Mounting structure for electronic component and electronic device

Abstract

The utility model discloses a mounting structure for an electronic component and an electronic device. The mounting structure comprises a first connecting bar, a second connecting bar and a third connecting bar. The first connecting bar is provided with a first terminal and a second terminal. The first connecting bar is provided with a first terminal and a second terminal, the second connecting bar is provided with a third terminal and a fourth terminal, an accommodating space is defined after the second connecting bar and the first connecting bar are installed, and the first terminal and the third terminal are arranged along a first direction and are used for external electric connection; the containing space is arranged to allow the multiple electronic components to be contained in the containing space in the length direction parallel to the first direction, and the first electrode and the second electrode of each electronic component are electrically connected with the second terminal and the fourth terminal respectively. By adopting the mounting structure, the configuration number of electronic components can be effectively increased, the current direction can be guided, and the current density and the hot-spot temperature can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic components, and more specifically, to a mounting structure for electronic components and an electronic device. Background Art

[0002] Many electronic components are used in various electronic devices, electromechanical equipment, etc. For example, in some cases, a mounting structure can be used to arrange several electronic components of the same or different types together to achieve the required functions and facilitate practical applications. Figure 1 and Figure 2 1 shows the general structure of an existing mounting structure product for electronic components. With the help of this mounting structure, several electronic components 1 can be arranged together, and then they can be configured and used as an integral unit in an electronic device or electromechanical equipment. Utility Model Content

[0003] In view of this, the present application provides a mounting structure for electronic components and an electronic device, which can solve or at least alleviate one or more of the problems existing in the prior art and other problems, or can provide an alternative technical solution for the prior art.

[0004] According to one aspect of the present application, a mounting structure for electronic components is first provided, comprising:

[0005] a first connecting row having a first terminal and a second terminal; and

[0006] A second connecting row has a third terminal and a fourth terminal. The second connecting row and the first connecting row define a storage space after being installed, wherein the first terminal and the third terminal are arranged along a first direction for external electrical connection, and the storage space is configured to allow multiple electronic components to be arranged in the storage space along a length direction parallel to the first direction, and the first electrode and the second electrode of each electronic component are electrically connected to the second terminal and the fourth terminal respectively.

[0007] In the mounting structure for electronic components according to the present application, optionally, the first connecting row and / or the second connecting row has a current guiding portion, and the current guiding portion is configured to guide the current flowing in after the first terminal and the third terminal are electrically connected to the outside toward the electronic components arranged in the accommodating space.

[0008] In the mounting structure for electronic components according to the present application, optionally, the current guiding portion includes one or more cutouts provided near the second terminal and / or the fourth terminal.

[0009] In the mounting structure for electronic components according to the present application, optionally, the incision is configured to guide current from the electronic component centered in the accommodating space to the electronic components located on both sides thereof, and / or the incision is constructed so that its length direction is perpendicular to the first direction.

[0010] In the mounting structure for electronic components according to the present application, optionally, at least one side of the accommodation space is configured to have an open structure.

[0011] In the mounting structure for electronic components according to the present application, optionally, the accommodating space includes a first accommodating space and a second accommodating space, the first terminal and the third terminal are located between the first accommodating space and the second accommodating space, and the first accommodating space and / or the second accommodating space are configured to accommodate at least two of the electronic components.

[0012] In the mounting structure for electronic components according to the present application, optionally, the first accommodation space and the second accommodation space are arranged to form a symmetrical arrangement with respect to the first terminal and the third terminal.

[0013] In the mounting structure for electronic components according to the present application, optionally, the first connecting bar and / or the second connecting bar include copper bars, and / or the first connecting bar and / or the second connecting bar are made by a stamping or casting process, and / or the electronic component includes a capacitor core, and the capacitor core includes a DC-LINK capacitor core.

[0014] In addition, according to another aspect of the present application, an electronic device is further provided, comprising:

[0015] One or more mounting structures for electronic components as described in any one of the above; and

[0016] A plurality of electronic components are arranged in the accommodation space of the mounting structure along a length direction parallel to the first direction of the mounting structure, and the first electrode and the second electrode of each electronic component are electrically connected to the second terminal and the fourth terminal respectively.

[0017] In the electronic device for electronic components according to the present application, optionally, the electronic device includes a power converter.

[0018] The mounting structure of the present application is easy to manufacture and use, can effectively increase the number of electronic components that can be accommodated, and is particularly suitable for arranging a large number of electronic components in a centralized location. Furthermore, through structural optimization, the mounting structure can effectively guide the flow of current, making the overall current distribution more uniform. This can effectively reduce the current density of electronic components and promote the reduction of hot spot temperatures, thereby improving operating performance and extending service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural diagram of an existing electronic component installation structure product.

[0020] Figure 2 yes Figure 1 Another three-dimensional structural schematic diagram of the installation structure product shown.

[0021] Figure 3 The figure is a schematic three-dimensional structure diagram of an embodiment of a mounting structure for electronic components according to the present application.

[0022] Figure 4 yes Figure 3 Another three-dimensional structural schematic diagram of the installation structure embodiment is shown. DETAILED DESCRIPTION

[0023] It should be noted that the following examples illustrate the mounting structure for electronic components and the structural configuration, features, and advantages of electronic devices according to the present application. However, all descriptions should not be used to limit the present application in any way. In this document, the technical terms "first," "second," "third," and "fourth" are used only for distinguishing purposes and are not intended to indicate their order or relative importance. To simplify the drawings, identical or similar components and features may be labeled in only one or more places in the same drawing.

[0024] exist Figure 3 and Figure 4 The basic configuration of an embodiment of a mounting structure for electronic components according to the present application is shown in FIG. In this example, the mounting structure 10 can be used to mount and arrange multiple electronic components 20, for example, Figure 3 The example specifically shows that a total of 6 electronic components can be configured. It should be noted that the specific types and installation quantities of these electronic components can be flexibly configured and adjusted according to actual application requirements.

[0025] like Figure 3 and Figure 4As shown, the mounting structure 10 may include a first connecting bar 11 and a second connecting bar 12, which may be made of suitable materials (e.g., copper, iron, metal alloys, etc.) as needed and may be manufactured using any one or more suitable processes such as stamping, casting, machining, etc. In specific applications, the first connecting bar 11 and the second connecting bar 12 may be the same or different in terms of material selection and manufacturing process. For example, in some applications, they may both be made of copper, which has excellent properties in terms of electrical conductivity, mechanical properties, and corrosion resistance, and are therefore often referred to as copper bars or copper wiring bars.

[0026] The first connection row 11 may have a first terminal 111 and a second terminal 112. The specific configuration, arrangement position, and configuration quantity of these terminals may be designed according to application requirements. The above situation also applies to the third terminal 121 and the fourth terminal 122 on the second connection row 12. When the mounting structure 10 is used, the first terminal 111 of the first connection row 11 and the third terminal 121 of the second connection row 12 may be used for external electrical connection. Figure 3 and Figure 4 It is shown in an exemplary manner that the above terminals 111 and 121 can be arranged along the direction Y shown in the figure.

[0027] The first connection row 11 and the second connection row 12 can be constructed as needed and together define a receiving space 13 after assembly. Electronic components 20 of suitable types and quantities required for actual applications can be centrally arranged in the above-mentioned receiving space 13. The two electrodes (i.e., positive and negative poles) of these electronic components 20 can be electrically connected to the second terminal 112 and the fourth terminal 122 respectively, so as to provide electrical energy to the electronic components 20. For example, in one or more embodiments, the electronic components 20 can all be configured as capacitor cores, such as DC-LINK capacitor cores. By centrally arranging these individual capacitor cores through the mounting structure 10, a unitized module can be formed externally, thereby facilitating various possible applications, such as being configured in some electronic devices and electromechanical equipment to meet application requirements for providing larger capacitance, more stable working performance, etc.

[0028] Continue to refer Figure 3 and Figure 4 In the mounting structure 10, a receiving space 13 is defined by the first connecting row 11 and the second connecting row 12. The receiving space 13 can be configured to allow electronic components 20 to be arranged therein along their respective length directions X, and the above-mentioned length direction X is parallel to the aforementioned direction Y.

[0029] The above structure and arrangement are completely different from the existing product design of electronic component installation structure. Figure 1 and Figure 2 The figure shows these installed electronic components 1, which are perpendicular to the arrangement direction Y of the external electrical connection terminals in their respective length directions X. However, this existing arrangement structure fails to fully utilize the overall structural space, especially the space in the length direction X, which makes it difficult to add more electronic components and increase the capacity. This can easily cause problems such as high high-frequency ripple current density and high hot spot temperature inside the electronic components (such as capacitor cores) in actual applications.

[0030] Comparison reference Figure 1 and Figure 3 Etc., when using the same size configuration and electronic components, such as Figure 1 The existing product structure shown can accommodate a total of 4 electronic components, while the solution of this application is as follows Figure 3 The mounting structure shown can accommodate a total of six electronic components, significantly increasing the mounting capacity by 50%. This significant increase in the number of electronic components accommodated can lead to beneficial technical benefits such as reduced current density and lower hotspot temperatures.

[0031] In addition, those skilled in the art should understand that, under the same circumstances where the same number of electronic components need to be configured, the installation structure of the present application can achieve a smaller and more compact size, occupy less space, and save more material costs.

[0032] As an optional configuration, one or more sides of the accommodating space 13 can be set to an open structure to facilitate operations such as installation or removal of electronic components, while also promoting heat dissipation, which is very beneficial when the configured electronic components have relatively large power.

[0033] In addition, regarding the structural layout of the accommodation space 13, it can be arranged as a whole, or it can be constructed into two, three or more relatively independent components as needed. Figure 3 and Figure 4 The embodiment of the present invention illustrates that the receiving space 13 can be configured to include two spaced-apart portions, namely, a first receiving space 131 and a second receiving space 132. The first terminal 111 and the third terminal 121 can be positioned between the two receiving spaces to provide current and other operations to the electronic components 20 mounted in the two receiving spaces. Alternatively, the first receiving space 131 (or the second receiving space 132) can be designed to accommodate two or more electronic components simultaneously, thereby enhancing the overall electronic component accommodation capacity of the mounting structure and increasing the possibility of flexible layout.

[0034] It should be pointed out that although the above examples show that the first accommodating space 131 and the second accommodating space 132 are arranged symmetrically relative to the first terminal 111 and the third terminal 121, in one or more other embodiments, such relatively independent components contained in the accommodating space 13 can be arranged asymmetrically, and each of them can be designed to accommodate the same or different numbers of electronic components, and these electronic components can be configured to have the same or different types, such as different product models.

[0035] In one or more embodiments, a current guiding portion 14 can be optionally provided in the mounting structure 10 to guide the current direction inside the mounting structure 10 of the current flowing in after the first terminal 111 and the third terminal 121 are electrically connected to the outside, so that the current flows in in the desired direction to each electronic component 20 installed in the accommodating space 13, thereby achieving good effects such as reducing current density and reducing hot spot temperature.

[0036] For example, the current guiding portion 14 can be provided on the first connecting row 11 and / or the second connecting row 12, for example, near the second terminal 112 and / or the fourth terminal 122. The current guiding portion 14 can adopt any feasible structure such as a cutout to change the current flow. Such a structure can be provided in one or more as needed and can be provided in any shape and size required by the application. For example, the length direction of the cutout can be perpendicular to the direction Y. Figure 3 and Figure 4 A schematic illustration has been given in .

[0037] Alternatively, the current can be directed by means of the current guiding portion 14 to first flow into the electronic component centered within the accommodation space 13, and then to the other electronic components distributed on either side thereof. This creates a more uniform current distribution overall, thereby reducing the hotspot temperature. A measured result shows that, compared to the prior art, the above approach can reduce the current density from 1.5 to 1 (a 33% reduction) and the hotspot temperature from 124°C to 115°C (a 23% reduction). This technical effect is quite significant, and is therefore very beneficial for ensuring and improving the performance of electronic components and extending their service life.

[0038] In addition, the present application also provides an electronic device that can be configured to use one or more mounting structures for electronic devices designed according to the present application according to specific application needs, and the required corresponding electronic components are arranged in the mounting structure, which has been described in detail above. It should be noted that the electronic device according to the present application has a wide range and can include but is not limited to power converters, etc. The electronic device according to the present application can be applied to many possible types of electromechanical equipment, such as vehicles, unmanned aerial vehicles, power tools, household appliances, etc.

[0039] The above description is merely an example of a detailed description of the electronic component mounting structure and electronic device according to the present application. These examples are intended only to illustrate the principles and implementation methods of the present application and are not intended to limit the present application. Persons skilled in the art may make various modifications and improvements without departing from the scope of the present application. Therefore, all equivalent technical solutions are intended to fall within the scope of the present application and are defined by the claims of the present application.

Claims

1. A mounting structure (10) for an electronic component (20), characterized in that: include: A first connecting row (11) having a first terminal (111) and a second terminal (112); as well as A second connection row (12) has a third terminal (121) and a fourth terminal (122); the second connection row (12) and the first connection row (11) are mounted to define an accommodation space (13); the first terminal (111) and the third terminal (121) are arranged along a first direction (Y) for external electrical connection; the accommodation space (13) is configured to allow a plurality of electronic components (20) to be arranged in the accommodation space (13) along a length direction (X) parallel to the first direction (Y); and the first electrode and the second electrode of each electronic component (20) are electrically connected to the second terminal (112) and the fourth terminal (122), respectively.

2. The mounting structure (10) for electronic components (20) according to claim 1, wherein: The first connection row (11) and / or the second connection row (12) has a current guiding portion (14), and the current guiding portion (14) is configured to guide the current flowing in after the first terminal (111) and the third terminal (121) are electrically connected to the outside toward the electronic components (20) arranged in the accommodating space (13).

3. The mounting structure (10) for electronic components (20) according to claim 2, wherein: The current guiding portion (14) includes one or more cutouts arranged adjacent to the second terminal (112) and / or the fourth terminal (122).

4. The mounting structure (10) for electronic components (20) according to claim 3, wherein: The cutout is configured to guide current from the electronic component (20) centered in the accommodation space (13) to the electronic components (20) located on both sides thereof, and / or the cutout is configured such that its length direction (X) is perpendicular to the first direction (Y).

5. The mounting structure (10) for electronic components (20) according to claim 1, wherein: At least one side portion of the accommodating space (13) is configured to have an open structure.

6. The mounting structure (10) for electronic components (20) according to claim 1, wherein: The accommodating space (13) comprises a first accommodating space (131) and a second accommodating space (132); the first terminal (111) and the third terminal (121) are located between the first accommodating space (131) and the second accommodating space (132); and the first accommodating space (131) and / or the second accommodating space (132) are configured to accommodate at least two electronic components (20).

7. The mounting structure (10) for electronic components (20) according to claim 6, wherein: The first accommodating space (131) and the second accommodating space (132) are arranged to form a symmetrical arrangement relative to the first terminal (111) and the third terminal (121).

8. The mounting structure (10) for electronic components (20) according to any one of claims 1 to 7, wherein: The first connecting bar (11) and / or the second connecting bar (12) comprise copper bars, and / or the first connecting bar (11) and / or the second connecting bar (12) are made by a stamping or casting process, and / or the electronic component (20) comprises a capacitor core, and the capacitor core comprises a DC-LINK capacitor core.

9. An electronic device, characterized in that: The electronic device comprises: One or more mounting structures (10) for electronic components (20) according to any one of claims 1 to 8; and A plurality of electronic components (20) are each arranged in a receiving space (13) of the mounting structure (10) along a length direction (X) parallel to the first direction (Y) in the mounting structure (10), and a first electrode and a second electrode of each electronic component (20) are electrically connected to the second terminal (112) and the fourth terminal (122), respectively.

10. The electronic device according to claim 9, wherein: The electronic device includes a power converter.

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