Rectifier bridge frame with radiating fins on pins

Abstract

The utility model relates to a rectifier bridge frame with a radiating fin on a pin, which belongs to the field of semiconductor accessories and is characterized in that a shell connecting hole, a grid line and a radiating gap are arranged on a DC (Direct Current) positive electrode frame, the DC positive electrode frame is connected with a DC positive electrode pin, and the DC positive electrode pin is connected with the radiating fin; a shell connecting hole, a grid line and a heat dissipation notch are arranged on the AC null line frame, the AC null line frame is connected with an AC null line pin, and the AC null line pin is connected with a heat dissipation sheet; a shell connecting hole and a grid line are arranged on the AC live wire frame, the AC live wire frame is connected with an AC live wire pin, and the AC live wire pin is connected with a cooling fin; a shell connecting hole, a grid line and a heat dissipation notch are arranged on the DC negative electrode frame, the DC negative electrode frame is connected with a DC negative electrode pin, and the DC negative electrode pin is connected with a heat dissipation sheet; according to the chip frame, the pins with the radiating fins are provided, and the area is enlarged.

Description

Technical Field

[0001] The utility model discloses a rectifier bridge frame with pins having heat sinks, belongs to the field of semiconductor accessories, and relates to heat sinks of the rectifier bridge frame. Background Art

[0002] A rectifier bridge frame is a conductor used to make a rectifier bridge. Existing rectifier bridge frames are divided into two types: surface-mount rectifier bridge frames and lead-type rectifier bridge frames. The advantages of surface-mount rectifier bridge frames are their small size and aesthetic appearance, but their disadvantages are poor heat dissipation and low power. The advantages of lead-type rectifier bridge frames are their high power, but their disadvantages are their large size and the need for additional heat sinks.

[0003] Application number: 2019204178340. A novel two-piece high-power SMD bridge rectifier frame comprises an upper frame and a lower frame. The upper frame comprises parallel upper side frames, with multiple upper frame transverse ribs disposed between the upper side frames, and a row of upper frame BRG units connected to the right side of the upper frame transverse ribs. The lower frame comprises parallel lower side frames, with multiple lower frame transverse ribs disposed between the lower side frames, and a row of lower frame BRG units connected to the left side of the lower frame transverse ribs. The upper and lower frames are assembled to form a double-layer rectangular wide frame. The upper and lower frame BRG units are interlocked to form multiple frame BRG units, each of which houses a chipset. This bridge rectifier frame can accommodate larger chips, expands the frame's application range, and improves the product's current-carrying capacity.

[0004] Application number: 2023213298808. This flattened rectifier bridge leadframe relates to the field of semiconductor processing technology. It comprises at least one leadframe unit formed on a leadframe sheet; the leadframe unit comprises frame 1, frame 4, and frame 2, spaced apart from each other from left to right. Frame 3 is spaced apart below frame 4, and a third chip carrier is located to the left of frame 3. Frame 4 is provided with a fourth chip carrier on the same side as the third chip carrier. Frame 2 is provided with a first chip carrier and a second chip carrier, spaced apart from each other. This utility model facilitates production.

[0005] The aforementioned novel two-piece high-power SMD rectifier bridge frame utilizes an upper frame, a lower frame, an upper side frame, upper frame cross ribs, an upper frame BRG unit, a lower side frame, a lower frame cross rib, and a lower frame BRG unit, thereby accommodating larger chips, expanding the application range of the frame, and improving the product's current carrying capacity, but it cannot achieve better heat dissipation. The aforementioned flattened rectifier bridge lead frame utilizes a lead frame unit, frame one, frame two, frame three, frame four, a first chip carrier, a second chip carrier, a third chip carrier, and a fourth chip carrier, thereby facilitating production, but it cannot achieve better heat dissipation.

[0006] During operation, a rectifier bridge needs to continuously convert AC power into DC power and carry a large charge. Therefore, the rectifier bridge chip generates heat, which is released through the rectifier bridge casing. However, when the rectifier bridge casing cannot meet the heat dissipation requirements of the chip, the chip will burn through due to excessive temperature, causing a short circuit and causing the rectifier bridge to cease operation. Therefore, a rectifier bridge frame with good self-heating properties is needed to ensure that the rectifier bridge has good heat dissipation and a long service life. Utility Model Content

[0007] The utility model discloses a rectifier bridge frame with pins having built-in heat sinks, which provides pins with built-in heat sinks and a chip frame with an enlarged area. The heat generated by the chip during operation of the rectifier bridge is quickly released through the chip frame with an enlarged area and the heat sinks on the pins.

[0008] The technical solution of the utility model is as follows: a rectifier bridge frame with a pin having a heat sink includes a DC positive pole frame 1, an AC neutral wire frame 2, an AC live wire frame 3, and a DC negative pole frame 4;

[0009] The DC positive frame 1 is provided with a shell connection hole 5, a grid line 6, and a heat dissipation notch 7. The DC positive frame 1 is fixedly connected to the DC positive pin 8, and the DC positive pin 8 is fixedly connected to the heat sink 12.

[0010] The AC neutral wire frame 2 is provided with a housing connection hole 5, a grid line 6, and a heat dissipation notch 7. The AC neutral wire frame 2 is fixedly connected to the AC neutral wire pin 10, and the AC neutral wire pin 10 is fixedly connected to the heat sink 12.

[0011] The AC live wire frame 3 is provided with a housing connection hole 5 and a grid line 6. The AC live wire frame 3 is fixedly connected to the AC live wire pin 9, and the AC live wire pin 9 is fixedly connected to the heat sink 12.

[0012] The DC negative frame 4 is provided with a housing connection hole 5, a grid line 6, and a heat dissipation notch 7. The DC negative frame 4 is fixedly connected to the DC negative pin 11, and the DC negative pin 11 is fixedly connected to the heat sink 12.

[0013] The heat sink 12 on the DC positive pin 8 is connected to the heat sink 12 on the AC live pin 9 through a connecting piece 13, the heat sink 12 on the AC live pin 9 is connected to the heat sink 12 on the AC neutral pin 10 through a connecting piece 13, and the heat sink 12 on the AC neutral pin 10 is connected to the heat sink 12 on the DC negative pin 11 through a connecting piece 13 to form a rectifier bridge frame unit.

[0014] Furthermore, the DC positive frame 1 is a rounded rectangle, the heat dissipation notch 7 set on the top is groove-shaped, the bottom of the DC positive frame 1 is connected to the top of the DC positive pin 8, and grid lines 6 are symmetrically set up on the right side of the front of the DC positive frame 1.

[0015] Furthermore, the DC positive pin 8 is L-shaped, and rectangular heat sinks 12 are provided on two symmetrical portions of the upper side.

[0016] Furthermore, the AC neutral wire frame 2 is J-shaped, with a heat dissipation gap 7 set on the top. The bottom of the AC neutral wire frame 2 is connected to the top of the AC neutral wire pin 10, and grid lines 6 are set symmetrically on both sides of the front of the AC neutral wire frame 2.

[0017] Furthermore, the AC neutral pin 10 is L-shaped, and heat sinks 12 are provided on two symmetrical portions of the upper side.

[0018] Furthermore, the AC live wire frame 3 is U-shaped, the bottom of the AC live wire frame 3 is connected to the top of the AC live wire pin 9, and grid lines 6 are symmetrically provided on both sides of the front of the AC live wire frame 3.

[0019] Furthermore, the AC live wire pin 9 is L-shaped, and heat sinks 12 are respectively provided on two symmetrical portions on the upper side.

[0020] Furthermore, the DC negative frame 4 is a rounded rectangle with a heat dissipation notch 7 on the top. The bottom of the DC negative frame 4 is connected to the top of the DC negative pin 11 . Grid lines 6 are symmetrically arranged on the left side of the front of the DC negative frame 4 .

[0021] Furthermore, the DC negative pin 11 is L-shaped, and heat sinks 12 are provided on two symmetrical portions of the upper side.

[0022] Furthermore, the grid lines 6 are in the shape of a tic-tac-toe that is concave inwards.

[0023] Beneficial effects: During use, the rectifier bridge needs to continuously convert AC power into DC power and carry a large charge. Therefore, the chip of the rectifier bridge will generate heat, and the heat will be released along with the shell of the rectifier bridge. However, when the shell of the rectifier bridge cannot meet the heat release of the chip, the chip will burn through due to excessive temperature, forming a short circuit, causing the rectifier bridge to stop working.

[0024] A rectifier bridge frame with pins having built-in heat sinks provides pins with built-in heat sinks and a chip frame with an enlarged area. During operation of the rectifier bridge, heat generated by the chip is quickly released through the enlarged chip frame and the heat sinks on the pins, thereby improving heat dissipation efficiency and increasing service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of a series connection of a rectifier bridge frame with a heat sink on the pins;

[0026] Figure 2 This is a front view of a rectifier bridge frame with built-in heat sinks on the pins;

[0027] In the figure, 1 is the DC positive pole frame, 2 is the AC neutral wire frame, 3 is the AC live wire frame, 4 is the DC negative pole frame, 5 is the shell connection hole, 6 is the grid line, 7 is the heat dissipation gap, 8 is the DC positive pole pin, 9 is the AC live wire pin, 10 is the AC neutral wire pin, 11 is the DC negative pole pin, 12 is the heat sink, and 13 is the connecting piece. DETAILED DESCRIPTION

[0028] The structure and shape of the utility model are described in detail with reference to the accompanying drawings and reference numerals:

[0029] Example 1

[0030] See attached Figure 1-2 A rectifier bridge frame with a pin with a heat sink includes a DC positive frame 1, the DC positive frame 1 is used to weld a conductive strip and transmit the DC positive current converted by the chip to the DC positive pin 8, an AC neutral frame 2 is used to fix the chip and transmit the AC current provided by the AC neutral pin 10 to the chip, an AC live frame 3 is used to fix the chip and transmit the AC current provided by the AC live pin 9 to the chip, and a DC negative frame 4 is used to weld a conductive strip and transmit the DC negative current converted by the chip to the DC negative pin 11;

[0031] The DC positive frame 1 is provided with a shell connection hole 5, a grid line 6, and a heat dissipation notch 7. The shell connection hole 5 is used to increase the connection strength between the front and rear of the injection-molded shell, the grid line 6 is used to increase the firmness of the welded conductive strip, and the heat dissipation notch 7 is used to increase the heat dissipation cross-sectional area of ​​the frame. The DC positive frame 1 is fixedly connected to the DC positive pin 8, which is used to transfer the DC positive charge to the positive circuit of the circuit board. The DC positive pin 8 is fixedly connected to the heat sink 12, which is used to release heat from the DC positive pin 8 and the DC positive frame 1.

[0032] The AC neutral wire frame 2 is provided with a housing connection hole 5, a grid line 6, and a heat dissipation notch 7. The grid line 6 is used to increase the firmness of chip bonding. The AC neutral wire frame 2 is fixedly connected to the AC neutral wire pin 10, which is used to transmit the AC current on the circuit board to the AC neutral wire frame 2. The AC neutral wire pin 10 is fixedly connected to the heat sink 12, which is used to release heat from the AC neutral wire pin 10 and the AC neutral wire frame 2.

[0033] The AC live wire frame 3 is provided with a housing connection hole 5 and a grid line 6. The grid line 6 is used to increase the firmness of the chip bonding. The AC live wire frame 3 is fixedly connected to the AC live wire pin 9. The AC live wire pin 9 is used to transmit the AC current on the circuit board to the AC live wire frame 3. The AC live wire pin 9 is fixedly connected to the heat sink 12. The heat sink 12 is used to release heat from the AC live wire pin 9 and the AC live wire frame 3.

[0034] The DC negative frame 4 is provided with a housing connection hole 5, a grid line 6, and a heat dissipation notch 7. The grid line 6 is used to increase the firmness of the welding conductive strip. The DC negative frame 4 is fixedly connected to the DC negative pin 11, which is used to transfer the DC negative charge to the negative circuit of the circuit board. The DC negative pin 11 is fixedly connected to the heat sink 12, which is used to release heat from the DC negative pin 11 and the DC negative frame 4.

[0035] The heat sink 12 on the DC positive pin 8 is connected to the heat sink 12 on the AC live wire pin 9 through a connecting piece 13, the heat sink 12 on the AC live wire pin 9 is connected to the heat sink 12 on the AC neutral wire pin 10 through a connecting piece 13, and the heat sink 12 on the AC neutral wire pin 10 is connected to the heat sink 12 on the DC negative pin 11 through a connecting piece 13 to form a rectifier bridge frame unit. The connecting piece 13 is used to position the DC positive pin 8, AC live wire pin 9, AC neutral wire pin 10, and DC negative pin 11 through the heat sink 12 to facilitate the DC positive frame 1, AC neutral wire frame 2, AC live wire frame 3, and DC negative frame 4 to avoid contact with each other and maintain a safe distance during the shell injection molding process. After the shell injection molding of the DC positive frame 1, AC neutral wire frame 2, AC live wire frame 3, and DC negative frame 4 is completed, the connecting piece 13 is cut off to ensure that the DC positive pin 8, AC live wire pin 9, AC neutral wire pin 10, and DC negative pin 11 can work independently.

[0036] See attached Figure 1-2 The DC positive frame 1 is a rounded rectangle, the heat dissipation notch 7 set on the top is groove-shaped, the bottom of the DC positive frame 1 is connected to the top of the DC positive pin 8, and the grid lines 6 are symmetrically set up in the upper and lower right positions in front of the DC positive frame 1.

[0037] See attached Figure 1-2 The DC positive pin 8 is L-shaped, and rectangular heat sinks 12 are respectively provided at the two symmetrical positions on the upper sides.

[0038] See attached Figure 1-2The AC neutral wire frame 2 is J-shaped, with a heat dissipation gap 7 set on the top. The bottom of the AC neutral wire frame 2 is connected to the top of the AC neutral wire pin 10. The grid lines 6 are set symmetrically on both sides of the front of the AC neutral wire frame 2.

[0039] See attached Figure 1-2 The AC neutral pin 10 is L-shaped, and heat sinks 12 are provided at the two symmetrical positions on the upper side.

[0040] See attached Figure 1-2 The AC live wire frame 3 is U-shaped, the bottom of the AC live wire frame 3 is connected to the top of the AC live wire pin 9, and grid lines 6 are symmetrically arranged on both sides of the front of the AC live wire frame 3.

[0041] See attached Figure 1-2 The AC live wire pin 9 is L-shaped, and heat sinks 12 are respectively provided at the two symmetrical positions on the upper side.

[0042] See attached Figure 1-2 The DC negative frame 4 is a rounded rectangle with a heat dissipation notch 7 on the top. The bottom of the DC negative frame 4 is connected to the top of the DC negative pin 11. The grid lines 6 are symmetrically set on the left side of the front of the DC negative frame 4.

[0043] See attached Figure 1-2 The DC negative pin 11 is L-shaped, and heat sinks 12 are respectively provided at the two symmetrical positions on the upper side.

[0044] See attached Figure 1-2 , the grid lines 6 are in the shape of a tic-tac-toe that is concave inward.

[0045] Example 2

[0046] See attached Figure 1 A rectifier bridge frame with a pin and a heat sink, a single rectifier bridge frame unit is connected to the heat sink 12 through a connecting piece 13 for left and right series connection, and a single rectifier bridge frame unit is connected to the connecting piece 13 through a pin for up and down series connection. This method is convenient for one-time shell injection molding of multiple rectifier bridge frame units.

[0047] Example 3

[0048] See attached Figure 1 A rectifier bridge frame with pins and heat sinks. A single rectifier bridge frame unit is connected in series synchronously up and down and left and right through a connecting piece 13, a heat sink 12 and a pin. This method facilitates the injection molding of the shells of multiple rectifier bridge frame units at one time.

[0049] Example 4

[0050] See attached Figure 1A rectifier bridge frame with a pin with a heat sink. A long conductive strip is welded to the right above the two grid lines 6 on the DC positive pole frame 1. The right sides of the two conductive strips are respectively bonded to the corresponding chips on the grid lines 6 on the left side of the AC neutral wire frame 2 and the AC live wire frame 3. A long conductive strip is welded to the left above the two grid lines 6 on the DC negative pole frame 4. The left sides of the two conductive strips are respectively bonded to the corresponding chips on the grid lines 6 on the right side of the AC neutral wire frame 2 and the AC live wire frame 3.

[0051] Example 5

[0052] See attached Figure 1 A rectifier bridge frame with a pin-mounted heat sink, the DC positive frame 1, the AC neutral frame 2, and the DC negative frame 4 have an enlarged area above the bottom of the heat dissipation gap 7 above.

Claims

1. A rectifier bridge frame with pins and heat sinks, characterized in that: Including DC positive frame, AC neutral frame, AC live frame, DC negative frame; The DC positive pole frame is provided with a shell connection hole, a grid line, and a heat dissipation notch. The DC positive pole frame is fixedly connected to the DC positive pole pin, and the DC positive pole pin is fixedly connected to the heat sink. The AC neutral wire frame is provided with a housing connection hole, a grid line, and a heat dissipation gap. The AC neutral wire frame is fixedly connected to the AC neutral wire pin, and the AC neutral wire pin is fixedly connected to the heat sink. The AC live wire frame is provided with a shell connection hole and a grid line. The AC live wire frame is fixedly connected to the AC live wire pin, and the AC live wire pin is fixedly connected to the heat sink. The DC negative pole frame is provided with a shell connection hole, a grid line, and a heat dissipation notch. The DC negative pole frame is fixedly connected to the DC negative pole pin, and the DC negative pole pin is fixedly connected to the heat sink. The heat sink on the DC positive pin is connected to the heat sink on the AC live wire pin through a connecting plate, the heat sink on the AC live wire pin is connected to the heat sink on the AC neutral wire pin through a connecting plate, and the heat sink on the AC neutral wire pin is connected to the heat sink on the DC negative pin through a connecting plate to form a rectifier bridge frame unit.

2. According to claim 1, a rectifier bridge frame with a pin having a heat sink, characterized in that The DC positive frame is a rounded rectangle, and the heat dissipation gap set on the top is groove-shaped. The bottom of the DC positive frame is connected to the top of the DC positive pin, and grid lines are set symmetrically on the upper and lower sides of the front right position of the DC positive frame.

3. A rectifier bridge frame with pins and heat sinks according to claim 1 or 2, characterized in that The DC positive pin is L-shaped, with rectangular heat sinks located symmetrically on both sides of the top.

4. According to claim 1, a rectifier bridge frame with a pin having a heat sink, characterized in that The AC neutral wire frame is J-shaped, with a heat dissipation notch on the top. The bottom of the AC neutral wire frame is connected to the top of the AC neutral wire pin. Grid lines are symmetrically set on both sides of the front of the AC neutral wire frame.

5. A rectifier bridge frame with pins and heat sinks according to claim 1 or 4, characterized in that The AC neutral pin is L-shaped, with heat sinks installed on the two symmetrical sides of the upper part.

6. A rectifier bridge frame with a pin having a heat sink according to claim 1, characterized in that The AC firewire frame is U-shaped, the bottom of the AC firewire frame is connected to the top of the AC firewire pin, and grid lines are symmetrically set on both sides of the front of the AC firewire frame.

7. A rectifier bridge frame with pins and heat sinks according to claim 1 or 6, characterized in that The AC live wire pin is L-shaped, with heat sinks located symmetrically on both sides of the top.

8. The rectifier bridge frame with a pin having a heat sink according to claim 1, characterized in that The DC negative pole frame is a rounded rectangle with a heat dissipation notch on the top. The bottom of the DC negative pole frame is connected to the top of the DC negative pole pin. Grid lines are symmetrically set on the upper and lower left sides of the front of the DC negative pole frame.

9. A rectifier bridge frame with pins and heat sinks according to claim 1 or 8, characterized in that The DC negative pin is L-shaped, with heat sinks located symmetrically on both sides of the top.

10. The rectifier bridge frame with pins and heat sinks according to claim 1, characterized in that The grid lines are in the shape of a tic-tac-toe that is concave inward.

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