy to disassemble and merge. It can be applied to any existing display application from small to large size.

[0040] MicroLEDs, also known as microscopic light-emitting diodes, are typically several hundred microns in size. The emergence of MicroLED microdisplay technology has enabled miniaturization and higher resolution in display devices such as augmented reality (AR), virtual reality (VR), near-eye displays (NED), and heads-up displays (HUD). In these applications, MicroLEDs typically measure 0.110 microns.

[0041] The packaging method used in traditional technology causes the packaging structure of Micro-LED display chips to be too large, which restricts the use scenarios of Micro-LED display chips.

[0042] In view of this, if Figure 1 and Figure 2 As shown, according to the first aspect of an embodiment of the present application, a Micro-LED display chip packaging structure 1000 is proposed, including: a substrate assembly 110, the substrate assembly 110 includes a first surface 111 and a second surface 112; a Micro-LED display chip 120, the Micro-LED display chip 120 is arranged at one end of the substrate assembly 110; a functional device 140 and a connector 130, the functional device 140 is arranged on the first surface of the substrate assembly 110, and the connector 130 is arranged on the second surface 112.

[0043] The micro-LED display chip package structure 1000 provided in the embodiment of the present application includes a substrate assembly 110, a micro-LED display chip 120, a connector 130 and a functional device 140. The substrate assembly 110 includes a first surface 111 and a second surface 112. Based on this, when the micro-LED display chip 120 and the connector 130 are packaged through the substrate assembly 110, the micro-LED display chip 120 is arranged at the end of the substrate assembly 110, the functional device 140 is arranged on the first surface 111, and the connector 130 is arranged on the second surface 112, so that the functional device 140 and the connector 130 can be arranged separately. The functional device 140 and the connector 130 can be respectively arranged on the front and back sides of the substrate assembly 110, which can reduce the volume of the micro-LED display chip package structure 1000, especially reduce the length of the substrate assembly 110, so that the micro-LED display chip package structure 1000 is smaller in size, enabling the micro-LED display to have more usage scenarios and facilitating the installation of the micro-LED display chip package structure 1000 in terminal products. At the same time, the Micro-LED display chip 120 is arranged at the end of the substrate assembly 110, which can enable the Micro-LED display chip 120 to better display images and make the Micro-LED display chip packaging structure more beautiful.

[0044] It can be understood that the Micro-LED display chip 120 is disposed at one end of the substrate assembly 110 , which means that the Micro-LED display chip 120 is disposed on the substrate assembly 110 and is located at one end of the substrate assembly 110 .

[0045] It can be understood that the first surface 111 and the second surface 112 are two different surfaces, which may be the front and back surfaces of the substrate assembly 110 .

[0046] It can be understood that the micro-LED display chip package structure 1000 provided in the embodiments of the present application can reduce the volume of the micro-LED display chip package structure 1000. From a product cost perspective, the reduced size of the micro-LED display chip package structure 1000 can reduce costs. From a packaging cost perspective, the miniaturized package structure can optimize the packaging process, reduce the use of packaging materials, and reduce losses and waste during the packaging process, thereby reducing packaging costs. From a product performance perspective, the present application flexibly arranges the positions of the functional device 140 and the connector 130 without changing the structure and performance of the micro-LED display chip 120 itself, thereby ensuring the display effect. From a heat dissipation perspective, as the micro-LED display chip package structure 1000 is miniaturized, the micro-LED display chip package structure 1000 will have better heat dissipation and correspondingly reduce thermal resistance, which is conducive to rapid heat dissipation. From a stability perspective, the miniaturization of the micro-LED display chip package structure 1000 helps reduce the impact of the external environment on the micro-LED display chip 120, thereby improving the stability and reliability of the micro-LED display chip 120.

[0047] It is understandable that, considering the usage scenario, the miniaturization of the Micro-LED display chip package structure 1000 makes micro-pitch display possible, which can provide a new solution for the high-end display market. For wearable devices, the miniaturized Micro-LED display chip package structure 1000 is very suitable for wearable devices such as smart watches and smart glasses, providing these devices with a lighter, thinner and more efficient display solution. For in-vehicle display products, with the development of autonomous driving technology, in-vehicle displays have increasingly higher requirements for high brightness, high resolution and high reliability. The miniaturized packaging structure of the Micro-LED display chip package structure 1000 can meet these needs.

[0048] It is understandable that the connector 130 of the Micro-LED display chip package structure 1000 provided in the embodiment of the present application is used to connect to a host of other devices when in use, so that the Micro-LED display chip 120 can display.

[0049] like Figure 1 and Figure 2As shown, in a feasible embodiment, the substrate assembly 110 includes a flexible circuit board 113 and a rigid circuit board 114, and the flexible circuit board 113 is connected to the rigid circuit board 114; wherein, the Micro-LED display chip 120 is connected to the flexible circuit board 113, the connector 130 is connected to the rigid circuit board 114, and the functional device 140 is connected to the rigid circuit board 114.

[0050] In this technical solution, the structural composition of the substrate assembly 110 is further provided. The substrate assembly 110 may include a flexible circuit board 113 and a rigid circuit board 114. The substrate assembly 110 adopts a combination of soft and rigid boards. The setting of the flexible circuit board 113 enables the Micro-LED display chip packaging structure 1000 to have a certain degree of bendability, which can enable the Micro-LED display chip packaging structure 1000 to have more usage scenarios.

[0051] In this technical solution, the setting of the rigid circuit board 114 provides an installation position for the connector 130 and the functional device 140. The rigid circuit board 114 can provide stable support for the connector 130 and the functional device 140, and has stronger mechanical strength, which facilitates the connection of the connector 130 with the host of other terminal devices, making the Micro-LED display chip packaging structure 1000 more reliable.

[0052] It can be understood that the Micro-LED display chip 120 is disposed at one end of the substrate assembly 110 , which means that the Micro-LED display chip 120 is disposed on the flexible circuit board 113 and is located at one end of the substrate assembly 110 .

[0053] In some instances, the flexible circuit board 113 may be a flexible printed circuit (FPC). By selecting a flexible printed circuit, parts of the substrate assembly 110 can be bent and folded freely, and can even be stretched and moved arbitrarily in three-dimensional space. This allows it to be flexibly designed according to the internal spatial layout of the product, realizing the integration of component assembly and wiring, and greatly improving the degree of freedom of design. Flexible printed circuit boards are generally thinner and lighter in weight, which enables them to greatly save space in electronic products and help further achieve miniaturization and lightweighting of products. Furthermore, from a reliability perspective, the flexible printed circuit board uses integrally connected wires with highly consistent parameters, which reduces errors during wire assembly and thus reduces the incidence of failures. Its planar wiring method also reduces switch interconnections, facilitates circuit design, improves the reliability of the entire system, and facilitates the stable operation of the Micro-LED display chip 120.

[0054] In some examples, the rigid circuit board 114 may include a printed circuit board (PCB). This PCB configuration allows for high density, high reliability, and design flexibility, enabling the integration of more electronic components and circuits within a limited space. This ensures long-term stable operation and meets the demands of various complex environments. Custom designs can be tailored to meet diverse circuit requirements, satisfying various electrical, physical, and chemical performance requirements. This ensures efficient signal transmission within the Micro-LED display chip package structure 1000.

[0055] like Figure 1 and Figure 2 As shown, in a feasible embodiment, the Micro-LED display chip 120 is arranged on the first surface 111 of the substrate assembly 110 or the second surface 112 of the substrate assembly 110. Based on this, the position of the Micro-LED display chip 120 can be flexibly set, making the layout of the Micro-LED display chip packaging structure more convenient.

[0056] In one feasible embodiment, the connector 130 includes a MIPI interface or a QSPI interface. Based on this, the rotation of the MIPI interface has the characteristics of high-speed transmission, low power consumption, flexibility and scalability, which can further expand the application scenarios of the Micro-LED display chip packaging structure. The selection of the QSPI interface can achieve high-speed data transmission through parallel transmission and high clock frequency, and can have efficient data processing capabilities, which can further expand the application scenarios of the Micro-LED display chip packaging structure.

[0057] In a feasible implementation, the functional device 140 includes one or more of a driver device, a power management device, and a power control device.

[0058] In this technical solution, a style of a functional device 140 is further provided. The functional device 140 may include a driving device, which is used to drive the Micro-LED display chip 120 to adjust the operating state of the Micro-LED display chip 120; through the setting of the power management device, it is convenient to control the power-on of the Micro-LED display chip 120, and thus the display effect of the Micro-LED display chip 120 can be adjusted; through the setting of the power control device, the operating frequency of the Micro-LED display chip 120 can be adjusted, and thus the display effect can be adjusted.

[0059] like Figure 1 and Figure 2As shown, in a feasible implementation, the Micro-LED display chip package structure 1000 further includes: a bonding wire 150 (bonding wire), and the bonding wire 150 connects the Micro-LED display chip 120 to the substrate assembly 110 .

[0060] In this technical solution, the Micro-LED display chip packaging structure 1000 also includes gold wires 150, which are connected to the Micro-LED display chip 120 and the substrate assembly 110. Then, the connection between the Micro-LED display chip and the functional device 140 or connector can be achieved through the circuit inside the substrate assembly 110, thereby facilitating communication and control of the Micro-LED display chip.

[0061] In a feasible implementation, the Micro-LED display chip package structure 1000 further includes: a protective layer, which covers the connection between the gold wires 150 .

[0062] In this technical solution, the Micro-LED display chip package structure 1000 further includes a protective layer, which can protect the connection of the gold wire 150 and reduce the probability of the gold wire 150 becoming loose. It is understood that the protective layer can be made of colloid.

[0063] In a feasible embodiment, the Micro-LED display chip packaging structure 1000 further includes: a reinforcement plate 160, which is disposed on the flexible circuit board 113 of the substrate assembly 110; wherein the Micro-LED display chip 120 is arranged in an area opposite to the flexible circuit board 113 of the substrate assembly 110 and the reinforcement plate 160, and the two are respectively located on two different surfaces of the substrate assembly 110.

[0064] In this technical solution, the Micro-LED display chip packaging structure 1000 may further include: a reinforcing plate 160, which is arranged on the flexible circuit board 113 of the substrate assembly 110 through the reinforcing plate 160, and then the Micro-LED display chip 120 is arranged in the area opposite to the substrate assembly 110 and the reinforcing plate 160. The reinforcing plate 160 can support the Micro-LED display chip 120, making the fixation of the Micro-LED display chip 120 more reliable.

[0065] In some examples, reinforcement plate 160 may be made of steel.

[0066] like Figure 3 As shown, in a feasible implementation manner, the Micro-LED display chip package structure 1000 further includes: a protective cover 170 , which is connected to the substrate assembly 110 and covers the functional device 140 .

[0067] In this technical solution, the Micro-LED display chip packaging structure 1000 may also include a protective cover 170 that can cover the functional device 140, thereby protecting the functional device 140, reducing the probability of collision between other objects and the functional device 140, and reducing the effect of dust intrusion into the functional device 140.

[0068] The Micro-LED display chip package structure 1000 provided in the embodiment of the present application can be manufactured by the following process:

[0069] Step 101: Design the size of the substrate assembly 110 according to the requirements of the display terminal 2000, and connect the flexible circuit board 113 of the substrate assembly 110 to the rigid circuit board 114;

[0070] Step 102: Install a reinforcement plate 160 on the flexible circuit board 113;

[0071] Step 103: Arrange functional components 140 and connectors 130 on the first surface 111 and the second surface 112 of the rigid circuit board 114;

[0072] Step 104: attaching the Micro-LED display chip 120 to the flexible circuit board 113 through a bonding process;

[0073] Step 105: Wire bonding and protective glue are applied to enable the Micro-LED display chip 120 to transmit signals and conduct electrical connections.

[0074] Based on this, in the Micro-LED display chip packaging structure 1000 prepared by the above method, the Micro-LED display chip 120 is arranged at the end of the substrate assembly 110, the functional device 140 is arranged on the first surface 111, and the connector 130 is arranged on the second surface 112, so that the MicroLED functional device 140 and the connector 130 can be arranged separately, and the functional device 140 and the connector 130 can be respectively arranged on the front and back of the substrate assembly 110, which can reduce the volume of the Micro-LED display chip packaging structure 1000, especially reduce the length of the substrate assembly 110, so that the Micro-LED display chip packaging structure 1000 is smaller in size, enabling the MicroLED display to have more usage scenarios, and facilitating the setting of the Micro-LED display chip packaging structure 1000 in the terminal product.

[0075] The Micro-LED display chip package structure 1000 may include multiple functional devices 140, with at least some of the multiple functional devices 140 being disposed on the first surface 111. This allows full utilization of the remaining area of ​​the substrate assembly 110, making the layout of the Micro-LED display chip 120, the functional device 140, and the connector 130 more rational, further reducing the volume of the Micro-LED display chip package structure 1000. Furthermore, considering the usage scenario, the miniaturization of the Micro-LED display chip package structure 1000 enables micro-pitch display, providing a new solution for the high-end display market. For wearable devices, the miniaturized Micro-LED display chip package structure 1000 is very suitable for use in wearable devices such as smart watches and smart glasses, providing these devices with a lighter, thinner, and more efficient display solution. For in-vehicle display products, with the development of autonomous driving technology, the requirements for high brightness, high resolution, and high reliability for in-vehicle displays are becoming increasingly stringent. The miniaturized packaging structure of the Micro-LED display chip package structure 1000 can meet these requirements.

[0076] like Figure 4 As shown, according to the second aspect of the embodiment of the present application, a display terminal 2000 is proposed, including: a Micro-LED display chip packaging structure 1000 as any of the above technical solutions; a host module 2100, and the host module 2100 is connected to the connector 130.

[0077] The display terminal 2000 provided in the embodiment of the present application includes the Micro-LED display chip packaging structure 1000 of any of the above technical solutions, so the display terminal 2000 has all the beneficial effects of the Micro-LED display chip packaging structure 1000 of the above technical solutions.

[0078] The display terminal 2000 provided in the embodiment of the present application includes a Micro-LED display chip package structure 1000 and a host module 2100. The host module 2100 is connected to the connector 130 of the Micro-LED display chip package structure 1000. The host module 2100 is used to output signals to the Micro-LED display chip package structure 1000, and the Micro-LED display chip 120 of the Micro-LED display chip package structure 1000 can be displayed. The Micro-LED display chip package structure 1000 includes a substrate assembly 110, a Micro-LED display chip 120 and a connector 130. The substrate assembly 110 includes a first surface 111 and a second surface 112. Based on this, when the Micro-LED display chip 120 is connected to the substrate assembly 110, the substrate assembly 110 is connected to the connector 130. When the D display chip 120 and the connector 130 are packaged, the Micro-LED display chip 120 is disposed at the end of the substrate assembly 110, the functional device 140 is disposed on the first surface 111 of the substrate assembly 110, and the connector 130 is disposed on the second surface 112. This allows the functional device 140 and the connector 130 to be disposed separately, and the functional device 140 and the connector 130 to be disposed on the front and back sides of the substrate assembly 110, respectively. This can reduce the volume of the Micro-LED display chip package structure 1000, and in particular, reduce the length of the substrate assembly 110, making the Micro-LED display chip package structure 1000 smaller. From the perspective of the display terminal 2000, the reduced size of the Micro-LED display chip package structure 1000 can reduce costs. From the perspective of packaging costs, the miniaturized packaging structure can optimize the packaging process, reduce the use of packaging materials, and reduce loss and waste during the packaging process, thereby reducing packaging costs. From the perspective of product performance, the present application flexibly arranges the positions of the Micro-LED display chip 120, the functional device 140 and the connector 130 without changing the structure and performance of the Micro-LED display chip 120 itself, thus ensuring the display effect. From the perspective of heat dissipation, as the Micro-LED display chip packaging structure 1000 is miniaturized, the Micro-LED display chip packaging structure 1000 will have a better heat dissipation effect, and the thermal resistance will be reduced accordingly, which is conducive to the rapid dissipation of heat. From the perspective of stability, the miniaturization of the Micro-LED display chip packaging structure 1000 helps to reduce the impact of the external environment on the Micro-LED display chip 120, and improve the stability and reliability of the Micro-LED display chip 120.

[0079] It is understandable that, considering the usage scenario, the miniaturization of the Micro-LED display chip package structure 1000 makes micro-pitch display possible, which can provide a new solution for the high-end display market. For wearable devices, the miniaturized Micro-LED display chip package structure 1000 is very suitable for wearable devices such as smart watches and smart glasses, providing these devices with a lighter, thinner and more efficient display solution. For in-vehicle display products, with the development of autonomous driving technology, in-vehicle displays have increasingly higher requirements for high brightness, high resolution and high reliability. The miniaturized packaging structure of the Micro-LED display chip package structure 1000 can meet these needs.

[0080] It can be understood that the display terminal 2000 includes but is not limited to VR glasses, smart glasses, smart handles, etc.

[0081] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless expressly limited otherwise. Terms such as "installed," "connected," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean fixed, removable, or integral; "connected" can mean directly or indirectly through an intermediary. Those skilled in the art will understand the specific meanings of these terms in this utility model based on specific circumstances.

[0082] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0083] Throughout this specification, terms such as "one embodiment," "some embodiments," and "specific embodiments" mean that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0084] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A Micro-LED display chip packaging structure, characterized in that: include: a substrate assembly comprising a first surface and a second surface; A Micro-LED display chip, wherein the Micro-LED display chip is arranged at one end of the substrate assembly; A functional device and a connector, wherein the functional device is arranged on the first surface of the substrate assembly, and the connector is arranged on the second surface.

2. The Micro-LED display chip packaging structure according to claim 1, wherein: The substrate assembly includes a flexible circuit board and a rigid circuit board, and the flexible circuit board is connected to the rigid circuit board.

3. The Micro-LED display chip packaging structure according to claim 2, wherein: The Micro-LED display chip is connected to the flexible circuit board, the connector is connected to the rigid circuit board, and the functional device is connected to the rigid circuit board.

4. The Micro-LED display chip packaging structure according to claim 3, wherein: Also includes: The Micro-LED display chip is disposed on the first surface of the substrate assembly or the second surface of the substrate assembly.

5. The Micro-LED display chip packaging structure according to claim 1, wherein: The connector includes a MIPI interface or a QSPI interface.

6. The Micro-LED display chip packaging structure according to claim 1, wherein: The functional device includes: One or more of driver devices, power management devices, and power control devices.

7. The Micro-LED display chip packaging structure according to claim 1, wherein: Also includes: Gold wires are used to electrically connect the Micro-LED display chip to the substrate assembly; A protective layer covers the gold wire.

8. The Micro-LED display chip packaging structure according to claim 1, wherein: Also includes: A reinforcement plate is provided on the substrate assembly, and the Micro-LED display chip is arranged in the area of ​​the substrate assembly corresponding to the reinforcement plate, and the two are respectively located on two different surfaces of the substrate assembly.

9. The Micro-LED display chip packaging structure according to claim 1, wherein: Also includes: A protective cover is connected to the substrate assembly and covers the functional device.

10. A display terminal, characterized in that: include: The Micro-LED display chip packaging structure according to any one of claims 1 to 9; A host module is connected to the connector.

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