Needle card high-temperature aging test device

Abstract

The utility model relates to the technical field of testing devices, in particular to a high-temperature aging testing device for a probe card, which comprises an upper plate, a circuit board is mounted at the bottom of the upper plate through screws, a probe seat is mounted at the bottom of the circuit board, a testing probe is inlaid on the surface of the probe seat, a lower plate is placed at the bottom of the upper plate, and the lower plate is mounted on the lower plate. The lower plate and the upper plate are mutually inserted and matched, a carrying disc is embedded in the surface of the lower plate, a wafer is placed on the surface of the carrying disc, the wafer is mutually matched with a test probe, a heat dissipation mechanism is arranged on the surfaces of the upper plate and the lower plate, and the heat dissipation mechanism internally comprises a heat dissipation groove, a heat conduction film, a ventilation opening and supporting legs. A positioning mechanism is arranged on the surface of the carrying disc, and a positioning component and a taking and placing opening are arranged in the positioning mechanism. According to the utility model, not only is the heat dissipation effect of the testing device in use improved, but also the convenience degree of positioning and placing the wafer by the testing device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of testing devices, in particular to a pin card high-temperature aging testing device. Background Art

[0002] The way to implement high-temperature aging testing of chips is the probe card. The probe card is the interface between the automatic tester and the device under test. We connect the tester and the chip under test through the probe card. There are tiny metal probes attached to the probe card. By lowering the height of the probe or raising the height of the chip to make it contact with the pads on the chip, the circuit on the card can be connected to the bonding pad of the chip. After that, run the test program to check whether the chip is qualified.

[0003] When the test device is in use, the circuit board will generate heat, but general test devices only dissipate heat through the outer shell, and the heat dissipation effect is poor; when placing the wafer, it is generally positioned by positioning pins, which is cumbersome, thereby reducing the convenience of the test device in positioning the wafer. Utility Model Content

[0004] The purpose of the present invention is to provide a pin card high temperature aging test device to solve the problems of poor heat dissipation effect when the test device is used and low convenience in positioning and placing wafers proposed in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a pin card high-temperature aging test device, comprising an upper plate, a circuit board is installed on the bottom of the upper plate by screws, a probe seat is installed on the bottom of the circuit board, a test probe is inlaid on the surface of the probe seat, the test probe passes through the probe seat and is connected to the circuit board, a lower plate is placed on the bottom of the upper plate, the lower plate and the upper plate are plugged into each other, a carrier is inlaid on the surface of the lower plate, a wafer is placed on the surface of the carrier, the wafer and the test probe cooperate with each other, a heat dissipation mechanism is provided on the surface of the upper plate and the lower plate, the interior of the heat dissipation mechanism includes a heat dissipation groove, a heat-conducting film, a vent and a support foot, a positioning mechanism is provided on the surface of the carrier, and the interior of the positioning mechanism includes a positioning component and a pick-up and drop port.

[0006] Preferably, the surface of the circuit board is coated with a heat-conducting film, and the heat-conducting film is a graphene film, and the surface of the upper plate is provided with heat dissipation grooves.

[0007] Preferably, support legs are fixed at the corner positions of the bottom of the lower plate, and ventilation holes are opened on the surface of the lower plate.

[0008] Preferably, a take-in / out opening is provided on one side of the surface of the carrier, and a positioning component is provided on the surface of the carrier.

[0009] Preferably, a limiting plate, an insert rod and a socket are provided inside the positioning component, and a limiting plate is provided circumferentially on the surface of the carrier. The structure of the limiting plate is an arc structure, and the surface of the limiting plate is tightly fitted with the surface of the wafer and the carrier respectively.

[0010] Preferably, the surface of the carrier plate is provided with equally spaced insertion holes, and an insertion rod is fixed to the bottom of the limiting plate, and the insertion rod and the insertion hole are plugged into each other.

[0011] Compared with the prior art, the beneficial effects of the present invention are: the pin card high temperature aging test device not only improves the heat dissipation effect when the test device is in use, but also improves the convenience of positioning the test device when placing the wafer;

[0012] 1. The heat dissipation mechanism accelerates the heat dissipation of the circuit board through the action of the thermal conductive film and the heat dissipation groove. At the same time, the support feet facilitate air circulation at the bottom of the lower board, making it convenient for the test device to ventilate and dissipate heat from the circuit board through the ventilation holes, thereby achieving efficient heat dissipation function of the test device and improving the heat dissipation effect when the test device is in use.

[0013] 2. By providing a positioning mechanism, the limit plates are placed above the corresponding sockets according to the size of the wafer, and the insertion rods are inserted into the sockets to fix each limit plate. The wafer is then placed on the inside of the carrier so that the wafer contacts the inside of the limit plate and the wafer is quickly positioned. At the same time, the wafer can be quickly taken out under the action of the take-and-place port, so that the test device can easily position and place the wafer, thereby improving the convenience of the test device in positioning and placing the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the three-dimensional appearance structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0016] Figure 3 This is an enlarged structural diagram of the heat dissipation mechanism of the present utility model;

[0017] Figure 4 It is an enlarged structural diagram of the positioning mechanism of the utility model.

[0018] In the figure: 1. Upper plate; 11. Circuit board; 12. Lower plate; 13. Probe holder; 14. Test probe; 15. Carrier; 16. Wafer; 2. Heat dissipation mechanism; 21. Heat dissipation slot; 22. Thermal conductive film; 23. Ventilation hole; 24. Support foot; 3. Positioning mechanism; 31. Positioning component; 311. Limiting plate; 312. Insertion rod; 313. Socket; 32. Access port. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] The structure of a pin card high temperature aging test device provided by the utility model is as follows Figure 1 and Figure 2 As shown, it includes an upper plate 1, a circuit board 11 is installed on the bottom of the upper plate 1 by screws, a probe seat 13 is installed on the bottom of the circuit board 11, and a test probe 14 is inlaid on the surface of the probe seat 13. The test probe 14 passes through the probe seat 13 and is connected to the circuit board 11. A lower plate 12 is placed on the bottom of the upper plate 1, and the lower plate 12 and the upper plate 1 are plugged into each other. A carrier plate 15 is inlaid on the surface of the lower plate 12, and a wafer 16 is placed on the surface of the carrier plate 15. The wafer 16 and the test probe 14 cooperate with each other.

[0021] During use, the upper plate 1 is then placed over the lower plate 12 so that the test probe 14 contacts the wafer 16. The test device is then connected to the test machine so that the test machine performs a high-temperature aging test on the wafer 16 through the test probe 14 to check whether the chip is qualified.

[0022] Furthermore, if Figure 2 and Figure 3 As shown, the surfaces of the upper plate 1 and the lower plate 12 are provided with a heat dissipation mechanism 2, the interior of the heat dissipation mechanism 2 includes a heat dissipation groove 21, a heat-conducting film 22, a vent 23 and a support foot 24, the surface of the circuit board 11 is coated with a heat-conducting film 22, and the heat-conducting film 22 is a graphene film. The surface of the upper plate 1 is provided with a heat dissipation groove 21, the corner positions of the bottom of the lower plate 12 are fixed with support feet 24, and the surface of the lower plate 12 is provided with a vent 23.

[0023] When in use, the heat dissipation of the circuit board 11 can be accelerated under the action of the thermal conductive film 22 and the heat dissipation groove 21. At the same time, the support feet 24 facilitate air circulation at the bottom of the lower plate 12, making it convenient for the test device to ventilate and dissipate heat to the circuit board 11 through the vents 23, so as to realize the efficient heat dissipation function of the test device.

[0024] Furthermore, if Figure 2 and Figure 4As shown, a positioning mechanism 3 is provided on the surface of the carrier 15, and the interior of the positioning mechanism 3 includes a positioning component 31 and a pick-up and release port 32. A pick-up and release port 32 is provided on one side of the surface of the carrier 15, and a positioning component 31 is provided on the surface of the carrier 15. A limiting plate 311, an insertion rod 312 and a socket 313 are provided inside the positioning component 31. The surface of the carrier 15 is provided with a limiting plate 311 along the circumference, and the structure of the limiting plate 311 is an arc structure. The surface of the limiting plate 311 is tightly fitted with the surface of the wafer 16 and the carrier 15 respectively, and the surface of the carrier 15 is provided with sockets 313 with equal intervals. The bottom of the limiting plate 311 is fixed with an insertion rod 312, and the insertion rod 312 and the socket 313 are plugged into each other.

[0025] When in use, the limit plate 311 is placed above the corresponding socket 313 according to the size of the wafer 16, and the insertion rod 312 is inserted into the socket 313 to fix each limit plate 311. Then the wafer 16 is placed on the inner side of the carrier 15, so that the wafer 16 contacts the inside of the limit plate 311, and the wafer 16 is quickly positioned. At the same time, the wafer 16 is quickly taken out under the action of the take-and-place port 32, so that the test device can easily position and place the wafer 16.

[0026] Working principle: When in use, first place the limit plate 311 above the corresponding socket 313 according to the size of the wafer 16, and insert the insertion rod 312 into the socket 313 to fix each limit plate 311, and then place the wafer 16 on the inside of the carrier 15, so that the wafer 16 contacts the inside of the limit plate 311, and quickly position the wafer 16. At the same time, the wafer 16 can be quickly taken out under the action of the take-and-place port 32, so as to realize the function of the test device to easily position and place the wafer 16, thereby improving the convenience of the test device in positioning and placing the wafer 16.

[0027] Then, the upper plate 1 is placed over the lower plate 12 to make the test probe 14 contact the wafer 16. Then, the test device is connected to the test machine, so that the test machine performs a high-temperature aging test on the wafer 16 through the test probe 14 to check whether the chip is qualified.

[0028] During use, the heat dissipation of the circuit board 11 can be accelerated under the action of the thermal conductive film 22 and the heat dissipation groove 21. At the same time, the support feet 24 facilitate air circulation at the bottom of the lower plate 12, making it convenient for the test device to ventilate and dissipate heat to the circuit board 11 through the vents 23, so as to realize the efficient heat dissipation function of the test device, thereby improving the heat dissipation effect of the test device during use, and finally completing the use of the test device.

[0029] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention.

Claims

1. A pin card high temperature aging test device, comprising an upper plate (1), characterized in that: A circuit board (11) is mounted on the bottom of the upper plate (1) by screws, a probe seat (13) is mounted on the bottom of the circuit board (11), a test probe (14) is embedded on the surface of the probe seat (13), and the test probe (14) passes through the probe seat (13) and is connected to the circuit board (11), a lower plate (12) is placed on the bottom of the upper plate (1), the lower plate (12) and the upper plate (1) are plugged into each other, and a carrier (15) is embedded on the surface of the lower plate (12), A wafer (16) is placed on the surface of the carrier (15), and the wafer (16) cooperates with the test probe (14). A heat dissipation mechanism (2) is provided on the surfaces of the upper plate (1) and the lower plate (12), and the interior of the heat dissipation mechanism (2) includes a heat dissipation groove (21), a heat-conducting film (22), a vent (23) and a support leg (24). A positioning mechanism (3) is provided on the surface of the carrier (15), and the interior of the positioning mechanism (3) includes a positioning component (31) and a take-and-put port (32).

2. The pin card high temperature aging test device according to claim 1, characterized in that: The surface of the circuit board (11) is coated with a heat-conducting film (22), and the heat-conducting film (22) is a graphene film. The surface of the upper plate (1) is provided with heat dissipation grooves (21).

3. The pin card high temperature aging test device according to claim 2, characterized in that: Support legs (24) are fixed at the corner positions of the bottom of the lower plate (12), and ventilation holes (23) are opened on the surface of the lower plate (12).

4. The pin card high temperature aging test device according to claim 1, characterized in that: A take-in / out opening (32) is provided on one side of the surface of the carrier plate (15), and a positioning component (31) is provided on the surface of the carrier plate (15).

5. The pin card high temperature aging test device according to claim 4, characterized in that: A limiting plate (311), an inserting rod (312) and a socket (313) are provided inside the positioning component (31); a limiting plate (311) is provided on the surface of the carrier (15) along the circumference; the limiting plate (311) has an arc-shaped structure; and the surfaces of the limiting plate (311) are tightly fitted with the surfaces of the wafer (16) and the carrier (15), respectively.

6. The pin card high temperature aging test device according to claim 5, characterized in that: The surface of the carrier plate (15) is provided with equidistant insertion holes (313), and the bottom of the limiting plate (311) is fixed with an insertion rod (312), and the insertion rod (312) and the insertion hole (313) are plugged into and matched with each other.

Images