Buffer type continuous stamping die

Through the design of a buffered continuous stamping die and the coordination of guide rods, buffer springs and connecting rods, the problem of insufficient buffering performance of the stamping die is solved, and the protection of the stamping parts and the improvement of the durability of the die are achieved.

CN223312861UActive Publication Date: 2025-09-09JIANGSU MEIFEISHI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202422622887.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-30
Publication Date
2025-09-09
Estimated Expiration
2034-10-30

AI Technical Summary

Technical Problem

Existing stamping dies have poor cushioning performance during the stamping process, resulting in excessive extrusion of the stamped parts and damage to the dies, affecting service life and product quality.

Method used

The buffer type continuous stamping die structure is adopted. Through the cooperation of the guide rod, buffer spring, shaft rod, intermediate spring and connecting rod, the buffer effect of the upper and lower dies is achieved, and the downward force and speed of the moving seat are reduced.

Benefits of technology

Effectively reduce the scrap rate of stamping parts, protect the integrity of the mold, and improve processing efficiency and product quality.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223312861U_ABST
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Abstract

The utility model discloses a buffering type continuous stamping die which comprises a top seat, a bottom seat, a movable seat, a guide rod and a stamping air cylinder, and an upper die and a lower die which can be correspondingly matched up and down are arranged at the bottom end of the movable seat and the top end of the bottom seat respectively. The lower portions of the guide rods are sleeved with buffer springs, the buffer springs are located between the movable base and the base, a shaft rod is arranged between the two guide rods located on the same side, two symmetrical movable sleeve bases are arranged in the middle of the shaft rod, the shaft rod is further sleeved with a middle spring, and the two ends of the middle spring are each connected with one movable sleeve base. A connecting rod is hinged to the top of the movable sleeve seat, and the other end of the connecting rod is hinged to one side of the bottom end of the movable seat. According to the stamping die, a certain buffering effect can be achieved when the upper die and the lower die are stamped, the situation that a to-be-stamped part is excessively extruded due to the fact that the downward pressing force of the movable base is too large or the downward pressing speed is too high is avoided, the rejection rate of the to-be-stamped part in the stamping process is effectively reduced, and meanwhile the integrity of the die is protected to a certain degree.
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Description

Technical Field

[0001] The utility model relates to the technical field of stamping dies, in particular to a buffer-type continuous stamping die. Background Art

[0002] A stamping die is a special process equipment used to process materials (metal or non-metal) into parts (or semi-finished products) during cold stamping. It is called a cold stamping die (commonly known as a cold stamping die). Stamping is a pressure processing method that uses a die installed on a press to apply pressure to the material at room temperature to cause it to separate or plastically deform, thereby obtaining the desired parts.

[0003] The prior art patent number CN218873475U, a Chinese utility model patent, discloses a stamping mechanism for a stamping die, comprising an upper die base and a lower die base. The lower die is fixed to the upper end surface of the lower die base, and a cylinder is fixed to the top of the upper die base. The cylinder drives the upper die base downward toward the lower die base to complete the stamping work. The mechanism can be used for stamping various shapes. However, when the upper die base contacts the lower die base for downward stamping, it generates large stress and impact, resulting in poor cushioning performance and inability to effectively cushion the lower die base. This not only causes excessive extrusion of the stamped parts, but also damages the die over time, affecting the service life of the stamping die and, in turn, the quality of the stamped products. Utility Model Content

[0004] In view of this, the purpose of the present invention is to provide a buffer-type continuous stamping die with a simple structure, easy use and good buffering effect.

[0005] To achieve the above purpose, the present invention adopts the following contents:

[0006] A buffer-type continuous stamping die comprises a top seat and a base arranged in parallel in an upper and lower direction, wherein the top seat and the base are fixedly connected by four sets of vertical guide rods, a movable seat is further provided between the top seat and the base, and the movable seat is movably sleeved on the four sets of guide rods via shaft sleeves, a stamping cylinder is vertically provided on the top of the top seat, and the output end of the stamping cylinder is downwardly connected to the movable seat, and the bottom end of the movable seat and the top end of the base are respectively provided with an upper die and a lower die that can correspond and match with each other up and down;

[0007] Among them, a buffer spring is sleeved on the lower part of the guide rod, and the buffer spring is located between the movable seat and the base. An axle rod is arranged between the two guide rods on the same side, and two symmetrical movable sleeves are arranged in the middle of the axle rod. An intermediate spring is also sleeved on the axle rod, and the two ends of the intermediate spring are respectively connected to a movable sleeve, and the top of the movable sleeve is hingedly connected to a connecting rod, and the other end of the connecting rod is hingedly connected to one side of the bottom end of the movable seat.

[0008] To further illustrate, a support is provided at the bottom end of the guide rod, and a hinged seat is provided in the middle of the guide rod. The support is fixed to the base, and the hinged seat is fixed to the movable seat. The upper and lower ends of the buffer spring are respectively connected to the hinged seat and the support. Ensure that the buffer spring is tightly installed to prevent the end position of the buffer spring from shifting during use, and ensure that the top end of the buffer spring can withstand the pressure of the movable seat.

[0009] Furthermore, the upper end of the connecting rod is hingedly connected to the hinged base, and the left and right connecting rods are axially symmetrical with each other. This ensures that the left and right connecting rods can rotate synchronously during the downward pressing process of the movable base, which can alleviate the pressure exerted by the movable base on the lower mold base to a certain extent.

[0010] Further, the lower die has a stamping area on its surface, and a material guide chute extending outward is provided on one side of the lower die, obliquely downward. The upper end of the material guide chute is connected to one side of the stamping area on the lower die surface. The material guide chute facilitates and quickly discharges materials, improving processing efficiency.

[0011] Further explanation: support pads are respectively provided at the four corners of the bottom end of the base. These four sets of support pads are used to further improve the cushioning and shock absorption performance of the mold.

[0012] Furthermore, a waste drop hole extending vertically through the center of the base is provided, and a waste chute plate extending outward is provided at an angle on one side of the base's bottom end, located below the waste drop hole. The waste chute plate facilitates the rapid discharge of waste generated during the stamping process, preventing waste from accumulating on the lower die base and affecting stamping.

[0013] The beneficial effects of the present invention are as follows: through the buffer spring arranged on the guide rod, and the cooperation of the arranged shaft rod, intermediate spring and connecting rod, a certain buffer effect is achieved when the upper die and the lower die are stamped, thereby avoiding excessive pressure under the moving seat or excessive pressing speed causing excessive squeezing of the stamped parts, effectively reducing the scrap rate of the stamped parts during the stamping process, and at the same time protecting the integrity of the mold to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The specific implementation of the present invention will be further described in detail below with reference to the accompanying drawings.

[0015] Figure 1 This is a schematic structural diagram of a buffer-type continuous stamping die according to an embodiment of the present utility model;

[0016] Figure 2 This is a cross-sectional view of the base and the lower mold portion of an embodiment of the present utility model;

[0017] In the figures, the reference numerals are:

[0018] 1-top seat, 2-base, 3-guide rod, 4-movable seat, 5-stamping cylinder, 6-upper die, 7-lower die, 8-material guide trough plate, 9-waste trough plate, 21-support pad, 22-waste drop hole, 31-buffer spring, 32-shaft rod, 33-movable sleeve, 34-middle spring, 35-connecting rod, 36-support, 37-hinge seat, 41-sleeve, 71-stamping area. DETAILED DESCRIPTION

[0019] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments. Those skilled in the art should understand that the following specific description is illustrative rather than restrictive and should not limit the scope of protection of the present invention.

[0020] See also Figure 1 and Figure 2 As shown, in this embodiment, a buffer-type continuous stamping die includes a top seat 1 and a base 2 which are arranged in parallel up and down. The top seat 1 and the base 2 are fixedly connected by four groups of vertical guide rods 3. A movable seat 4 is also provided between the top seat 1 and the base 2. The movable seat 4 can be movably mounted on the four groups of guide rods 3 up and down through a shaft sleeve 41. A stamping cylinder 5 is vertically provided on the top of the top seat 1, and the output end of the stamping cylinder 5 is downwardly connected to the movable seat 4. The bottom end of the movable seat 4 and the top end of the base 2 are respectively provided with an upper die 6 and a lower die 7 which can correspond to each other up and down. In this way, the movable seat 4 is pressed down by the stamping cylinder 5, so that the upper die 6 and the lower die 7 are closed up and down to realize the stamping work of the stamped parts.

[0021] Among them, the lower part of the guide rod 3 is sleeved with a buffer spring 31, the buffer spring 31 is located between the movable seat 4 and the base 2, and a shaft rod 32 is provided between the two guide rods 3 on the same side. The middle part of the shaft rod 32 is provided with two symmetrical movable sleeves 33, and the shaft rod 32 is also sleeved with an intermediate spring 34. The two ends of the intermediate spring 34 are respectively connected to a movable sleeve 33, and the top of the movable sleeve 33 is hingedly connected to a connecting rod 35, and the other end of the connecting rod 35 is hingedly connected to one side of the bottom end of the movable seat 4.

[0022] In this way, when the moving seat 4 moves downwardly and approaches the base 2, the buffer spring 31 between the moving seat 4 and the base 2 can effectively buffer the downward pressure of the moving seat 4. At the same time, during the movement of the moving seat 4, it will force the connecting rod 35 to rotate, and force the two movable sleeves 33 on the shaft 32 to move closer to each other toward the middle through the connecting rod 35, and the middle spring 34 can buffer the extrusion force between the two movable sleeves 33. In this way, together with the buffer spring 31, the pressure and downward speed of the moving seat 4 during the downward movement process are relieved, thereby achieving a good buffering effect.

[0023] Furthermore, a support 36 is provided at the bottom end of the guide rod 3, and a hinged seat 37 is provided in the middle of the guide rod 3. The support 36 is fixed to the base 2, and the hinged seat 37 is fixed to the movable seat 4. The upper and lower ends of the buffer spring 31 are respectively connected to the hinged seat 37 and the support 36. The support and the hinged seat ensure that the buffer spring is tightly installed, preventing the end position of the buffer spring from changing during use, and ensuring that the top end of the buffer spring can withstand the pressure of the movable seat.

[0024] The upper end of the connecting rod 35 is hingedly connected to the hinge seat 37, and the left and right connecting rods 35 are axially symmetrical to each other. This ensures that the left and right connecting rods can rotate synchronously during the downward pressing process of the moving seat, which can alleviate the pressure caused by the moving seat on the lower die seat to a certain extent.

[0025] Furthermore, the surface of the lower die 7 has a stamping area 71, and a material guide chute plate 8 extending outward is provided on one side of the lower die 7 at an angle downward, with the upper end of the material guide chute plate 8 connected to one side of the stamping area 71 on the surface of the lower die 7. The material guide chute plate facilitates rapid material discharge from one side of the lower die, thereby improving processing efficiency.

[0026] Furthermore, support pads 21 are respectively provided at the four corners of the bottom end of the base 2. These four groups of support pads are used to further improve the cushioning and shock absorption performance of the mold.

[0027] The base 2 is provided with a waste drop hole 22 extending vertically therethrough in the middle thereof, which corresponds to the lower die 7. A waste chute plate 9 extending outward is provided at an angle on one side of the bottom end of the base 2, and is located below the waste drop hole 22. The waste chute plate facilitates the rapid discharge of waste generated during the stamping process, preventing waste from accumulating on the lower die base and affecting stamping.

[0028] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A buffer type continuous stamping die, characterized in that: The invention comprises a top seat (1) and a base (2) which are arranged in parallel in an upper and lower direction. The top seat (1) and the base (2) are fixedly connected by four groups of vertical guide rods (3). A movable seat (4) is further arranged between the top seat (1) and the base (2). The movable seat (4) is movably sleeved on the four groups of guide rods (3) via a shaft sleeve (41). A punching cylinder (5) is vertically arranged on the top of the top seat (1). The output end of the punching cylinder (5) is downwardly connected to the movable seat (4). The bottom end of the movable seat (4) and the top end of the base (2) are respectively provided with an upper die (6) and a lower die (7) which can correspond to each other up and down. The lower part of the guide rod (3) is provided with a buffer spring (31), the buffer spring (31) is located between the movable seat (4) and the base (2), and an axle rod (32) is provided between the two guide rods (3) on the same side. Two symmetrical movable sleeves (33) are provided in the middle of the axle rod (32), and an intermediate spring (34) is also provided on the axle rod (32). The two ends of the intermediate spring (34) are respectively connected to a movable sleeve (33), and the top of the movable sleeve (33) is hingedly connected to a connecting rod (35), and the other end of the connecting rod (35) is hingedly connected to one side of the bottom end of the movable seat (4).

2. A buffer type continuous stamping die according to claim 1, characterized in that: A support (36) is provided at the bottom end of the guide rod (3), a hinge seat (37) is provided on the middle movable sleeve of the guide rod (3), the support (36) is fixed on the base (2), the hinge seat (37) is fixed on the movable seat (4), and the upper and lower head ends of the buffer spring (31) are respectively connected to the hinge seat (37) and the support (36).

3. A buffer type continuous stamping die according to claim 2, characterized in that: The upper end of the connecting rod (35) is hingedly connected to the hinge seat (37), and the left and right connecting rods (35) are axially symmetrical structures.

4. A buffer type continuous stamping die according to claim 1, characterized in that: The surface of the lower die (7) has a stamping area (71), and a material guide trough plate (8) extending outward is provided on one side of the lower die (7) obliquely downward, and the upper end of the material guide trough plate (8) is connected to one side of the stamping area (71) on the surface of the lower die (7).

5. The buffer type continuous stamping die according to claim 1, characterized in that: Support pads (21) are respectively provided at the four corners of the bottom end of the base (2).

6. The buffer type continuous stamping die according to claim 5, characterized in that: A waste drop hole (22) is provided in the middle of the base (2) and extends vertically therethrough. A waste trough plate (9) is provided at an angle on one side of the bottom end of the base (2) and extends outward. The waste trough plate (9) is located below the waste drop hole (22).

Citation Information

Patent Citations

  • Stamping mechanism of stamping die

    CN218873475U