Degumming and collecting device for monocrystalline silicon wafer

Abstract

The utility model discloses a degumming and gathering device for monocrystalline silicon wafers, which relates to the technical field of monocrystalline silicon wafers and comprises a cleaning box and a box cover, the box cover is mounted at the top of the cleaning box, a controller is mounted on the front side of the cleaning box, a placing frame is arranged in an inner cavity of the cleaning box, and cleaning discs are mounted on the front side and the rear side of the inner cavity of the cleaning box. A water supply pipe is installed on the left side of the cleaning box, a blow-off pipe is installed at the bottom of the left side of the cleaning box, a drying assembly is arranged on the top of the box cover, a limiting assembly is arranged between the containing frame and the cleaning box and between the containing frame and the box cover, and an ultrasonic generator is installed at the bottom of an inner cavity of the cleaning box. Limiting of the placing frame can be relieved after the monocrystalline silicon wafers are dried, the placing frame can be taken out of the cleaning box through the lifting handle, the multiple monocrystalline silicon wafers can be taken conveniently, and time and labor are saved during operation.

Description

Technical Field

[0001] The utility model relates to the technical field of single crystal silicon slices, in particular to a debonding and gathering device for single crystal silicon slices. Background Art

[0002] Single crystal silicon wafers refer to materials formed by silicon atoms arranged in a certain form through a specific process. They are one of the most important materials in the semiconductor industry. In the process of processing single crystal silicon wafers, in order to obtain single crystal silicon wafers with higher cleanliness, they often need to be debonded.

[0003] The prior art patent document with publication number CN220126984U discloses a single crystal silicon wafer degumming pre-cleaning device. The cleaning brush of this utility model can move back and forth on the bottom wall of the inner cavity of the cleaning box, thereby cleaning the silicon mud and silicon powder after cleaning, and preventing the silicon mud and silicon powder from clogging the sewage pipe. However, after the batch cleaning of multiple single crystal silicon wafers is completed in the above-mentioned patent, the staff is usually required to take out the multiple single crystal silicon wafers placed in the cleaning box one by one. The positions of the multiple single crystal silicon wafers in the cleaning box are not fixed, which makes the operation more time-consuming and labor-intensive. Therefore, it is necessary to propose a single crystal silicon wafer degumming and collection device. Utility Model Content

[0004] The purpose of the utility model is to provide a device for debonding and gathering single crystal silicon wafers to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a degumming and gathering device for single crystal silicon wafers, comprising a cleaning box and a box cover, the box cover being installed on the top of the cleaning box, a controller being installed on the front side of the cleaning box, an inner cavity of the cleaning box being provided with a placement frame, and the surface of the placement frame being provided with a mesh structure, cleaning discs being installed on both the front and rear sides of the inner cavity of the cleaning box, a plurality of evenly distributed nozzles being installed on the surface of the cleaning disc, a water supply pipe connected to the cleaning disc being installed on the left side of the cleaning box, a sewage pipe being installed on the bottom left side of the cleaning box, a drying assembly being provided on the top of the box cover, a limiting assembly being provided between the placement frame, the cleaning box and the box cover, and an ultrasonic generator being installed on the bottom inner cavity of the cleaning box.

[0006] Preferably, the drying component includes a hot air blower, which is installed on the top of the box cover. The air outlet of the hot air blower is equipped with an air duct, and the bottom of the air duct passes through the box cover and is equipped with an air outlet hood.

[0007] Preferably, the limit assembly includes two limit plates, which are respectively installed on the left and right sides of the inner cavity of the cleaning box, and the limit plates are abutted against the placement frame. Long screws are threadedly inserted at the four corners of the top of the box cover, and a knob is installed on the top of the long screw. The bottom of the long screw extends into the inner cavity of the cleaning box and abuts against the placement frame.

[0008] Preferably, the top of the box cover is away from the hot air blower and is equipped with a pressure relief valve.

[0009] Preferably, handles are installed on both left and right sides of the top of the placement frame.

[0010] Preferably, a control valve is installed on the sewage pipe.

[0011] Preferably, support legs are installed at the four corners of the bottom of the cleaning box.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. In the present invention, water is supplied to the cleaning tray through a water supply pipe and sprayed toward the placement frame through a nozzle, so that the monocrystalline silicon wafer can be preliminarily cleaned. The ultrasonic wave generated by the ultrasonic generator can further clean the monocrystalline silicon wafer to achieve the purpose of cleaning and degumming.

[0014] 2. The utility model is provided with a drying component. Through the coordinated use of a hot air blower, an air duct and an air outlet hood, the single crystal silicon wafers after cleaning and degumming can be dried. The pressure relief valve can relieve pressure, thereby avoiding excessive air pressure in the cleaning box.

[0015] 3. The present invention is provided with a limiting assembly. By using a limiting plate, a long screw and a knob in conjunction, the limit on the placement frame can be released after the single crystal silicon wafers are dried. The placement frame can be taken out of the cleaning box by the handle so that multiple single crystal silicon wafers can be taken, which is time-saving and labor-saving to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the cleaning box of the utility model;

[0018] Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle.

[0019] In the figure: 1. Cleaning box; 2. Box cover; 3. Controller; 4. Placement frame; 5. Cleaning tray; 6. Water supply pipe; 7. Sewage pipe; 8. Drying component; 81. Hot air blower; 82. Air supply pipe; 83. Air outlet hood; 84. Pressure relief valve; 9. Limiting component; 91. Limiting plate; 92. Long screw; 93. Knob; 10. Ultrasonic generator; 11. Handle; 12. Control valve; 13. Support leg. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Example 1:

[0022] See also Figure 1 and Figure 2 The utility model provides a technical solution: a degumming and collecting device for single crystal silicon wafers, comprising a cleaning box 1 and a box cover 2. Support legs 13 are installed at the four corners of the bottom of the cleaning box 1. The box cover 2 is installed on the top of the cleaning box 1, and a controller 3 is installed on the front side of the cleaning box 1. The inner cavity of the cleaning box 1 is provided with a placing frame 4, which is used to place multiple single crystal silicon wafers to be cleaned. The surface of the placing frame 4 is set to a mesh structure. Cleaning discs 5 are installed on the front and back sides of the inner cavity of the cleaning box 1. A plurality of evenly distributed nozzles are installed on the surface of the cleaning disc 5. A water supply pipe 6 connected to the cleaning disc 5 is installed on the left side of the cleaning box 1. An ultrasonic generator 10 is installed at the bottom of the inner cavity of the cleaning box 1. By connecting the water supply pipe 6 to the external water pipe, the water supply pipe 6 supplies water to the cleaning disc 5 and sprays water to the placing frame 4 through the nozzle, so as to perform preliminary cleaning on the single crystal silicon wafer. The single crystal silicon wafer is further cleaned by starting the ultrasonic wave generated by the ultrasonic generator 10 to achieve the purpose of cleaning and degumming.

[0023] In this embodiment, please refer to Figure 1 and Figure 2 A drain pipe 7 is installed at the bottom left of the cleaning box 1, and a control valve 12 is installed on the drain pipe 7. After the single crystal silicon wafer is cleaned, the control valve 12 is opened to discharge the sewage generated in the cleaning box 1 along the drain pipe 7.

[0024] In this embodiment, please refer to Figure 1 and Figure 2A drying assembly 8 is provided on the top of the box cover 2. The drying assembly 8 includes a hot air blower 81. The hot air blower 81 is installed on the top of the box cover 2. An air duct 82 is installed at the air outlet of the hot air blower 81. The bottom of the air duct 82 passes through the box cover 2 and is installed with an air outlet hood 83. By starting the hot air blower 81, the generated hot air is introduced into the air outlet hood 83 through the air duct 82, and is blown toward the cleaned and debonded single crystal silicon wafers through the air outlet hood 83 to achieve the purpose of drying.

[0025] In this embodiment, please refer to Figure 1 、 Figure 2 and Figure 3 A limit assembly 9 is provided between the placement frame 4 and the cleaning box 1 and the box cover 2. The limit assembly 9 includes two limit plates 91. The two limit plates 91 are respectively installed on the left and right sides of the inner cavity of the cleaning box 1. The limit plates 91 abut against the placement frame 4. A long screw rod 92 is threadedly inserted at the four corners of the top of the box cover 2. A knob 93 is installed on the top of the long screw rod 92. The bottom of the long screw rod 92 extends into the inner cavity of the cleaning box 1 and abuts against the placement frame 4. Handles 11 are installed on the left and right sides of the top of the placement frame 4. After the single crystal silicon wafers are dried, the long screw rod 92 is driven to rotate upward by rotating the knob 93, thereby releasing the limit on the placement frame 4, and the placement frame 4 is separated from the limit plates 91 by the handle 11, and then the placement frame 4 is taken out of the cleaning box 1, so as to take out multiple single crystal silicon wafers, which is time-saving and labor-saving.

[0026] Example 2:

[0027] See also Figure 2 This embodiment is different from the first embodiment in that the top of the box cover 2 is away from the hot air blower 81 and is installed with a pressure relief valve 84, which can relieve pressure and thus avoid excessive air pressure in the cleaning box 1.

[0028] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for debonding and gathering single crystal silicon wafers, characterized by: The invention comprises a cleaning box (1) and a box cover (2), wherein the box cover (2) is installed on the top of the cleaning box (1), a controller (3) is installed on the front side of the cleaning box (1), a placement frame (4) is provided in the inner cavity of the cleaning box (1), and the surface of the placement frame (4) is arranged in a mesh structure, a cleaning disc (5) is installed on both the front and rear sides of the inner cavity of the cleaning box (1), and a plurality of evenly distributed nozzles are installed on the surface of the cleaning disc (5), a water supply pipe (6) connected to the cleaning disc (5) is installed on the left side of the cleaning box (1), a sewage pipe (7) is installed on the bottom of the left side of the cleaning box (1), a drying component (8) is provided on the top of the box cover (2), a limiting component (9) is provided between the placement frame (4), the cleaning box (1) and the box cover (2), and an ultrasonic generator (10) is installed at the bottom of the inner cavity of the cleaning box (1).

2. The device for debonding and gathering single crystal silicon wafers according to claim 1, characterized in that: The drying assembly (8) comprises a hot air blower (81), which is mounted on the top of the box cover (2). An air duct (82) is mounted at the air outlet of the hot air blower (81), and the bottom of the air duct (82) passes through the box cover (2) and is mounted with an air outlet cover (83).

3. The device for debonding and gathering single crystal silicon wafers according to claim 1, wherein: The limiting assembly (9) includes two limiting plates (91), which are respectively installed on the left and right sides of the inner cavity of the cleaning box (1). The limiting plates (91) are in contact with the placement frame (4). Long screw rods (92) are threadedly inserted at the four corners of the top of the box cover (2). A knob (93) is installed on the top of the long screw rod (92). The bottom of the long screw rod (92) extends into the inner cavity of the cleaning box (1) and is in contact with the placement frame (4).

4. The device for debonding and gathering single crystal silicon wafers according to claim 2, wherein: The top of the box cover (2) is away from the hot air blower (81) and is equipped with a pressure relief valve (84).

5. The device for debonding and gathering single crystal silicon wafers according to claim 1, characterized in that: Handles (11) are installed on both the left and right sides of the top of the placement frame (4).

6. The device for debonding and gathering single crystal silicon wafers according to claim 1, characterized in that: A control valve (12) is installed on the sewage pipe (7).

7. The device for debonding and gathering single crystal silicon wafers according to claim 1, characterized in that: Support legs (13) are installed at the four corners of the bottom of the cleaning box (1).

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