Loudspeaker assembly and electronic equipment

Abstract

The utility model provides a loudspeaker assembly and electronic equipment, and the loudspeaker assembly comprises a housing which is provided with an opening for sound output; a first loudspeaker and a second loudspeaker, the first loudspeaker is installed in the shell, and the second loudspeaker is installed at the opening; the first power amplifier is electrically connected with the first loudspeaker, the second power amplifier is electrically connected with the second loudspeaker, the first power amplifier is provided with a first signal processing module, the second power amplifier is provided with a second signal processing module, the first signal processing module is used for filtering audio signals larger than a first frequency, and the second signal processing module is used for filtering audio signals larger than a second frequency. The second signal processing module is used for filtering the audio signals smaller than the second frequency, so that the sound production frequency of the first loudspeaker is smaller than the sound production frequency of the second loudspeaker. Through the arrangement, high-frequency sound emitted by the second loudspeaker can be directly output to the sound output channel through the opening, so that the transmission efficiency of the high-frequency sound and the high-frequency performance of the loudspeaker assembly are greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of loudspeakers, and in particular to a loudspeaker assembly and an electronic device. Background Art

[0002] In order to increase the sound volume, the amplitude of the speakers of electronic devices currently on the market is getting larger and larger. However, the larger the amplitude of the speaker, the larger the vibration space that needs to be reserved in the electronic device, which in turn causes the high-frequency part of the sound to be attenuated and increases, affecting the high-frequency performance of the sound. Utility Model Content

[0003] In view of this, the present application provides a speaker assembly and an electronic device for improving the high-frequency performance of sound.

[0004] Specifically, the following technical solutions are included:

[0005] In a first aspect, an embodiment of the present application provides a speaker assembly, the speaker assembly comprising:

[0006] a housing having an opening for sound output;

[0007] a first speaker and a second speaker, wherein the first speaker is installed inside the housing, and the second speaker is installed at the opening;

[0008] a first power amplifier and a second power amplifier, wherein the first power amplifier is electrically connected to the first speaker, and the second power amplifier is electrically connected to the second speaker, the first power amplifier is provided with a first signal processing module, and the second power amplifier is provided with a second signal processing module, the first signal processing module is used to filter out audio signals greater than a first frequency, and the second signal processing module is used to filter out audio signals less than a second frequency, so that the sound frequency of the first speaker is lower than the sound frequency of the second speaker.

[0009] In an optional embodiment, a partition is provided in the shell, and the partition and the first speaker separate the space inside the shell into a front sound cavity and a rear sound cavity, and the opening of the shell is connected to the front sound cavity.

[0010] In an optional embodiment, the speaker assembly further includes a dustproof net, the dustproof net covers the opening, and the second speaker is mounted on the dustproof net.

[0011] In an optional embodiment, the second speaker is in a sheet shape and covers the dustproof net, and the second speaker is provided with a through hole.

[0012] In an optional embodiment, there are multiple through holes.

[0013] In an optional embodiment, the dustproof net is located on a side of the second speaker facing away from the interior of the housing.

[0014] In an optional embodiment, the second speaker is a piezoelectric speaker.

[0015] In an optional embodiment, the speaker assembly further includes a sealing member, which is arranged around the edge of the dustproof net.

[0016] In an optional embodiment, the first signal processing module includes a low-pass filter, and the second signal processing module includes a high-pass filter.

[0017] In a second aspect, an embodiment of the present application provides an electronic device, comprising a housing, a chip, and a speaker assembly provided by any embodiment of the first aspect, wherein the speaker assembly and the chip are both located inside the housing, the housing is provided with a sound hole, and a sound channel connected to the sound hole is constructed inside the housing, an opening of the shell of the speaker assembly is connected to the sound channel, and the first power amplifier and the second power amplifier of the speaker assembly are electrically connected to the chip, respectively.

[0018] In an optional embodiment, the electronic device further includes a carrier disposed inside the housing, the speaker assembly is mounted on the carrier, and the sound output channel is formed on the carrier.

[0019] The beneficial effects of the technical solution provided by the embodiment of the present application include at least: by setting the first power amplifier to have a first signal processing module and the second power amplifier to have a second signal processing module, the input signal is frequency-divided, so that the first speaker emits medium and low frequency sounds and the second speaker emits high frequency sounds; since the second speaker is installed at the opening of the shell, the high frequency sound emitted by the second speaker can be directly output to the sound output channel through the opening, which greatly improves the transmission efficiency of the high frequency sound and the high frequency performance of the speaker assembly, and enhances the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0021] Figure 1 A schematic diagram of assembling a speaker assembly in an electronic device according to an embodiment of the present application;

[0022] Figure 2 Schematic diagram of audio signal transmission of the speaker assembly provided in an embodiment of the present application.

[0023] The reference numerals in the figures represent:

[0024] 1 - housing; 11 - partition; 12 - front sound cavity; 13 - rear sound cavity; 2 - first speaker; 21 - center magnet; 22 - side magnet; 23 - voice coil; 24 - diaphragm; 25 - magnetic plate; 251 - air vent; 3 - second speaker; 31 - through hole; 4 - dust screen; 5 - seal; 61 - first power amplifier; 62 - second power amplifier;

[0025] 100-housing; 101-sound outlet; 200-carrying part; 201-sound outlet channel; 300-chip.

[0026] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0028] The directional nouns involved in the embodiments of this application, such as "upper", "lower", "side", etc., are generally expressed in the form of Figure 1 The relative relationships shown in the figure are used as a reference, and these directional terms are used only to more clearly describe the relationship between structures, not to describe absolute directions. When the product is placed in different postures, the direction may change, for example, "up" and "down" may be interchangeable.

[0029] Unless otherwise defined, all technical terms used in the examples of this application have the same meanings as those commonly understood by those skilled in the art. Some technical terms that appear in the examples of this application are explained below.

[0030] In order to make the technical solutions and advantages of the present application clearer, the implementation methods of the present application will be described in further detail below with reference to the accompanying drawings.

[0031] like Figure 1As shown, the speaker assembly provided in the embodiment of the present application includes a housing 1 , a first speaker 2 , a second speaker 3 , a first power amplifier 61 and a second power amplifier 62 .

[0032] Speaker components are used in electronic devices such as mobile phones, tablets, driving recorders, wearable devices, virtual reality devices, etc.

[0033] The housing 1 has an opening for sound output. Specifically, the housing 100 of the electronic device has a sound outlet 101, and a sound outlet channel 201 is constructed inside the housing 100 of the electronic device. The sound outlet channel 201 is connected to the sound outlet 101, so that sound is transmitted to the outside of the electronic device through the opening, the sound outlet channel 201, and the sound outlet 101 in sequence.

[0034] The housing 1 has a space inside for accommodating electronic components. The first speaker 2 is installed inside the housing 1 , and the second speaker 3 is installed at the opening.

[0035] The first power amplifier 61 is electrically connected to the first speaker 2, and the second power amplifier 62 is electrically connected to the second speaker 3. The first power amplifier 61 is provided with a first signal processing module, and the second power amplifier 62 is provided with a second signal processing module. The first signal processing module is used to filter out audio signals greater than the first frequency, and the second signal processing module is used to filter out audio signals less than the second frequency, so that the sound frequency of the first speaker 2 is lower than the sound frequency of the second speaker 3.

[0036] The first power amplifier 61 and the second power amplifier 62 are used to amplify the input signal from the electronic device chip 300 to respectively drive the first speaker 2 and the second speaker 3 to produce sound. The first signal processing module and the second signal processing module are used to perform frequency division processing on the input signal, so that the first speaker 2 produces low- and medium-frequency sounds and the second speaker 3 produces high-frequency sounds.

[0037] It is understandable that if Figure 2 As shown, the first power amplifier 61 and the second power amplifier 62 are electrically connected to the chip 300 of the electronic device respectively, so as to receive input signals from the chip 300 .

[0038] The first frequency is less than or equal to the second frequency. For example, the first frequency and the second frequency are both 8 kHz. That is, the first signal processing module filters out audio signals greater than 8 kHz, so that the first speaker 2 outputs medium and low frequency sounds with a frequency less than or equal to 8 kHz. The second signal processing module filters out audio signals less than 8 kHz, so that the second speaker 3 outputs high frequency sounds with a frequency greater than or equal to 8 kHz.

[0039] By installing the second speaker 3 at the opening of the shell 1, the high-frequency sound emitted by the second speaker 3 can be directly transmitted to the sound outlet channel 201 through the opening, and then transmitted to the outside of the electronic device through the sound outlet 101, which greatly shortens the transmission path of the high-frequency sound and effectively improves the transmission efficiency of the high-frequency sound.

[0040] Exemplarily, the second speaker 3 is a high-frequency speaker, and the second speaker 3 may be a film speaker, a ceramic speaker, a dynamic speaker, or the like.

[0041] The speaker assembly provided in the embodiment of the present application performs frequency division processing on the input signal by setting the first power amplifier 61 with a first signal processing module and the second power amplifier 62 with a second signal processing module, so that the first speaker 2 emits medium and low frequency sounds and the second speaker 3 emits high frequency sounds; since the second speaker 3 is installed at the opening of the shell 1, the high frequency sound emitted by the second speaker 3 can be directly output to the sound output channel 201 through the opening, which greatly improves the transmission efficiency of the high frequency sound and the high frequency performance of the speaker assembly, and enhances the user experience.

[0042] In a further embodiment, a partition 11 is provided in the shell 1 , and the partition 11 and the first speaker 2 separate the space inside the shell 1 into a front sound cavity 12 and a rear sound cavity 13 , and an opening of the shell 1 is connected to the front sound cavity 12 .

[0043] like Figure 1 As shown, the first speaker 2 includes a central magnet 21, side magnets 22, a voice coil 23, a diaphragm 24, and a magnetic conductive sheet 25. The side magnets 22 are arranged around the periphery of the central magnet 21 and spaced apart from the central magnet 21. The diaphragm 24 is located on the side of the central magnet 21 facing away from the magnetic conductive sheet 25. The voice coil 23 is connected to the diaphragm 24 and located in the gap between the central magnet 21 and the side magnets 22. The magnetic conductive sheet 25 has an air vent 251. A magnetic circuit is formed between the central magnet and the side magnets 22. The voice coil 23 is inserted into the magnetic circuit and can reciprocate within the magnetic circuit, thereby driving the diaphragm 24 to vibrate and produce corresponding sound. The central magnet 21 and the side magnets 22 are both arranged on the magnetic conductive sheet 25. The central magnet 21, the side magnets 22, and the magnetic conductive sheet 25 cooperate to provide a permanent magnetic field for the voice coil 23. The air vent 251 provided on the magnetic conductive sheet 25 passes through the magnetic conductive sheet 25 along the thickness direction of the magnetic conductive sheet 25 . The air vent 251 is used to ensure the air pressure balance inside and outside the first speaker 2 , ensuring that the first speaker 2 can smoothly exchange air with the outside world and making the diaphragm 24 less susceptible to damage.

[0044] like Figure 1As shown, the diaphragm 24 faces the front cavity 12, the rear cavity 13 is located on the side of the first speaker 2 facing away from the front cavity 12, and the opening of the housing 1 is located on the side extending in the direction of the diaphragm 24. The mid- and low-frequency sounds emitted by the first speaker 2 are transmitted through the front cavity 12 to the opening of the housing 1, and the mid- and low-frequency sounds are output in a side-out manner. The high-frequency sounds emitted by the second speaker 3 do not pass through the front cavity 12, but are transmitted directly toward the opening of the housing 1 and the sound output channel 201, and the high-frequency sounds are output in a front-out manner, greatly improving the transmission efficiency of high-frequency sounds.

[0045] In a specific embodiment, the speaker assembly further includes a dustproof net 4 , which covers the opening, and the second speaker 3 is mounted on the dustproof net 4 .

[0046] The dustproof net 4 is in a mesh shape and can connect the interior of the housing 1 with the external environment. The dustproof net 4 is used to prevent dust and other fine particles from entering the interior of the housing 1.

[0047] By providing a dust-proof net 4, small particles can be prevented from damaging key components such as the voice coil 23, which helps to maintain the stable performance of the speaker assembly and reduce malfunctions caused by dust entry; by installing the second speaker 3 on the dust-proof net 4, the structure of the dust-proof net 4 itself is used to provide an installation position for the second speaker 3, and there is no need to additionally provide a supporting structure for the second speaker 3 inside the shell 1, which is beneficial to reducing the space occupied by the second speaker 3 and reducing the production and manufacturing cost of the speaker assembly.

[0048] Furthermore, the second speaker 3 is in a sheet shape and covers the dustproof net 4 , and a through hole 31 is formed in the second speaker 3 .

[0049] like Figure 1 As shown, the edge contour shape of the second speaker 3 is the same as the edge contour shape of the dustproof net 4, and the second speaker 3 and the dustproof net 4 are arranged in an overlapping manner. The second speaker 3 and the dustproof net 4 are both in the shape of a rounded rectangle, so that the second speaker 3 is fully covered on the dustproof net 4.

[0050] Illustratively, the second speaker 3 is mounted on the dustproof net 4 by bonding, which simplifies the process and helps improve the installation efficiency of the second speaker 3 .

[0051] The through hole 31 passes through the second speaker 3 along the thickness direction of the second speaker 3 to avoid affecting the communication between the interior of the housing 1 and the external environment.

[0052] In this embodiment, by setting the second speaker 3 in a sheet-like shape to cover the dustproof net 4, it is beneficial to reduce the space occupied by the second speaker 3 and improve the installation efficiency of the second speaker 3. At the same time, it provides a certain support for the dustproof net 4 to prevent the dustproof net 4 from collapsing.

[0053] Furthermore, there are multiple through holes 31 .

[0054] For example Figure 1 As shown, the second speaker 3 is provided with three through holes 31 spaced apart from each other. For example, the opening area of ​​the second speaker 3 is 10 mm. 2 .

[0055] By providing a plurality of through holes 31 , the connection area between the interior of the housing 1 and the external environment is increased, thereby avoiding affecting the sound volume of the first speaker 2 and the second speaker 3 .

[0056] In one embodiment, the dustproof net 4 is located on a side of the second speaker 3 facing away from the interior of the housing 1 , that is, the dustproof net 4 is located on an outer side of the second speaker 3 .

[0057] This arrangement ensures the protective effect of the dustproof net 4 and prevents foreign matter from the external environment from entering the housing 1 and affecting the electronic components inside the housing 1 .

[0058] In one embodiment, the second speaker 3 is a piezoelectric speaker.

[0059] Specifically, the second speaker 3 may be a piezoelectric film speaker, a piezoelectric ceramic speaker, a piezoelectric crystal speaker, or the like.

[0060] In this embodiment, the second speaker 3 can serve as a piezoelectric skeleton to support the dustproof net 4. It also has many advantages such as small size, light weight, thin thickness, low energy consumption, etc., and is easy to install on the dustproof net 4.

[0061] In one embodiment, the speaker assembly further includes a sealing member 5 , which is disposed around an edge of the dustproof net 4 .

[0062] Exemplarily, the sealing member 5 is made of flexible materials such as rubber and foam.

[0063] By providing the sealing member 5 , the connection sealing performance between the dustproof net 4 and the housing 1 is improved, which not only improves the dustproof effect of the loudspeaker assembly, but also helps to optimize the acoustic performance of the loudspeaker assembly.

[0064] In one embodiment, the first signal processing module includes a low-pass filter, and the second signal processing module includes a high-pass filter.

[0065] Low-pass filters and high-pass filters are used to allow signals of specific frequencies to pass through. Low-pass filters can allow signals below the cutoff frequency to pass through and suppress signals above the cutoff frequency. High-pass filters can allow signals above the cutoff frequency to pass through and suppress signals below the cutoff frequency.

[0066] By setting a low-pass filter and a high-pass filter, frequency division processing of the input signal is achieved, so that the sound frequency of the first loudspeaker 2 is lower than the sound frequency of the second loudspeaker 3.

[0067] like Figure 1 As shown, an embodiment of the present application also provides an electronic device, which includes a housing 100, a chip 300 and a speaker assembly provided by any of the above embodiments, wherein the speaker assembly and the chip 300 are both located inside the housing 100, the housing 100 is provided with a sound hole 101, and the housing 100 is internally constructed with a sound channel 201 connected to the sound hole 101, the opening of the shell 1 of the speaker assembly is connected to the sound channel 201, and the first power amplifier 61 and the second power amplifier 62 of the speaker assembly are electrically connected to the chip 300, respectively.

[0068] The electronic device may be a mobile phone, tablet computer, driving recorder, wearable device, virtual reality device, etc. The sound generated by the speaker assembly is transmitted to the outside of the electronic device through the opening of the housing 1, the sound outlet channel 201 and the sound outlet hole 101 in sequence.

[0069] The chip 300 is used to send input signals to the speaker assembly, such as Figure 2 As shown, the first power amplifier 61 and the second power amplifier 62 perform frequency division processing on the input signal sent by the chip 300, so that the first speaker 2 and the second speaker 3 emit sounds of different frequencies.

[0070] In a further embodiment, the electronic device further includes a carrier 200 disposed inside the housing 100 , the speaker assembly is mounted on the carrier 200 , and the carrier 200 is formed with a sound outlet channel 201 .

[0071] Exemplarily, the carrier 200 is a middle frame, and the carrier 200 is used to carry and connect components of the electronic device.

[0072] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0073] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the present invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only.

[0074] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A speaker assembly, characterized in that: The speaker assembly comprises: A housing (1), the housing (1) having an opening for sound output; a first speaker (2) and a second speaker (3), wherein the first speaker (2) is installed inside the housing (1), and the second speaker (3) is installed at the opening; A first power amplifier (61) and a second power amplifier (62), wherein the first power amplifier (61) is electrically connected to the first loudspeaker (2), and the second power amplifier (62) is electrically connected to the second loudspeaker (3), the first power amplifier (61) is provided with a first signal processing module, and the second power amplifier (62) is provided with a second signal processing module, the first signal processing module is used to filter out audio signals with a frequency greater than a first frequency, and the second signal processing module is used to filter out audio signals with a frequency less than a second frequency, so that the sound frequency of the first loudspeaker (2) is less than the sound frequency of the second loudspeaker (3).

2. The loudspeaker assembly according to claim 1, wherein A partition (11) is provided in the shell (1); the partition (11) and the first loudspeaker (2) separate the space inside the shell (1) into a front sound cavity (12) and a rear sound cavity (13); the opening of the shell (1) is in communication with the front sound cavity (12).

3. The loudspeaker assembly according to claim 1, wherein The loudspeaker assembly further comprises a dustproof net (4), the dustproof net (4) covers the opening, and the second loudspeaker (3) is mounted on the dustproof net (4).

4. The loudspeaker assembly according to claim 3, wherein The second speaker (3) is in sheet form and covers the dustproof net (4); the second speaker (3) is provided with a through hole (31).

5. The loudspeaker assembly according to claim 4, wherein: The number of the through holes (31) is multiple.

6. The loudspeaker assembly according to claim 4, wherein: The dustproof net (4) is located on a side of the second speaker (3) facing away from the interior of the housing (1).

7. The loudspeaker assembly according to claim 4, wherein: The second speaker (3) is a piezoelectric speaker.

8. The loudspeaker assembly according to claim 3, wherein: The loudspeaker assembly further comprises a sealing member (5), and the sealing member (5) is arranged around the edge of the dustproof net (4).

9. The loudspeaker assembly according to claim 1, wherein The first signal processing module includes a low-pass filter, and the second signal processing module includes a high-pass filter.

10. An electronic device, characterized in that: The electronic device comprises a housing (100), a chip (300) and a speaker assembly according to any one of claims 1 to 9, wherein the speaker assembly and the chip (300) are both located inside the housing (100), the housing (100) is provided with a sound outlet (101), and the housing (100) is internally constructed with a sound outlet channel (201) connected to the sound outlet (101), an opening of the shell (1) of the speaker assembly is connected to the sound outlet channel (201), and a first power amplifier (61) and a second power amplifier (62) of the speaker assembly are electrically connected to the chip (300) respectively.

11. The electronic device according to claim 10, characterized in that The electronic device further comprises a carrier (200) arranged inside the housing (100), the speaker assembly is mounted on the carrier (200), and the carrier (200) is formed with the sound output channel (201).

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