Air inlet device for semiconductor equipment and semiconductor equipment

Abstract

The utility model relates to an air inlet device for semiconductor equipment and the semiconductor equipment, which comprises a lower flow uniformizing plate, an upper flow uniformizing plate and a lower flow uniformizing plate, the upper flow uniformizing plate is arranged above the lower flow uniformizing plate, and the periphery of the upper flow uniformizing plate is connected with the flange of the lower flow uniformizing plate; wherein at least two wedge-shaped grooves are formed in the lower surface of the periphery of the upper flow uniformizing plate, and the different wedge-shaped grooves are evenly distributed in the periphery of the upper flow uniformizing plate; the operating part comprises a main body, a holding part and a shovel part, the shovel part is arranged at one end of the main body, the holding part is arranged at the other end of the main body, and the shovel part has a shape matched with that of the wedge-shaped groove. According to the air inlet device disclosed by the utility model, the air inlet device can be conveniently disassembled after a long-time process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to the technical field of air intake devices for semiconductor equipment. Background Art

[0002] In semiconductor equipment, the air intake device is generally designed as a structure combining upper and lower parts due to functional requirements. The upper and lower parts of the air intake device are both made of smooth materials. In order to ensure a firm connection between the two, they need to be fixed with screws. In addition, in order to ensure airtightness between the upper and lower parts, a sealing ring needs to be used to seal between the two. After being sealed for a long time, the sealing ring is squeezed and deformed by the upper and lower parts of the air intake device for a long time, and adheres to the surface of the smooth material due to long-term compression contact. Therefore, after the screws are released, the air intake device will still be tightly combined with the sealing ring, making it difficult to separate.

[0003] In the prior art, the solution is to knock and continuously vibrate to remove the adhesion, but this is time-consuming and labor-intensive, and the effect is not good. Utility Model Content

[0004] The purpose of the utility model is to provide a device which can conveniently disassemble the upper and lower structures of an air intake device.

[0005] In order to achieve the above-mentioned object, the present invention provides an air intake device for semiconductor equipment, comprising:

[0006] A lower flow equalizer plate, wherein flanges are provided around the lower flow equalizer plate;

[0007] An upper flow equalizer plate, the upper flow equalizer plate being arranged above the lower flow equalizer plate, and the four sides of the upper flow equalizer plate are connected to the flange of the lower flow equalizer plate; wherein at least two wedge-shaped grooves are provided on the lower surface of the four sides of the upper flow equalizer plate, and the different wedge-shaped grooves are evenly distributed around the four sides of the upper flow equalizer plate;

[0008] The operating part includes a main body, a gripping part and a shovel part. The shovel part is arranged at one end of the main body, the gripping part is arranged at the other end of the main body, and the shovel part has a shape matching the wedge-shaped groove.

[0009] Optionally, the lower surface of the operating portion is a plane.

[0010] Optionally, the upper surface of the shovel portion is an inclined surface, and the thickness of the shovel portion gradually increases from the shovel portion toward the grip portion.

[0011] Optionally, a protrusion is provided on the upper surface of the gripping portion.

[0012] Optionally, a sealing ring is provided between the lower flow equalizer plate and the upper flow equalizer plate.

[0013] Optionally, the width of the main body is smaller than the width of the shovel portion.

[0014] Optionally, the number of the wedge-shaped grooves is 3.

[0015] The utility model also provides a semiconductor device, comprising:

[0016] cavity;

[0017] a base, the base being disposed in the cavity;

[0018] As for the above-mentioned air intake device, the air intake device is arranged above the cavity.

[0019] Optionally, the semiconductor device is a thin film deposition device or an etching device.

[0020] Compared with the prior art, the utility model has the following advantages:

[0021] The air intake device of the present invention is provided with a wedge-shaped groove and an operating part, and the operating part can conveniently penetrate into the wedge-shaped groove to separate the upper and lower flow equalizer plates of the air intake device, thereby preventing adhesion between the sealing ring and the upper and lower flow equalizer plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the semiconductor device provided by the present utility model;

[0023] Figure 2 A schematic diagram of the air intake device provided by the present utility model;

[0024] Figure 3 A top view of the operating portion provided by the utility model;

[0025] Figure 4 This is a side view of the operating part provided by the utility model. DETAILED DESCRIPTION

[0026] The following is a further detailed description of a semiconductor device and a valve for a semiconductor device proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the implementation conditions of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed by the present invention without affecting the efficacy and purpose that can be achieved by the present invention.

[0027] Figure 1 A schematic diagram of a semiconductor device of the present invention is shown. Figure 1 As shown, the semiconductor device 100 includes: a chamber 101, a susceptor 103, an air inlet device, and an air inlet nozzle 105. The susceptor 103 is disposed in the chamber 101 for supporting wafers to be processed. The air inlet device is disposed above the chamber 101. The air inlet nozzle 105 is disposed above the air inlet device for supplying process gas into the chamber. The semiconductor device can be, for example, a thin film deposition device or an etching device. The thin film deposition device can be, for example, one of epitaxy, CVD, and PVD.

[0028] like Figure 1-2 As shown, the air intake device includes: an upper flow equalizer plate 201 and a lower flow equalizer plate 202, and a flange 205 is set around the lower flow equalizer plate 202; the upper flow equalizer plate 201 is arranged above the lower flow equalizer plate, and the upper flow equalizer plate is connected to the flange of the lower flow equalizer plate on all sides; wherein, at least two wedge-shaped grooves 207 are set on the lower surface of the upper flow equalizer plate, and the different wedge-shaped grooves 207 are evenly distributed around the upper flow equalizer plate; air flow holes are set in the middle of the upper flow equalizer plate 201 and the lower flow equalizer plate 202 for uniformly flowing the process gas entering the cavity.

[0029] Optionally, a sealing ring 203 is provided between the lower flow equalizer plate and the upper flow equalizer plate. The number of the wedge-shaped grooves is 3.

[0030] like Figure 3-4As shown, the air intake device further includes an operating portion 300, which includes a main body 301, a grip portion 302, and a scoop portion 303. The scoop portion 303 is disposed at one end of the main body, and the grip portion 302 is disposed at the other end of the main body 301. The scoop portion has a shape that matches the wedge-shaped groove. Optionally, the lower surface of the operating portion is flat. The upper surface of the scoop portion is inclined, and the thickness of the scoop portion gradually increases from the scoop portion toward the grip portion.

[0031] Optionally, a protrusion is provided on the upper surface of the gripping portion.

[0032] Optionally, the width of the main body is smaller than the width of the shovel portion.

[0033] When in use, the shovel portion 303 of the operating portion 300 is inserted into the wedge-shaped groove to slowly separate the upper flow plate and the lower flow plate. In some embodiments, one operating portion 300 is inserted into each wedge-shaped groove while applying force.

[0034] The air intake device of the present invention is provided with a wedge-shaped groove and an operating part, and the operating part can conveniently penetrate into the wedge-shaped groove to separate the upper and lower flow equalizer plates of the air intake device, thereby preventing adhesion between the sealing ring and the upper and lower flow equalizer plates.

[0035] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. After reading the above description, various modifications and alternatives to the present invention will be readily apparent to those skilled in the art. Therefore, the scope of protection of the present invention shall be defined by the appended claims.

Claims

1. An air intake device for semiconductor equipment, characterized in that: include: A lower flow equalizer plate, wherein flanges are provided around the lower flow equalizer plate; An upper flow equalizer plate, the upper flow equalizer plate being arranged above the lower flow equalizer plate, and the four sides of the upper flow equalizer plate are connected to the flange of the lower flow equalizer plate; wherein at least two wedge-shaped grooves are provided on the lower surface of the four sides of the upper flow equalizer plate, and the different wedge-shaped grooves are evenly distributed around the four sides of the upper flow equalizer plate; The operating part includes a main body, a gripping part and a shovel part. The shovel part is arranged at one end of the main body, the gripping part is arranged at the other end of the main body, and the shovel part has a shape matching the wedge-shaped groove.

2. The air intake device for semiconductor equipment according to claim 1, wherein The lower surface of the operating portion is a plane.

3. The air intake device for semiconductor equipment according to claim 2, wherein: The upper surface of the shovel portion is an inclined surface, and the thickness of the shovel portion gradually increases from the shovel portion to the grip portion.

4. The air intake device for semiconductor equipment according to claim 2, wherein: A protrusion is provided on the upper surface of the gripping portion.

5. The air intake device for semiconductor equipment according to claim 1, wherein A sealing ring is provided between the lower flow equalizer plate and the upper flow equalizer plate.

6. The air intake device for semiconductor equipment according to claim 1, wherein The width of the main body is smaller than the width of the shovel portion.

7. The air intake device for semiconductor equipment according to claim 1, wherein: The number of the wedge-shaped grooves is 3.

8. A semiconductor device, characterized in that: include: cavity; a base, the base being disposed in the cavity; The air intake device according to any one of claims 1 to 7, wherein the air intake device is arranged above the cavity.

9. The semiconductor device according to claim 8, wherein The semiconductor device is a thin film deposition device or an etching device.

Images