High-frequency multilayer printed circuit board based on 5G communication

Abstract

The utility model discloses a high-frequency multilayer printed circuit board based on 5G communication, and particularly relates to the technical field of circuit boards, and the PCB can effectively reduce the mutual interference between signals through the shielding effect of a ground plane layer and a power plane layer, supports the high-speed data transmission and stable signal quality, and improves the reliability of the circuit board. The arrangement of the reinforcing layer can improve the structural strength of the circuit board and reduce the influence of vibration and mechanical stress on the circuit board, the design of the multi-layer printed circuit board can provide more wiring space, the function is powerful, the circuit board is suitable for a complex circuit system, the aluminum plate in the reinforcing layer provides mechanical strength and an electromagnetic shielding function, and the service life of the circuit board is prolonged. The glass fiber cloth provides insulation performance and durability, the epoxy resin plays a role in bonding and fixing, the structural strength, stability and durability of the circuit board are jointly improved, the deposited metal tin, the adhesive and the polyurethane coating in the corrosion-resistant layer jointly provide comprehensive corrosion-resistant protection, and the service life of the circuit board is prolonged. And the reliability and the service life of the PCB in a severe environment are remarkably improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, specifically a high-frequency multi-layer printed circuit board based on 5G communication. Background Art

[0002] The fifth-generation mobile phone standard, also known as fifth-generation mobile communication technology, abbreviated as 5G, is an extension of 4G and is currently under development, with network speeds reaching 5-6 Mbps. From a user experience perspective, 5G offers higher speeds and wider bandwidth, and is expected to be approximately 10 times faster than 4G. Downloading a high-definition movie in just seconds will be enough to meet consumer demand for advanced network experiences such as virtual reality and ultra-high-definition video.

[0003] From the perspective of industry applications, 5G offers higher reliability and lower latency, meeting the specific needs of applications in industries such as smart manufacturing and autonomous driving. This will broaden the development space for integrated industries and support innovative economic and social development. Communication technology is typically implemented by mounting related components and circuits on printed circuit boards (PCBs). PCBs are the foundational material that supports and connects electronic components, providing the physical platform required for circuits.

[0004] In the prior art, Chinese patent publication number CN116456573A discloses a circuit board comprising a base substrate, a thermally conductive insulating layer, and a circuit layer. The upper surface of the base substrate is covered with the thermally conductive insulating layer, and the upper surface of the thermally conductive insulating layer is covered with the circuit layer. The thermally conductive insulating layer and the circuit layer are connected by welding.

[0005] Although the above-mentioned circuit board is covered with a thermally conductive insulating layer on the surface, which enhances the heat resistance of the circuit board to a certain extent, various electronic components such as capacitors and capacitors are soldered on the circuit board. The circuit board itself is brittle, especially when subjected to impact or stress, it is prone to cracks or breakage. In particular, multi-layer circuit boards are prone to cracking or delamination of the substrate, affecting the performance of the product. To this end, we propose a high-frequency multi-layer printed circuit board based on 5G communication to solve the above problems. Utility Model Content

[0006] The utility model aims to solve one of the technical problems existing in the prior art or related technologies.

[0007] To this end, the technical solution adopted in this utility model is:

[0008] A high-frequency multi-layer printed circuit board based on 5G communication includes a PCB layer, wherein the PCB layer includes two signal layers, a ground plane layer and a power plane layer are filled between the two signal layers, the ground plane layer and the power plane layer are in contact with each other, and the sides of the ground plane layer and the power plane layer that are away from each other are fixed to the signal layer, through holes for connecting wires are provided between the signal layer, the ground plane layer and the power plane layer, reinforcement layers for enhancing their own structural strength are provided on both sides of the PCB layer, the reinforcement layers on both sides are symmetrically distributed along the axis of the PCB layer, corrosion-resistant layers for enhancing and protecting the circuit board are provided on the end surfaces of the reinforcement layers on both sides that are away from each other, and the corrosion-resistant layers on both sides are symmetrically distributed along the axis of the PCB layer, and the PCB layer, reinforcement layer and corrosion-resistant layer together constitute a multi-layer printed circuit board.

[0009] Preferably, the reinforcement layer comprises aluminum plate, glass fiber cloth and epoxy resin.

[0010] Preferably, the aluminum plates are arranged on both sides of the PCB layer, and the end surfaces of the aluminum plates on both sides that are away from each other are compositely bonded with glass fiber cloth.

[0011] Preferably, the epoxy resin is arranged on a side of the glass fiber cloth away from the aluminum plate, the epoxy resin is impregnated in the glass fiber cloth, and the aluminum plate, glass fiber cloth and epoxy resin are sequentially arranged and distributed in a direction away from the PCB layer.

[0012] Preferably, the corrosion-resistant layer includes precipitated metal tin, an adhesive and a polyurethane coating.

[0013] Preferably, the immersion metal tin is arranged on both sides of the PCB layer, and the immersion metal tin on both sides is symmetrically distributed along the axis of the PCB layer.

[0014] Preferably, the side of the metal tin on both sides close to the PCB layer is in contact with the epoxy resin and adheres thereto, and the side of the metal tin away from the epoxy resin is in contact with the adhesive.

[0015] Preferably, the side of the adhesive on both sides away from the precipitated metal tin is in contact with and adhered to the polyurethane coating, and the precipitated metal tin, adhesive and polyurethane coating are arranged and distributed in sequence along the direction of the reinforcement layer away from the PCB layer.

[0016] By adopting the above technical solution, the beneficial effects achieved by the utility model are as follows:

[0017] The PCB board in this utility model can effectively reduce mutual interference between signals through the shielding effect of the ground plane layer and the power plane layer, improve the overall anti-interference capability, thereby reducing signal transmission loss and crosstalk, supporting high-speed data transmission and stable signal quality. The provision of the reinforcement layer can enhance the structural strength of the circuit board, reduce the impact of vibration and mechanical stress on the circuit board, and increase its reliability and stability. The provision of the corrosion-resistant layer can enhance the corrosion resistance of the circuit board and extend its service life, making it particularly suitable for application scenarios in harsh environments. The design of the multi-layer printed circuit board can provide more wiring space, making the design more flexible and more powerful, and suitable for complex circuit systems. The aluminum plate in the reinforcement layer provides mechanical strength and electromagnetic shielding function, the glass fiber cloth provides insulation and durability, and the epoxy resin plays a role in bonding and fixing, which together enhance the structural strength, stability and durability of the circuit board. The tin plating, adhesive and polyurethane coating in the corrosion-resistant layer together provide comprehensive anti-corrosion protection, significantly improving the reliability and life of the PCB in harsh environments. The high-frequency multi-layer printed circuit board based on 5G communication has a reasonable structural design, can meet the needs of high-frequency communication and complex circuit systems, and has good application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of the utility model as a whole.

[0019] Figure 2 For this utility model Figure 1 Enlarged structural diagram at point A in the middle.

[0020] Figure 3 This is a schematic diagram of the reinforcing layer structure of the utility model.

[0021] Figure 4 This is a schematic diagram of the corrosion-resistant layer structure of the utility model.

[0022] In the figure: 1. PCB layer; 101. Signal layer; 102. Ground plane layer; 103. Power plane layer; 104. Through hole; 2. Reinforcement layer; 201. Aluminum plate; 202. Fiberglass cloth; 203. Epoxy resin; 3. Corrosion-resistant layer; 301. Immersion tin; 302. Adhesive; 303. Polyurethane coating. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] Example: Figure 1-Figure 4 As shown, the utility model provides a high-frequency multi-layer printed circuit board based on 5G communication, including a PCB layer 1, the PCB layer 1 includes two signal layers 101, a ground plane layer 102 and a power plane layer 103 are filled between the two signal layers 101, the ground plane layer 102 and the power plane layer 103 are in contact with each other, and the side of the ground plane layer 102 and the power plane layer 103 away from each other is fixed to the signal layer 101, and a through hole 104 for connecting a wire is opened between the signal layer 101, the ground plane layer 102 and the power plane layer 103. Both sides of the PCB layer 1 A reinforcement layer 2 is provided to enhance its own structural strength. The reinforcement layers 2 on both sides are symmetrically distributed along the axis of the PCB layer 1. The end surfaces of the reinforcement layers 2 on both sides that are away from each other are provided with corrosion-resistant layers 3 for improving the protection of the circuit board. The corrosion-resistant layers 3 on both sides are symmetrically distributed along the axis of the PCB layer 1. The PCB layer 1, the reinforcement layer 2 and the corrosion-resistant layer 3 together constitute a multi-layer printed circuit board. The two signal layers 101 are located in the PCB layer 1 and are used to transmit high-frequency signals and data. The ground plane layer 102 and the power plane layer 103 are filled between the two signal layers 101 to play a shielding and isolation role. The ground plane layer 102 and the power plane layer 103 contact each other to form a ground plane and a power plane, which helps to reduce the mutual interference between the signal layers 101. A through hole 104 is opened between the signal layer 101, the ground plane layer 102 and the power plane layer 103 for connecting wires to realize signal transmission and power supply. The multi-layer printed circuit board structure can provide better high-frequency performance, reduce signal transmission loss and crosstalk, support high-speed data transmission and stable signal quality, and effectively reduce mutual interference between signals through the shielding effect of the ground plane layer 102 and the power plane layer 103, thereby improving the overall anti-interference ability. The setting of the reinforcement layer 2 can enhance the structural strength of the circuit board, reduce the impact of vibration and mechanical stress on the circuit board, and increase its reliability and stability. The setting of the corrosion-resistant layer 3 can enhance the corrosion resistance of the circuit board and extend its service life. It is particularly suitable for application scenarios in harsh environments. The design of the multi-layer printed circuit board can provide more wiring space, making the design more flexible and more powerful. It is suitable for complex circuit systems and is suitable for application in high-frequency communications and complex circuit systems.

[0025] The reinforcement layer 2 includes an aluminum plate 201, a glass fiber cloth 202 and an epoxy resin 203. The aluminum plate 201 is arranged on both sides of the PCB layer 1. The end faces of the aluminum plates 201 on both sides that are away from each other are compositely bonded with the glass fiber cloth 202. The epoxy resin 203 is arranged on the side of the glass fiber cloth 202 away from the aluminum plate 201. The epoxy resin 203 is impregnated in the glass fiber cloth 202. The aluminum plate 201, the glass fiber cloth 202 and the epoxy resin 203 are arranged in sequence in a direction away from the PCB layer 1. The aluminum plate 201 provides high mechanical strength and rigidity, which helps to enhance the overall structural strength of the circuit board. It has good thermal conductivity, which helps to dissipate heat and maintain a stable operating temperature of the circuit board. At the same time, it can effectively shield electromagnetic interference and improve the anti-interference ability of the circuit board. The glass fiber cloth 202, as an insulating material, can provide good Insulation performance, prevents short circuits between circuit board components, has high mechanical strength and wear resistance, and can enhance the durability of the circuit board. Epoxy resin 203 is used as an adhesive 302 to bond the aluminum plate 201 and the glass fiber cloth 202 together, and is filled in the glass fiber cloth 202 to play a role of fixing and reinforcing. It has good bonding performance and chemical resistance, can effectively fix the material and improve the stability of the overall structure. At the same time, epoxy resin 203 can also provide a certain moisture-proof performance to protect the circuit board from moisture. The aluminum plate 201 provides mechanical strength and electromagnetic shielding function, the glass fiber cloth 202 provides insulation performance and durability, and the epoxy resin 203 plays a role of bonding and fixing. They together constitute the reinforcement layer 2, which provides better structural strength, stability and durability for the multi-layer printed circuit board.

[0026] Furthermore, the corrosion-resistant layer 3 includes a metal tin 301, an adhesive 302 and a polyurethane coating 303. The metal tin 301 is arranged on both sides of the PCB layer 1. The metal tin 301 on both sides is symmetrically distributed along the axis of the PCB layer 1. The side of the metal tin 301 on both sides close to the PCB layer 1 is in contact and adhesion with the epoxy resin 203, and the side of the metal tin 301 away from the epoxy resin 203 is in contact with the adhesive 302. The side of the adhesive 302 on both sides away from the metal tin 301 is in contact and adhesion with the polyurethane coating 303. The metal tin 301, the adhesive 302 and the polyurethane coating 303 are arranged in sequence along the direction of the reinforcement layer 2 away from the PCB layer 1. The metal tin 301 provides good electrical connection performance and solderability, and also has a certain antioxidant ability, which can protect the PCB surface from oxidative corrosion to a certain extent. The adhesive 302 is used to bond the metal tin 301 to the outer layer of the polyurethane coating The PCB is firmly bonded together using 303. The use of adhesive 302 can improve the adhesion between layers and prevent delamination or peeling, thereby enhancing the stability and durability of the overall structure. The polyurethane coating 303 provides strong corrosion protection, isolating the PCB from external environmental erosion such as moisture, chemicals, dust, etc. It has excellent chemical resistance, wear resistance and elasticity, and can effectively protect the PCB from damage by environmental factors. In addition, the polyurethane coating 303 also has certain flexibility and weather resistance, and can adapt to temperature changes and mechanical stress, thereby extending the service life of the PCB. The immersion tin 301 provides good electrical properties and preliminary anti-oxidation protection. The adhesive 302 ensures a strong bond between the various layers of material, while the polyurethane coating 303 provides comprehensive anti-corrosion protection. The combination of these three materials can significantly improve the reliability and life of the PCB in harsh environments.

[0027] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A high-frequency multi-layer printed circuit board based on 5G communication, characterized in that: The invention comprises a PCB layer (1), wherein the PCB layer (1) comprises two signal layers (101), a ground plane layer (102) and a power plane layer (103) are filled between the two signal layers (101), the ground plane layer (102) and the power plane layer (103) are in contact with each other, and the sides of the ground plane layer (102) and the power plane layer (103) that are away from each other are fixed to the signal layer (101), and the signal layer (101), the ground plane layer (102) and the power plane layer (103) are opened. A through hole (104) for connecting a wire is provided, and reinforcement layers (2) for enhancing the structural strength of the PCB layer (1) are provided on both sides of the PCB layer (1), and the reinforcement layers (2) on both sides are symmetrically distributed along the axis of the PCB layer (1), and corrosion-resistant layers (3) for enhancing the protection of the circuit board are provided on the end faces of the reinforcement layers (2) on both sides that are away from each other, and the corrosion-resistant layers (3) on both sides are symmetrically distributed along the axis of the PCB layer (1), and the PCB layer (1), the reinforcement layer (2) and the corrosion-resistant layer (3) together constitute a multilayer printed circuit board.

2. A high-frequency multi-layer printed circuit board based on 5G communication according to claim 1, characterized in that: The reinforcement layer (2) comprises an aluminum plate (201), a glass fiber cloth (202) and an epoxy resin (203).

3. A high-frequency multi-layer printed circuit board based on 5G communication according to claim 2, characterized in that: The aluminum plates (201) are arranged on both sides of the PCB layer (1), and the end surfaces of the aluminum plates (201) on both sides that are away from each other are compositely bonded to the glass fiber cloth (202).

4. A high-frequency multi-layer printed circuit board based on 5G communication according to claim 2, characterized in that: The epoxy resin (203) is arranged on a side of the glass fiber cloth (202) away from the aluminum plate (201), the epoxy resin (203) is impregnated in the glass fiber cloth (202), and the aluminum plate (201), the glass fiber cloth (202), and the epoxy resin (203) are arranged and distributed in sequence in a direction away from the PCB layer (1).

5. A high-frequency multi-layer printed circuit board based on 5G communication according to claim 1, characterized in that: The corrosion-resistant layer (3) comprises precipitated metal tin (301), an adhesive (302) and a polyurethane coating (303).

6. A high-frequency multi-layer printed circuit board based on 5G communication according to claim 5, characterized in that: The immersion metal tin (301) is arranged on both sides of the PCB layer (1), and the immersion metal tin (301) on both sides is symmetrically distributed along the axis of the PCB layer (1).

7. A high-frequency multi-layer printed circuit board based on 5G communication according to claim 6, characterized in that: The side of the metal tin (301) on both sides close to the PCB layer (1) is in contact with the epoxy resin (203) and adheres thereto, and the side of the metal tin (301) away from the epoxy resin (203) is in contact with the adhesive (302).

8. A high-frequency multi-layer printed circuit board based on 5G communication according to claim 7, characterized in that: The adhesive (302) on both sides is in contact and adhered to the polyurethane coating (303) on a side away from the precipitated metal tin (301), and the precipitated metal tin (301), the adhesive (302) and the polyurethane coating (303) are arranged and distributed in sequence along a direction from the reinforcement layer (2) away from the PCB layer (1).

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