Needle card testing device convenient to operate

Abstract

The utility model relates to the technical field of probe card testing devices, in particular to a probe card testing device convenient to operate, which comprises an upper heat dissipation plate, a circuit board is arranged in the upper heat dissipation plate, a probe seat is arranged on the surface of the circuit board, a testing probe is arranged on the surface of the probe seat, a carrying disc is arranged below the testing probe, and the carrying disc is arranged on the surface of the circuit board. A loading disc is arranged on the upper heat dissipation plate, a wafer is placed in the loading disc, buffer mechanisms are arranged at the corner positions of the upper heat dissipation plate and the lower loading plate, each buffer mechanism is composed of a buffer assembly and a guide plate, a taking and placing mechanism is arranged on the surface of the lower loading plate, and a sliding plate, a clamping block, a clamping groove and a containing groove are arranged in the taking and placing mechanism. According to the utility model, the operation convenience of the probe card testing device is improved, and the service life of the testing probe is prolonged when the probe card testing device is used.

Description

Technical Field

[0001] The utility model relates to the technical field of pin card testing devices, in particular to a pin card testing device which is easy to operate. Background Art

[0002] A pin card tester is a tool used to test electronic devices. It is the interface between the automatic tester and the device under test. It usually consists of a card with multiple probes and a circuit board. Each probe can contact the electronic device on the wafer.

[0003] The probe card test device generally places the wafer to be tested inside the carrier first, and then moves the probe card above the wafer. The operation is relatively cumbersome, which affects the convenience of operating the probe card test device. When the needle card test device is used, the probe height is lowered or the chip height is raised to make it contact with the pad on the chip. The probe is easily impacted during adjustment, and the general needle card test device is not easy to buffer, which affects the service life of the probe when the needle card test device is used. Utility Model Content

[0004] The purpose of the present invention is to provide a needle card test device that is easy to operate, so as to solve the problems in the background art mentioned above that the needle card test device is inconvenient to operate and easily affects the service life of the probe when the needle card test device is used.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a needle card testing device that is easy to operate, comprising an upper heat sink, a circuit board is installed inside the upper heat sink, a probe seat is installed on the surface of the circuit board, a test probe is installed on the surface of the probe seat, a carrier is provided below the test probe, a wafer is placed inside the carrier, a buffer mechanism is provided at the corner position of the upper heat sink and the download plate, the buffer mechanism is composed of a buffer assembly and a guide plate, a pick-and-place mechanism is provided on the surface of the download plate, and the interior of the pick-and-place mechanism includes a slide plate, a card block, a card slot and a receiving slot.

[0006] Preferably, guide plates are fixed at the corner positions of the bottom of the upper heat dissipation plate, and buffer components are provided at the corner positions of the download plate.

[0007] Preferably, a sleeve frame, a buffer spring and a buffer plate are provided inside the buffer assembly, and sleeve frames are fixed at the corner positions of the download plate, and the sleeve frames and the guide plates are plugged into each other.

[0008] Preferably, a buffer plate is provided inside the sleeve frame, the buffer plate and the sleeve frame are slidably matched with each other, and the surface of the buffer plate is fixedly connected to the bottom of the guide plate.

[0009] Preferably, a buffer spring is fixed to the bottom of each buffer plate, and one end of the buffer spring is fixedly connected to the inner wall of the sleeve frame.

[0010] Preferably, a receiving groove is provided on the surface of the download plate, and the structure of the receiving groove is a U-shaped structure. A slide plate is fixed to the bottom of the carrier plate, and the slide plate and the receiving groove are slidably matched with each other.

[0011] Preferably, clamping blocks are fixed on both sides of one end of the slide, and clamping slots are provided on both sides of one end of the receiving groove, and the clamping slots and the clamping blocks are engaged with each other.

[0012] Compared with the prior art, the beneficial effects of the present invention are: the easy-to-operate pin card test device not only improves the convenience of operating the pin card test device, but also extends the service life of the test probe when the pin card test device is in use;

[0013] 1. By providing a pick-and-place mechanism, the slide is pulled out under the sliding cooperation between the slide and the receiving slot, and then the wafer to be tested is placed inside the carrier. Then the slide is pushed so that one side of the slide is in close contact with the inner wall of the receiving slot. At this time, the clamping block is locked into the clamping slot, thereby fixing the slide and allowing the slide to deliver the wafer to the bottom of the test probe, so that the needle card test device can easily pick up and place wafers, thereby improving the convenience of operating the needle card test device;

[0014] 2. By providing a buffer mechanism, when the upper heat sink moves downward, the guide plate is driven to move synchronously, so that the guide plate squeezes the buffer plate, and the buffer plate slides downward along the sleeve frame, causing the buffer spring to contract. Under the action of the buffer spring, the upper heat sink can be buffered, thereby buffering the test probe, avoiding the test probe from being damaged due to excessive impact when moving downward, thereby realizing the buffer function of the pin card test device, thereby extending the service life of the test probe when the pin card test device is in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the three-dimensional appearance structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0017] Figure 3 For the utility model Figure 2 Schematic diagram of cross-section structure;

[0018] Figure 4 It is an enlarged structural diagram of the buffer mechanism of the present utility model.

[0019] In the figure: 1. Upper heat sink; 11. Lower plate; 12. Probe holder; 13. Test probe; 14. Wafer; 15. Carrier; 16. Circuit board; 2. Buffer mechanism; 21. Buffer assembly; 211. Frame; 212. Buffer spring; 213. Buffer plate; 22. Guide plate; 3. Pick-and-place mechanism; 31. Slide plate; 32. Card block; 33. Card slot; 34. Receiving slot. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] The utility model provides a needle card testing device that is easy to operate. Figure 1 and Figure 4 As shown, it includes an upper heat sink 1, a circuit board 16 is installed inside the upper heat sink 1, a probe seat 12 is installed on the surface of the circuit board 16, a test probe 13 is installed on the surface of the probe seat 12, a carrier 15 is provided below the test probe 13, a wafer 14 is placed inside the carrier 15, a buffer mechanism 2 is provided at the corner position of the upper heat sink 1 and the download plate 11, the buffer mechanism 2 is composed of a buffer component 21 and a guide plate 22, the corner position of the bottom of the upper heat sink 1 is fixed with a guide plate 22, and the corner position of the download plate 11 is provided with a buffer component Component 21, the interior of the buffer component 21 is provided with a sleeve frame 211, a buffer spring 212 and a buffer plate 213, the corner positions of the download plate 11 are fixed with sleeve frames 211, the sleeve frame 211 and the guide plate 22 are plugged into each other, and the interior of the sleeve frame 211 is provided with a buffer plate 213, the buffer plate 213 and the sleeve frame 211 slide with each other, the surface of the buffer plate 213 is fixedly connected to the bottom of the guide plate 22, and the bottom of the buffer plate 213 is fixed with a buffer spring 212, and one end of the buffer spring 212 is fixedly connected to the inner wall of the sleeve frame 211.

[0022] During use, the upper heat sink 1 drives the guide plate 22 to move synchronously when moving downward, so that the guide plate 22 squeezes the buffer plate 213, and the buffer plate 213 slides downward along the sleeve frame 211, so that the buffer spring 212 contracts. Under the action of the buffer spring 212, the upper heat sink 1 can be buffered, thereby buffering the test probe 13, avoiding damage to the test probe 13 due to excessive impact when moving downward, so as to realize the buffering function of the pin card test device.

[0023] Furthermore, if Figure 2 and Figure 3As shown, a pick-up and placement mechanism 3 is provided on the surface of the download plate 11. The interior of the pick-up and placement mechanism 3 includes a slide plate 31, a card block 32, a card slot 33 and a receiving slot 34. The receiving slot 34 is provided on the surface of the download plate 11. The structure of the receiving slot 34 is a U-shaped structure. The slide plate 31 is fixed to the bottom of the carrier 15. The slide plate 31 and the receiving slot 34 slide with each other. Card blocks 32 are fixed on both sides of one end of the slide plate 31. Card slots 33 are provided on both sides of one end of the receiving slot 34. The card slot 33 and the card block 32 are engaged with each other.

[0024] When in use, pull the slide 31, and pull out the slide 31 under the sliding cooperation between the slide 31 and the receiving groove 34, then place the wafer 14 to be tested into the carrier 15, and then push the slide 31 so that one side of the slide 31 is tightly attached to the inner wall of the receiving groove 34. At this time, the card block 32 is locked into the card slot 33, thereby fixing the slide 31, so that the slide 31 sends the wafer 14 to the bottom of the test probe 13, so as to realize the function of the needle card test device to facilitate the removal and placement of the wafer 14.

[0025] Working principle: When in use, first pull the slide 31, and pull out the slide 31 under the sliding cooperation between the slide 31 and the receiving groove 34, then place the wafer 14 to be tested into the carrier 15, and then push the slide 31 so that one side of the slide 31 is tightly against the inner wall of the receiving groove 34. At this time, the card block 32 is locked into the card slot 33, thereby fixing the slide 31, so that the slide 31 sends the wafer 14 to the bottom of the test probe 13, so as to realize the function of the needle card test device to facilitate the removal and placement of the wafer 14, thereby improving the convenience of the needle card test device during operation.

[0026] Then, the pin card test device is connected to the test machine, and the upper heat sink 1 is driven to move downward by the driving structure, so that the test probe 13 contacts the surface of the wafer 14, and the wafer 14 is tested under the action of the test probe 13. At the same time, when the upper heat sink 1 moves downward, it drives the guide plate 22 to move synchronously, so that the guide plate 22 squeezes the buffer plate 213, and the buffer plate 213 slides downward along the sleeve frame 211, so that the buffer spring 212 contracts. Under the action of the buffer spring 212, the upper heat sink 1 can be buffered, thereby buffering the test probe 13, and avoiding the test probe 13 from being damaged due to excessive impact of downward movement, so as to realize the buffering function of the pin card test device, thereby extending the service life of the test probe 13 when the pin card test device is in use, and finally completing the use of the pin card test device.

[0027] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention.

Claims

1. A needle card testing device that is easy to operate, comprising an upper heat dissipation plate (1), characterized in that: A circuit board (16) is installed inside the upper heat dissipation plate (1), a probe seat (12) is installed on the surface of the circuit board (16), a test probe (13) is installed on the surface of the probe seat (12), a carrier (15) is provided below the test probe (13), a wafer (14) is placed inside the carrier (15), a buffer mechanism (2) is provided at the corner position of the upper heat dissipation plate (1) and the download plate (11), the buffer mechanism (2) is composed of a buffer component (21) and a guide plate (22), a pick-up and placement mechanism (3) is provided on the surface of the download plate (11), and the interior of the pick-up and placement mechanism (3) includes a slide plate (31), a card block (32), a card slot (33) and a receiving slot (34).

2. The easy-to-operate pin card testing device according to claim 1, characterized in that: Guide plates (22) are fixed at the corner positions of the bottom of the upper heat dissipation plate (1), and buffer components (21) are provided at the corner positions of the download plate (11).

3. The easy-to-operate pin card testing device according to claim 2, characterized in that: The buffer assembly (21) is provided with a sleeve frame (211), a buffer spring (212) and a buffer plate (213) inside. The sleeve frame (211) is fixed at the corner position of the download plate (11). The sleeve frame (211) and the guide plate (22) are plugged into each other.

4. The easy-to-operate pin card testing device according to claim 3, characterized in that: A buffer plate (213) is provided inside the sleeve frame (211), the buffer plate (213) and the sleeve frame (211) are slidably matched with each other, and the surface of the buffer plate (213) is fixedly connected to the bottom of the guide plate (22).

5. The easy-to-operate pin card testing device according to claim 4, characterized in that: A buffer spring (212) is fixed to the bottom of each buffer plate (213), and one end of the buffer spring (212) is fixedly connected to the inner wall of the sleeve frame (211).

6. The easy-to-operate pin card testing device according to claim 1, characterized in that: The surface of the download plate (11) is provided with a receiving groove (34), the structure of the receiving groove (34) is a U-shaped structure, and a slide plate (31) is fixed to the bottom of the carrier plate (15), and the slide plate (31) and the receiving groove (34) are slidably matched with each other.

7. The easy-to-operate pin card testing device according to claim 6, characterized in that: Both sides of one end of the slide plate (31) are fixed with a clamping block (32), and both sides of one end of the receiving groove (34) are provided with a clamping groove (33), and the clamping groove (33) and the clamping block (32) are mutually engaged.

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