Temperature equalizing structure of split mounting type floor tile heating layer
Through the uniform temperature structure of the assembled floor tile heating layer, the metal frame and heat diffusion film are used to achieve uniform heat diffusion, which solves the problems of local excessive temperature and large temperature difference of the tiles and improves the durability and waterproof performance of the tiles.
Patent Information
- Application Number
- CN202422714575.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-11-07
AI Technical Summary
Existing floor heating tiles suffer from tile loss due to excessively high local temperatures and large temperature differences, and lack an effective temperature-balancing structure.
The uniform temperature structure of the assembled floor tile heating layer is adopted, including metal frame, PTE board and heat diffusion film, which are connected by heat-resistant glue and plug-in blocks to achieve uniform heat diffusion.
It effectively reduces the damage caused by excessively high local temperatures on the surface of the tiles, evens out the temperature difference inside the tiles, improves the waterproof effect and enhances the stability of the connection.
Smart Images
Figure CN223322180U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of floor tiles, in particular to a temperature-uniform structure of an assembled floor tile heating layer. Background Art
[0002] Floor tiles are a kind of acid- and alkali-resistant porcelain or stone building or decorative material made of refractory metal oxides and semi-metal oxides through a process of grinding, mixing, pressing, glazing, and sintering. Their raw materials are mostly made of clay and quartz sand, which are mixed after high temperature and compression, and have very high hardness.
[0003] Currently, common tiles used for floor heating usually use electric heating wires, carbon fibers or electric heating films as heating elements, and organic polyurethane panels or foamed ceramics as bottom thermal insulation materials. Since the local temperature of the tile surface is too high when it is covered, and there is a large temperature difference between the non-heating areas around the tile body and the center of the tile body, the uneven temperature can easily cause the tile to wear out. Therefore, a temperature-uniform structure of the assembled floor tile heating layer is proposed to solve the above problems. Utility Model Content
[0004] The purpose of the utility model is to provide a temperature-uniform structure of an assembled floor tile heating layer to solve the above-mentioned problem.
[0005] The technical solution of the utility model to solve the above technical problems is as follows:
[0006] A temperature-uniform structure for an assembled floor tile heating layer includes a metal frame, a first PTE plate, a heat diffusion film, a mounting PTE plate, an energized heating film, and a second PTE plate. The first PTE plate is provided on the inner side of the metal frame, the heat diffusion film is provided on the bottom of the first PTE plate, the mounting PTE plate is provided on the bottom of the heat diffusion film, the energized heating film is provided inside the mounting PTE plate, and the second PTE plate is provided on the bottom of the mounting PTE plate.
[0007] Preferably, the metal frame, the first PTE board, the heat diffusion film, the installation PTE board, the energized heating film and the second PTE board are bonded together by heat-resistant adhesive.
[0008] Preferably, the outer surfaces of the metal frames on the left and front sides are fixedly connected with plug-in blocks, and the insides of the metal frames on the right and rear sides are provided with plug-in slots adapted to the plug-in blocks.
[0009] Preferably, the heat diffusion film is located inside the mounting PTE board.
[0010] Preferably, the material of the heat diffusion film is aluminum foil or graphene film, the interior of the heat diffusion film is not charged, and the heat diffusion film is in contact with four metal frames.
[0011] The beneficial effects of one embodiment of the present invention are:
[0012] 1. The temperature-uniform structure of the assembled floor tile heating layer is designed to prevent the local temperature from being too high when the tile surface is covered, and to minimize the temperature difference between the position where there is no energized heating film around the tile body and the center of the tile body. The temperature-uniform structure is used to transfer the local high temperature to the metal frame and then to the metal frame of every brick in the house, avoiding the harm caused by local high temperature and having the advantage of making heat dissipation more even.
[0013] 2. The waterproof effect can be enhanced by bonding the metal frame, the first PTE board, the heat diffusion film, the installation PTE board, the energized heating film and the second PTE board with heat-resistant adhesive.
[0014] 3. Insert the plug-in block into the adjacent plug-in slot to make the connection more secure.
[0015] 4. Heat can be transferred to the metal frame through the diffusion film to make the heat dissipation more uniform. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The accompanying drawings further illustrate the present invention, but the contents in the accompanying drawings do not constitute any limitation to the present invention.
[0017] Figure 1 This is a schematic diagram of the structure of the utility model;
[0018] Figure 2 This is a top view of the structure of the utility model;
[0019] In the accompanying drawings: 1-metal frame, 2-first PTE board, 3-second PTE board, 4-heat diffusion film, 5-installation PTE board, 6-powered heating film. DETAILED DESCRIPTION
[0020] The following describes embodiments of the present invention in detail, with examples of the embodiments illustrated in the accompanying drawings. Throughout, identical or similar reference numerals denote identical or similar elements or elements having identical or similar functions. The embodiments described below with reference to the accompanying drawings are illustrative and intended solely for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. In the description of the present invention, it should be understood that terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" indicate positions or positional relationships based on those shown in the accompanying drawings. These terms are intended solely for the purpose of describing the present invention and simplifying the description. They do not indicate or imply that the devices or elements referred to must have, be constructed, or operate in a specific orientation, and are therefore not to be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Thus, features designated "first" or "second" may explicitly or implicitly include one or more of the aforementioned features. In the description of the present invention, “a plurality of” means two or more, and “a number of” means one or more, unless otherwise clearly defined.
[0021] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, or mutual communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.
[0022] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0023] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will recognize the application of other processes and / or the use of other materials.
[0024] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.
[0025] In the embodiment, Figure 1-2 A temperature-uniform structure for an assembled floor tile heating layer is provided. The utility model includes a metal frame 1, a first PTE plate 2, a heat diffusion film 4, a mounting PTE plate 5, an electrically heated heating film 6, and a second PTE plate 3. The first PTE plate 2 is provided on the inner side of the metal frame 1, the heat diffusion film 4 is provided on the bottom of the first PTE plate 2, the mounting PTE plate 5 is provided on the bottom of the heat diffusion film 4, the electrically heated heating film 6 is provided inside the mounting PTE plate 5, and the second PTE plate 3 is provided on the bottom of the mounting PTE plate 5;
[0026] In order to prevent the local temperature from being too high when the tile surface is covered, and at the same time minimize the temperature difference between the position where the heating film 6 is not energized around the tile body and the center of the tile body, a temperature uniformity structure is used to transfer the local high temperature to the metal frame 1, and then to the metal frame 1 of each tile in the whole house, thereby avoiding the harm caused by local high temperature;
[0027] The metal frame 1, the first PTE board 2, the heat diffusion film 4, the installation PTE board 5, the energized heating film 6 and the second PTE board 3 are bonded together by heat-resistant glue;
[0028] The waterproof effect can be enhanced by bonding the metal frame 1, the first PTE board 2, the heat diffusion film 4, the installation PTE board 5, the energized heating film 6 and the second PTE board 3 with heat-resistant adhesive;
[0029] The outer surfaces of the left and front metal frames 1 are fixedly connected with plug-in blocks, and the insides of the right and rear metal frames 1 are provided with plug-in slots adapted to the plug-in blocks;
[0030] By inserting the plug-in block into the adjacent plug-in slot, the connection can be tightened;
[0031] The heat diffusion film 4 is located inside the mounting PTE board 5;
[0032] The material of the heat diffusion film 4 is either aluminum foil or graphene film. The interior of the heat diffusion film 4 is not charged. The heat diffusion film 4 is in contact with the four metal frames 1.
[0033] The heat can be transferred to the metal frame 1 through the heat diffusion film 4 to make the heat dissipation more uniform.
[0034] Working principle:
[0035] By energizing the heating film 6, the heat is transferred to the heat diffusion film 4 through the installed PTE board 5. The heat diffusion film 4 can transfer the local high temperature to the metal frame 1, and then transfer it to the metal frame 1 of each brick in the whole house through the metal frame 1 in contact with it, thereby reducing the temperature difference at different positions of the tile body and making the room temperature more stable.
[0036] Throughout this specification, reference to terms such as "an embodiment," "one embodiment," "certain embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
[0037] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and should not be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will be able to devise other specific embodiments of the present invention without inventive effort, and such equivalent variations or substitutions are encompassed within the scope of the claims of this application.
Claims
1. A temperature-uniform structure for a modular floor tile heating layer, characterized by: It includes a metal frame, a first PTE plate, a heat diffusion film, a mounting PTE plate, an electrically heated film and a second PTE plate. The first PTE plate is provided on the inner side of the metal frame, the heat diffusion film is provided on the bottom of the first PTE plate, the mounting PTE plate is provided on the bottom of the heat diffusion film, the electrically heated film is provided inside the mounting PTE plate, and the second PTE plate is provided on the bottom of the mounting PTE plate.
2. The temperature-uniform structure of the assembled floor tile heating layer according to claim 1, characterized in that: The metal frame, the first PTE board, the heat diffusion film, the installation PTE board, the energized heating film and the second PTE board are bonded together by heat-resistant glue.
3. The temperature-uniform structure of the assembled floor tile heating layer according to claim 1, characterized in that: The outer surfaces of the metal frames on the left and front sides are fixedly connected with plug-in blocks, and the insides of the metal frames on the right and rear sides are provided with plug-in slots adapted to the plug-in blocks.
4. The temperature-uniform structure of the assembled floor tile heating layer according to claim 1, characterized in that: The heat diffusion film is located inside the mounting PTE board.
5. The temperature-uniform structure of the assembled floor tile heating layer according to claim 1, characterized in that: The material of the heat diffusion film is aluminum foil or graphene film. The interior of the heat diffusion film is not charged. The heat diffusion film is in contact with four metal frames.