Circuit board assembly and camera module

Abstract

The utility model relates to a circuit board assembly and a camera module. The circuit board assembly comprises an inner frame, a first elastic connecting structure, a second elastic connecting structure, a middle frame surrounding the periphery of the inner frame at intervals and an outer frame surrounding the periphery of the middle frame at intervals, and the inner frame is connected to the middle frame in a suspended mode through the first elastic connecting structure. The middle frame is connected to the outer frame in a suspended mode through a second elastic connecting structure. The first elastic connecting structure extends along at least one half circumference of the edge contour of the inner frame, one end of the first elastic connecting structure is connected to the middle frame, and the other end of the first elastic connecting structure is connected to the inner frame, so that the moment of force of the first elastic connecting structure can be increased, the first elastic connecting structure is easy to deform, and the inner frame is easy to drive; and meanwhile, the stress on the second elastic connecting structure is relatively uniform, and the deformation process is relatively stable after the second elastic connecting structure is stressed.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to a circuit board assembly and a camera module. Background Art

[0002] Camera modules are commonly used in smart electronic devices with camera functions, such as mobile phones, drones, and watches, to capture images. A camera module generally consists of a lens, a chip assembly, a spring plate, and a drive unit. The chip assembly is mounted on the spring plate. The lens is positioned above the chip assembly, allowing light to pass through the lens and reach the chip assembly, which then generates a corresponding image signal. The drive unit is used to move the chip assembly relative to the lens in the XY plane and along the Z axis, thereby changing the relative position of the chip assembly and lens to achieve focus and anti-shake. After the chip assembly moves relative to the lens, the spring plate's deformation force forces the chip assembly back to its original position.

[0003] Currently, the spring plates used in camera modules are generally complex in structure, resulting in high manufacturing costs. Furthermore, precise control of their elastic deformation accuracy is difficult during manufacturing. Providing a simpler, lower-cost, and more easily controllable elastic structure to replace existing spring plates in camera modules is a key research area for manufacturers. Utility Model Content

[0004] The utility model provides a circuit board assembly and a camera module, which have a simple structure and low manufacturing cost.

[0005] The technical solutions adopted in this utility model are as follows:

[0006] A circuit board assembly, applied to a camera module, comprises an inner frame, a first elastic connection structure, a second elastic connection structure, an intermediate frame spaced around the periphery of the inner frame, and an outer frame spaced around the periphery of the intermediate frame; the inner frame is connected to the intermediate frame in a suspended manner via the first elastic connection structure; the intermediate frame is connected to the outer frame in a suspended manner via the second elastic connection structure; wherein the first elastic connection structure extends along at least half the circumference of the edge contour of the inner frame, and the two ends of the first elastic connection structure are respectively connected to the intermediate frame and the inner frame.

[0007] In which, the second elastic connection structure includes an elastic frame that is spaced around the periphery of the intermediate frame, first connection blocks symmetrically arranged on two opposite sides of the intermediate frame, and second connection blocks symmetrically arranged on the other opposite sides of the intermediate frame, and the line connecting the two first connection blocks is perpendicular to the line connecting the two second connection blocks; the elastic frame is connected to the intermediate frame through the first connection block, and is connected to the outer frame through the second connection block.

[0008] In one embodiment, the first elastic connection structure is located between the inner frame and the middle frame; one end of the first elastic connection structure is fixedly connected to the inner side of the middle frame, and the other end of the first elastic connection structure is fixedly connected to the outer side of the inner frame, and the two ends of the first elastic connection structure are respectively located on both sides of one of the corner parts of the inner frame.

[0009] In one embodiment, the first elastic connection structure extends for a length greater than or equal to three quarters of the perimeter of the inner frame edge, or less than the perimeter of the inner frame edge.

[0010] In one embodiment, the elastic frame is located between the middle frame and the outer frame, and there are at least two elastic frames configured, one of the two elastic frames surrounds the periphery of the other at intervals, and one of the two elastic frames is fixed to the other through a first connecting block and a second connecting block.

[0011] In one embodiment, the second elastic connection structure further includes a connecting member, and the connecting member connects the two elastic frames.

[0012] In one embodiment, there are four connecting members, and the four connecting members are connected to the four corners of the elastic frame one by one.

[0013] In one embodiment, the length direction of the connecting member is parallel to the diagonal line of the elastic frame; and the connecting portion between the connecting member and the elastic frame is located on the corresponding diagonal line of the elastic frame.

[0014] In one embodiment, the outer frame, the middle frame and the inner frame are all circuit boards; the second elastic connection structure and the first elastic connection structure are both conductive components; the outer frame is electrically connected to the middle frame through the second elastic connection structure; and the middle frame is electrically connected to the inner frame through the first elastic connection structure.

[0015] A camera module includes a shell and a lens, wherein a chip assembly, a main bracket, an elastic bracket, a drive unit and the above-mentioned circuit board assembly are arranged in the shell; the lens is suspended above the chip assembly through the shell; the outer frame is fixed to the bottom of the shell; the main bracket is fixed to the top surface of the intermediate frame; the chip assembly is suspended on the main bracket through the elastic bracket and is located above the inner frame; the inner frame is fixed to the chip assembly and is electrically connected to the chip assembly; the drive unit connects the chip assembly, the shell and the main bracket, and is used to drive the chip assembly to move up and down along the Z axis relative to the main bracket, and to drive the main bracket to move in the XY axis plane relative to the outer frame.

[0016] The beneficial effects of the utility model are:

[0017] In the circuit board assembly provided herein, an inner frame is suspendedly connected to an intermediate frame via a first elastic connection structure; the intermediate frame is suspendedly connected to an outer frame via a second elastic connection structure. The second elastic connection structure includes elastic frames spaced apart around the periphery of the intermediate frame. The elastic frames are connected to the intermediate frame via first connection blocks symmetrically located on opposite sides of the intermediate frame; the elastic frames are connected to the outer frame via second connection blocks symmetrically located on other opposite sides of the intermediate frame; the line connecting the two first connection blocks is perpendicular to the line connecting the two second connection blocks. The first elastic connection structure extends along the edge contour of the inner frame, with its two ends connected to the intermediate frame and the inner frame, respectively. This structure increases the torque of the first elastic connection structure, making it easier to deform and thus easier to drive the inner frame. Furthermore, the second elastic connection structure is located between the outer frame and the intermediate frame, making it more compact. Each side of the second elastic connection structure is connected to a corresponding component, thereby applying force to the second elastic connection structure more evenly and causing it to deform more smoothly after being subjected to force. Compared with the prior art, the above-mentioned structural design of the present application has lower strength requirements for the first elastic connection structure and the second elastic connection structure. There is no need to use costly and complex spring plates in the first elastic connection structure and the second elastic connection structure. The first elastic connection structure and the second elastic connection structure can be manufactured by using elastic circuit boards or metal sheets, which effectively simplifies the structure and saves costs. In addition, the force application method of the first elastic connection structure and the second elastic connection structure is more efficient and uniform, which can improve the elastic deformation accuracy of the circuit board assembly during the focusing and anti-shake process of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but should not be construed as limiting the present invention. In the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the overall structure of the camera module according to an embodiment of the present utility model;

[0020] Figure 2 This is a schematic cross-sectional view of a camera module according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure decomposition of the camera module according to an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the combined structure of the circuit board assembly, bracket assembly, drive unit and chip assembly of an embodiment of the present utility model;

[0023] Figure 5This is a schematic planar structural diagram of a circuit board assembly according to an embodiment of the present utility model.

[0024] Description of the accompanying drawings:

[0025] 100, housing; 110, bottom plate;

[0026] 200, lens;

[0027] 10. Circuit board assembly; 11. Outer frame; 12. Intermediate frame; 13. Inner frame; 14. First elastic connection structure; 15. Second elastic connection structure; 151. First connection block; 152. Second connection block; 153. Elastic frame; 154. Connector;

[0028] 20. Bracket assembly; 21. Elastic bracket; 22. Main bracket; 221. Assembly window; 23. Mounting piece;

[0029] 30. Chip assembly; 31. Chip carrier plate; 32. Carrier frame; 33. Chip;

[0030] 40. Drive unit; 41. Magnet; 42. Anti-shake coil; 43. Focus coil. DETAILED DESCRIPTION

[0031] The following is a detailed description of the specific embodiments of the present invention in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention and are not intended to limit the present invention.

[0032] This embodiment discloses a camera module, which can be applied to electronic devices with shooting functions, such as mobile phones, computers, watches, drones, and sweepers.

[0033] See first Figure 1 、 Figure 2 and Figure 3The camera module includes a housing 100, a lens 200, a chip assembly 30, a bracket assembly 20, a drive unit 40 and a circuit board assembly 10. The lens 200 is installed in the housing 100 and is at least partially exposed from a shooting hole (unnumbered) opened in the housing 100 for collecting external light. The chip assembly 30, the bracket assembly 20, the drive unit 40 and the circuit board assembly 10 are all arranged in the housing 100. The bracket assembly 20 is installed on the circuit board assembly 10, and the chip assembly 30 is suspended in the bracket assembly 20 through the elastic frame 21 of the bracket assembly 20. The bottom surface of the chip assembly 30 is also fixed to the circuit board assembly 10. Specifically, a through hole (unnumbered) for assembling the chip assembly 30 is provided in the middle of the bracket assembly 20. The chip assembly 30 is roughly in the shape of a cube. The four corners of the chip assembly 30 are connected to the edges of the through hole through the elastic frame 21. The chip assembly 30 can be moved up and down in the through hole. This allows the lens 200 to be suspended above the chip assembly 30 through the housing 100. External light passes through the lens and reaches the chip assembly 30, causing the chip assembly 30 to generate a corresponding image signal. The housing 100 includes a base plate 110, mounted on the bottom of the housing 100 opposite the lens 200, to enclose the chip assembly 30, the bracket assembly 20, the drive unit 40, and the circuit board assembly 10 within the housing 100.

[0034] The chip assembly 30 includes a carrier frame 32, a chip carrier plate 31 mounted on the carrier frame 32, and a chip 33 mounted on the chip carrier plate 31. Specifically, the carrier frame 32 is in the shape of a square frame, and the top surface of the carrier frame 32 is fixedly connected to the elastic frame 21, and the carrier frame 32 is suspended in the bracket assembly 20 by the elastic frame 21. The chip carrier plate 31 is arranged on the bottom surface of the carrier frame 32; the chip 33 is arranged on the top surface of the chip carrier plate 31 and is located in the carrier frame 32, and is arranged facing the lens 200. Among them, the chip 33 is the photosensitive component of the image sensor assembly 30, and the photosensitive surface of the chip 33 is the photosensitive surface of the image sensor assembly 30. Preferably, as Figure 2 As shown, the size of the chip carrier plate 31 facing the base plate 110 is appropriately reduced compared to the size of the side facing the chip 33 and the lens 200 to prevent the chip carrier plate 31 from interfering with other devices inside the camera module.

[0035] The bracket assembly 20 includes the aforementioned elastic bracket 21, as well as a main bracket 22 and a mounting plate 23. The main bracket 22 is fixed in the housing 100 and surrounds the chip assembly 30. The elastic bracket 21 is connected between the main bracket 22 and the carrier frame 32. The four side walls of the main bracket 22 are each provided with a hollow assembly window 221. The mounting plate 23 is shaped like a square frame formed by four upright plates, surrounding the main bracket 22. The four upright plates are respectively arranged parallel to the four side walls of the main bracket 22. The outer side of the mounting plate 23 is fixed to the inner wall of the housing 100.

[0036] The drive unit 40 is connected to the chip assembly 30, the housing and the bracket assembly 20 to drive the chip assembly 30 to move up and down along the Z axis relative to the main bracket 22 to complete the focus of the camera module. In addition, the drive unit 40 can also drive the main bracket 22 relative to the outer frame 11 in, for example, Figure 1 or Figure 3 The camera module moves in the XY-axis plane as shown in the figure to achieve anti-shake of the camera module.

[0037] Specifically, in this embodiment, the driving unit 40 includes a focusing coil 43, an anti-shake coil 42 and a magnet 41; the focusing coil 43 is installed on the chip assembly 30, for example, installed on the outside of the carrier frame 32 or the chip carrier plate 31; the magnet 41 is embedded in the assembly window 221 of the main bracket 22; the anti-shake coil 42 is installed on the inside of the mounting plate 23; the focusing coil 43 and the anti-shake coil 42 are respectively opposite to the inside and outside of the magnet 41. In this embodiment, the number of focus coils 43, anti-shake coils 42, and magnets 41 is preferably four each. The focus coils 43 are mounted on the four sides of the carrier frame 32, the anti-shake coils 42 are mounted on the inner sides of the four upright tabs of the mounting plate 23, and the magnets 41 are embedded in the mounting windows 221 defined in the four sidewalls of the main bracket 22. Thus, a focus coil 43, an anti-shake coil 42, and a magnet 41 are arranged on each side of the chip assembly 30, with the focus coils 43 and the anti-shake coils 42 facing the inner and outer sides of the magnets 41, respectively. Embedding the magnets 41 in the mounting windows 221 of the main bracket 22 ensures that there are no obstacles between the magnets 41 and the focus coils 43, and between the magnets 41 and the anti-shake coils 42, preventing these obstacles from weakening the forces exerted between the magnets 41 and the focus coils 43 and the anti-shake coils 43.

[0038] Based on the above structural arrangement, when the focus coil 43 is energized, it generates a magnetic field, which interacts with the magnet 41, driving the focus coil 43 to move up and down along the Z axis. The focus coil 43 drives the chip assembly 30 to move up and down along the Z axis, thereby changing the relative position of the chip assembly 30 and the lens, and completing the camera module focus. When the anti-shake coil 42 is energized, the anti-shake coil 42 generates a magnetic field, which interacts with the magnet 41, driving the magnet 41 to move within the XY axis plane. The magnet 41 drives the main bracket 22 and the chip assembly 30 connected to the main bracket 22 to move, thereby changing the relative position of the chip assembly 30 and the lens, and completing the camera module anti-shake.

[0039] In other embodiments, two magnets may be used for focus and anti-shake respectively, replacing the shared magnet 41 for focus and anti-shake in the above embodiment. That is, the drive unit 40 may also include the focus coil 43 and anti-shake coil 42 described above, as well as a focus magnet (not shown) and an anti-shake magnet (not shown). The focus magnet is mounted on the chip assembly 30, with the focus coil 43 positioned opposite the focus magnet. When the focus coil 43 is energized, it generates a magnetic field that interacts with the focus magnet to generate a driving force that drives the focus magnet up and down along the Z axis, thereby driving the chip assembly 30 up and down. The anti-shake magnet is mounted on the main bracket 22, with the anti-shake coil 42 positioned opposite the anti-shake magnet. When the anti-shake coil 42 is energized, it generates a magnetic field that interacts with the anti-shake magnet to generate a driving force that drives the anti-shake magnet in the XY plane. The anti-shake magnet drives the main bracket 22 to move, which in turn drives the chip assembly 30 to move. Of course, in the embodiment, the driving unit 40 may also be other applicable structures, as long as it can drive the chip assembly 30 to move in the aforementioned manner to achieve focusing and anti-shake respectively.

[0040] See also Figure 4 and Figure 5 In this embodiment, the circuit board assembly 10 includes an inner frame 13, an intermediate frame 12 spaced apart around the periphery of the inner frame 13, and an outer frame 11 spaced apart around the periphery of the intermediate frame 12. The inner frame 13 is connected to the intermediate frame 12 in a suspended manner via a first elastic connection structure 14; the intermediate frame 12 is connected to the outer frame 11 in a suspended manner via a second elastic connection structure 15. The first elastic connection structure 14 extends along at least half the perimeter of the edge contour of the inner frame 13, thereby making the inner frame 13 easy to drive while maintaining sufficient stability. The two ends of the first elastic connection structure 14 are connected to the intermediate frame 12 and the inner frame 13, respectively.

[0041] Furthermore, the outer frame 11 is fixed to the bottom of the shell; the main bracket 22 is fixed to the top surface of the middle frame 12; the chip assembly 30 is suspended on the bracket assembly 20 through the elastic frame 21 and is located above the inner frame 13; the inner frame 13 is fixed to the chip assembly 30 and is electrically connected to the chip assembly 30.

[0042] In this embodiment, the inner frame 13 is connected to the middle frame 12 in a suspended manner via a first elastic connection structure 14; the middle frame 12 is connected to the outer frame 11 in a suspended manner via a second elastic connection structure 15. The first elastic connection structure 14 extends along at least half the circumference of the edge profile of the inner frame 13, with its ends connected to the middle frame 12 and the inner frame 13, respectively. This structure increases the torque of the first elastic connection structure 14, making it easier to deform, thereby facilitating the driving of the inner frame 13. This helps reduce the energy consumption of the drive unit 40 when driving the chip assembly 30 and the inner frame 13 to move up and down along the Z-axis. Furthermore, compared to spring wire, the first elastic connection structure 14 is simpler in structure and has lower manufacturing costs.

[0043] In this embodiment, the edge profile of the middle frame 12 is square. The second elastic connection structure 15 includes at least one elastic frame 153 spaced apart and surrounding the outer periphery of the middle frame 12. The elastic frame 153 is connected to the middle frame 12 via a pair of first connecting blocks 151 symmetrically located on opposite sides of the middle frame 12. The elastic frame 153 is connected to the outer frame 11 via a pair of second connecting blocks 152 symmetrically located on other opposite sides of the middle frame 12. This structural solution ensures that when the elastic frame 153 deforms within the XY plane, it possesses a significant elastic force, which can help the middle frame 12 return to its original position.

[0044] In this embodiment, the first elastic connection structure 14, the inner frame 13, the middle frame 12, the elastic frame 153 and the outer frame 11 are located in the same XY axis plane; the first elastic connection structure 14 is located between the inner frame 13 and the middle frame 12, and the two ends of the first elastic connection structure 14 are respectively fixed to the inner side of the middle frame 12 and the outer side of the inner frame 13; in this way, the first elastic connection structure 14, the inner frame 13 and the middle frame 12 are located in the same plane, so that the circuit board assembly 10 appears flat and the structure is more compact, which is conducive to reducing the overall thickness of the camera module.

[0045] Furthermore, the extended length of the first elastic connection structure 14 is greater than or equal to three-quarters of the edge circumference of the inner frame 13, so that the first elastic connection structure 14 has sufficient extended length, increases the torque of the first elastic connection structure 14, and makes the first elastic connection structure 14 more prone to elastic deformation.

[0046] Furthermore, the extended length of the first elastic connection structure 14 is less than the perimeter of the inner frame 13. This prevents the torque of the first elastic connection structure 14 from being excessively long, which could cause the first elastic connection structure 14 to become weak and prone to deformation. Furthermore, this prevents the first elastic connection structure 14 from extending too long and occupying too much installation space. Of course, in other embodiments, the extended length of the first elastic connection structure 14 can be greater than or equal to the perimeter of the inner frame. When the extended length of the first elastic connection structure 14 is greater than the perimeter of the inner frame, the first elastic connection structure 14 can be spirally wound.

[0047] Furthermore, the inner frame 13 is in a cube shape; both ends of the first elastic connection structure 14 are respectively located on both sides of one corner portion of the inner frame 13 .

[0048] In this embodiment, two elastic frames 153 are provided, one of which surrounds the other at intervals, and one of the two elastic frames 153 is fixedly connected to the other via the first connecting block 151 and the second connecting block 152. In this manner, the elastic force of the two elastic frames 153 can be used to drive the intermediate frame 12 back to its original position, providing a strong driving force. Of course, in other embodiments, the number of elastic frames 153 can be increased or decreased based on the actual application scenario, thereby increasing or decreasing the elastic force of the second elastic connection structure 15.

[0049] In one embodiment, the second elastic connection structure 15 further includes a connecting member 154 . The connecting member 154 connects the two elastic frames 153 , thereby increasing the connection stability and connection strength of the two elastic frames 153 .

[0050] In one embodiment, the edge contour of the elastic frame 153 is square; the number of connecting members 154 is four, and the four connecting members 154 are connected to the four corner parts of the elastic frame 153 one by one, so that a four-point connection can be formed, and the connection parts are distributed more evenly, which is conducive to improving the connection stability of the two elastic frames 153.

[0051] In one embodiment, the length direction of the connecting member 154 is parallel to the diagonal line of the elastic frame 153 ; the connecting portion between the connecting member 154 and the elastic frame 153 is located on the corresponding diagonal line of the elastic frame 153 .

[0052] In this embodiment, the outer frame 11, the middle frame 12, and the inner frame 13 are all circuit boards. The second elastic connection structure 15 and the first elastic connection structure 14 are both electrically conductive elastic components. For example, the surfaces of the second elastic connection structure 15 and the first elastic connection structure 14 may be etched with circuits, thereby forming an elastic circuit board. For another example, the second elastic connection structure 15 and the first elastic connection structure 14 themselves may be made of elastic metal sheets, which can be both elastic and conductive. Of course, the second elastic connection structure 15 and the first elastic connection structure 14 can also achieve electrical conductivity through other methods. An external conductive component is electrically connected to the outer frame 11, and the outer frame 11 is electrically connected to the middle frame 12 via the second elastic connection structure 15; the middle frame 12 is electrically connected to the inner frame 13 via the first elastic connection structure 14, and the chip assembly 30 is electrically connected to the inner frame 13. In this way, the chip assembly 30 can exchange electrical signals with the outside world through the inner frame 13, the first elastic connection structure 14, the middle frame 12, the second elastic connection structure 15, and the outer frame 11.

[0053] During operation, if the focusing coil 43 is energized, the magnet 41 and the focusing coil 43 form an interaction force. This interaction force drives the chip assembly 30 and the inner frame 13 to move up and down along the Z axis relative to the intermediate frame 12. This can change the distance between the chip assembly 30 and the lens 200, achieving camera module focus. After the inner frame 13 moves up and down along the Z axis, the first elastic connection structure 14 undergoes elastic deformation. When the focusing coil 43 is de-energized, the interaction force between the focusing coil 43 and the magnet 41 disappears, and the deformation elastic force of the first elastic connection structure 14 can force the inner frame 13 to return to its original position in the vertical direction, thereby driving the chip assembly 30 to return to its original position in the vertical direction.

[0054] When the anti-shake coil 42 is energized, it generates an interaction force with the magnet 41, forcing the intermediate frame 12 to move within the XY plane. The intermediate frame 12 drives the inner frame 13 to move along the XY plane via the first elastic connection structure 14. Simultaneously, the intermediate frame 12 also drives the main support 22 to move within the XY plane. In this way, the intermediate frame 12 can drive the main support 22 and the inner frame 13 to move synchronously within the XY plane. The main support 22 and the inner frame 13 also synchronously drive the chip assembly 30 to move within the XY plane, thereby changing the relative position between the chip assembly 30 and the lens, achieving camera module anti-shake. During this process, the second elastic connection structure 15 is subjected to force and undergoes elastic deformation.

[0055] When the anti-shake coil 42 is powered off, the force between the anti-shake coil 42 and the magnet 41 disappears, and the deformation elastic force of the second elastic connection structure 15 drives the middle frame 12 to move in the XY axis plane, so that the middle frame 12 returns to its original position, and the middle frame 12 drives the main bracket 22 and the chip assembly 30 to return to their original position.

[0056] According to the above-mentioned operating principle, it can be seen that the focus and anti-shake operations of the camera module are both achieved by the elastic deformation of the first elastic connection structure 14 and the second elastic connection structure 15 in the circuit board assembly 10. In this embodiment, the first elastic connection structure 14 is extended along the edge contour of the inner frame 13, and the two ends of the first elastic connection structure 14 are respectively connected to the middle frame 12 and the inner frame 13. Such a structure can increase the torque of the first elastic connection structure 14, making the first elastic connection structure 14 easy to deform, thereby making the inner frame 13 easy to drive, and thus the energy consumption required to drive the inner frame 13 is low. In addition, the second elastic connection structure 15 is located between the outer frame 11 and the middle frame 12, which makes the structure of the second elastic connection structure 15 more compact. In addition, the second elastic connection structure 15 includes two elastic frames 153, one of which surrounds the periphery of the other at intervals, and the corners of the two elastic frames 153 are connected to each other by connectors 154. The two opposite sides of each elastic frame 153 are connected to the opposite sides of the middle frame 12 through two first connecting blocks 151, and the other two opposite sides of each elastic frame 153 are connected to the opposite sides of the outer frame 11 through two second connecting blocks 152. In this way, the four sides of the second elastic connection structure 15 are connected to corresponding components. Therefore, the second elastic connection structure 15 is subjected to more uniform force, and its deformation process after being subjected to force is relatively smooth.

[0057] Compared with the prior art, the above-mentioned structural design of the present application has lower strength requirements for the first elastic connection structure 14 and the second elastic connection structure 15. There is no need to use costly and complex spring plates in the first elastic connection structure 14 and the second elastic connection structure 15. The first elastic connection structure 14 and the second elastic connection structure 15 can be manufactured by using elastic circuit boards or metal sheets, which effectively simplifies the structure and saves costs. In addition, the force application method of the first elastic connection structure 14 and the second elastic connection structure 15 is more efficient and uniform, which can improve the elastic deformation accuracy of the circuit board assembly 10 during the focusing and anti-shake process of the camera module.

[0058] As long as it does not violate the creative idea of ​​the present invention, any combination of various different embodiments of the present invention should be regarded as the content disclosed by the present invention; within the technical concept of the present invention, any simple modification of the technical solution and any combination of different embodiments that do not violate the creative idea of ​​the present invention should be within the protection scope of the present invention.

Claims

1. A circuit board assembly, which is applied to a camera module, characterized in that: The invention comprises an inner frame (13), a first elastic connection structure (14), a second elastic connection structure (15), an intermediate frame (12) spaced around the periphery of the inner frame (13), and an outer frame (11) spaced around the periphery of the intermediate frame (12); the inner frame (13) is connected to the intermediate frame (12) in a suspended manner through the first elastic connection structure (14); the intermediate frame (12) is connected to the outer frame (11) in a suspended manner through the second elastic connection structure (15); The first elastic connection structure (14) is extended along at least half of the circumference of the edge contour of the inner frame (13), and the two ends of the first elastic connection structure (14) are respectively connected to the middle frame (12) and the inner frame (13).

2. The circuit board assembly according to claim 1, wherein: The second elastic connection structure (15) comprises an elastic frame (153) spaced around the periphery of the intermediate frame (12), a first connection block (151) symmetrically arranged on two opposite sides of the intermediate frame (12), and a second connection block (152) symmetrically arranged on the other opposite sides of the intermediate frame (12), wherein the line connecting the two first connection blocks (151) is perpendicular to the line connecting the two second connection blocks (152); the elastic frame (153) is connected to the intermediate frame (12) via the first connection block (151), and is connected to the outer frame (11) via the second connection block (152).

3. The circuit board assembly according to claim 2, wherein: The first elastic connection structure (14) is located between the inner frame (13) and the middle frame (12); one end of the first elastic connection structure (14) is fixedly connected to the inner side of the middle frame, and the other end of the first elastic connection structure (14) is fixedly connected to the outer side of the inner frame (13), and the two ends of the first elastic connection structure (14) are respectively located on both sides of one of the corner parts of the inner frame (13).

4. The circuit board assembly according to claim 3, wherein: The extended length of the first elastic connection structure (14) is greater than or equal to three quarters of the edge perimeter of the inner frame (13); the extended length of the first elastic connection structure (14) is less than the edge perimeter of the inner frame (13).

5. The circuit board assembly according to claim 2, wherein: The elastic frame (153) is located between the middle frame (12) and the outer frame (11). The number of the elastic frames (153) is at least two. One of the two adjacent elastic frames (153) surrounds the periphery of the other at intervals, and one of the two adjacent elastic frames (153) is fixedly connected to the other through the first connecting block (151) and the second connecting block (152).

6. The circuit board assembly according to claim 2, wherein: The second elastic connection structure further comprises a connecting member (154), and the connecting member (154) connects the two elastic frames (153).

7. The circuit board assembly according to claim 6, wherein: The number of the connecting members (154) is four, and the four connecting members (154) are connected to the four corners of the elastic frame (153) one by one.

8. The circuit board assembly according to claim 7, wherein: The length direction of the connecting member (154) is parallel to the diagonal line of the elastic frame (153); and the connection portion between the (154) and the elastic frame (153) is located on the corresponding diagonal line of the elastic frame (153).

9. The circuit board assembly according to claim 1, wherein: The outer frame (11), the middle frame (12) and the inner frame (13) are all circuit boards; the second elastic connection structure (15) and the first elastic connection structure (14) are both conductive components; the outer frame (11) is electrically connected to the middle frame (12) via the second elastic connection structure (15); and the middle frame (12) is electrically connected to the inner frame (13) via the first elastic connection structure (14).

10. A camera module, characterized in that: The invention comprises a shell (100) and a lens (200), wherein the shell (100) is provided with a chip assembly (30), a main bracket (22), an elastic frame (21), a drive unit (40) and a circuit board assembly according to any one of claims 1 to 9; the lens (200) is suspended above the chip assembly (30) through the shell (100); the outer frame (11) is fixed to the bottom of the shell (100); the main bracket (22) is fixed to the top surface of the middle frame (12); the chip assembly (30) is suspended above ... outer frame (11) is fixed to the bottom of the shell (100); the outer frame (11) is fixed to the bottom of the middle frame (12); the outer frame ( The elastic frame (21) is suspended on the main support (22) and is located above the inner frame (13); the inner frame (13) is fixed to the chip component (30) and is electrically connected to the chip component (30); the driving unit (40) is connected to the chip component (30), the shell (100) and the main support (22) to drive the chip component (30) to move up and down relative to the main support (22), and to drive the main support (22) to move in the XY axis plane relative to the outer frame (11).

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