Optical coupling packaging structure

Abstract

The utility model discloses an optical coupling packaging structure, and the structure comprises a bearing base island which is provided with a light receiving chip and a light emitting chip; the first output base island is provided with a first power chip; the second output base island is provided with a second power chip; the first output pin and the second output pin are respectively connected with the first output base island and the second output base island; the first input base island and the second input base island are respectively connected with the first pole and the second pole of the light-emitting chip; the first input pin and the second input pin are respectively connected with the first input base island and the second input base island and extend out of the plastic package body, the first input pin is connected with the first input base island, and the second input pin is connected with the second input base island; the plastic package body wraps the base islands and the chips on the base islands; the first input base island or the second input base island and the bearing base island are of an integrated structure, the design solves the problem that an independent frame base island needs to be subjected to rib cutting, and the reliability of the optical coupling packaging structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optoelectronic devices, and more specifically, to an optical coupling packaging structure. Background Art

[0002] Compared to traditional solid-state relays, optocoupler packaging offers advantages such as fast response, low power consumption, long service life, strong electromagnetic interference resistance, and high reliability. It has been widely used in fields such as communications and automotive electronics. An optocoupler package integrates a light-emitting diode (LED) as the input signal source, a light-receiving chip as the optocoupler device, and a power MOSFET as the output device, resulting in a miniaturized solid-state relay with high-speed switching capabilities.

[0003] The existing optical coupling packaging structure has many packaging schemes and packaging forms. Different packaging schemes and packaging forms correspond to different lead frame structures. The light receiving chip is responsible for converting the optical signal to the electrical signal between input and output, but it is neither an input end nor an output end. Therefore, the lead frame carrying the light receiving chip is usually an independent carrier base island. Figure 1 As shown, the independent carrier base island 51 is connected to the support pins 70. The support pins 70 play the role of fixing and supporting the carrier base island 51, and can also be used for wire bonding and jumpering. In the packaging process, it is necessary to add a rib cutting process. When cutting the ribs, the support pins 70 extending out of the plastic package body 50 will be cut off, but it is inevitable that some support pins 70 will remain outside the plastic package body 50. This part of the remaining support pins 70 is integrated with the internal carrier base island 51, which will affect the pin voltage resistance and reliability of the optical coupling packaging structure.

[0004] Therefore, how to improve the layout of the lead frame of the optical coupling package structure and enhance the reliability of the optical coupling package structure is an urgent problem to be solved at this stage. Utility Model Content

[0005] In view of this, an object of the present invention is to provide an optical coupling package structure to improve the layout of the lead frame and enhance the quality and reliability of the optical coupling package structure.

[0006] The utility model provides an optical coupling packaging structure, comprising: a carrier base island, on which a light-receiving chip and a light-emitting chip located on the light-receiving chip are arranged; a first output base island, on which a first power chip is arranged; a second output base island, on which a second power chip is arranged; a first output pin, connected to the first output base island and extending from the plastic package; a second output pin, connected to the second output base island and extending from the plastic package; a first input base island and a second input base island, respectively connected to a first electrode and a second electrode of the light-emitting chip; a first input pin and a second input pin, the first input pin being connected to the first input base island and extending from the plastic package, and the second input pin being connected to the second input base island and extending from the plastic package; a plastic package covering the carrier base island, the first output base island, the second output base island, the first input base island, the second input base island, and the chips on each base island; wherein the carrier base island and the first input base island are an integrated structure, or the carrier base island and the second input base island are an integrated structure.

[0007] Optionally, the source of the first power chip is connected to the source of the second power chip, the positive electrode of the light receiving chip is connected to the gate of the first power chip and the second power chip respectively, and the negative electrode of the light receiving chip is connected to the source of the first power chip or the second power chip.

[0008] Optionally, an isolation plate is provided between the light-emitting chip and the light-receiving chip.

[0009] Optionally, the light receiving chip is in direct contact with the light emitting chip, and the light emitting chip and the light receiving chip are isolated by a transparent substrate of the light emitting chip.

[0010] Optionally, positioning holes are provided on the first input base island, the second input base island, the first output base island and the second output base island.

[0011] Optionally, the isolation plate is located on the upper surface of the light receiving chip, and the size of the isolation plate is smaller than the size of the light receiving chip, so that at least part of the upper surface of the light receiving chip is exposed.

[0012] Optionally, the first input pin and the second input pin are led out from a first side of the plastic package body, and the first output pin and the second output pin are led out from a second side of the plastic package body, where the second side is opposite to the first side.

[0013] Optionally, the first input pin is close to the third side of the plastic package body, the second input pin is close to the fourth side of the plastic package body, the third side and the fourth side are opposite, and the third side is perpendicular to the first side. The first input pin is electrically connected to the first pole of the light-emitting chip, and the second input pin is electrically connected to the second pole of the light-emitting chip. The first pole is the positive pole, and the second pole is the negative pole. The supporting base island and the second input base island are an integrated structure.

[0014] Optionally, the first input pin is close to the fourth side of the plastic package body, the second input pin is close to the third side of the plastic package body, the third side and the fourth side are opposite, and the third side is perpendicular to the first side. The first input pin is electrically connected to the first pole of the light-emitting chip, and the second input pin is electrically connected to the second pole of the light-emitting chip. The first pole is the positive pole, and the second pole is the negative pole. The supporting base island and the second input base island are an integrated structure.

[0015] Optionally, the first input pin is close to the third side of the plastic package body, the second input pin is close to the fourth side of the plastic package body, the third side and the fourth side are opposite, and the third side is perpendicular to the first side. The first input pin is electrically connected to the first pole of the light-emitting chip, and the second input pin is electrically connected to the second pole of the light-emitting chip. The first pole is the negative pole, and the second pole is the positive pole. The supporting base island and the second input base island are an integrated structure.

[0016] Optionally, the first input pin is close to the fourth side of the plastic package body, the second input pin is close to the third side of the plastic package body, the third side and the fourth side are opposite, and the third side is perpendicular to the first side. The first input pin is electrically connected to the first pole of the light-emitting chip, and the second input pin is electrically connected to the second pole of the light-emitting chip. The first pole is the negative pole, and the second pole is the positive pole. The supporting base island and the second input base island are an integrated structure.

[0017] Optionally, the light receiving chip is fixed on the supporting base island by insulating glue.

[0018] Optionally, the isolation sheet is an insulating light-transmitting sheet, and the isolation sheet has a preset thickness so that there is a specific distance between the light-receiving chip and the light-emitting chip.

[0019] Optionally, the plastic package body is made of non-light-transmitting material.

[0020] Optionally, the first power chip and the second power chip include at least one of a silicon-based metal oxide semiconductor field effect transistor, a silicon carbide-based metal oxide semiconductor field effect transistor, and a gallium nitride-based high electron mobility transistor, the drain of the first power chip is connected to the first output pin, and the drain of the second power chip is connected to the second output pin.

[0021] Optionally, the drain of the first power chip is located on its bottom surface, and the drain of the first power chip is electrically connected to the first output base island through a conductive layer; the drain of the second power chip is located on its bottom surface, and the drain of the second power chip is electrically connected to the second output base island through a conductive layer.

[0022] Optionally, the drain of the first power chip is located on its front side, and the drain of the first power chip is electrically connected to the first output base island through a bonding wire; the drain of the second power chip is located on its front side, and the drain of the second power chip is electrically connected to the second output base island through a bonding wire.

[0023] Beneficial effects of the utility model:

[0024] The optical coupling packaging structure provided by the present invention is an integrated structure of the carrier base island and the first input base island, or the carrier base island and the second input base island, so that the carrier base island is no longer an independent base island, and the first input base island or the second input base island plays a role in supporting and fixing the carrier base island. At the same time, this design does not generate additional steps for the packaging process and is compatible with the original packaging process. While ensuring the original functional parameters of the optical coupling packaging structure, it solves the problem that the independent frame base island needs to be cut, simplifies the packaging process, and improves the reliability of the optical coupling packaging structure without increasing the cost.

[0025] Furthermore, the carrier base island and the first input base island (the input base island connected to the positive pole of the light-emitting chip) are an integrated structure, so that the potential difference between the light-receiving chip and the carrier base island is low. Therefore, the light-receiving chip only needs to be fixed on the carrier base island through insulating glue, and no insulating gasket is required for isolation. The cost is low, the isolation effect is good, and the reliability is high.

[0026] Furthermore, the carrier base island and the second input base island (the input base island connected to the negative pole of the light-emitting chip) are an integrated structure, so that the potential difference between the light-receiving chip and the carrier base island is extremely low. Therefore, the light-receiving chip only needs to be fixed on the carrier base island through insulating glue, and no insulating gasket is required for isolation, which has low cost, better isolation effect and higher reliability.

[0027] The optically coupled packaging structure is simpler overall and more convenient to package. An insulating and light-transmissive spacer is provided between the light-receiving chip and the light-emitting chip. The spacer has a certain thickness, ensuring sufficient insulation and voltage resistance between the light-emitting chip and the light-receiving chip, ensuring the functional stability of the light-emitting chip and the light-receiving chip, and improving the reliability of the optically coupled packaging structure.

[0028] Furthermore, the light-receiving chip is in direct contact with the light-emitting chip, and the transparent substrate of the light-emitting chip is used as an isolation structure, so there is no need to use an isolation sheet, which reduces the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings.

[0030] Figure 1 A top view showing a conventional optical coupling packaging structure;

[0031] Figure 2 A top view of the optical coupling packaging structure according to the first embodiment of the present invention is shown;

[0032] Figure 3 The optical coupling packaging structure of the first embodiment of the present invention is shown along Figure 2 Schematic diagram of the cross section taken along the AA section line;

[0033] Figure 4 The optical coupling packaging structure of the first embodiment of the present invention is shown along Figure 2 Schematic diagram of the cross section taken along the BB section line;

[0034] Figure 5 A circuit diagram showing the optical coupling package structure of the first embodiment of the present invention;

[0035] Figure 6 A top view of an optical coupling packaging structure according to a second embodiment of the present invention is shown;

[0036] Figure 7 A top view showing an optical coupling package structure according to a third embodiment of the present invention;

[0037] Figure 8 The optical coupling packaging structure of the second embodiment of the present invention is shown along Figure 6 Schematic diagram of the cross section taken along the CC section line;

[0038] Figure 9 The optical coupling packaging structure of the second embodiment of the present invention is shown along Figure 6 Schematic diagram of the cross section taken along the DD section line. DETAILED DESCRIPTION

[0039] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, identical elements are represented by identical or similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale.

[0040] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0041] Figure 2 FIG2 is a top view of the optical coupling package structure of the first embodiment of the present invention; in order to more clearly illustrate the internal structure of the optical coupling package structure, Figure 2 The plastic package 50 is treated with perspective. Figure 2 As shown, the optical coupling packaging structure includes: a first input pin 10, a first input base island 11, a second input pin 20, a second input base island 21, a first output pin 30, a first output base island 31, a second output pin 40, a second output base island 41, a supporting base island 51, and a plastic package body 50 covering the above base islands and a portion of the above pins; wherein, the first input pin 10 is connected to the first input base island 11, the second input pin 20 is connected to the second input base island 21, the first output pin 30 is connected to the first output base island 31, and the second output pin 40 is connected to the second output base island 41; the first input pin 10 and the second input pin 20 extend from a first side edge of the plastic package body 50, and the first output pin 30 and the second output pin 40 extend from a second side edge of the plastic package body 50, and the first side edge and the second side edge are opposite to each other. A light-receiving chip 1 is arranged on the carrier base island 51, and the light-receiving chip 1 is fixed on the carrier base island 51 by insulating glue. A light-emitting chip 3 is arranged above the light-receiving chip 1, and an isolation plate 2 is arranged between the light-emitting chip 3 and the light-receiving chip 1. The isolation plate 2 is, for example, an insulating transparent material, and the isolation plate 2 has a certain thickness, so that there is sufficient spacing between the light-emitting chip 3 and the light-receiving chip 1, thereby obtaining a sufficiently high insulation withstand voltage performance, ensuring the normal functions of the light-emitting chip 3 and the light-receiving chip 1, and at the same time ensuring that the light-receiving area of ​​the light-receiving chip 1 is illuminated, thereby improving the long-term reliability of the optical coupling packaging structure. A first power chip 4 is arranged on the first output base island 31, and a second power chip 5 is arranged on the second output base island 41. Furthermore, a positioning hole 60 is provided on the first input base island 11, the second input base island 21, the first output base island 31 and the second output base island 41. The first power chip 4 and the second power chip 5, for example, both include but are not limited to at least one of a silicon-based metal oxide semiconductor field effect transistor, a silicon carbide-based metal oxide semiconductor field effect transistor and a gallium nitride-based high electron mobility transistor. The areas of the first output base island 31 and the second output base island 41 are, for example, larger than the areas of the first input base island 11 and the second input base island 21, so that in addition to the arrangement of the power chips, there is still additional area for setting the positioning hole 60.

[0042] The light-emitting chip 3 includes, for example, a light-emitting diode. The first input pin 10 is connected to the positive electrode of the light-emitting chip 3 via the first input base island 11, and the second input pin 20 is connected to the negative electrode of the light-emitting chip 3 via the second input base island 21. The positive electrode of the light-receiving chip 1 is connected to the gate of the first power chip 4 and the gate of the second power chip 5, respectively. The negative electrode of the light-receiving chip 1 is connected to the source electrode of the first power chip 4, and the source electrode of the first power chip 4 is connected to the source electrode of the second power chip 5. Each of the above connections is bonded, for example, via bonding wires. Furthermore, since the source electrodes of the first power chip 4 and the second power chip 5 are connected, the negative electrode of the light-receiving chip 1 can be connected to the source electrode of either the first power chip 4 or the second power chip 5.

[0043] Since the carrier base island 51 is located in the middle area of ​​the plastic package body 50, in order to solve the cutting problem caused by the independent carrier base island 51, simplify the packaging process, and avoid the problem that some pins remain outside the plastic package body 50 after cutting and affect the reliability, the carrier base island 51 in this embodiment is connected to the second input base island 21, and the carrier base island 51 and the second input base island 21 are an integrated structure, and the second input base island 21 provides support and fixation for the carrier base island 51.

[0044] Figure 3 and Figure 4 The optical coupling packaging structure of the first embodiment of the present invention is shown respectively along Figure 2 Schematic diagram of the cross section taken by the AA section line and the BB section line; combined Figures 2 to 4As can be seen, the light-receiving chip 1, the spacer 2, and the light-emitting chip 3 are stacked sequentially from bottom to top on the carrier base island 51. The cathode of the light-emitting chip 3 is connected to the second input base island 21 via a bonding wire and extends from the first side of the plastic package 50 via the second input pin 20. The anode of the light-emitting chip 3 is connected to the first input base island 11 via a bonding wire and extends from the first side of the plastic package 50 via the first input pin 10. The first power chip 4 is located on the first output base island 31, and the drain of the first power chip 4 extends from the second side of the plastic package 50 via the first output pin 30. The second power chip 5 is located on the second output base island 41, and the drain of the second power chip 5 extends from the second side of the plastic package 50 via the second output pin 40. The drain of the first power chip 4 is located on its bottom surface and is fixed and electrically connected to the first output base island 31 via a conductive layer (e.g., conductive glue). The drain of the second power chip 5 is located on its bottom surface and is fixed and electrically connected to the second output base island 41 via a conductive layer. The carrier island 51 is located in the middle area of ​​the plastic package body 50. The first output island 31 and the second output island 41 are symmetrically arranged on both sides of the carrier island 51. The first input island 11 and the second input island 21 are symmetrically arranged on both sides of the carrier island 51. It is understood that the positions of the first input island 11 and the second input island 21 can be interchanged, and the positions of the first output island 31 and the second output island 41 can be interchanged.

[0045] Figure 5 A circuit diagram showing the optical coupling package structure of the first embodiment of the present invention is shown as follows: Figure 5 As shown, the light-emitting chip 3 is, for example, a light-emitting diode, the positive electrode of the light-emitting chip 3 is connected to the first input pin 10, and the negative electrode of the light-emitting chip 3 is connected to the second input pin 20; the light-receiving chip 1 is, for example, a photoelectric conversion chip, and the light-receiving chip 1 can generate a corresponding electrical signal by receiving the optical signal generated by the light-emitting chip 3 to drive the first power chip 4 and the second power chip 5. Specifically, the positive electrode of the light-receiving chip 1 is respectively connected to the gate of the first power chip 4 and the gate of the second power chip 5, the source of the first power chip 4 is connected to the source of the second power chip 5 and is connected to the negative electrode of the light-receiving chip 1, the drain of the first power chip 4 is connected to the first output pin 30, and the drain of the second power chip 5 is connected to the second output pin 40.

[0046] Figure 6A top view of the optical coupling packaging structure of the second embodiment of the present invention is shown; the second embodiment is similar to the first embodiment, and the same parts are not repeated here. The differences between the second embodiment and the first embodiment include that, in the second embodiment, the carrier base island 51 is connected to the first input base island 11 (the input base island electrically connected to the positive pole of the light-emitting chip 3) and the two are integrated into one design. The light-emitting chip 3 includes a light-emitting structure 7 and a transparent substrate 6. Normally, the input voltage of the first input pin 10 is 1~2V, and the light-receiving chip 1 is fixed to the carrier base island 51 with insulating glue, and the insulating glue can play an isolation role; further, an insulating gasket (not shown in the figure) can be added between the light-receiving chip 1 and the carrier base island 51 to obtain a better insulation effect.

[0047] It can be understood that the positions of the first input pin 10 and the second input pin 20 can be interchanged, and the first input pin 10 and the second input pin 20 can be respectively connected to the positive and negative poles of the light-emitting chip 3, or respectively connected to the negative and positive poles of the light-emitting chip 3, and the supporting base island 51 can be an integrated structure with the first input base island 11, or an integrated structure with the second input base island 21.

[0048] Figure 7 A top view of the optical coupling packaging structure of the third embodiment of the present invention is shown; the third embodiment is similar to the second embodiment, and the same parts are not repeated here. The difference between the third embodiment and the second embodiment is that the drain of the first power chip 4 on the first output base island 31 is located on its front side, and the drain of the first power chip 4 is electrically connected to the first output base island 31 through a bonding wire; similarly, the drain of the second power chip 5 is also located on its front side, and the drain of the second power chip 5 is electrically connected to the second output base island 41 through a bonding wire.

[0049] Figure 8 and Figure 9 The optical coupling packaging structure of the second embodiment of the present invention is shown along Figure 6 Schematic diagram of the cross section taken by CC section line and DD section line; Figure 8 and Figure 9 As shown, in the optical coupling packaging structure of the second embodiment, the light-emitting chip 3 includes a light-emitting structure 7 and a transparent substrate 6. The light-emitting chip 3 is in direct contact with the light-receiving chip 1, that is, the transparent substrate 6 of the light-emitting chip 3 is in direct contact with the light-receiving chip 1. The light emitted by the light-emitting structure 7 of the light-emitting chip 3 can pass through the transparent substrate 6 to irradiate the photosensitive area of ​​the light-receiving chip 1, that is, no additional isolation plate is required between the light-emitting chip 3 and the light-receiving chip 1. The light-emitting chip 3 and the light-receiving chip 1 are isolated by the transparent substrate 6 of the light-emitting chip 3, which saves costs. At the same time, the transparent substrate 6 is made of a light-transmitting material, which ensures that the light from the light-emitting chip 3 can be irradiated on the photosensitive area of ​​the light-receiving chip 1 without affecting the normal operation of the device.

[0050] The optical coupling packaging structure provided by the present invention is an integrated structure of the carrier base island and the first input base island, or the carrier base island and the second input base island, so that the carrier base island is no longer an independent base island, and the first input base island or the second input base island plays a role in supporting and fixing the carrier base island. At the same time, this design does not generate additional steps for the packaging process and is compatible with the original packaging process. While ensuring the original functional parameters of the optical coupling packaging structure, it solves the problem that the independent frame base island needs to be cut, simplifies the packaging process, and improves the reliability of the optical coupling packaging structure without increasing the cost.

[0051] Furthermore, the carrier base island and the first input base island (the input base island connected to the positive pole of the light-emitting chip) are an integrated structure, so that the potential difference between the light-receiving chip and the carrier base island is low. Therefore, the light-receiving chip only needs to be fixed on the carrier base island through insulating glue, and no insulating gasket is required for isolation. The cost is low, the isolation effect is good, and the reliability is high.

[0052] Furthermore, the carrier base island and the second input base island (the input base island connected to the negative pole of the light-emitting chip) are an integrated structure, so that the potential difference between the light-receiving chip and the carrier base island is extremely low. Therefore, the light-receiving chip only needs to be fixed on the carrier base island through insulating glue, and no insulating gasket is required for isolation, which has low cost, better isolation effect and higher reliability.

[0053] The optically coupled packaging structure is simpler overall and more convenient to package. An insulating and light-transmissive spacer is provided between the light-receiving chip and the light-emitting chip. The spacer has a certain thickness, ensuring sufficient insulation and voltage resistance between the light-emitting chip and the light-receiving chip, ensuring the functional stability of the light-emitting chip and the light-receiving chip, and improving the reliability of the optically coupled packaging structure.

[0054] Furthermore, the light-receiving chip is in direct contact with the light-emitting chip, and the transparent substrate of the light-emitting chip is used as an isolation structure, so there is no need to use an isolation sheet, which reduces the cost.

[0055] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0056] While embodiments of the present invention have been described above, these embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An optical coupling packaging structure, characterized in that: include: A carrier base island, wherein a light receiving chip and a light emitting chip located on the light receiving chip are arranged on the carrier base island; a first output base island, wherein a first power chip is disposed on the first output base island; a second output base island, wherein a second power chip is disposed on the second output base island; a first output pin connected to the first output base island and extending out from the plastic package; a second output pin connected to the second output base island and extending from the plastic package body; A first input base island and a second input base island are connected to the first electrode and the second electrode of the light-emitting chip respectively; A first input pin and a second input pin, wherein the first input pin is connected to the first input base island and extends out of the plastic package, and the second input pin is connected to the second input base island and extends out of the plastic package; A plastic package covering the carrier base island, the first output base island, the second output base island, the first input base island, the second input base island and the chips on each base island; The carrier base island and the first input base island are an integrated structure, or the carrier base island and the second input base island are an integrated structure.

2. The optical coupling package structure according to claim 1, wherein: The source of the first power chip is connected to the source of the second power chip, the positive electrode of the light receiving chip is connected to the gate of the first power chip and the second power chip respectively, and the negative electrode of the light receiving chip is connected to the source of the first power chip or the second power chip.

3. The optical coupling package structure according to claim 1, wherein: An isolation sheet is provided between the light emitting chip and the light receiving chip.

4. The optical coupling package structure according to claim 1, wherein: The light receiving chip is in direct contact with the light emitting chip, and the light emitting chip and the light receiving chip are isolated by the transparent substrate of the light emitting chip.

5. The optical coupling package structure according to claim 1, wherein: Positioning holes are provided on the first input base island, the second input base island, the first output base island, and the second output base island.

6. The optical coupling package structure according to claim 3, wherein: The isolation plate is located on the upper surface of the light receiving chip. The size of the isolation plate is smaller than the size of the light receiving chip, so that at least a portion of the upper surface of the light receiving chip is exposed.

7. The optical coupling package structure according to claim 1, wherein: The first input pin and the second input pin are led out from a first side of the plastic package body, and the first output pin and the second output pin are led out from a second side of the plastic package body, where the second side is opposite to the first side.

8. The optical coupling package structure according to claim 7, wherein: The first input pin is close to the third side of the plastic package body, the second input pin is close to the fourth side of the plastic package body, the third side is opposite to the fourth side, and the third side is perpendicular to the first side. The first input pin is electrically connected to the first pole of the light-emitting chip, and the second input pin is electrically connected to the second pole of the light-emitting chip. The first pole is the positive pole, and the second pole is the negative pole. The supporting base island and the second input base island are an integrated structure.

9. The optical coupling package structure according to claim 7, wherein: The first input pin is close to the fourth side of the plastic package body, the second input pin is close to the third side of the plastic package body, the third side is opposite to the fourth side, and the third side is perpendicular to the first side. The first input pin is electrically connected to the first pole of the light-emitting chip, and the second input pin is electrically connected to the second pole of the light-emitting chip. The first pole is the positive pole, and the second pole is the negative pole. The supporting base island and the second input base island are an integrated structure.

10. The optical coupling package structure according to claim 7, wherein: The first input pin is close to the third side of the plastic package body, the second input pin is close to the fourth side of the plastic package body, the third side is opposite to the fourth side, and the third side is perpendicular to the first side. The first input pin is electrically connected to the first pole of the light-emitting chip, and the second input pin is electrically connected to the second pole of the light-emitting chip. The first pole is the negative pole, and the second pole is the positive pole. The supporting base island and the second input base island are an integrated structure.

11. The optical coupling package structure according to claim 7, wherein: The first input pin is close to the fourth side of the plastic package body, the second input pin is close to the third side of the plastic package body, the third side is opposite to the fourth side, and the third side is perpendicular to the first side. The first input pin is electrically connected to the first pole of the light-emitting chip, and the second input pin is electrically connected to the second pole of the light-emitting chip. The first pole is the negative pole, and the second pole is the positive pole. The supporting base island and the second input base island are an integrated structure.

12. The optical coupling package structure according to claim 1, wherein: The light receiving chip is fixed on the supporting base island by insulating glue.

13. The optical coupling package structure according to claim 3, wherein: The isolation sheet is an insulating light-transmitting sheet and has a preset thickness so as to provide insulation and voltage-withstanding performance between the light-receiving chip and the light-emitting chip.

14. The optical coupling package structure according to claim 1, wherein: The plastic package body is made of non-light-transmitting material.

15. The optical coupling package structure according to claim 1, wherein: The first power chip and the second power chip include at least one of a silicon-based metal oxide semiconductor field effect transistor, a silicon carbide-based metal oxide semiconductor field effect transistor, and a gallium nitride-based high electron mobility transistor. The drain of the first power chip is connected to the first output pin, and the drain of the second power chip is connected to the second output pin.

16. The optical coupling package structure according to claim 15, wherein: The drain of the first power chip is located on its bottom surface, and the drain of the first power chip is electrically connected to the first output base island through a conductive layer; the drain of the second power chip is located on its bottom surface, and the drain of the second power chip is electrically connected to the second output base island through a conductive layer.

17. The optical coupling package structure according to claim 15, wherein: The drain of the first power chip is located on its front side, and the drain of the first power chip is electrically connected to the first output base island through a bonding wire; the drain of the second power chip is located on its front side, and the drain of the second power chip is electrically connected to the second output base island through a bonding wire.

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