Package structure

Abstract

The application proposes a packaging structure, and the structure comprises a radio frequency substrate, the radio frequency substrate comprises a thinning region and a non-thinning region, the non-thinning region is provided with a welding pad, and the welding pad is exposed out of the upper surface of the non-thinning region; the antenna substrate is arranged above the radio frequency substrate, and the projection of the thinning area in the vertical direction is in a groove shape; and the coating layer is arranged between the radio frequency substrate and the antenna substrate, and the non-thinning area is filled with the coating layer. Therefore, the radio frequency substrate and the antenna substrate are connected through the coating layer, so that the two substrates can be integrally formed; the thinning area is arranged, so that cavitation bubbles can be prevented, and electrical connection of the two substrates can also be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a packaging structure. Background Art

[0002] Currently, bonding two substrates is mostly done by substrate factories. For the production process, see Figure 1 Steps a to e are shown. Step a: Prepare RF substrate 01 and antenna substrate 02; Step b: Laminate RF substrate 01 and antenna substrate 02; Step c: Connect electronic components 03 and passive components 04 below the RF substrate; Step d: Molding electronic components 03 and passive components 04 with coating layer 05; Step e: Form molding layer 06 above antenna substrate 02.

[0003] When the above process is used to press the two substrates together, it is easy for bubbles to be trapped between the two substrates, which may cause the substrate to explode at high temperatures. In addition, the circuit alignment of the two substrates may be inaccurate during pressing, which may lead to the risk of electrical connection failure. Figure 2 After step b, there will be bubble area 07 and connection failure area 08. Figure 3 When the two substrates are pressed together using the upper alignment mold 09, the lower alignment mold 10, and the adhesive layer 12 (the adhesive layer 12 includes solder 121), the lower alignment mold 10 needs to form pins 11 on all four sides. Since there is a 50μm error between the pins 11 and the substrate holes 15, a displacement of less than 100μm may occur between the through holes of the two substrates, resulting in electrical connection failure between the two substrates. The displacement change can be seen in Figure 4 , Figure 4 This is a local enlarged change diagram after pressing. Figure 4 The left side shows a schematic diagram of circuit alignment, where RF substrate circuit 13 and antenna substrate circuit 14 overlap. The right side shows a schematic diagram of circuit shifting, where RF substrate circuit 13 and antenna substrate circuit 14 do not overlap. Even if the two substrates to be bonded are treated as a single substrate and fabricated layer by layer, process errors can easily cause circuit shifting, impacting product yield. Utility Model Content

[0004] This application proposes a packaging structure, including:

[0005] A radio frequency substrate, the radio frequency substrate comprising a thinned area and a non-thinned area, the non-thinned area being provided with a solder pad, the solder pad being exposed on the upper surface of the non-thinned area, and the thinned area being projected in a groove shape in a vertical direction;

[0006] an antenna substrate, the antenna substrate being arranged above the radio frequency substrate;

[0007] The cladding layer is arranged between the radio frequency substrate and the antenna substrate and fills the non-thinning area.

[0008] As a possible implementation manner, a projection of the antenna substrate in the horizontal direction covers projections of the thinned area and the non-thinned area in the horizontal direction.

[0009] As a possible implementation manner, a projection of the cladding layer in the horizontal direction covers a projection of the RF substrate in the horizontal direction.

[0010] As a possible implementation manner, there are multiple non-thinning areas, and their projections in the horizontal direction are distributed in a grid.

[0011] As a possible implementation manner, the thinned area surrounds the welding pad.

[0012] As a possible implementation manner, the thinned area surrounds the non-thinned area, and the thinned area and the pad are separated by the non-thinned area.

[0013] As a possible implementation manner, the radio frequency substrate has a through hole.

[0014] As a possible implementation manner, the cladding layer fills the through hole and is connected to the lower surface of the RF substrate.

[0015] As a possible implementation manner, the through hole is provided at an edge of the RF substrate, the cladding layer has a non-vertical surface, and the non-vertical surface vertically overlaps with the through hole.

[0016] As a possible implementation manner, the through holes are evenly arranged on the RF substrate.

[0017] As a possible implementation manner, the packaging structure further includes:

[0018] An electronic component is arranged below the radio frequency substrate.

[0019] As a possible implementation manner, the electronic component is covered by the covering layer.

[0020] As a possible implementation manner, the packaging structure further includes:

[0021] A passive component is disposed below the radio frequency substrate.

[0022] As a possible implementation manner, the passive component is covered by the covering layer.

[0023] As a possible implementation manner, the packaging structure further includes:

[0024] A molding layer is arranged above the antenna substrate.

[0025] As a possible implementation manner, the packaging structure further includes:

[0026] A metal connecting block is provided between the radio frequency substrate and the antenna substrate.

[0027] As a possible implementation manner, the bonding pad is electrically connected to the RF substrate through the metal connection block.

[0028] To ensure the success rate of connecting the two substrates, the present application proposes a packaging structure comprising an RF substrate, the RF substrate including a thinned region and a non-thinned region, the non-thinned region being provided with a solder pad, the solder pad being exposed on the upper surface of the non-thinned region, and the thinned region having a vertical projection in the shape of a groove; an antenna substrate disposed above the RF substrate; and a cladding layer disposed between the RF substrate and the antenna substrate and filling the non-thinned region. Thus, by connecting the RF substrate and the antenna substrate via the cladding layer, the two substrates can be integrally formed; the thinned region can prevent the generation of cavitation and ensure electrical connection between the two substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Other features, objects and advantages of the present invention will become more apparent from the detailed description of the non-limiting embodiments made with reference to the following drawings:

[0030] Figure 1 It is a schematic diagram of the structure of the packaging structure of the prior art at various manufacturing stages;

[0031] Figure 2 is a schematic structural diagram of a packaging structure in the prior art at the manufacturing stage (b);

[0032] Figure 3 is a schematic diagram of a mold for a packaging structure manufacturing process (b) in the prior art;

[0033] Figure 4 This is a partial enlarged diagram of the changes in the packaging structure after pressing in the prior art;

[0034] Figure 5 is a longitudinal cross-sectional view of a packaging structure 100 according to an embodiment of the present utility model;

[0035] Figure 6 is a top view of a packaging structure 200 according to an embodiment of the present invention;

[0036] Figure 7 is a top view of a package structure 200 before cutting according to an embodiment of the present invention;

[0037] Figure 8 is a top view of a packaging structure 300 according to an embodiment of the present invention;

[0038] Figure 9 is a top view of a package structure 300 before cutting according to an embodiment of the present invention;

[0039] Figure 10-14 1 is a schematic structural diagram of a packaging structure 100 at various manufacturing stages according to an embodiment of the present invention.

[0040] Description of reference numerals / symbols:

[0041] 01-RF substrate; 02-antenna substrate; 03-electronic components; 04-passive components; 05-coating layer; 06-molding layer; 07-bubble area; 08-connection failure area; 09-upper alignment mold; 10-lower alignment mold; 11-pin; 12-adhesive layer; 121-solder; 13-RF substrate circuit; 14-antenna substrate circuit; 15-substrate hole; 101-RF substrate; 1011-thinning area; 1012-non-thinning area; 1013-solder pad; 1014-through hole; 102-antenna substrate; 103-coating layer; 104-electronic components; 105-passive components; 106-molding layer; 107-metal connection block. DETAILED DESCRIPTION

[0042] The following describes the specific embodiments of the present application in conjunction with the accompanying drawings and examples. Those skilled in the art will readily understand the technical problems solved by the present application and the technical effects produced by the present application through the contents of this specification. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the relevant invention and are not intended to limit the invention. Furthermore, for ease of description, only portions relevant to the relevant invention are shown in the accompanying drawings.

[0043] It should be readily understood that the meanings of “on,” “over,” and “over…” in this application should be interpreted in the broadest sense, such that “on” not only means “directly on something,” but also means “on something” including intermediate components or layers therebetween.

[0044] Furthermore, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90° or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0045] As used herein, the term "layer" refers to a portion of a material comprising an area having a certain thickness. A layer may extend over the entire underlying or superstructure, or may have an extent that is less than the extent of the underlying or superstructure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers thereon, above and / or below. A layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0046] As used herein, the term "substrate" refers to the material onto which subsequent material layers are added. The substrate itself can be patterned. The material added on top of the substrate can be patterned or can remain unpatterned. In addition, the substrate can include a variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate can be made of a non-conductive material, such as glass, plastic, or sapphire wafer. Further alternatively, the substrate can have semiconductor devices or circuits formed therein.

[0047] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.

[0048] It should also be noted that the longitudinal section corresponding to the embodiment of the present application may be a section corresponding to the front view direction, the transverse section may be a section corresponding to the right view direction, and the horizontal section may be a section corresponding to the top view direction.

[0049] In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0050] See also Figure 5 , Figure 5 FIG1 is a longitudinal cross-sectional view of a package structure 100 according to an embodiment of the present invention. The package structure 100 includes:

[0051] The RF substrate 101 includes a thinned region 1011 and a non-thinned region 1012. The non-thinned region 1012 is provided with a solder pad 1013 exposed on the upper surface of the non-thinned region 1012. The solder pad 1013 is used to electrically connect to the antenna substrate 102. The thinned region 1011 is vertically projected into a groove shape.

[0052] The antenna substrate 102 is disposed above the RF substrate 101;

[0053] The cladding layer 103 is disposed between the RF substrate 101 and the antenna substrate 102 and fills the non-thinning area 1012 .

[0054] In this way, the non-thinned area 1012 provided with the solder pad 1013 can ensure the electrical connection between the RF substrate 101 and the antenna substrate 102. Providing the thinned area 1011 on the RF substrate 101 can ensure uniform and smooth mold flow during the formation of the cladding layer 103, preventing the generation of bubbles. Furthermore, the non-thinned area 1012, which protrudes from the thinned area 1011, can limit the connection position (i.e., the solder pad 1013), further improving the reliability of the connection between the RF substrate 101 and the antenna substrate 102.

[0055] As a possible implementation, the horizontal projection of the antenna substrate 102 covers the horizontal projections of the thinned region 1011 and the non-thinned region 1012. The horizontal projection of the cladding layer 103 covers the horizontal projection of the RF substrate 101. In this way, the cladding layer 103 can fully connect the entire RF substrate 101 and the antenna substrate 102.

[0056] As a possible implementation, the projection of the thinned area 1011 in the vertical direction can be in the shape of a groove, which is equivalent to forming a groove at a position on the upper surface of the RF substrate 101 where no electrical connection is required. This does not affect the electrical connection, but also facilitates a uniform and smooth mold flow process and prevents cavitation.

[0057] As a possible implementation, the RF substrate 101 may have a through-hole 1014, with the cladding layer 103 filling the through-hole 1014 and connecting to the lower surface of the RF substrate 101. When electronic components 104 and passive components 105 are disposed beneath the RF substrate 101, both may be encapsulated by the cladding layer 103. This allows the cladding layer 103 to have a non-perpendicular surface that overlaps perpendicularly with the through-hole 1014, allowing all components on the RF substrate 101 that require connection to be covered simultaneously by the cladding layer 103, reducing process complexity. Furthermore, the through-hole 1014 allows the mold flow to fill the gap between the two substrates, further reducing the generation of cavitation bubbles.

[0058] As a possible implementation, a metal connection block 107 may be provided between the RF substrate 101 and the antenna substrate 102 , and the pad 1013 is electrically connected to the RF substrate 101 through the metal connection block 107 .

[0059] As a possible implementation, the packaging structure 100 may further include: a molding layer 106 disposed above the antenna substrate 102 for packaging components above the antenna substrate 102 , which is not limited herein.

[0060] The above-mentioned packaging structures can be formed in multiple forms on a wafer or a packaging panel, and then cut into individual packaging structures. In this case, the reduced top view can present multiple packaging structures.

[0061] See below Figure 6 and Figure 7 , Figure 6 FIG. 2 is a top view of a packaging structure 200 according to an embodiment of the present invention. Figure 7 FIG. 2 is a top view of the package structure 200 before cutting according to an embodiment of the present invention.

[0062] The package structure 200 is similar to the package structure 100 , and the only difference is that the thinning area 1011 , the non-thinning area 1012 , the pad 1013 , the through hole 1014 and the metal connection block 107 provided in the package structure 200 and the package structure 100 are different in size.

[0063] See further Figure 6 Both package structure 200 and package structure 100 may have multiple non-thinned regions 1012, with their horizontal projections forming a grid arrangement. Thinned regions 1011 surround solder pads 1013 and non-thinned regions 1012, with thinned regions 1011 and solder pads 1013 separated by non-thinned regions 1012. This allows for a larger area of ​​thinned regions 1011, facilitating a smooth and uniform mold flow and preventing cavitation.

[0064] See further Figure 7 Before cutting, the through holes 1014 of the package structure 200 and the package structure 100 are evenly arranged on the RF substrate 101. In this way, after cutting, the through holes 1014 will remain in the package structure.

[0065] In addition, see Figure 7 , the package structure 100 and the package structure 200 can both adopt a strip design, such as Figure 7 The left side is the mold inlet side, and the right side is the ventilation side.

[0066] Continue to see Figure 8 and Figure 9 , Figure 8is a top view of a packaging structure 300 according to an embodiment of the present invention. Figure 9 FIG. 3 is a top view of the package structure 300 before cutting according to an embodiment of the present invention.

[0067] The package structure 300 is similar to the package structure 200 , except that the through holes 1014 of the package structure 300 are disposed at the edge of the RF substrate 101 , while the through holes 1014 of the package structure 200 are uniformly disposed on the RF substrate 101 .

[0068] See also Figure 9 During the cutting process, the through hole 1014 on the package structure 300 can be removed. That is, the through hole 1014 is provided during the manufacturing process, but the package structure 300 after cutting does not include the through hole 1014. In this way, the package structure 300 can not only use the through hole 1014 to reduce cavitation, but also make the through hole 1014 not exist in the finished package structure, which is conducive to product miniaturization. It should be noted that the package structure 300 can also adopt a strip design, such as Figure 9 The left side is the mold inlet side, and the right side is the ventilation side.

[0069] See below Figure 10-14 , introduces the manufacturing steps of a packaging structure 100 according to an embodiment of the present invention:

[0070] Step 1, see Figure 10 , forming a metal connection block 107 above the bonding pad 1013 of the RF substrate 101;

[0071] Step 2, see Figure 11 , connecting the antenna substrate 102 to the RF substrate 101 through the metal connecting block 107;

[0072] Step 3, see Figure 12 , connecting electronic components 104 and passive components 105 below the RF substrate 101;

[0073] Step 4, see Figure 13 , filling the molding material between the RF substrate 101 and the antenna substrate 102 to form a coating layer 103;

[0074] It should be noted that the coating layer 103 can fill the thinned area 1011 and the through hole 1014 , and at the same time, coat the electronic component 104 and the passive component 105 ;

[0075] Step 5, see Figure 14 , a molding layer 106 is formed above the antenna substrate 102 .

[0076] As used herein, the terms "substantially," "substantial," "approximately," and "about" are used to indicate and explain minor variations. For example, when used in conjunction with a numerical value, the above terms may refer to a variation range of less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another example, a film or layer having a thickness that is "substantially uniform" may refer to a film or layer having an average thickness that has a standard deviation of less than or equal to ±10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" may refer to two surfaces that are within 50 μm along the same plane, such as within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane. Two components may be considered "substantially aligned" if, for example, they overlap or are within 200 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm. Two surfaces or components may be considered "substantially perpendicular" if the angle between them is, for example, 90° ± 10°, such as ± 5°, ± 4°, ± 3°, ± 2°, ± 1°, ± 0.5°, ± 0.1°, or ± 0.05°. When used in conjunction with an event or circumstance, the terms "substantially," "substantial," "approximately," and "about" may refer to both situations where the event or circumstance occurs exactly and situations where the event or circumstance occurs very approximately.

Claims

1. A packaging structure, characterized in that: The packaging structure includes: A radio frequency substrate, the radio frequency substrate comprising a thinned area and a non-thinned area, the non-thinned area being provided with a solder pad, the solder pad being exposed on the upper surface of the non-thinned area, and the thinned area being projected in a groove shape in a vertical direction; an antenna substrate, the antenna substrate being arranged above the radio frequency substrate; The cladding layer is arranged between the radio frequency substrate and the antenna substrate and fills the non-thinning area.

2. The packaging structure according to claim 1, wherein: The projection of the antenna substrate in the horizontal direction covers the projections of the thinning area and the non-thinning area in the horizontal direction, and the projection of the cladding layer in the horizontal direction covers the projection of the RF substrate in the horizontal direction.

3. The packaging structure according to claim 1, wherein: There are multiple non-thinning areas, and their projections in the horizontal direction are distributed in a grid.

4. The packaging structure according to claim 1, wherein: The thinned area surrounds the bonding pad and the non-thinned area, and the thinned area and the bonding pad are separated by the non-thinned area.

5. The packaging structure according to claim 1, wherein: The RF substrate has a through hole, and the cladding layer fills the through hole and is connected to the lower surface of the RF substrate.

6. The packaging structure according to claim 5, wherein: The through hole is arranged at the edge of the radio frequency substrate, the cladding layer has a non-vertical surface, and the non-vertical surface is vertically overlapped with the through hole.

7. The packaging structure according to claim 1, wherein: The packaging structure further includes: An electronic component is arranged below the radio frequency substrate and is covered by the covering layer.

8. The packaging structure according to claim 1, wherein: The packaging structure further includes: A passive component is disposed below the radio frequency substrate and is covered by the covering layer.

9. The packaging structure according to claim 1, wherein: The packaging structure further includes: A molding layer is arranged above the antenna substrate.

10. The packaging structure according to claim 1, wherein: The packaging structure further includes: A metal connecting block is provided between the radio frequency substrate and the antenna substrate, and the soldering pad is electrically connected to the radio frequency substrate via the metal connecting block.

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